Datasheet DAC08EP, DAC08CS-REEL, DAC08CS, DAC08HP, DAC08ES-REEL Datasheet (Analog Devices)

...
Page 1
8-Bit, High-Speed, Multiplying D/A Converter
a
(Universal Digital Logic Interface)
FEATURES Fast Settling Output Current: 85 ns Full-Scale Current Prematched to 1 LSB Direct Interface to TTL, CMOS, ECL, HTL, PMOS Nonlinearity to 0.1% Maximum over
Temperature Range
High Output Impedance and Compliance:
–10 V to +18 V Complementary Current Outputs Wide Range Multiplying Capability: 1 MHz Bandwidth Low FS Current Drift: 10 ppm/ⴗC Wide Power Supply Range: 4.5 V to 18 V Low Power Consumption: 33 mW @ 5 V Low Cost Available in Die Form
GENERAL DESCRIPTION
The DAC08 series of 8-bit monolithic digital-to-analog convert­ers provide very high-speed performance coupled with low cost and outstanding applications flexibility.
Advanced circuit design achieves 85 ns settling times with very low “glitch” energy and at low power consumption. Monotonic multiplying performance is attained over a wide 20-to-1 reference current range. Matching to within 1 LSB between reference and
DAC08
full-scale currents eliminates the need for full-scale trimming in most applications. Direct interface to all popular logic families with full noise immunity is provided by the high swing, adjust­able threshold logic input.
High voltage compliance complementary current outputs are provided, increasing versatility and enabling differential opera­tion to effectively double the peak-to-peak output swing. In many applications, the outputs can be directly converted to voltage without the need for an external op amp.
All DAC08 series models guarantee full 8-bit monotonicity, and nonlinearities as tight as ± 0.1% over the entire operating temperature range are available. Device performance is essen­tially unchanged over the ±4.5 V to ±18 V power supply range, with 33 mW power consumption attainable at ±5 V supplies.
The compact size and low power consumption make the DAC08 attractive for portable and military/aerospace applications; devices processed to MIL-STD-883, Level B are available.
DAC08 applications include 8-bit, 1 µs A/D converters, servo motor and pen drivers, waveform generators, audio encoders and attenuators, analog meter drivers, programmable power supplies, CRT display drivers, high-speed modems and other applications where low cost, high speed and complete input/ output versatility are required.

FUNCTIONAL BLOCK DIAGRAM

V+
13 1 5 6 7 8 9 10 11 12
DAC08
BIAS NETWORK
14
V
(+)
REF
15
V
(–)
REF
REFERENCE AMPLIFIER
16
COMP
V
LC
CURRENT SWITCHES
MSB
B1
V–
B2 B3 B4 B5 B6 B7
3
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
LSB
B8
I
OUT
4 2
I
OUT
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002
Page 2
DAC08–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
for DAC08E and DAC08H, –40C to +85C for DAC08C, unless otherwise noted. Output characteristics refer to both I
(@ VS = 15 V, I
= 2.0 mA, –55C TA +125C for DAC08/08A, 0C TA +70C
REF
OUT
and
I
.)
OUT
DAC08A/H DAC08E DAC08C
Parameter Symbol Conditions Min Typ Max Min Typ Max Min Typ Max Unit
Resolution 8 8 8 Bits Monotonicity 8 8 8 Bits Nonlinearity NL ± 0.1 ± 0.19 ± 0.39 % FS Settling Time t
Propagation Delay
Each Bit t All Bits Switched t
Full-Scale Tempco
1
S
PLH
PHL
TCI
To ± 1/2 LSB, 85 135 85 150 85 150 ns All Bits Switched ON or OFF, T
TA = 25°C
= 25°C
A
1
1
35 60 35 60 35 60 ns 35 60 35 60 35 60 ns
FS
± 10 ± 50 ± 10 ± 80 ±10 ± 80 ppm/°C
DAC08E ± 50
Output Voltage
Compliance V
Full-Scale Current
OC
(True Compliance) Change <1/2 LSB, –10 +18 –10 +18 –10 +18 V
R
> 20 M typ
Full Range Current I
FR4
OUT
V
= 10.000 V 1.984 1.992 2.000 1.94 1.99 2.04 1.94 1.99 2.04 mA
REF
R14, R15 = 5.000 k T
= 25°C Full Range Symmetry I Zero-Scale Current I Output Current Range I
I
FRS
ZS
OR1
OR2
A
I
FR4
– I
FR2
± 0.5 ± 4 ± 1 ± 8 ±2 ± 16 µA
0.1 1 0.2 2 0.2 4 µA R14, R15 = 5.000 k 2.1 2.1 2.1 mA V
= +15.0 V,
REF
V– = –10 V V
= +25.0 V, 4.2 4.2 4.2 mA
REF
V– = –12 V
Output Current Noise I
= 2 mA 25 25 25 nA
REF
Logic Input Levels
Logic “0” V Logic Input “1” V
Logic Input Current V
Logic “0” I Logic Input “1” I
IL
IH
Logic Input Swing V Logic Threshold Range V Reference Bias Current I
15
Reference Input dI/dt R
Slew Rate R
Power Supply Sensitivity PSSI
PSSI
Power Supply Current I+ VS = ± 5 V, I
VLC = 0 V 0.8 0.8 0.8 V
IL
IL
LC
= 0 V
22 2 V
VIN = –10 V to +0.8 V –2 –10 –2 –10 –2 –10 µA VIN = 2.0 V to 18 V 0.002 10 0.002 10 0.002 10 µA V– = –15 V –10 +18 –10 +18 –10 +18 V
IS
THR
VS = ± 15 V
1
–10 +13.5 –10 +13.5 –10 +13.5 V
–1 –3 –1 –3 –1 –3 µA
= 200 4 8 4 8 4 8 mA/µs
EQ
= 100
L
C
= 0 pF See Fast Pulsed Ref. Info Following.
C
V+ = 4.5 V to 18 V ± 0.0003 ± 0.01 ± 0.0003 ± 0.01 ± 0.0003 ± 0.01 %∆IO/%V+
FS+
V– = –4.5 V to –18 V ± 0.002 ± 0.01 ± 0.002 ±0.01 ± 0.002 ± 0.01 %∆IO/%V–
FS–
I
= 1.0 mA
REF
= 1.0 mA 2.3 3.8 2.3 3.8 2.3 3.8 mA
REF
1
I– –4.3 –5.8 –4.3 –5.8 –4.3 –5.8 mA
Power Dissipation P
I+ V I– I I+ V I– I
D
= +5 V, –15 V, 2.4 3.8 2.4 3.8 2.4 3.8 mA
S
= 2.0 mA –6.4 –7.8 –6.4 –7.8 –6.4 –7.8 mA
REF
= ±15 V, 2.5 3.8 2.5 3.8 2.5 3.8 mA
S
= 2.0 mA –6.5 –7.8 –6.5 –7.8 –6.5 –7.8 mA
REF
± 5 V, I
= 1.0 mA 33 48 33 48 33 48 mW
REF
+5 V, –15 V, I
= 2.0 mA 108 136 103 136 108 136 mW
REF
± 15 V, I
NOTES
1
Guaranteed by design.
Specifications subject to change without notice.
= 2.0 mA 135 174 135 174 135 174 mW
REF
–2–
REV. B
Page 3
DAC08
WARNING!
ESD SENSITIVE DEVICE
TYPICAL ELECTRICAL CHARACTERISTICS
(@ VS = 15 V, and I
characteristics apply to both I
= 2.0 mA, unless otherwise noted. Output
REF
OUT
and
I
.)
OUT
All Grades
Parameter Symbol Conditions Typical Unit
Reference Input Slew Rate dI/dt 8 mA/µs Propagation Delay t Settling Time t
PLH
S
, t
PHL
TA = 25°C, Any Bit 35 ns To ± 1/2 LSB, All Bits Switched ON or OFF, 85 ns TA = 25°C
Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

1
Operating Temperature
DAC08AQ, Q . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
DAC08HQ, EQ, CQ, HP, EP . . . . . . . . . . . . 0°C to +70°C
DAC08CP, CS . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature (T
) . . . . . . . . . . . . . –65°C to +150°C
J
Storage Temperature Q Package . . . . . . . . . –65°C to +150°C
Storage Temperature P Package . . . . . . . . . –65°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . V– to V– plus 36 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V– to V+
V
LC
Analog Current Outputs (at V Reference Input (V
to V15) . . . . . . . . . . . . . . . . . . . V– to V+
14
– = 15 V) . . . . . . . . . . 4.25 mA
S
Package Type
16-Lead Cerdip (Q) 100 16 °C/W 16-Lead Plastic DIP (P) 82 39 °C/W 20-Terminal LCC (RC) 76 36 °C/W 16-Lead SO (S) 111 35 °C/W
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θJA is specified for worst-case mounting conditions, i.e., θJA is specified for device
in socket for cerdip, Plastic DIP, and LCC packages; θJA is specified for device soldered to printed circuit board for SO package.
2
JA
JC
Unit
Reference Input Differential Voltage
to V15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
(V
14
Reference Input Current (I
) . . . . . . . . . . . . . . . . . . . 5.0 mA
14
ORDERING GUIDE
1
Temperature Package Package # Parts Per
Model NL Range Description Option Container
DAC08AQ ± 0.10% –55°C to +125°C Cerdip-16 Q-16 25 DAC08AQ
2
/883C ±0.10% –55°C to +125°C Cerdip-16 Q-16 25 DAC08HP ± 0.10% 0°C to 70°C P-DIP-16 N-16 25 DAC08HQ ± 0.10% 0°C to 70°C Cerdip-16 Q-16 25 DAC08Q ± 0.19% –55°C to +125°C Cerdip-16 Q-16 25 DAC08Q
2
/883C ± 0.19% –55°C to +125°C Cerdip-16 Q-16 25 DAC08RC/883C ± 0.19% –55°C to +125°C LCC-20 E-20 55 DAC08EP ± 0.19% 0°C to 70°C P-DIP-16 N-16 25 DAC08EQ ± 0.19% 0°C to 70°C Cerdip-16 Q-16 25 DAC08ES ±0.19% 0°C to 70°C SO-16 R-16A (Narrow Body) 47 DAC08ES-REEL ±0.19% 0°C to 70° C SO-16 R-16A (Narrow Body) 2500 DAC08CP ± 0.39% –40°C to +85°C P-DIP-16 N-16 25 DAC08CQ ± 0.39% 0°C to 70°C Cerdip-16 Q-16 25 DAC08CS ± 0.39% –40°C to +85°C SO-16 R-16A (Narrow Body) 47 DAC08CS-REEL ± 0.39% –40°C to +85°C SO-16 R-16A (Narrow Body) 2500 DAC08NBC ± 0.10% 25°C DICE DAC08GBC ± 0.19% 25°C DICE DAC08GRBC ± 0.39% 25°C DICE
NOTES
1
Devices processed in total compliance to MIL-STD-883. Consult factory for 883 data sheet.
2
For availability and burn-in information on SO and PLCC packages, contact your local sales office.
The DAC08 contains 84 transistors. Die size 63 mil x 87 mil = 5,481 square mils.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the DAC08 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
–3–
Page 4
DAC08
PIN CONNECTIONS
16-Lead Dual-In-Line Package
(Q and P Suffix)
V
I
OUT
I
OUT
MSB B1
1
LC
2
3
V–
4
5
6
B2
7
B3
8
B4
16
COMPENSATION
15
V
(–)
REF
14
V
(+)
REF
13
V+
12
B8 LSB
11
B7
10
B6
9
B5
16-Lead SO
(S Suffix)
16
15
14
13
12
11
10
9
B8 LSB
B7
B6
B5
B4
B3
B2
B1 MSB
V
REF
V
REF
(+)
(–)
COMP
V
I
OUT
I
OUT
1
V+
2
3
4
5
LC
6
7
V–
8

DICE CHARACTERISTICS

(125°C Tested Dice Available)
1. V
LC
2. I
OUT
3. V–
4. I
OUT
5. BIT 1 (MSB)
6. BIT 2
7. BIT 3
8. BIT 4
9. BIT 5
10. BIT 6
11. BIT 7
12. BIT 8 (LSB)
13. V+ (+)
14. V
REF
15. V
(–)
REF
16. COMP
DIE SIZE 0.087 ⴛ 0.063 inch, 5,270 sq. mils (2.209 1.60 mm, 3.54 sq. mm)
DAC08RC/883 20-Lead LCC
(RC Suffix)
(–)
LC
NC
V
20 19123
B4NCB5
V
COMP
B6
REF
18
17
16
15
14
V
REF
V+
NC
B8 LSB
B7
(+)
I
OUT
NC
MSB B1
V–
B2
OUT
I
4
5
6
7
8
10 11 12 13
9
B3
NC = NO CONNECT
–4–
REV. B
Page 5
DAC08
WAFER TEST LIMITS
(@ VS = 15 V, I
I
and
I
OUT
OUT
= 2.0 mA; TA = 25C, unless otherwise noted. Output characteristics apply to both
REF
.)
DAC08N DAC08G DAC08GR
Parameter Symbol Conditions Limit Limit Limit Unit
Resolution 8 8 8 Bits min Monotonicity 8 8 8 Bits min Nonlinearity NL ± 0.1 ± 0.19 ± 0.39 % FS max Output Voltage V
OC
Full-Scale Current +18 +18 +18 V max
Compliance Change < 1/2 LSB –10 –10 10 V min
Full-Scale Current I
Full-Scale Symmetry I Zero-Scale Current I Output Current Range I
or V
FS4
I
FS2
FSS
ZS
or V– = –10 V,
FS1
REF
R14, R15 = 5.000 k 1.94 1.94 1.94 mA min
V
REF
= 10.000 V 2.04 2.04 2.04 mA max
± 8 ± 8 ± 16 µA max 244µA max
= +15 V 2.1 2.1 2.1 mA min
V– = –12 V,
I
FS2
Logic Input “0” V Logic Input “1” V
IL
IH
Logic Input Current V Logic “0” I Logic “1” I Logic Input Swing V
IL
IH
IS
V
= +25 V 4.2 4.2 4.2 mA min
REF
R
, R15 = 5.000 k
14
0.8 0.8 0.8 V max 222V min
= 0 V
LC
VIN = –10 V to +0.8 V ± 10 ± 10 ± 10 µA max VIN = +2.0 V to +18 V ± 10 ± 10 ± 10 µA max V– = –15 V +18 +18 +18 V max
–10 –10 –10 V min Reference Bias Current I Power Supply PSSI Sensitivity PSSI
Power Supply Current I+ V
Power Dissipation P
NOTE Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
15
FS+
FS–
D
V+ = +4.5 V to +18 V 0.01 0.01 0.01 % FS/% V max V– = –4.5 V to –18 V I
= 1.0 mA
REF
= ± 15 V 3.8 3.8 3.8 mA max
S
I
2.0 mA –7.8 –7.8 –7.8 µA max
REF
VS = ± 15 V 174 174 174 mW max I
2.0 mA
REF
–3 –3 –3 µA max
REV. B
–5–
Page 6
DAC08
0V
TYPICAL VALUES:
= 5k
R
IN
= 10V
+V
IN
+V
REF
OPTIONAL RESISTOR
R
REF
EQ
P
14
15 16
FOR OFFSET INPUTS
NO CAP
R
4
2
L
R
L
R
IN
R 200
R
0mA
1.0mA
2.0mA
(0000|0000) I
= 2mA (1111|1111)
REF
I
OUT
I
OUT
Figure 1. Pulsed Reference Operation
C2
C1 R1
16 15 14 13 12 11 10 9
12345 678
C3
+18V
DAC08
–18V MIN
R1 = 9k C1 = 0.001F C2, C3 = 0.01F
Figure 2. Burn-in Circuit
1V
2.5V
0.5V
–0.5mA
I
OUT
–2.5mA
100mV
R
EQ
R
L
C
C
200 = 100 = 0
200ns/DIVISION
200ns
Figure 4. True and Complementary Output Operation
100mV
2V
50ns
50ns/DIVISION
2.4V
0.4V
8A
5mV
0V
0
Figure 5. LSB Switching
ALL BITS SWITCHED ON
1V
2.4V
LOGIC INPUT
0.4V
OUTPUT –1/2LSB SETTLING 0V
+1/2LSB
10mV
SETTLING TIME FIXTURE
= 2mA, RL = 1k
I
FS
1/2LSB = 4␮A
50ns
50ns/DIVISION
Figure 3. Fast Pulsed Reference Operation
–6–
Figure 6. Full-Scale Settling Time
REV. B
Page 7
Typical Performance Characteristics–DAC08
5.0 TA = T
ALL BITS “HIGH”
4.0
3.0
2.0
, OUTPUT CURRENT – mA
FS
1.0
I
0.0
0.0
TO T
MIN
1.0 2.0 3.0 4.0 5.0
I
, REFERENCE CURRENT – mA
REF
MAX
LIMIT FOR V– = –5V
LIMIT FOR V– = –15V
TPC 1. Full-Scale Current vs. Reference Current
4.0
TA = T
TO T
MIN
3.6
3.2
2.8
2.4
V– = –15V V– = –5V V+ = +15V
2.0
1.6
1.2
OUTPUT CURRENT – mA
0.8
0.4
0.0
10 6 22 61014
14
V15, REFERENCE COMMON-MODE VOLTAGE – V
MAX
NOTE: POSITIVE COMMON-MODE RANGE IS ALWAYS (V+) –1.5V
ALL BITS ON
I
REF
I
REF
I
= 0.2mA
REF
= 2mA
= 1mA
500
400
300
1LSB = 7.8A
200
PROPAGATION DELAY – ns
100
0
0.05 0.02 0.1 0.5 2.0
0.01 0.05 0.2 1.0 5.0
IFS, OUTPUT FULL SCALE CURRENT – mA
1LSB = 61nA
TPC 2. LSB Propagation Delay vs. I
10
FS
10
R14 = R15 = 1k
500
R
8
L
ALL BITS “ON”
6
V
= 0V
R15
4
2
0
2
4
6
CC = 15pF, V
1. CENTERED AT +1.0V
–8
RELATIVE OUTPUT – dB
LARGE SIGNAL
–10
2.
C
= 15pF, V
C
CENTERED AT +200mV
–12
SMALL SIGNAL
–14
0.1
0.2 0.5 1.0 2.0 10
= 2.0V p–p
IN
= 50mV p–p
IN
FREQUENCY – MHz
2
1
5.0
TPC 3. Reference Input Frequency Response
10.0
8.0
6.0
4.0
LOGIC INPUT – A
2.0
0
–8.0 –4.0 0 4.0 8.0 12.0 16.0
18
–12.0
LOGIC INPUT VOLTAGE – V
2.0
1.6
1.2
– V
LC
– V
TH
0.8
V
0.4
0
–50
0 50 100 150
TEMPERATURE – C
TPC 4. Reference Amp Common­Mode Range
4.0 TA = T
TO T
MIN
3.6
3.2
2.8
2.4
V– = –15V V– = –5V
2.0
1.6
1.2
OUTPUT CURRENT – mA
0.8
0.4
0.0
10 6 22 61014
14
MAX
OUTPUT VOLTAGE – V
ALL BITS ON
I
REF
I
REF
I
= 0.2mA
REF
= 2mA
= 1mA
18
TPC 7. Output Current vs. Output Voltage (Output Voltage Compliance)
TPC 5. Logic Input Current vs. Input Voltage
28
24
20
16
12
SHADED AREA INDICATES PERMISSIBLE OUTPUT VOLTAGE
8
RANGE FOR V– = –15V. I
4
FOR OTHER V– OR I
0
SEE OUTPUT CURRENT VS. OUTPUT
OUTPUT VOLTAGE – V
VOLTAGE CURVE.
4
8
12
–50 0 50 100 150
TEMPERATURE – C
REF
REF
.
2.0mA.
TPC 8. Output Voltage Compliance vs. Temperature
TPC 6. V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
OUTPUT CURRENT – mA
0.4
0.2 V– = –15V
0 –12 0 4 8 16–8 –412
NOTE: B1 THROUGH B8 HAVE IDENTICAL TRANSFER CHARACTERISTICS. BITS ARE FULLY SWITCHED WITH LESS THAN 1/2 LSB ERROR, AT LESS THAN THESE SWITCHING POINTS ARE GUARANTEED TO LIE BETWEEN 0.8V AND 2.0V OVER THE OPERATING TEMPERATURE RANGE
– VLC vs. Temperature
TH
I
= 2.0mA
REF
V– = –5V
LOGIC INPUT VOLTAGE – V
100mV FROM ACTUAL THRESHOLD.
B1
B2
B3B4
(V
= 0.0V).
LC
B5
TPC 9. Bit Transfer Characteristics
REV. B
–7–
Page 8
DAC08
10
ALL BITS “HIGH” OR “LOW”
8
7
6
5
4
3
2
POWER SUPPLY CURRENT – mA
1
0
020294 6 8 10 12 14 16 18
V+, POSITIVE POWER SUPPLY – V dc
I–
I+
TPC 10. Power Supply Current vs. V+
+V
REF
R
REF
I
REF
IN
I
REF
R
R15
14
15
PEAK NEGATIVE SWING OF I
REF
14
15
V
R
V
IN
REF
IN
R15
I
IN
R
+V
REF
(OPTIONAL)
HIGH INPUT
IMPEDANCE
+V
MUST BE ABOVE PEAK POSITIVE SWING OF V
REF
10
BITS MAY BE “HIGH” OR “LOW”
8
7
6
5
4
3
2
POWER SUPPLY CURRENT – mA
1
0
–0 –20–29–4 –6 –8 –10 –12 –14 –16 –18
V–, NEGATIVE POWER SUPPLY – V dc
I– WITH I
I– WITH I
I– WITH I
REF
REF
REF
= 2mA
= 1mA
= 0.2mA
I+
TPC 11. Power Supply Current vs. V–

BASIC CONNECTIONS

I
REF
+V
REF
R
REF
(R14)
R15
IN
255
+V
REF
IFR =
+ IO = I
I
IN
O
ALL LOGIC STATES
R
256
REF
FOR
FR
V
V
10
ALL BITS “HIGH” OR “LOW”
9
8
POWER SUPPLY CURRENT – mA
7
6
5
4
3
2
1
0
V– = –15V
I
= 2.0mA
REF
V+ = +15V
–50 0 50 100 150
TEMPERATURE – C
TPC 12. Power Supply Current vs. Temperature
REF
REF
0.1F
MSB
B1
B2 B3B4 B5 B6B7
(+)
6789101112
5
14
(–)
15
316131
V–
0.1F
V– V+ V
C
C
COMP
LSB
B8
4
2
FOR FIXED REFERENCE,
V+
TTL OPERATION, TYPICAL VALUES ARE:
V
REF
R
REF
R15 = R CC = 0.01F V
= 0V (GROUND)
LC
LC
I
O
I
O
= 10.000V = 5.000k
REF
I–
I+
Figure 7. Accommodating Bipolar References
LSB
B8
I
E
O
5.000k
O
4
5.000k
2
I
O
E
O
I
REF
= 2.000mA
MSB
B1
B2 B3B4 B5 B6 B7
14
Figure 9. Basic Unipolar Negative Operation
FULL RANGE HALF-SCALE +LSB HALF-SCALE HALF-SCALE –LSB ZERO-SCALE +LSB ZERO-SCALE
–8–
Figure 8. Basic Positive Reference Operation
mA
IOmA
B1
B2
B3
B4
B5
B6
B7
B8
I
O
1
1
1
1
1
1
0
0
1
0
0
0
1
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
1.992
1
1
1.008
0
1
1.000
0
0
0.992
1
1
0.008
0
1
0.000
0
0
0.000
0.984
0.992
1.000
1.984
1.992
E
O
9.9605.0405.0004.9600.040
0.000
E
O
0.0004.9204.9605.0009.9209.860
REV. B
Page 9
I
4
2
I
O
I
O
E
O
0 TO –IFR R
L
OP711
I
FR
= I
REF
255 256
R
L
FOR COMPLEMENTARY OUTPUT (OPERATION AS A NEGATIVE LOGIC DAC), CONNECT NONINVERTING INPUT OF OP AMP TO IO (PIN 2); CONNECT IO (PIN 4) TO GROUND.
(+) = 2.000mA
REF
MSB
B1
B2 B3B4 B5 B6 B7
14
10.000V
LSB
B8
I
I
O
O
10.000k
4
2
POS. FULL RANGE
10.000k POS. FULL RANGE –LSB
ZERO-SCALE +LSB
E
O
E
O
ZERO-SCALE ZERO-SCALE –LSB NEG. FULL-SCALE +LSB NEG. FULL-SCALE
B1
1 1 1 1 0 0 0
Figure 10. Basic Bipolar Output Operation
DAC08
B2
B3
B4
B5
B6
B7
B8
1
1
1 1 0 0 1 0 0
1
1
1
1
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
–9.920
1
1
1
–9.840
1
1
0
–0.080
0
0
1
0.000
0
0
0
+0.080
1
1
1
+9.920
0
0
1
+10.000
0
0
0
E
E
O
O
+10.000 +9.920 +0.160 +0.080
0.000
9.8409.920
LOW T.C.
V
REF
10V
10k
POT
4.5k
I
(+)
REF
39k
APPROX
5k
1V
2mA
14
15
Figure 11. Recommended Full-Scale Adjustment Circuit
10k
15V
2
10V
REF01*
MSB
B1
B2 B3 B4 B5 B6
5.000k
6
V
O
5
5.0k V+ V– CCV
LSB
B8
B7
I
O
4
2
I
O
LC
5.0k
+15V
OP711
4
*OR ADR01
+15V –15V
–15V
Figure 13. Offset Binary Operation
R
L
I
O
4
I
2
OP711
O
0 TO +IFR R
IFR = I
FOR COMPLEMENTARY OUTPUT (OPERATION AS A NEGATIVE LOGIC DAC), CONNECT INVERTING INPUT OF OP AMP TO IO (PIN 2); CONNECT IO (PIN 4) TO GROUND.
255 256
REF
E
O
L
R
REF
14
I
REF
FS
R15
15
–V
R
NOTE
REF
REF
SETS IFS; R15 IS FOR
R
REF
BIAS CURRENT CANCELLATION.
–V
4
2
Figure 12. Basic Negative Reference Operation
B1
B2
B3
B4
B5
B6
B7
B8
E POS. FULL RANGE ZERO-SCALE
E
O
NEG. FULL-SCALE +1 LSB NEG. FULL-SCALE
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
O
1
1
+4.960
0
0
0.000
0
1
–4.960
0
0
–5.000
I
O
I
O
Figure 14. Positive Low Impedance Output Operation
V
TH
15V
TTL, DTL
= 1.4V
V
TH
V
LC
1
REV. B
9.1k
6.2k 0.1F
Figure 16. Interfacing with Various Logic Families
= VLC 1.4V 15V CMOS V
= 7.6V
TH
Figure 15. Negative Low Impedance Output Operation
ECL
13k
V
LC
A
39k
2N3904
–5.2V
2N3904
3k
TO PIN 1
6.2k
TEMPERATURE COMPENSATING VLC CIRCUITS
CMOS, HTL, NMOS
20k
A
20k
V
LC
V+
2N3904
3k
2N3904
TO PIN 1
R3 400A
V
LC
–9–
Page 10
DAC08
APPLICATION INFORMATION REFERENCE AMPLIFIER SETUP
The DAC08 is a multiplying D/A converter in which the output current is the product of a digital number and the input refer­ence current. The reference current may be fixed or may vary from nearly zero to 4.0 mA. The full-scale output current is a linear function of the reference current and is given by:
255
II
FR REF
256
, where I
REF
= I
14
In positive reference applications, an external positive reference voltage forces current through R14 into the V
REF(+)
terminal (Pin 14) of the reference amplifier. Alternatively, a negative reference may be applied to V flows from ground through R14 into V
at Pin 15; reference current
REF(–)
as in the positive
REF(+)
reference case. This negative reference connection has the advan­tage of a very high impedance presented at Pin 15. The voltage at Pin 14 is equal to and tracks the voltage at Pin 15 due to the high gain of the internal reference amplifier. R15 (nominally equal to R14) is used to cancel bias current errors; R15 may be elimi­nated with only a minor increase in error.
Bipolar references may be accommodated by offsetting V
REF
or Pin 15. The negative common-mode range of the reference amplifier is given by: V
– = V– plus (I
CM
× 1 k) plus 2.5 V.
REF
The positive common-mode range is V+ less 1.5 V.
When a dc reference is used, a reference bypass capacitor is recommended. A 5.0 V TTL logic supply is not recommended as a reference. If a regulated power supply is used as a reference, R14 should be split into two resistors with the junction bypassed to ground with a 0.1 µF capacitor.
For most applications the tight relationship between I will eliminate the need for trimming I
. If required, full-scale
REF
REF
and I
FS
trimming may be accomplished by adjusting the value of R14, or by using a potentiometer for R14. An improved method of full-scale trimming which eliminates potentiometer T.C. effects is shown in the recommended full-scale adjustment circuit.
Using lower values of reference current reduces negative power supply current and increases reference amplifier negative com­mon-mode range. The recommended range for operation with a dc reference current is 0.2 mA to 4.0 mA.

REFERENCE AMPLIFIER COMPENSATION FOR MULTIPLYING APPLICATIONS

AC reference applications will require the reference amplifier to be compensated using a capacitor from Pin 16 to V–. The value of this capacitor depends on the impedance presented to Pin 14: for R14 values of 1.0, 2.5 and 5.0 k, minimum values of C
C
are 15, 37 and 75 pF. Larger values of R14 require proportion­ately increased values of C ratio of C
(pF) to R14 (k) = 15.
C
for proper phase margin, so the
C
For fastest response to a pulse, low values of R14 enabling small C
values should be used. If Pin 14 is driven by a high
C
impedance such as a transistor current source, none of the above values will suffice and the amplifier must be heavily compensated which will decrease overall bandwidth and slew rate. For R14 = 1 k and C slews at 4 mA/µs enabling a transition from I
= 15 pF, the reference amplifier
C
= 0 to I
REF
REF
=
2 mA in 500 ns.
Operation with pulse inputs to the reference amplifier may be accommodated by an alternate compensation scheme. This
–10–
technique provides lowest full-scale transition times. An internal clamp allows quick recovery of the reference amplifier from a cutoff (I
= 0) condition. Full-scale transition (0 mA to 2 mA)
REF
occurs in 120 ns when the equivalent impedance at Pin 14 is 200 and C which is relatively independent of R
= 0. This yields a reference slew rate of 16 mA/µs,
C
and VIN values.
IN

LOGIC INPUTS

The DAC08 design incorporates a unique logic input circuit that enables direct interface to all popular logic families and provides maximum noise immunity. This feature is made pos­sible by the large input swing capability, 2 µA logic input current and completely adjustable logic threshold voltage. For V– = –15 V, the logic inputs may swing between –10 V and +18 V. This enables direct interface with 15 V CMOS logic, even when the DAC08 is powered from a 5 V supply. Minimum input logic swing and minimum logic threshold voltage are given by: V– plus (I
× 1 k) plus 2.5 V. The
REF
logic threshold may be adjusted over a wide range by placing an appropriate voltage at the logic threshold control pin (Pin 1,
). The appropriate graph shows the relationship between
V
LC
and VTH over the temperature range, with VTH nominally
V
LC
1.4 above V
1. When interfacing ECL, an I
. For TTL and DTL interface, simply ground pin
LC
= 1 mA is recommended. For
REF
interfacing other logic families, see preceding page. For general set-up of the logic control circuit, it should be noted that Pin 1 will source 100 µA typical; external circuitry should be designed to accommodate this current.
Fastest settling times are obtained when Pin 1 sees a low imped­ance. If Pin 1 is connected to a 1 k divider, for example, it should be bypassed to ground by a 0.01 µF capacitor.

ANALOG OUTPUT CURRENTS

Both true and complemented output sink currents are provided
+
where I
= IFS. Current appears at the “true” (IO) output
I
O
O
when a “1” (logic high) is applied to each logic input. As the binary count increases, the sink current at pin 4 increases pro­portionally, in the fashion of a positive logic D/A converter. When a “0” is applied to any input bit, that current is turned off at Pin 4 and turned on at Pin 2. A decreasing logic count increases
as in a negative or inverted logic D/A converter.
I
O
Both outputs may be used simultaneously. If one of the outputs is not required, it must be connected to ground or to a point capable of sourcing I
; do not leave an unused output pin open.
FS
Both outputs have an extremely wide voltage compliance enabling fast direct current-to-voltage conversion through a resistor tied to ground or other voltage source. Positive compliance is 36 V above V– and is independent of the positive supply. Negative compliance is given by V– plus (I
× 1 k) plus 2.5 V.
REF
The dual outputs enable double the usual peak-to-peak load swing when driving loads in quasi-differential fashion. This feature is especially useful in cable driving, CRT deflection and in other balanced applications such as driving center-tapped coils and transformers.

POWER SUPPLIES

The DAC08 operates over a wide range of power supply voltages from a total supply of 9 V to 36 V. When operating at supplies of ± 5 V or less, I
1 mA is recommended. Low reference
REF
current operation decreases power consumption and increases negative compliance, reference amplifier negative common-mode
REV. B
Page 11
DAC08
range, negative logic input range and negative logic threshold range; consult the various figures for guidance. For example, operation at –4.5 V with I
= 2 mA is not recommended
REF
because negative output compliance would be reduced to near zero. Operation from lower supplies is possible; however, at least 8 V total must be applied to ensure turn-on of the internal bias network.
Symmetrical supplies are not required, as the DAC08 is quite insensitive to variations in supply voltage. Battery operation is feasible as no ground connection is required: however, an artificial ground may be used to ensure logic swings, etc., remain between acceptable limits.
Power consumption may be calculated as follows:
P
= (I+) (V+) + (I–) (V–)
D
A useful feature of the DAC08 design is that supply current is constant and independent of input logic states; this is useful in cryptographic applications and further serves to reduce the size of the power supply bypass capacitors.

TEMPERATURE PERFORMANCE

The nonlinearity and monotonicity specifications of the DAC08 are guaranteed to apply over the entire rated operating temperature range. Full-scale output current drift is low, typically ±10 ppm/°C, with zero-scale output current and drift essentially negligible compared to 1/2 LSB.
The temperature coefficient of the reference resistor R14 should match and track that of the output resistor for minimum overall full-scale drift. Settling times of the DAC08 decrease approxi­mately 10% at –55°C; at +125°C an increase of about 15% is typical.
The reference amplifier must be compensated by using a capacitor from pin 16 to V–. For fixed reference operation, a 0.01 µF capacitor is recommended. For variable reference applications, see Reference Amplifier Compensation for Multiplying Applica­tions section.

MULTIPLYING OPERATION

The DAC08 provides excellent multiplying performance with an extremely linear relationship between I
and I
FS
over a range
REF
of 4 µA to 4 mA. Monotonic operation is maintained over a typical range of I
from 100 µA to 4.0 mA.
REF

SETTLING TIME

The DAC08 is capable of extremely fast settling times, typically 85 ns at I
= 2.0 mA. Judicious circuit design and careful
REF
board layout must be employed to obtain full performance potential during testing and application. The logic switch design enables propagation delays of only 35 ns for each of the 8 bits. Settling time to within 1/2 LSB of the LSB is therefore 35 ns, with each progressively larger bit taking successively longer. The MSB settles in 85 ns, thus determining the overall settling time of 85 ns. Settling to 6-bit accuracy requires about 65 ns to 70 ns. The output capacitance of the DAC08 including the package is approximately 15 pF, therefore the output RC time constant dominates settling time if R
> 500 Ω.
L
Settling time and propagation delay are relatively insensitive to logic input amplitude and rise and fall times, due to the high gain of the logic switches. Settling time also remains essentially constant for I
values. The principal advantage of higher I
REF
REF
values lies in the ability to attain a given output level with lower load resistors, thus reducing the output RC time constant.

Measurement of settling time requires the ability to accurately resolve ± 4 µA, therefore a 1 k load is needed to provide adequate drive for most oscilloscopes. The settling time fix­ture shown in schematic labelled Settling Time Measurement uses a cascade design to permit driving a 1 k load with less than 5 pF of parasitic capacitance at the measurement node. At I

values of less than 1.0 mA, excessive RC damping of the
REF
output is difficult to prevent while maintaining adequate sensi­tivity. However, the major carry from 01111111 to 10000000 provides an accurate indicator of settling time. This code change does not require the normal 6.2 time constants to settle to within ± 0.2% of the final value, and thus settling times may be observed at lower values of I
REF
.
DAC08 switching transients or glitches are very low and may be further reduced by small capacitive loads at the output at a minor sacrifice in settling time.
Fastest operation can be obtained by using short leads, minimizing output capacitance and load resistor values, and by adequate bypassing at the supply, reference, and V
terminals. Supplies
LC
do not require large electrolytic bypass capacitors as the supply current drain is independent of input logic states; 0.1 µF capacitors at the supply pins provide full transient protection.
REV. B
1F
+5V
Q2
–15V
15k
V
OUT
PROBE
1X
+0.4V
–0.4V
0.1F
0V 0V
V
I
OUT
L
1k
Q1
1F50␮F
1k
100k2k
FOR TURN-ON, V FOR TURN-OFF, VL = 0.7V
V
CL
0.7V
+V
REF
R
R15
REF
0.1F
14
15
0.1F
5
V
IN
6789101112
DAC08
13
316
+15V
–15V
= 2.7V
L
MINIMUM
CAPACITANCE
4
2
0.01F
0.1F
Figure 17. Settling Time Measurement
–11–
Page 12
DAC08
TOP
VIEW
0.358 (9.09)
0.342 (8.69) SQ
1
20
4
9
8
13
19
14
3
18
BOTTOM
VIEW
0.028 (0.71)
0.022 (0.56)
45° TYP
0.015 (0.38) MIN
0.055 (1.40)
0.045 (1.14)
0.050 (1.27) BSC
0.075 (1.91) REF
0.011 (0.28)
0.007 (0.18) R TYP
0.095 (2.41)
0.075 (1.90)
0.100 (2.54) BSC
0.200 (5.08) BSC
0.150 (3.81) BSC
0.075 (1.91)
REF
0.358 (9.09)
MAX
SQ
0.100 (2.54)
0.064 (1.63)
0.088 (2.24)
0.054 (1.37)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
PIN 1
0.210 (5.33) MAX
0.160 (4.06)
0.115 (2.93)
0.1574 (4.00)
0.1497 (3.80)
PIN 1
0.0098 (0.25)
0.0040 (0.10)
16-Lead Plastic DIP (N-16)
0.840 (21.34)
0.745 (18.92)
16
18
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
BSC
9
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.070 (1.77)
0.045 (1.15)
16-Lead SO (R-16A)
0.3937 (10.00)
0.3859 (9.80)
16 9
0.050 (1.27) BSC
0.0192 (0.49)
0.0138 (0.35)
0.2440 (6.20)
0.2284 (5.80)
81
0.0688 (1.75)
0.0532 (1.35)
SEATING PLANE
0.130 (3.30) MIN
SEATING PLANE
0.0099 (0.25)
0.0075 (0.19)
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.0196 (0.50)
0.0099 (0.25)
8 0
0.195 (4.95)
0.115 (2.93)
0.0500 (1.27)
0.0160 (0.41)
45
16-Lead Cerdip (Q-16)
0.005 (0.13) MIN
PIN 1
0.200 (5.08) MAX
0.200 (5.08)
0.125 (3.18)
16
0.840 (21.34) MAX
0.023 (0.58)
0.014 (0.36)
0.080 (2.03) MAX
9
0.310 (7.87)
0.070 (1.78)
0.030 (0.76)
0.220 (5.59)
0.060 (1.52)
0.015 (0.38)
0.150 (3.81) MIN
SEATING PLANE
18
0.100 (2.54)
BSC
0.320 (8.13)
0.290 (7.37)
15°
0°
20-Terminal Leadless Chip Carrier (E-20)
0.015 (0.38)
C00268–0–2/02(B)
0.008 (0.20)

Revision History

Location Page
Data Sheet changed from REV. A to REV. B.
Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Edits to WAFER TEST LIMITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Edit to Figure 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Edits to Figures 14 and 15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Replacement of SO-16 with R-16A Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
–12–
PRINTED IN U.S.A.
REV. B
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