Datasheet DAN222 Datasheet (ON Semiconductor)

DAN222

Common Cathode Silicon
Dual Switching Diode

This Common Cathode Silicon Epitaxial Planar Dual Diode is
designed for use in ultra high speed switching applications. This
device is housed in the SOT–416/SC–90 package which is designed
for low power surface mount applications, where board space is at a
premium.

• Fast t

• Low C

• Available in 8 mm T ape and Reel

rr

D

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SOT–416/SC–90 PACKAGE

COMMON CATHODE

DUAL SWITCHING DIODE

SURFACE MOUNT

MAXIMUM RATINGS (TA = 25°C)

Rating Symbol Value Unit

Reverse Voltage V
Peak Reverse Voltage V
Forward Current I
Peak Forward Current I
Peak Forward Surge Current I

THERMAL CHARACTERISTICS

Rating Symbol Max Unit

Power Dissipation P
Junction Temperature T
Storage Temperature Range T

1. t = 1 µS

R

RM

F

FM

(1) 2.0 Adc

FSM

D
J

stg

80 Vdc

80 Vdc
100 mAdc
300 mAdc

150 mW
150 °C

–55 to +150 °C

CATHODE

3

12

ANODE

3

2

1

SOT–416

CASE 463

STYLE 3

DEVICE MARKING

 Semiconductor Components Industries, LLC, 2000

March, 2000 – Rev . 2

N9

ORDERING INFORMATION

Device Package Shipping

DAN222 SOT–416 3000/Tape & Reel

1 Publication Order Number:

DAN222/D

DAN222

ELECTRICAL CHARACTERISTICS (T

Characteristic

Reverse Voltage Leakage Current I
Forward Voltage V
Reverse Breakdown Voltage V
Diode Capacitance C

= 25°C)

A

Symbol Condition Min Max Unit

R

F
R
D

VR = 70 V — 0.1 µAdc
IF = 100 mA — 1.2 Vdc
IR = 100 µA 80 — Vdc

VR = 6.0 V, f = 1.0 MHz — 3.5 pF

Reverse Recovery Time trr(2) IF = 5.0 mA, VR = 6.0 V, RL = 100 Ω, Irr = 0.1 I

2. trr Test Circuit on following page.

— 4.0 ns

R

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DAN222

TYPICAL ELECTRICAL CHARACTERISTICS

100

10

1.0

, FORWARD CURRENT (mA)

F

I

0.1

0.2 0.4

TA = 85°C

TA = –40°C

TA = 25°C

0.6 0.8 1.0

VF, FORWARD VOLTAGE (VOLTS)

1.2

, REVERSE CURRENT (µA)

R

I

1.0

0.1

0.01

0.001

10

0

10 20 30 40

TA = 150°C
TA = 125°C

TA = 85°C

TA = 55°C

TA = 25°C

, REVERSE VOLTAGE (VOLTS)

V

R

Figure 1. Forward Voltage Figure 2. Reverse Current

1.0

0.9

0.8

50

, DIODE CAPACITANCE (pF)

D

C

0.7

0.6
0

2468

, REVERSE VOLTAGE (VOLTS)

V

R

Figure 3. Diode Capacitance

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3

DAN222

RECOVERY TIME EQUIVALENT TEST CIRCUIT

R

t

rr

= 6 V

R

= 100 Ω

L

L

= 0.1 I

I

rr

A

INPUT PULSE OUTPUT PULSE

t

r

t

p

I

t

10%

90%

V

R

tp = 2 µs
t

= 0.35 ns

r

F

IF = 5.0 mA
V
R

t

R

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DAN222

INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection

0.5 min. (3x)

TYPICAL
SOLDERING PATTERN

Unit: mm

0.5 min. (3x)

SOT–416/SC–90 POWER DISSIPATION

The power dissipation of the SOT–416/SC–90 is a
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by T
junction temperature of the die, R

, the maximum rated

J(max)

, the thermal

JA

θ

resistance from the device junction to ambient; and the
operating temperature, TA. Using the values provided on
the data sheet, PD can be calculated as follows.

PD =

J(max)

R

A

θ

JA

T

– T

The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values

interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.

0.5

1

1.4

into the equation for an ambient temperature T

of 25°C,

A

one can calculate the power dissipation of the device which
in this case is 125 milliwatts.

PD =

150°C – 25°C

833°C/W

= 150 milliwatts

The 833°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 150 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, a higher power dissipation can be
achieved using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.

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• The soldering temperature and time should not exceed
260°C for more than 10 seconds.

• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.

• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied
during cooling

* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.

5

DAN222

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 4 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.

The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.

The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.

200°C

150°C

100°C

50°C

STEP 1

PREHEAT

ZONE 1
“RAMP”

DESIRED CURVE FOR HIGH

TIME (3 TO 7 MINUTES TOTAL) T

STEP 2

VENT

“SOAK”

ZONES 2 & 5

MASS ASSEMBLIES

150°C

100°C

DESIRED CURVE FOR LOW

STEP 3

HEATING

“RAMP”

160°C

MASS ASSEMBLIES

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

140°C

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

170°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

Figure 4. T ypical Solder Heating Profile

STEP 6

VENT

MAX

STEP 7

COOLING

205° TO 219°C

PEAK AT

SOLDER JOINT

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6

S

D

3 PL

0.20 (0.008) B

M

J

–A–

3

DAN222

P ACKAGE DIMENSIONS

SOT–416/SC–90

CASE 463–01

ISSUE B

2

G

–B–

1

0.20 (0.008) A

K

C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

DIM MIN MAX MIN MAX

A 0.70 0.80 0.028 0.031
B 1.40 1.80 0.055 0.071
C 0.60 0.90 0.024 0.035
D 0.15 0.30 0.006 0.012
G 1.00 BSC 0.039 BSC
H ––– 0.10 ––– 0.004
J 0.10 0.25 0.004 0.010
K 1.45 1.75 0.057 0.069
L 0.10 0.20 0.004 0.008
S 0.50 BSC 0.020 BSC

INCHESMILLIMETERS

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

L

H

STYLE 2:

PIN 1. ANODE

2. N/C

3. CATHODE

STYLE 3:

PIN 1. ANODE

2. ANODE

3. CATHODE

STYLE 4:

PIN 1. CATHODE

2. CATHODE

3. ANODE

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DAN222

Thermal Clad is a trademark of the Bergquist Company .

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .

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DAN222/D