Datasheet DAC7612UB-2K5, DAC7612UB, DAC7612U-2K5, DAC7612U Datasheet (Burr Brown Corporation)

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© 1999 Burr-Brown Corporation PDS-1501A Printed in U.S.A. June, 1999
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
®
DAC7612
Dual, 12-Bit Serial Input
DIGITAL-TO-ANALOG CONVERTER
DESCRIPTION
The synchronous serial interface is compatible with a wide variety of DSPs and microcontrollers. Clock (CLK), Serial Data In (SDI), Chip Select (CS) and Load DACs (LOADDACS) comprise the serial inter­face.
The DAC7612 is available in an 8-lead SOIC package and is fully specified over the industrial temperature range of –40°C to +85°C.
FEATURES
LOW POWER: 3.7mW
FAST SETTLING: 7µs to 1 LSB
1mV LSB WITH 4.095V FULL-SCALE
RANGE
COMPLETE WITH REFERENCE
12-BIT LINEARITY AND MONOTONICITY
OVER INDUSTRIAL TEMP RANGE
3-WIRE INTERFACE: Up to 20MHz Clock
SMALL PACKAGE: 8-Lead SOIC
APPLICATIONS
PROCESS CONTROL
DATA ACQUISITION SYSTEMS
CLOSED-LOOP SERVO-CONTROL
PC PERIPHERALS
PORTABLE INSTRUMENTATION
DAC7612
12-Bit DAC A
DAC Register A
14-Bit Serial Shift Register
12
12
DAC Register B
Ref
12
12
LOADDACS
CS
CLK
SDI
V
DD
GND
V
OUTA
DAC7612
12-Bit DAC B
V
OUTB
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DAC7612
SPECIFICATIONS
At TA = –40°C to +85°C, and VDD = +5V, unless otherwise noted.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
DAC7612U DAC7612UB
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS RESOLUTION 12 Bits
ACCURACY
Relative Accuracy
(1)
–2 ±1/2 +2 –1 ±1/4 +1 LSB Differential Nonlinearity Guaranteed Monotonic –1 ±1/2 +1 –1 ±1/4 +1 LSB Zero-Scale Error Code 000
H
–1 +1 +3 ✻✻✻ LSB Zero Scale Match Code 000
H
1/2 1/2 2 LSB
Full-Scale Voltage Code FFF
H
4.079 4.095 4.111 4.087 4.095 4.103 V
Full-Scale Match Code FFF
H
1/2 1/2 2 LSB
ANALOG OUTPUT
Output Current Code 800
H
±5 ±7 ✻✻ mA Load Regulation R
LOAD
402, Code 800
H
13 ✻✻ LSB Capacitive Load No Oscillation 500 pF Short-Circuit Current ±15 mA Short-Circuit Duration GND or V
DD
Indefinite
DIGITAL INPUT
Data Format Serial Data Coding Straight Binary Logic Family CMOS Logic Levels
V
IH
0.7 • V
DD
V
V
IL
0.3 • V
DD
V
I
IH
±10 µA
I
IL
±10 µA
DYNAMIC PERFORMANCE
Settling Time
(2)
(tS) To ±1 LSB of Final Value 7 µs DAC Glitch 2.5 nV-s Digital Feedthrough 0.5 nV-s
POWER SUPPLY
V
DD
+4.75 +5.0 +5.25 ✻✻✻ V
I
DD
VIH = 5V, VIL = 0V, No Load, at Code 000
H
0.75 1.5 ✻✻ mA
Power Dissipation V
IH
= 5V, VIL = 0V, No Load 3.5 7.5 ✻✻ mW
Power Supply Sensitivity ∆V
DD
= ±5% 0.0025 0.002 ✻✻%/%
TEMPERATURE RANGE
Specified Performance –40 +85 ✻✻°C
Same specification as for DAC7612U.
NOTES: (1) This term is sometimes referred to as Linearity Error or Integral Nonlinearity (INL). (2) Specification does not apply to negative-going transitions where the final output voltage will be within 3 LSBs of ground. In this region, settling time may be double the value indicated.
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DAC7612
PIN CONFIGURATION
Top View SO-8
VDD to GND .......................................................................... –0.3V to 6V
Digital Inputs to GND .............................................. –0.3V to V
DD
+ 0.3V
V
OUT
to GND ........................................................... –0.3V to VDD + 0.3V
Power Dissipation ........................................................................ 325mW
Thermal Resistance,
θ
JA
........................................................... 150°C/W
Maximum Junction Temperature.................................................. +150°C
Operating Temperature Range ...................................... –40°C to +85°C
Storage Temperature Range ....................................... –65 °C to +150°C
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
(1)
PIN DESCRIPTIONS
PIN LABEL DESCRIPTION
1 SDI Serial Data Input. Data is clocked into the internal
serial register on the rising edge of CLK. 2 CLK Synchronous Clock for the Serial Data Input. 3 LOADDACS Loads the internal DAC registers. All DAC registers
are transparent latches and are transparent when
LOADDACS is LOW (regardless of the state of CS
or CLK). 4 CS Chip Select. Active LOW. 5V
OUTB
DAC B Output Voltage 6 GND Ground 7V
DD
Positive Power Supply 8V
OUTA
DAC A Output Voltage
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada­tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE DIFFERENTIAL SPECIFICATION PACKAGE
ACCURACY NONLINEARITY TEMPERATURE DRAWING ORDERING TRANSPORT
PRODUCT (LSB) (LSB) RANGE PACKAGE NUMBER
(1)
NUMBER
(2)
MEDIA
DAC7612U ±2 ±1 –40°C to +85°C SO-8 182 DAC7612U Rails
"" " " ""DAC7612U/2K5 Tape and Reel
DAC7612UB ±1 ±1 –40°C to +85°C SO-8 182 DAC7612UB Rails
"" " " ""DAC7612UB/2K5 Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DAC7612U/2K5” will get a single 2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
1 2 3 4
8 7 6
5
SDI
CLK
LOADDACS
CS
V
OUTA
V
DD
GND V
OUTB
DAC7612U
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DAC7612
EQUIVALENT INPUT LOGIC
Serial Shift Register
DAC B Register
DAC A Register
DAC Switches
Data
DAC Switches
12
12
12
12
ESD protection
diodes to V
DD
and GND
LOADDACS
SDI
CS
CLK
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DAC7612
TIMING DIAGRAMS
LOGIC TRUTH TABLE TIMING SPECIFICATIONS
TA = –40°C to +85°C and VDD = +5V.
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
CH
Clock Width HIGH 30 ns
t
CL
Clock Width LOW 30 ns
t
LDW
Load Pulse Width 20 ns
t
DS
Data Setup 15 ns
t
DH
Data Hold 15 ns
t
LD1
Load Setup 15 ns
t
LD2
Load Hold 10 ns
t
CSS
Select 30 ns
t
CSH
Deselect 20 ns
NOTE: All input control signals are specified with t
R
= tF = 5ns (10% to 90% of +5V) and timed from a voltage level of 2.5V. These parameters are guaranteed by design and are not subject to production testing.
SDI
CLK
t
CL
t
CH
t
DH
t
DS
SERIAL SHIFT DAC DAC
A1 A0
CLK
CS
LOADDACS
REGISTER REGISTER A REGISTER B
X X X H H No Change No Change No Change XX
L H Shifts One Bit No Change No Change
LXXH
(1)
L No Change Loads Serial Loads Serial
Data Word Data Word
H L X H L No Change Loads Serial No Change
Data Word
H H X H L No Change No Change Loads Serial
Data Word
Positive Logic Transition; X = Don’t Care.
NOTE: (1) A HIGH value is suggested in order to avoid to “false clock” from advancing the shift register and changing the DAC voltage.
B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DATA INPUT TABLE
A1
(MSB) (LSB)
SDI
CLK
CS
LOADDACS
A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
t
CSS
t
LD1
t
LD2
t
CSH
LOADDACS
FS ZS
V
OUT
t
LDW
t
S
±1 LSB Error Band
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DAC7612
TYPICAL PERFORMANCE CURVES
At TA = +25°, and VDD = 5V, unless otherwise specified.
5.0
4.8
4.6
4.4
4.2
4.0
MINIMUM SUPPLY VOLTAGE vs LOAD
V
DD
Minimum (V)
Output Load Current (mA)
0.01 0.1 1 10
5
4
3
2
1
0
OUTPUT SWING vs LOAD
Output Voltage (V)
Load Resistance ()
10 100 1k 10k 100k
RL tied to V
DD
Data = 000
H
RL tied to GND
Data = FFF
H
70
60
50
40
30
20
10
0
POWER SUPPLY REJECTION vs FREQUENCY
PSR (dB)
Frequency (Hz)
10 100 1k 10k 100k 1M
Data = FFF
H
VDD = 5V ±200mV AC
Time (2ms/div)
Code = FFF
H
, BW = 1MHz
BROADBAND NOISE
Noise Voltage (500µV/div)
1k
100
10
1
0.1
0.01
PULL-DOWN VOLTAGE vs OUTPUT SINK CURRENT
Delta V
OUT
(mV)
Current (mA)
0.001 0.01 0.1 1 10 100
+85°C
Data = 000
H
–40°C
+25°C
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5 0
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE
Supply Current (mA)
Logic Voltage (V)
012345
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DAC7612
RISE TIME DETAIL
V
OUT
(1mV/div)
Time (10µs/div)
LOADDACS
CL = 100pF
R
L
= No Load
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°, and VDD = 5V, unless otherwise specified.
20 15 10
5 0
–5 –10 –15 –20
SHORT-CIRCUIT CURRENT vs OUTPUT VOLTAGE
Output Current (mA)
Output Voltage (V)
01 423 56
Positive Current
Limit
Data = 800
H
Output tied to I
SOURCE
Negative
Current
Limit
MIDSCALE GLITCH PERFORMANCE
V
OUT
(5mV/div)
Time (500ns/div)
7FFH to 800
H
LOADDACS
MIDSCALE GLITCH PERFORMANCE
V
OUT
(5mV/div)
Time (500ns/div)
800H to 7FF
H
LOADDACS
LARGE-SIGNAL SETTLING TIME
V
OUT
(1V/div)
Time (20µs/div)
CL = 100pF R
L
= No Load
LOADDACS
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2 0
SUPPLY CURRENT vs TEMPERATURE
Supply Current (mA)
Temperature (°C)
–50 –30 –10 10 30 50 70 90 110 130
V
LOGIC
= 3.5V
Data = FFF
H
No Load
VDD = 4.75V
At worst-case digital inputs.
VDD = 5.25V
VDD = 5.0V
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DAC7612
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°, and VDD = 5V, unless otherwise specified.
10.000
1.000
0.100
0.010
OUTPUT VOLTAGE NOISE vs FREQUENCY
Noise (µV/Hz)
Frequency (Hz)
10 100 1k 10k 100k
Data = FFF
H
5 4 3 2 1
0 –1 –2 –3 –4 –5
LONG-TERM DRIFT ACCELERATED BY BURN-IN
Output Voltage Change at FS (mV)
Hours of Operation at +150°C
0 168 336 504 672 840 1008
Max
Avg
Min
4.111
4.103
4.095
4.087
4.079
FULL-SCALE VOLTAGE vs TEMPERATURE
Full-Scale Output (V)
Temperature (°C)
–40 –15 10 35 60 85
Avg + 3σ
Avg – 3σ
Avg
35
30
25
20
15
10
5
0
–12
–10 –8 –6 –4 –2 0 2 84 6 10 12
T.U.E = Σ (INL + ZSE + FSE)
Sample Size = 200 Units
T
A
= +25°C
Number of Units
TOTAL UNADJUSTED ERROR HISTOGRAM
FALL TIME DETAIL
V
OUT
(1mV/div)
Time (10µs/div)
CL = 100pF
R
L
= No Load
LOADDACS
3
2
1
0
–1
ZERO-SCALE VOLTAGE vs TEMPERATURE
Zero-Scale Output (mV)
Temperature (°C)
–40 –15 10 35 60 85
Avg – 3σ
Avg
Avg + 3σ
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DAC7612
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°, and VDD = 5V, unless otherwise specified.
2.0
1.5
1.0
0.5 0
–0.5 –1.0 –1.5 –2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC A at +85°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5 0
–0.5 –1.0 –1.5 –2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC B at +85°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5 0
–0.5 –1.0 –1.5 –2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC A at +25°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5 0
–0.5 –1.0 –1.5 –2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC B at +25°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5 0
–0.5 –1.0 –1.5 –2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC A at –40°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
2.0
1.5
1.0
0.5 0
–0.5 –1.0 –1.5 –2.0
LINEARITY ERROR vs DIGITAL CODE
(DAC B at –40°C)
Linearity Error (LSBs)
Code
0 512 1024 1536 2048 2560 3072 3584 4096
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DAC7612
next 12 bits are the code (MSB-first) sent to the DAC. The data format is Straight Binary and is loaded MSB-first into the shift registers after loading the address bits. Table I shows the relationship between input code and output voltage.
The digital data into the DAC7612 is double-buffered. This means that new data can be entered into the chosen DAC without disturbing the old data and the analog output of the converter. At some point after the data has been entered into the serial shift register, this data can be transferred into the DAC registers. This transfer is accomplished with a HIGH to LOW transition of the LOADDACS pin. The LOADDACS pin makes the DAC registers transparent. If new data is shifted into the shift register while LOADDACS is LOW, the DAC output voltages will change as each new bit is entered. To prevent this, LOADDACS must be returned HIGH prior to shifting in new serial data.
DIGITAL-TO-ANALOG CONVERTER
The internal DAC section is a 12-bit voltage output device that swings between ground and the internal ref­erence voltage. The DAC is realized by a laser-trimmed R-2R ladder network which is switched by N-channel MOSFETs. Each DAC output is internally connected to a rail-to-rail output operational amplifier.
OUTPUT AMPLIFIER
A precision, low-power amplifier buffers the output of each DAC section and provides additional gain to achieve a 0V to
4.095V range. Each amplifier has low offset voltage, low
OPERATION
The DAC7612 is a dual, 12-bit digital-to-analog converter (DAC) complete with a serial-to-parallel shift register, DAC registers, laser-trimmed 12-bit DACs, on-board reference, and rail-to-rail output amplifiers. Figure 1 shows the basic operation of the DAC7612.
INTERFACE
Figure 1 shows the basic connection between a microcontroller and the DAC7612. The interface consists of a Serial Clock (CLK), Serial Data (SDI), and a Load DAC signal (LOADDACS). In addition, a chip select (CS) input is available to enable serial communication when there are multiple serial devices. Loading either DAC A or DAC B is done by shifting 14 serial bits in via the SDI input. The first 2 bits represent the address of the DAC to be updated and the
DAC7612 Full-Scale Range = 4.095V Least Significant Bit = 1mV
DIGITAL INPUT CODE ANALOG OUTPUT STRAIGHT OFFSETBINARY (V) DESCRIPTION
FFF
H
+4.095 Full Scale
801
H
+2.049 Midscale + 1 LSB
800
H
+2.048 Midscale
7FF
H
+2.047 Midscale – 1 LSB
000
H
0 Zero Scale
TABLE I. Digital Input Code and Corresponding Ideal
Analog Output.
FIGURE 1. Basic Operation of the DAC7612.
1 2 3 4
8 7 6 5
SDI CLK LOADDACS CS
V
OUTA
V
DD
GND
V
OUTB
DAC7612U
Serial Data
Serial Clock
Load DACs Chip Select
0.1µF
0V to +4.095V
0V to +4.095V
10µF
+
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DAC7612
noise, and a set gain of 1.682V/V (4.095/2.435). See Figure 2 for an equivalent circuit schematic of the analog portion of the DAC7612.
The output amplifier has a 7µs typical settling time to ±1 LSB of the final value. Note that there are differences in the settling time for negative-going signals versus positive­going signals.
The rail-to-rail output stage of the amplifier provides the full­scale range of 0V to 4.095V while operating on a supply voltage as low as 4.75V. In addition to its ability to drive resistive loads, the amplifier will remain stable while driving capacitive loads of up to 500pF. See Figure 3 for an equivalent circuit schematic of the amplifier’s output driver and the Typical Performance Curves section for more information regarding settling time, load driving capability, and output noise.
POWER SUPPLY
A BiCMOS process and careful design of the bipolar and CMOS sections of the DAC7612 result in a very low power device. Bipolar transistors are used where tight matching and low noise are needed to achieve analog accuracy, and CMOS transistors are used for logic, switching functions and for other low power stages.
If power consumption is critical, it is important to keep the logic levels on the digital inputs (SDI, CLK, CS, LOADDACS) as close as possible to either VDD or ground. This will keep the CMOS inputs (see “Supply Current vs Logic Input Voltages” in the Typical Performance Curves) from shunting current between VDD and ground.
The DAC7612 power supply should be bypassed as shown in Figure 1. The bypass capacitors should be placed as close to the device as possible, with the 0.1µF capacitor taking priority in this regard. The “Power Supply Rejection vs Frequency” graph in the Typical Performance Curves sec­tion shows the PSRR performance of the DAC7612. This should be taken into account when using switching power supplies or DC/DC converters.
In addition to offering guaranteed performance with VDD in the 4.75V to 5.25V range, the DAC7612 will operate with reduced performance down to 4.5V. Operation between
4.5V and 4.75V will result in longer settling time, reduced performance, and current sourcing capability. Consult the “VDD vs Load Current” graph in the Typical Performance Curves section for more information.
FIGURE 2. Simplified Schematic of Analog Portion.
FIGURE 3. Simplified Driver Section of Output Amplifier.
N-Channel
P-Channel
V
DD
V
OUT
GND
2R
2R
2R
R
2R
2R
R
R
1
R
R
2
Output Amplifier
R-2R DAC
Bandgap
Reference
2.435V
Typical of DAC A or DAC B
Buffer
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DAC7612
FIGURE 4. Suggested Power and Ground Connections for a DAC7612 Sharing a +5V Supply with a Digital System.
APPLICATIONS
POWER AND GROUNDING
The DAC7612 can be used in a wide variety of situations— from low power, battery operated systems to large-scale industrial process control systems. In addition, some appli­cations require better performance than others, or are par­ticularly sensitive to one or two specific parameters. This diversity makes it difficult to define definite rules to follow concerning the power supply, bypassing, and grounding. The following discussion must be considered in relation to the desired performance and needs of the particular system.
A precision analog component requires careful layout, ad­equate bypassing, and a clean, well-regulated power supply. As the DAC7612 is a single-supply, +5V component, it will often be used in conjunction with digital logic, microcontrollers, microprocessors, and digital signal proces­sors. The more digital logic present in the design and the higher the switching speed, the more difficult it will be to achieve good performance.
Because the DAC7612 has a single ground pin, all return currents, including digital and analog return currents, must flow through this pin. The GND pin is also the ground
reference point for the internal bandgap reference. Ideally, GND would be connected directly to an analog ground plane. This plane would be separate from the ground con­nection for the digital components until they are connected at the power entry point of the system (see Figure 4).
The power applied to VDD should be well regulated and low­noise. Switching power supplies and DC/DC converters will often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high frequency spikes as their internal logic switches states. This noise can easily couple into the DAC output voltage through various paths between VDD and V
OUT
.
As with the GND connection, VDD should be connected to a +5V power supply plane or trace that is separate from the connection for digital logic until they are connected at the power entry point. In addition, the 10µF and 0.1µF capaci­tors shown in Figure 4 are strongly recommended and should be installed as close to VDD and ground as possible. In some situations, additional bypassing may be required such as a 100µF electrolytic capacitor or even a “Pi” filter made up of inductors and capacitors—all designed to essen­tially lowpass filter the +5V supply, removing the high frequency noise (see Figure 4).
+
+5V
GND
100µF
Digital Circuits
+5V
GND
+5V Power Supply
Other
Analog
Components
V
DD
GND
DAC7612
+
10µF
0.1µF
Optional
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