Datasheet DS1104SG30, DS1104SG29, DS1104SG28, DS1104SG27, DS1104SG26 Datasheet (DYNEX)

DS1104SG

DS1104SG

Rectifier Diode

Replaces January 2000 version, DS4167-3.2 DS4167-4.0 August 2001

FEATURES

■ Double Side Cooling

■ High Surge Capability

APPLICATIONS

■ Rectification

■ Freewheel Diode

■ DC Motor Control

■ Power Supplies

■ Welding

■ Battery Chargers

VOLTAGE RATINGS

Type Number Repetitive Peak

Reverse Voltage

V

RRM

V

DS1104SG30
DS1104SG29
DS1104SG28
DS1104SG27
DS1104SG26
DS1104SG25

Lower voltage grades available.

3000
2900
2800
2700
2600
2500

Conditions

V

= V

RSM

RRM

+ 100V

KEY PARAMETERS
V

3000V

RRM

I

1571A

F(AV)

I

20000A

FSM

Outline type code: G

See Package Details for further information.

Fig. 1 Package outline

ORDERING INFORMATION

When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:

DS1104SG29

Note: Please use the complete part number when ordering
and quote this number in any future correspondance relating
to your order.

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DS1104SG

CURRENT RATINGS

T

= 75oC unless otherwise stated

case

Symbol Parameter Conditions

Double Side Cooled

I

F(AV)

I

F(RMS)

I

Mean forward current

RMS value

F

Continuous (direct) forward current

Half wave resistive load 1849 A

Single Side Cooled (Anode side)

I

F(AV)

I

F(RMS)

I

F

T

= 100oC unless otherwise stated

case

Mean forward current

RMS value

Continuous (direct) forward current

Half wave resistive load 1173 A

Symbol Parameter Conditions

Double Side Cooled

I

F(AV)

Mean forward current

Half wave resistive load 1315 A

UnitsMax.

- 2904 A

- 2545 A

- 1843 A

- 1502 A

UnitsMax.

I

F(RMS)

I

F

RMS value

Continuous (direct) forward current

Single Side Cooled (Anode side)

I

F(AV)

I

F(RMS)

I

F

Mean forward current

RMS value

Continuous (direct) forward current

- 2065 A

- 1880 A

Half wave resistive load 840 A

- 1320 A

- 1130 A

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SURGE RATINGS

DS1104SG

I

FSM

2

tI

I

I

FSM

I2t

Surge (non-repetitive) forward current

2

t for fusing

Surge (non-repetitive) forward current

2

I

t for fusing A2s

THERMAL AND MECHANICAL DATA

Symbol

R

th(j-c)

R

th(c-h)

Thermal resistance - junction to case

Thermal resistance - case to heatsink

Parameter

Conditions

10ms half sine; T

VR = 50% V

10ms half sine; T

VR = 0

Conditions Min. Max. Units

Double side cooled

Single side cooled

Clamping force 12.0kN
with mounting compound

case

- 1/4 sine

RRM

case

= 175oC

= 175oC

dc

Cathode dc
Double side

Single side

Max. UnitsSymbol Parameter

16.0 kA

6

1.28x 10

A2s

20.0 kA

2.0 x 10

6

- 0.032oC/W

o

C/W- 0.064Anode dc

o

- 0.064

0.008

-

C/W

o

C/W

- 0.016oC/W

Forward (conducting) - 185

T

vj

T

stg

Virtual junction temperature

Storage temperature range

Reverse (blocking)

-

175

-55 200

o

C

o

C

o

C

Clamping force- 11.5 13.5 kN

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DS1104SG

CHARACTERISTICS

Symbol

V

FM

I

RRM

Q

S

I

rr

V

TO

r

T

CURVES

2500

2000

- (A)

F

Parameter

Forward voltage

Peak reverse current

Total stored charge

Reverse recovery current

Threshold voltage
Slope resistance 0.31 mΩ

Measured under pulse
conditions

At V

, T

RRM

= 1000A, dIrr/dt = 3A/µs

I

F

T

= 175˚C, VR = 100V

case

= 175˚C - 0.67 V

At T

vj

At Tvj = 175˚C -

Conditions Min. Max. Units

= 25oC

case

= 175oC-50mA

case

- 1.3 VAt 1800A peak, T

-

-85A

4000

3000

Half wave

dc

µC1600

1500

1000

Instantaneous forward current, I

500

Tj = 175˚C

0

0.5 1.0 1.5 2.0
Instantaneous forward voltage, V

Tj = 25˚C

Fig.2 Maximum (limit) forward characteristics

VFM Equation:­V

= A + Bln (IF) + C.IF+D.√I

FM

F

- (V)

F

3 phase

2000

Mean power dissipation - (W)

1000

6 phase

0

0 1000 2000 3000

Mean forward current, I

F(AV)

- (A)

Fig.3 Dissipation curves

Where A = 0.82527

B = –0.07771
C = 0.00012
D = 0.019599

these values are valid for T

= 125˚C for IF 500A to 2500A

j

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DS1104SG

10000

Conditions:
Tj = 175˚C
VR = 100V
IF = 1000A

- (µC)

S

1000

Stored charge, Q

I

F

dIF/dt

100

0.1 1.0 10 100
Rate of decay of on-state current dI

/dt - (A/µs)

F

I

Fig.4 Total stored charge Fig.5 Maximum reverse recovery current

RM

1000

Conditions:
T

= 175˚C

j

V

= 100V

R

I

= 1000A

F

- (A)

rr

100

Reverse recovery current I

Q

S

10

0.1 1.0 10 100
Rate of decay of forward current, dI

/dt - (A/µs)

F

30

I2t = Î2 x t

2

25

20

15

10

I2t

Peak half sine forward current - (kA)

5

0

1 101 2351020 50

ms Cycles at 50Hz

Duration

1300

1200

1100

1000

900

800

700

I

2

t value - (A

2

s x 10

3

)

0.1
Anode side cooled

- (˚C/W)

th(j–c)

Double side cooled

0.01

Conduction

Thermal Impedance - junction to case, R

0.001

Halfwave

3 phase 120˚

6 phase 60˚

Effective thermal resistance

Junction to case ˚C/W

Double side

d.c.

0.032

0.034

0.044

0.057

Single side

0.064

0.066

0.076

0.089

0.001 0.01 0.1 1.0 10
Time - (s)

Fig.6 Surge (non-repetitive) forward current vs time (with

50% V

RRM

at T

case

175˚C)

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Fig.7 Maximum (limit) transient thermal impedance -

junction to case

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DS1104SG

PACKAGE DETAILS

For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.

Hole Ø3.6 x 2.0 deep (in both electrodes)

Cathode

Note:

1. Package maybe supplied with pins and/or tags.

Ø58.5 max

Ø34 nom

Ø34 nom

Nominal weight: 250g

Clamping force: 12kN ±10%

Package outine type code: G

Anode

27.0

25.4

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DS1104SG

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.

Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).

DEVICE CLAMPS

Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm

Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839

HEATSINKS

Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.

http://www.dynexsemi.com

e-mail: [email protected]

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

CUSTOMER SERVICE CENTRES

Mainland Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone].
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SALES OFFICES

Mainland Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]. Toll Free: 1.888.33.DYNEX (39639) /

Tel: [phone]. Fax: [phone].
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4167-4 Issue No. 4.0 August 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

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