Datasheet DP8212N Datasheet (NSC)

Page 1
DP8212/DP8212M 8-Bit Input/Output Port
DP8212/DP8212M 8-Bit Input/Output Port
June 1988
General Description
The DP8212/DP8212M is an 8-bit input/output port con­tained in a standard 24-pin dual-in-line package. The device, which is fabricated using Schottky Bipolar technology, is part of National Semiconductor’s 8080A support family. The DP8212/DP8212M can be used to implement latches, gat­ed buffers, or multiplexers. Thus, all of the major peripheral and input/output functions of a microcomputer system can be implemented with this device.
The DP8212/DP8212M includes an 8-bit latch with TRI-STATE trol logic. Also included is a service request flip-flop for the
output buffers, and device selection and con-
É
Features
Y
8-Bit data latch and buffer
Y
Service request flip-flop for generation and control of interrupts
Y
0.25 mA input load current
Y
TRI-STATE TTL output drive capability
Y
Outputs sink 15 mA
Y
Asynchronous latch clear
Y
3.65V output for direct interface to INS8080A
Y
Reduces system package count by replacing buffers, latches, and multiplexers in microcomputer systems
generation and control of interrupts to the microprocessor.
8080A Microcomputer Family Block Diagram
TL/F/6824– 1
TRI-STATEÉis a registered trademark of National Semiconductor Corp.
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
TL/F/6824
Page 2
Absolute Maximum Ratings
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Storage Temperature
All Output or Supply Voltages
All Input Voltages
Output Currents 125 mA
Maximum Power Dissipation* at 25§C
Cavity Package 1903 mW Molded Package 2005 mW
*Derate cavity package 12.7 mW/§C above 25§C; derate molded package
16.0 mW/
C above 25§C.
§
b
65§Ctoa160§C
b
0.5V toa7V
b
1.0V to 5.5V
Operating Conditions
Supply Voltage (V
DP8212M 4.50 5.50 V
CC
)
DP8212 4.75 5.25 V
Operating Temperaure (TA)
DP8212M DP8212 0
Note:
Maximum ratings indicate limits beyond which perma­nent damage may occur. Continuous operation at these lim­its is not intended and should be limited to those conditions specified under DC electrical characteristics.
Min Max Units
DC DC
b
a
55
125
a
75
§
§
C C
Electrical Characteristics Min
s
T
s
Max, MinsV
A
s
Max, unless otherwise noted
CC
Symbol Parameter Conditions Min Typ Max Units
I
F
I
F
I
F
I
R
I
R
I
R
V
C
Input Load Current, V STB, DS2, CLR
,DI1–DI8Inputs
Input Load Current, MD Input V
Input Load Current, DS1 Input V
Input Leakage Current V STB, DS2, CLR,DI1–DI8Inputs
Input Leakage Current, MD Input V
Input Leakage Current, DS1 Input V
Input Forward Voltage Clamp I
e
0.45V
F
e
0.45V
F
e
0.45V
F
e
VCCMax
R
e
VCCMax 30 mA
R
e
VCCMax 40 mA
R
eb
5mA
C
b
0.25 mA
b
0.75 mA
b
10 mA
b
1.0 mA
1V
VILInput ‘‘Low’’ Voltage DP8212M 0.08 V
DP8212 0.85 V
V
IH
V
OL
V
OH
I
SC
I
l
l
O
I
CC
Input ‘‘High’’ Voltage 2.0 V
Output ‘‘Low’’ Voltage I
Output ‘‘High’’ Voltage I
Short-Circuit Output Current V
Output Leakage Current, High V Impedance State
e
10 mA DP8212M 0.45 V
OL
e
I
15 mA DP8212 0.45 V
OL
e
0.5 mA DP8212M 3.40 4.0 V
OH
e
I
1.0 mA DP8212 3.65 4.0 V
OH
e
O
e
O
e
0V, V
CC
5V
0.45V/VCCMax
b
15
b
75 mA
20 mA
Power Supply Current DP8212M 90 145 mA
DP8212 90 130 mA
Capacitance* F
e
1 MHz, V
BIAS
e
2.5V, V
CC
e
5V, T
e
25§C
A
Symbol Parameter Min Typ Max Units
C
IN
C
IN
C
OUT
*This parameter is sampled and not 100% tested.
DS1, MD Input Capacitance 9 12 pF
DS2, CLR, STB, DI1–DI8Input Capacitance 5 9 pF
DO1–DO8 Output Capacitance 8 12 pF
2
Page 3
s
Switching Characteristics Min
s
T
A
Max, MinsV
Symbol Parameter Conditions
s
Max
CC
DP8212M DP8212
Min Max Min Max
t
PW
t
PD
t
WE
t
SET
t
H
t
R
t
S
t
E
t
C
Note 1: C
Note 2: C
t
E (DISABLE)CL
Pulse Width 40 30 ns
Data to Output Delay (Note 1) 30 30 ns
Write Enable to Output Delay (Note 1) 50 40 ns
Data Set-Up Time 20 15 ns
Data Hold Time 30 20 ns
Reset to Output Delay (Note 1) 55 40 ns
Set to Output Delay (Note 1) 35 30 ns
Output Enable/Disable Time (Note 2) 50 45 ns
Clear to Output Delay (Note 1) 65 55 ns
e
30 pF
L
e
30 pF except for DP8212M
L
e
5pF
Switching Conditions
1. Input Pulse Amplitudee2.5V.
2. Input Rise and Fall Timese5 ns.
3. Between 1V and 2V Measurements made at 1.5V with 15 mA & 30 pF Test Load.
includes jig and probe capacitance.
4. C
L
e
5. C
30 pF.
L
e
6. C
30 pF except for DP8212M t
L
E (DISABLE)CL
e
5pF
Units
Test Load
TL/F/6824– 2
Alternate Test Load
(Refer to Timing Diagram)
TL/F/6824– 3
3
Page 4
Timing Diagram
TL/F/6824– 4
4
Page 5
Logic Diagram
TL/F/6824– 5
5
Page 6
Logic Tables
Logic Table A
STB MD (DS
0 0 0 TRI-STATE
1 0 0 TRI-STATE
0 1 0 DATA LATCH
1 1 0 DATA LATCH
0 0 1 DATA LATCH
1 0 1 DATA IN
0 1 1 DATA IN
1 1 1 DATA IN
CLR K resets data latch to the output low state.
The data latch clock is level sensitive, a low level clock latches the data.
CLR (DS
0 RESET 0 0 0 1
10001
10K10
1 1 RESET 0 0 0
10001
*Internal Service Request flip-flop.
DS2)
#
1
Logic Table B
DS2) STB Q* INT
#
1
Data Out
Equals
Functional Pin Definitions
The following describes the function of all the DP8212/ DP8212M input/output pins. Some of these descriptions reference internal circuits.
INPUT SIGNALS
Device Select (DS
high, the device is selected. The output buffers are enabled and the service request flip-flop is asynchronously reset (cleared) when the device is selected.
Mode (MD): When high (output mode), the output buffers are enabled and the source of the data latch clock input is the device selection logic (DS mode), the state of the output buffers is determined by the device selection logic (DS data latch clock input is the strobe (STB) input.
Strobe (STB): Used as data latch clock input when the mode (MD) input is low (input mode). Also used to synchro­nously set the service request flip-flop, which is negative edge triggered.
,DS2): When DS1is low and DS2is
1
DS2). When low (input
#
1
DS2) and the source of the
#
1
Data In (DI
which consists of eight D-type flip-flops. Incorporating a lev­el sensitive clock while the data latch clock input is high, the Q output of each flip-flop follows the data input. When the clock input returns low, the data latch stores the data input. The clock input high overrides the clear (CLR latch reset.
Clear (CLR
data latch and the service request flip-flop. The service re­quest flip-flop is in the non-interrupting state when reset.
OUTPUT SIGNALS
Interrupt (INT
the service request flip-flop is synchronously set by the strobe (STB) input or the device is selected.
Data Out (DO
which are TRI-STATE, non-inverting stages. These buffers have a common control line that either enables the buffers to transmit the data from the data latch outputs or disables the buffers by placing them in the high-impedance state.
–DI8): Eight-bit data input to the data latch,
1
) input data
): When low, asynchronously resets (clears) the
): Goes low (interrupting state) when either
–DO8): Eight-bit data output of data buffers,
1
Connection Diagram
Dual-In-Line Package
Top View
Order Number DP8212J, DP8212N
or DP8212MJ
See NS Package Number J24A or N24A
TL/F/6824– 6
6
Page 7
Applications in Microcomputer Systems
Gated Buffer
(TRI-STATE)
TL/F/6824– 7
TL/F/6824– 8
Interrupting Input Port
Interrupt Instruction Port
TL/F/6824– 10
TL/F/6824– 9
7
Page 8
Applications in Microcomputer Systems (Continued)
Output Port (with Hand-Shanking)
INS8080A Status Latch
TL/F/6824– 11
TL/F/6824– 12
8
Page 9
Physical Dimensions inches (millimeters)
Ceramic Dual-In-Line Package (J)
Order Number DP8212J or DP8212MJ
NS Package Number J24A
9
Page 10
Physical Dimensions inches (millimeters) (Continued)
DP8212/DP8212M 8-Bit Input/Output Port
Molded Dual-In-Line Package (N)
Order Number DP8212N
NS Package Number N24A
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