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DNB64
DNB64
Rectifier Diode
Replaces January 2000 version, DS4180-5.0 DS4180-6.0 August 2001
FEATURES
■ Double Side Cooling
■ High Surge Capability
APPLICATIONS
■ Rectification
■ Freewheel Diode
■ DC Motor Control
■ Power Supplies
■ Welding
■ Battery Chargers
VOLTAGE RATINGS
Type Number Repetitive Peak
Reverse Voltage
V
RRM
V
DNB64 36
DNB64 34
DNB64 32
DNB64 30
DNB64 28
DNB64 26
Lower voltage grades available.
3600
3400
3200
3000
2800
2600
Conditions
V
= V
RSM
RRM
+ 100V
KEY PARAMETERS
V
I
F(AV)
I
FSM
RRM
3600V
3019A
27000A
Outline type code: DO200AD
See Package Details for further information.
Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:
DNB64 34
Note: Please use the complete part number when ordering
and quote this number in any future correspondance relating
to your order.
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DNB64
CURRENT RATINGS
T
= 75oC unless otherwise stated
case
Symbol Parameter Conditions
Double Side Cooled
I
F(AV)
I
F(RMS)
I
Mean forward current
RMS value
F
Continuous (direct) forward current
Half wave resistive load 3019 A
Single Side Cooled (Anode side)
I
F(AV)
I
F(RMS)
I
F
T
= 100oC unless otherwise stated
case
Mean forward current
RMS value
Continuous (direct) forward current
Half wave resistive load 2280 A
Symbol Parameter Conditions
Double Side Cooled
I
F(AV)
Mean forward current
Half wave resistive load, T
UnitsMax.
- 4741 A
- 4414 A
- 3581 A
- 3182 A
UnitsMax.
= 100oC 2530 A
case
I
F(RMS)
I
F
RMS value
Continuous (direct) forward current
Single Side Cooled (Anode side)
I
F(AV)
I
F(RMS)
I
F
Mean forward current
RMS value
Continuous (direct) forward current
T
= 100oC 3980 A
case
T
= 100oC 3635 A
case
Half wave resistive load, T
T
= 100oC 2600 A
case
T
= 100oC 2280 A
case
= 100oC 1655 A
case
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SURGE RATINGS
DNB64
Symbol
I
FSM
2
tI
I
I
FSM
I2t
Surge (non-repetitive) forward current
2
t for fusing
Surge (non-repetitive) forward current
2
I
t for fusing 3.645 x 106A2s
Parameter
THERMAL AND MECHANICAL DATA
Symbol
R
th(j-c)
R
th(c-h)
Thermal resistance - junction to case
Thermal resistance - case to heatsink
Parameter
Conditions
10ms half sine; T
VR = 50% V
10ms half sine; T
VR = 0
Conditions Min. Max. Units
Double side cooled
Single side cooled
Clamping force 45.0kN
with mounting compound
case
- 1/4 sine
RRM
case
= 175oC
= 175oC
dc
Cathode dc
Double side
Single side
Max. Units
21.5 kA
6
2.33 x 10
A2s
27.0 kA
- 0.013oC/W
o
C/W- 0.025Anode dc
o
- 0.027
0.003
-
C/W
o
C/W
- 0.006oC/W
Forward (conducting) -
T
vj
Virtual junction temperature
Reverse (blocking) -
T
stg
-
Storage temperature range
Clamping force
-55 200
40.0 48.0 kN
185
175
o
C
o
C
o
C
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DNB64
CHARACTERISTICS
Symbol
V
FM
I
RRM
Q
S
I
RR
t
rr
V
TO
r
T
CURVES
10000
8000
Parameter
Forward voltage
Peak reverse current
Total stored charge
, T
At V
RRM
I
= 1000A, dIRR/dt = 5A/µs
F
Conditions Typ. Max. Units
= 25oC
case
= 175oC - 100 mA
case
- 1.1 VAt 1500A peak, T
4000
Peak recovery current 150 - A
T
= 125˚C, VR = 100V
case
Reverse recovery time 30 - µs
Threshold voltage
Slope resistance 0.2 mΩ
Measured under
pulse conditions
= 175˚C - 0.86 V
At T
vj
At Tvj = 175˚C -
10000
dc
8000
Half wave
µC-
- (A)
F
6000
4000
Instantaneous forward current, I
2000
0
01.02.03.0
Instantaneous forward voltage, V
Fig.2 Maximum (limit) forward characteristics Fig.3 Dissipation curves
VFM Equation:-
= A + Bln (IF) + C.IF+D.√I
V
FM
Tj = 25˚C
F
Tj = 175˚C
- (V)
F
3 phase
6000
6 phase
4000
Mean power dissipation - (W)
2000
0
0 2000 4000 6000
Mean forward current, I
Where A = 0.506497
B = 0.070975
C = 0.000219
D = –0.00553
these values are valid for T
- (A)
F(AV)
= 125˚C for IF 500A to 10000A
j
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DNB64
60
50
40
30
20
VR = 0
= 50% V
V
R
I2t
RRM
I2t = Î2 x t
2
5
4
I
2
t value - (A
3
2
s x 10
2
6
)
Peak half sine forward current - (kA)
10
0
1101235102050
1
0
ms Cycles at 50Hz
Duration
Fig.4 Surge (non-repetitive) forward current vs time
(at T
case
175˚C)
0.1
Effective thermal resistance
Junction to case ˚C/W
Double side
0.0130
0.0141
0.0170
0.0200
Anode side
0.0250
0.0261
0.0290
0.0320
Anode side cooled
Double side cooled
0.01
0.001
Thermal impedance - (˚C/W)
Conduction
d.c.
Halfwave
3 phase 120˚
6 phase 60˚
0.0001
1010.10.010.001
Time - (s)
Fig.5 Maximum (limit) transient thermal impedance -
junction to case
100
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DNB64
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Hole Ø3.6 x 2.0 deep
(One in each electrode)
Package outine type code: DO200AD
Note:
1. Package maybe supplied with pins and/or tags.
Ø102 max
Ø63nom
Ø63nom
Ø92 max
Nominal weight: 1100g
Clamping force: 45kN ±10%
Cathode
32.9
Anode
34.1
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DNB64
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4180-6 Issue No. 6.0August 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
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