Datasheet DRD420D18, DRD420D16, DRD420D14, DRD420D12 Datasheet (DYNEX)

DRD420D

DRD420D

Rectifier Diode

Target Information

DS5517-1.0 February 2002

FEATURES

■ Double Side Cooling

■ High Surge Capability

APPLICATIONS

■ Rectification

■ Freewheel Diode

■ DC Motor Control

■ Power Supplies

■ Welding

■ Battery Chargers

VOLTAGE RATINGS

Type Number Repetitive Peak

Reverse Voltage

V

RRM

V

DRD420D18
DRD420D16
DRD420D14
DRD420D12

1800
1600
1400
1200

Conditions

V

= V

RSM

RRM

+ 100V

KEY PARAMETERS
V
I

F(AV)

I

FSM

RRM

1800V
4200A
70000A

Outline type code: DO200AD

See Package Details for further information.

Fig. 1 Package outline

Lower voltage grades available.

ORDERING INFORMATION

When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:

DRD420D18

Note: Please use the complete part number when ordering
and quote this number in any future correspondance relating
to your order.

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DRD420D

CURRENT RATINGS

T

= 75oC unless otherwise stated

case

Symbol Parameter Conditions

Double Side Cooled

I

F(AV)

I

F(RMS)

I

Mean forward current

RMS value

F

Continuous (direct) forward current

Half wave resistive load 5150 A

Single Side Cooled (Anode side)

I

F(AV)

I

F(RMS)

I

F

T

= 100oC unless otherwise stated

case

Mean forward current

RMS value

Continuous (direct) forward current

Half wave resistive load 3760 A

Symbol Parameter Conditions

Double Side Cooled

I

F(AV)

Mean forward current

Half wave resistive load, T

UnitsMax.

- 8090 A

- 7450 A

- 5910 A

- 4820 A

UnitsMax.

= 100oC 4200 A

case

I

F(RMS)

I

F

RMS value

Continuous (direct) forward current

Single Side Cooled (Anode side)

I

F(AV)

I

F(RMS)

I

F

Mean forward current

RMS value

Continuous (direct) forward current

T

= 100oC 6600 A

case

T

= 100oC 5980 A

case

Half wave resistive load, T

T

= 100oC 4780 A

case

T

= 100oC 3800 A

case

= 100oC 3000 A

case

2/7

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SURGE RATINGS

DRD420D

Symbol

I

FSM

2

tI

I

I

FSM

2

I

t

Surge (non-repetitive) forward current

2

t for fusing

Surge (non-repetitive) forward current

2

I

t for fusing 24.5 x 106A2s

Parameter

THERMAL AND MECHANICAL DATA

Symbol

R

th(j-c)

R

th(c-h)

Thermal resistance - junction to case

Thermal resistance - case to heatsink

Parameter

Conditions

10ms half sine; T

VR = 50% V

10ms half sine; T

VR = 0

Conditions Min. Max. Units

Double side cooled

Single side cooled

Clamping force 45.0kN
with mounting compound

case

- 1/4 sine

RRM

case

= 175oC

= 175oC

dc

Cathode dc
Double side

Single side

Max. Units

56 kA

15.68 x 10

6A2

70 kA

- 0.013oC/W

o

C/W- 0.025Anode dc

o

- 0.027

0.003

-

C/W

o

C/W

- 0.006oC/W

s

Forward (conducting) -

T

vj

Virtual junction temperature

Reverse (blocking) -

T

stg

-

Storage temperature range

Clamping force

-55 200

40.0 48.0 kN

185

175

o

C

o

C

o

C

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DRD420D

CHARACTERISTICS

Symbol

I

RRM

Q

S

I

RR

t

rr

V

TO

r

T

CURVES

10000

9000

8000

- (A)

7000

F

Parameter

Peak reverse current

Total stored charge

At V

RRM

, T

Conditions Typ. Max. Units

= 175oC - 100 mA

case

2500

IF = 1000A, dIRR/dt = 5A/µs

Peak recovery current 155 - A

T

= 175˚C, VR = 100V

case

Reverse recovery time 50 - µs

Threshold voltage
Slope resistance 0.0494 mΩ

Tj = 125˚C

= 175˚C - 0.75 V

At T

vj

At Tvj = 175˚C -

7000

6000

5000

µC-

6000

5000

4000

3000

Instantaneous forward current, I

2000

1000

0

0.7 0.8 0.9 1.0 1.1 1.2 1.3
Instantaneous forward voltage, V

- (A)

F

Fig.2 Maximum (limit) forward characteristics

4000

3000

Mean power dissipation - (W)

2000

1000

0

0 1000 2000 3000 4000 5000 6000 7000

Mean forward current, I

F(AV)

3 phase
6 phase

- (A)

Fig.3 Dissipation curves

dc

1/2 wave

4/7

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DRD420D

80

70

60

50

40

30

20

Peak half sine wave on-state current - (kA)

10

Surge current (VR = 0)

0

Surge current (V

= 50% V

R

RRM

)

0 102030405060

Number of cycles @ 50Hz

Fig.4 Series multi-cycle surge current

160

140

120

100

80

60

40

Peak half sine forward current - (kA)

20

I

(VR = 0)

FSM

I

(VR = 50% V

FSM

I2t (VR = 0)
I2t (VR = 50% V

0

110

98765432

RRM

RRM

)

40

35

30

25

20

15

10

)

5

0

I

2

t value - (A

2

s x 10

6

)

Pulse length, half sine wave - (ms)

Fig.5 Sub-cycle surge curves

0.1

Effective thermal resistance

Junction to case ˚C/W

Double side

0.0130

0.0141

0.0170

0.0200

Anode side

0.0250

0.0261

0.0290

0.0320

Anode side cooled

Double side cooled

0.01

0.001

Thermal impedance - (˚C/W)

Conduction

d.c.

Halfwave

3 phase 120˚

6 phase 60˚

0.0001

1010.10.010.001

Time - (s)

Fig.5 Maximum (limit) transient thermal impedance -

junction to case

100

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DRD420D

PACKAGE DETAILS

For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.

Hole Ø3.6 x 2.0 deep
(One in each electrode)

Package outine type code: DO200AD

Note:

1. Package maybe supplied with pins and/or tags.

Ø102 max

Ø63nom

Ø63nom

Ø92 max

Nominal weight: 1100g

Clamping force: 45kN ±10%

Cathode

32.9

Anode

34.1

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DRD420D

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.

Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).

DEVICE CLAMPS

Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm

Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839

HEATSINKS

Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.

http://www.dynexsemi.com

e-mail: [e-mail]

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

CUSTOMER SERVICE CENTRE
Tel: [phone] / 502901. Fax: [phone]

SALES OFFICES
North America Tel: [phone]. Fax: [phone]. Toll Free: 1.888.33.DYNEX (39639) /
Tel: [phone]. Fax: [phone].
Europe & Rest Of World Tel: [phone] / 502901. Fax: [phone]

These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 Publication No. DS5517-1 Issue No. 1.0 February 2002
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

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