Datasheet DP8224N Datasheet (NSC)

Page 1
DP8224 Clock Generator and Driver
DP8224 Clock Generator and Driver
June 1986
General Description
The DP8224 is a clock generator/driver contained in a stan­dard, 16-pin dual-in-line package. The chip, which is fabri­cated using Schottky Bipolar technology, generates clocks and timing for the 8080A microcomputer family.
Included in the DP8224 is an oscillator circuit that is con­trolled by an external crystal, which is selected by the de­signer to meet a variety of system speed requirements. Also included in the chip are circuits that provide: a status strobe for the DP8228 or DP8238 system controllers, power-on re­set for the 8080A microprocessor, and synchronization of the READY input to the 8080A.
Features
Y
Crystal-controlled oscillator for stable system operation
Y
Single chip clock generator and driver for 8080A micro­processor
Y
Provides status strobe for DP8228 or DP8238 system controllers
Y
Provides power-on reset for 8080A microprocessor
Y
Synchronizes READY input to 8080A microprocessor
Y
Provides oscillator output for synchronization of exter­nal circuits
Y
Reduces system component count
8080A Microcomputer Family Block Diagram
TL/F/8752– 1
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
TL/F/8752
Page 2
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Supply Voltage
V
CC
V
DD
Input Voltage
Storage Temperature Range
b
1V toa5.5V
b
65§Ctoa150§C
7V
15V
Operating Conditions
Supply Voltage
V
CC
V
DD
Temperature (T
)0
A
Min Max Units
4.75 5.25 V
11.4 12.6 V
a
70
C
§
Maximum Power Dissipation* at 25§C
Cavity Package 1509 mW Molded Package 1476 mW
Lead Temperature (Soldering, 4 seconds) 260
* Derate cavity package 10.1 mW/§C above 25§C; derate molded package
11.8 mW/
C above 25§C.
§
C
§
Electrical Characteristics (Note 3)
Symbol Parameter Conditions Min Typ Max Units
I
F
I
R
V
C
V
IL
V
IH
Input Current Loading V
Input Leakage Current V
Input Forward Clamp Voltage I
Input ‘‘Low’’ Voltage V
Input ‘‘High’’ Voltage RESIN Input 2.6 V
e
0.45V
F
e
5.25V 10 mA
R
eb
5mA
C
e
5V 0.8 V
CC
All Other Inputs 2.0 V
b
V
V
IH
V
OL
RESIN Input Hysteresis V
IL
Output ‘‘Low’’ Voltage
(w1, w2), Ready, Reset STSTB Osc., w2 (TTL) I Osc., w2 (TTL) I
V
OH
Output ‘‘High’’ Voltage
w1, w2I Ready, Reset I Osc., w2 (TTL), STSTB
I
SC
Output Short-Circuit Current V (All Low Voltage Outputs Only),
e
5V 0.25 V
CC
e
I
2.5 mA 0.45 V
OL
e
10 mA 0.45 V
OL
e
15 mA 0.45 V
OL
eb
100 mA 9.4 V
OH
eb
100 mA 3.6 V
OH
eb
I
1 mA 2.4 V
OH
e
O
0V, V
CC
e
5V
b
10
(Note 1)
I
CC
I
DD
Note 1: Cautionbw1 and w2 output drivers do not have short circuit protection.
Note 2: ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaranteed. Except for ‘‘Operating Temperature Range’’
they are not meant to imply that the devices should be operated at these limits. The table of ‘‘Electrical Characteristics’’ provides conditions for actual device operation.
Note 3: Unless otherwise specified min/max limits apply across the 0
e
12V.
V
DD
Power Supply Current 115 mA
Power Supply Current 12 mA
Ctoa70§C range for the DP8224. All typical values are for T
§
b
0.25 mA
b
1.0 V
b
60 mA
e
25§C, V
A
e
5V, and
CC
Crystal Requirements*
Tolerance 0.005% at 0§Ctoa70§C
Resonance Fundamental
Load Capacitance 20 pF to 30 pF
*It is good design practice to ground the case of the crystal
**With tank circuit, use 3rd overtone mode
Equivalent Resistance 75X to 20X
Power Dissipation (Min) 4 mW
2
Page 3
Switching Characteristics (Note 3)
Symbol Parameter Conditions Min Typ Max Units
t
w1
t
w2
t
D1
t
D2
t
D3
t
r
t
f
t
Dw2
t
DSS
t
PW
t
DRS
t
DRH
t
DR
t
CLK
f
MAX
C
IN
w1 Pulse Width
w2 Pulse Width
w1tow2 Delay
w2tow1 Delay
w1tow2 Delay
w1 and w2 Rise Time 20 ns
w1 and w2 Fall Time 20 ns
w2tow2 (TTL) Delay w2 TTL, C
w2 to STSTB Delay
STSTB Pulse Width
RDYIN Set-Up Time to Status Strobe
RDYIN Hold Time After STSTB
READY or RESET to w2 Delay Ready and Reset, C
CLK Period
Maximum Oscillating Frequency 27 MHz
Input Capacitance V
e
C
20 pF to 50 pF
L
e
30 pF,
L
e
300X,R2e600X
R1
,C
e
15 pF
L
STSTB
R1e2kX,R2e4kX
DD
L
e
12V,
e
2kX,R2e4kX
R1
e
5V, V
CC
e
V
BIAS
2.5V, fe1 MHz
e
10 pF,
2t
CY
b
20 ns
9
5t
CY
b
35 ns
9
0ns
2t
CY
b
14 ns
9
2t
CY
9
b
515ns
6t
CY
b
30
9
t
CY
b
15 ns
9
4t
CY
b
50
9
4t
CY
9
4t
CY
b
25 ns
9
2t
CY
a
20 ns
9
6t
CY
9
ns
ns
ns
t
CY
9
ns
8pF
Test Circuit
TL/F/8752– 2
3
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Waveforms
Voltage Measurement Points: w1, w 2 Logic ‘‘0’’e1.0V, Logic ‘‘1’’e8.0V. All other signals measured at 1.5V.
Switching Characteristics (For t
CY
e
488.28 ns)
TL/F/8752– 3
Symbol Parameter Conditions Min Typ Max Units
t
w1
t
w2
t
D1
t
D2
t
D3
t
r
t
f
t
DSS
t
Dw2
w1 Pulse Width 89 ns
w2 Pulse Width 236 ns
Delay w1tow20ns
Delay w2tow195ns
Delay w1tow2 Leading Edges 109 129 ns
Output Rise Time
Output Fall Time
w2 to STSTB Delay
w2tow2 (TTL) Delay
w1 and w2 Loaded to C
Ready and Reset Loaded to 2 mA/10 pF
e
L
20 to 50 pF
All Measurements Referenced to 1.5V unless Specified Otherwise
296 326 ns
b
515ns
20 ns
20 ns
tPWStatus Strobe Pulse Width 40 ns
t
DRS
t
DRH
t
DR
f
MAX
RDYIN Set-Up Time to STSTB
RDYIN Hold Time after STSTB 217 ns
READY or RESET to w2 Delay 192 ns
Oscillator Frequency 18.432 MHz
b
167 ns
4
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Functional Pin Definitions
The following describes the function of all of the DP8224 input/output pins. Some of these descriptions reference in­ternal circuits.
INPUT SIGNALS
Crystal Connections (XTAL 1 and XTAL 2): Two inputs
that connect an external crystal to the oscillator circuit of the DP8224. Normally, a fundamental mode crystal is used to determine the basic operating frequency of the oscillator. However, overtone mode crystals may also be used. The crystal frequency is 9 times the desired microprocessor speed (that is, crystal frequency equals 1/t the crystal frequency is above 10 MHz, a selected capacitor (3 to 10 pF) may have to be connected in series with the crystal to produce the exact desired frequency.
Tank: Allows the use of overtone mode crystals with the oscillator circuit. When an overtone mode crystal is used, the tank input connects to a parallel LC network that is ac coupled to ground. The formula for determining the reso­nant frequency of this LC network is as follows:
1
e
F
2q0LC
Synchronizing (SYNC) Signal: When high, indicates the beginning of a new machine cycle. The 8080A microproces­sor outputs a status word (which describes the current ma­chine cycle) onto its data bus during the first state (SYNC interval) of each machine cycle.
Reset In (RESIN
): Provides an automatic system reset and
start-up upon application of power as follows. The RESIN input, which is obtained from the junction of an external RC network that is connected between V ed to an internal Schmitt Trigger circuit. This circuit converts
CC
the slow transition of the power supply rise into a sharp, clean edge when its input reaches a predetermined value. When this occurs, an internal D-type flip-flop is synchro­nously reset, thereby providing the RESET output signal dis­cussed below.
c
9). When
CY
Figure A
.
and ground, is rout-
For manual system reset, a momentary contact switch that provides a low (ground) when closed is also connected to the RESIN
input.
Ready In (RDYIN): An asynchronous READY signal that is re-clocked by a D-type flip-flop of the DP8224 to provide the synchronous READY output discussed below.
a
5 Volts: VCCsupply.
a
12 Volts: VDDsupply.
Ground: 0 volt reference.
OUTPUT SIGNALS
Oscillator (OSC): A buffered oscillator signal that can be
used for external timing purposes.
w
and w2Clocks: Two non-TTL compatible clock phases
1
that provide nonoverlapping timing references for internal storage elements and logic circuits of the 8080A microproc­essor. The two clock phases are produced by an internal clock generator that consists of a divide-by-nine counter and the associated decode gating logic.
Figure B
.
w2(TTL) Clock: A TTL w2clock phase that can be used for external timing purposes.
Status Strobe (STSTB
new machine cycle. The STSTB ing a high-level SYNC input with the w the internal clock generator of the DP8224. The STSTB
): Activated (low) at the start of each
signal is generated by gat-
timing signal from
1A
sig­nal is used to clock status information into the status latch of the DP8228 system controller and bus driver.
Reset: When the RESET signal is activated, the content of the program counter of the 8080A is cleared. After RESET, the program will start at location 0 in memory.
Ready: The READY signal indicates to the 8080A that valid memory or input data is available. This signal is used to synchronize the 8080A with slower memory or input/output devices.
Logic and Connection Diagrams
Dual-In-Line Package
TL/F/8752– 5
Top View
Order Number DP8224J or DP8224N
See NS Package Number
J16A or N16A
TL/F/8752– 4
5
Page 6
Applications Information
FIGURE A. DP8224 Connection Diagram
TL/F/8752– 6
EXAMPLE: (8080 t
CY
e
OSC
18 MHz/55 ns
e
w
110 ns (2c55 ns)
1
e
w
275 ns (5c55 ns)
2
e
w
2–w1
e
500 ns)
110 ns (2c55 ns)
FIGURE B. DP8224 Clock Generator Waveforms
TL/F/8752– 7
6
Page 7
Physical Dimensions inches (millimeters)
Ceramic Dual-In-Line Package (J)
Order Number DP8224J
NS Package Number J16A
7
Page 8
Physical Dimensions inches (millimeters) (Continued)
DP8224 Clock Generator and Driver
Molded Dual-In-Line Package (N)
Order Number DP8224N
NS Package Number N16A
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