Datasheet DS0026H-883, DS0026H-SMD, DS0026H-MLS, DS0026H, DS0026CL Datasheet (NSC)

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DS0026 Dual High-Speed MOS Driver
General Description
DS0026 is a low cost monolithic high speed two phase MOS clock driver and interface circuit. Unique circuit design pro­vides both very high speed operation and the ability to drive large capacitive loads. The device accepts standard TTL outputs and converts them to MOS logic levels. The device may be driven from standard 54/74 series and 54S/74S series gates and flip-flops or from drivers such as the DS8830 or DM7440. The DS0026 is intended for applica­tions in which the output pulse width is logically controlled; i.e., the output pulse width is equal to the input pulse width.
The DS0026 is designed to fulfill a wide variety of MOS interface requirements. Information on the correct usage of the DS0026 in these as well as other systems is included in the application note AN-76.
Features
n Fast rise and fall times—20 ns 1000 pF load n High output swing—20V n High output current drive—
±
1.5 amps
n TTL compatible inputs n High rep rate—5 to 10 MHz depending on power
dissipation
n Low power consumption in MOS “0” state—2 mW n Drives to 0.4V of GND for RAM address drive
Connection Diagram (Top View)
Dual-In-Line Package
00585302
February 2002
DS0026 Dual High-Speed MOS Driver
© 2002 National Semiconductor Corporation DS005853 www.national.com
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
(V
+
)−(V−) Differential Voltage 22V Input Current 100 mA Input Voltage (V
IN
)−(V−) 5.5V Peak Output Current 1.5A Storage Temperature Range −65˚C to +150˚C Lead Temperature
(Soldering, 10 sec.) 300˚C
Operating Ratings
(V+)−(V−) Differential Voltage 10V to 20V Maximum Power Dissipation at T
A
= 25˚C (Note 7) 1168mW
N08E θ
JA
107˚C/W
N08E θ
JC
37˚C/W
M08A θ
JA
180˚C/W
MUA08A θ
JA
220˚C/W
Operating Temperature Range, T
A
0˚C to +70˚C
Ordering Information
Order Number Package Type NS Package Number
DS0026CN M-DIP N08E
DS0026CMA SOIC M08A
DS0026CMM MSOP MUA08A
Electrical Characteristics (Notes 2, 3, 4)
Symbol Parameter Conditions Min Typ Max Units
V
IH
Logic “1” Input Voltage V−= 0V 2 1.5 V
I
IH
Logic “1” Input Current VIN−V−= 2.4V 10 15 mA
V
IL
Logic “0” Input Voltage V−= 0V 0.6 0.4 V
I
IL
Logic “0” Input Current VIN−V−= 0V −3 −10 µA
V
OL
Logic “1” Output Voltage VIN−V−= 2.4V, IOL= 1 mA V−+0.7 V−+1.0 V
V
OH
Logic “0” Output Voltage VIN−V−= 0.4V, VSS≥ V++ 1.0V
I
OH
=−1mA
V
+
− 1.0 V+−0.8 V
I
CC(ON)
“ON” Supply Current (one side on)
V+−V−= 20V, VIN−V−= 2.4V
30 40 mA
I
CC(OFF)
“OFF” Supply Current V+−V−= 20V,
V
IN
−V−=0V
10 100 µA
Switching Characteristics
(TA= 25˚C) (Notes 5, 6)
Symbol Parameter Conditions Min Typ Max Units
t
ON
Turn-On Delay
(Figure 1
) 5 7.5 12 ns
(Figure 2
)11ns
t
OFF
Turn-Off Delay
(Figure 1
)1215ns
(Figure 2
)13ns
t
r
Rise Time
(Figure 1
),
(Note 5)
C
L
= 500 pF 15 18 ns
C
L
= 1000 pF 20 35 ns
(Figure 2
),
(Note 5)
C
L
= 500 pF 30 40 ns
C
L
= 1000 pF 36 50 ns
t
f
Fall Time
(Figure 1
),
(Note 5)
C
L
= 500 pF 12 16 ns
C
L
= 1000 pF 17 25 ns
(Figure 2
),
(Note 5)
C
L
= 500 pF 28 35 ns
C
L
= 1000 pF 31 40 ns
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. Except for “Operating Temperature Range” they are not meant to imply that the devices should be operated atthese limits. The table of “Electrical Characteristics provides conditions for actual device operation.
Note 2: These specifications apply for V
+−V−
= 10V to 20V, CL= 1000 pF, over the temperature range of 0˚C to +70˚C for the DS0026CN.
Note 3: All currents into device pins shown as positive, out of device pins as negative, all voltages referenced to ground unless otherwise noted. All values shown as max or min on absolute value basis.
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Switching Characteristics (Continued)
Note 4: All typical values for TA= 25˚C. Note 5: Rise and fall time are given for MOS logic levels; i.e., rise time is transition from logic “0” to logic “1” which is voltage fall. Note 6: The high current transient (as high as 1.5A) through the resistance of the internal interconnecting V
lead during the output transition from the high state
to the low state can appear as negative feedback to the input. If the external interconnecting lead from the driving circuit to V
is electrically long, or has significant
dc resistance, it can subtract from the switching response. Note 7: Derate N08E package 9.3 mW/˚C for T
A
above 25˚C.
Typical VBBConnection
00585308
Typical Performance Characteristics
Input Current vs Input Voltage Supply Current vs Temperature
Turn-On and Turn-Off Delay
vs Temperature
00585322
00585323
00585324
Rise Time vs Load
Capacitance
Fall Time vs Load
Capacitance
00585325
00585326
DS0026
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Typical Performance Characteristics (Continued)
Recommended Input Coding
Capacitance
DC Power (P
DC
)vs
Duty Cycle
00585327
00585328
Schematic Diagram
1/2 DS0026
00585310
DS0026
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AC Test Circuits and Switching Time Waveforms
Typical Applications
AC Coupled MOS Clock Driver
00585316
DC Coupled RAM Memory Address or Precharge
Driver (Positive Supply Only)
00585317
Application Hints
DRIVING THE MM5262 WITH THE DS0026 CLOCK DRIVER
The clock signals for the MM5262 have three requirements which have the potential of generating problems for the user. These requirements, high speed, large voltage swing and large capacitive loads, combine to provide ample opportunity for inductive ringing on clock lines, coupling clock signals to other clocks and/or inputs and outputs and generating noise on the power supplies. All of these problems have the po­tential of causing the memory system to malfunction. Rec­ognizing the source and potential of these problems early in the design of a memory system is the most critical step. The object here is to point out the source of these problems and give a quantitative feel for their magnitude.
00585312
00585313
FIGURE 1.
00585314
00585315
FIGURE 2.
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Application Hints (Continued)
Line ringing comes from the fact that at a high enough frequency any line must be considered as a transmission line with distributed inductance and capacitance. To see how much ringing can be tolerated we must examine the clock voltage specification.
Figure 3
shows the clock specification, in diagram form, with idealized ringing sketched in. The ringing of the clock about the V
SS
level is particularly critical.
If the V
SS
−1VOHis not maintained, at
all
times, the information stored in the memory could be altered. Referring to
Figure 1
, if the threshold voltage of a transistor were
−1.3V, the clock going to V
SS
− 1 would mean that all the devices, whose gates are tied to that clock, would be only 300 mV from turning on. The internal circuitry needs this noise margin and from the functional description of the RAM it is easy to see that turning a clock on at the wrong time can have disastrous results.
Controlling theclock ringing is particularly difficult because of the relative magnitude of the allowable ringing, compared to magnitude of the transition. In this case it is 1V out of 20V or only 5%. Ringing can be controlled by damping the clock driver and minimizing the line inductance.
Damping the clock driver by placing a resistance in series with its output is effective, but there is a limit since it also slows downthe rise and fall time of theclock signal. Because the typical clock driver can be much faster than the worst case driver, the damping resistor serves the useful function of limiting the minimum rise and fall time. This is very impor­tant because the faster the rise and fall times, the worse the ringing problem becomes. The size of the damping resistor varies because it is dependent on the details of the actual application. It must be determined empirically. In practice a resistance of 10to 20is usually optimum.
Limiting the inductance of the clock lines can be accom­plished by minimizing their length and by laying out the lines such that the return current is closely coupled to the clock lines. When minimizing the length of clock lines it is impor­tant to minimize the distance from the clock driver output to the furthest point being driven. Because of this, memory boards are usually designed with clock drivers in the center of the memory array, rather than on one side, reducing the maximum distance by a factor of 2.
Using multilayer printed circuit boards with clock lines sand­wiched between the V
DD
and VSSpower plains minimizes the inductance of the clock lines. It also serves the function of preventing the clocks from coupling noise into input and output lines. Unfortunately multilayer printed circuit boards
are more expensive than two sided boards. The user must make the decision as to the necessity of multilayer boards. Suffice it to say here, that reliable memory boards can be designed using two sided printed circuit boards.
Because of the amount of current that the clock driver must supply to its capacitive load, the distribution of power to the clock driver must be considered.
Figure 4
gives the idealized voltage and current waveforms for a clock driver driving a 1000 pF capacitor with 20 ns rise and fall time.
As can be seen the current is significant. This current flows in the V
DD
and VSSpower lines.Any significant inductance in the lines will produce large voltage transients on the power supplies. A bypass capacitor, as close as possible to the clock driver, is helpful in minimizing this problem. This by­pass is most effectivewhen connected between the V
SS
and
V
DD
supplies. The size of the bypass capacitor depends on the amount of capacitance being driven. Using a low induc­tance capacitor, such as a ceramic or silver mica, is most effective. Another helpful technique is to run the V
DD
and
V
SS
lines, to the clock driver, adjacent to each other. This tends to reduce the lines inductance and therefore the mag­nitude of the voltage transients.
While discussing the clock driver, it should be pointed out that the DS0026 is a relatively low input impedance device. It is possible to couple current noise into the input without seeing a significant voltage. Since the noise is difficult to detect with an oscilloscope it is often overlooked.
00585318
FIGURE 3. Clock Waveform
00585319
FIGURE 4. Clock Waveforms (Voltage and Current)
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Application Hints (Continued)
Lastly, the clock lines must be considered as noise genera­tors.
Figure 5
shows a clock coupled through a parasitic
coupling capacitor, C
C
, to eight data input lines being driven by a 7404. A parasitic lumped line inductance, L, is also shown. Let us assume, for the sake of argument, that C
C
is 1 pF and that the rise time of the clock is high enough to completely isolate the clock transient from the 7404 because of the inductance, L.
With a clock transition of 20V the magnitude of the voltage generated across C
L
is:
This has been a hypothetical example to emphasize that with 20V low rise/fall time transitions, parasitic elements can not be neglected. In this example, 1 pF of parasitic capaci­tance could cause system malfunction, because a 7404 without a pull up resistor has typically only 0.3V of noise margin in the “1” state at 25˚C. Of course it is stretching things to assume that the inductance, L, completely isolates the clock transient from the 7404. However, it does point out the need to minimize inductance in input/output as well as clock lines.
The output is current, so it is more meaningful to examine the current that is coupled througha1pFparasitic capaci­tance. The current would be:
This exceeds the total output current swing so it is obviously significant.
Clock coupling to inputs and outputs can be minimized by using multilayer printed circuit boards, as mentioned previ­ously, physically isolating clock lines and/or running clock lines at right angles to input/output lines. All of these tech­niques tend to minimize parasitic coupling capacitance from the clocks to the signals in question.
In considering clock coupling it is also important to have a detailed knowledge of the functional characteristics of the device being used. As an example, for the MM5262, cou­pling noise from the φ2 clock to the address lines is of no particular consequence. On the other hand the address inputs will be sensitive to noise coupled from φ1 clock.
00585320
FIGURE 5. Clock Coupling
DS0026
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Physical Dimensions inches (millimeters) unless otherwise noted
Molded Dual-In-Line Package (N)
Order Number DS0026CN
NS Package Number N08E
8-Lead Small Outline Molded package (M)
NS Package Number M08A
DS0026
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Lead Mini SOIC Package (MM)
NS Package Number MU08A
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DS0026 Dual High-Speed MOS Driver
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