Datasheet DAC08 Datasheet (ANALOG DEVICES)

8-Bit, High Speed, Multiplying D/A Converter

FEATURES

Fast settling output current: 85 ns Full-scale current prematched to ±1 LSB Direct interface to TTL, CMOS, ECL, HTL, PMOS Nonlinearity to 0.1% maximum over temperature range High output impedance and compliance: −10 V to +18 V Complementary current outputs Wide range multiplying capability: 1 MHz bandwidth Low FS current drift: ±10 ppm/°C Wide power supply range: ±4.5 V to ±18 V Low power consumption: 33 mW @ ±5 V Low cost

GENERAL DESCRIPTION

The DAC08 series of 8-bit monolithic digital-to-analog convert­ers provide very high speed performance coupled with low cost and outstanding applications flexibility.
Advanced circuit design achieves 85 ns settling times with very low “glitch” energy and at low power consumption. Monotonic multiplying performance is attained over a wide 20-to-1 reference current range. Matching to within 1 LSB between reference and full-scale currents eliminates the need for full-
(Universal Digital Logic Interface)
DAC08
scale trimming in most applications. Direct interface to all popular logic families with full noise immunity is provided by the high swing, adjustable threshold logic input.
High voltage compliance complementary current outputs are provided, increasing versatility and enabling differential operation to effectively double the peak-to-peak output swing. In many applications, the outputs can be directly converted to voltage without the need for an external op amp. All DAC08 series models guarantee full 8-bit monotonicity, and nonlineari­ties as tight as ±0.1% over the entire operating temperature range are available. Device performance is essentially unchanged over the ±4.5 V to ±18 V power supply range, with 33 mW power consumption attainable at ±5 V supplies.
The compact size and low power consumption make the DAC08 attractive for portable and military/aerospace applications; devices processed to MIL-STD-883, Level B are available.
DAC08 applications include 8-bit, 1 µs A/D converters, servo motor and pen drivers, waveform generators, audio encoders and attenuators, analog meter drivers, programmable power supplies, LCD display drivers, high speed modems, and other applications where low cost, high speed, and complete input/output versatility are required.

FUNCTIONAL BLOCK DIAGRAM

V+ V
13 1 5 6 7 8 9 10 11 12
DAC08
BIAS NETWORK
14
V
(+)
REF
15
V
(–)
REF
REFERENCE
AMPLIFIER
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
LC
CURRENT
SWITCHES
(MSB)
B1
V–COMP
B2 B3 B4 B5 B6 B7
316
Figure 1.
(LSB)
B8
I
OUT
4 2
I
OUT
00268-C-001
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
DAC08
TABLE OF CONTENTS
Specifications..................................................................................... 3
Electrical Characteristics............................................................. 3
Typical E l e ctric a l Characte r i s tics ............................................... 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Connections ............................................................................... 6
Test and Burn-In Circuits................................................................ 7
Typical Performance Characteristics ............................................. 8
Basic Connections.......................................................................... 11
Application Information................................................................ 13
Reference Amplifier Setup ........................................................ 13
Reference Amplifier Compensation for Multiplying Applications
Logic Inputs................................................................................. 13
Analog Output Currents ........................................................... 14
Power Supplies ............................................................................ 14
Temperature Performance......................................................... 14
Multiplying Operation............................................................... 14
Settling Time............................................................................... 14
ADI Current Output DACs........................................................... 16
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 18
................................................................................ 13
REVISION HISTORY
11/04—Rev. B to Rev. C
Changed SO to SOIC .........................................................Universal
Removed DIE......................................................................Universal
Changes to Figure 30, Figure 31, Figure 32................................. 12
Change to Figure 33 ....................................................................... 15
Added Table 4.................................................................................. 16
Updated Outline Dimensions....................................................... 17
Changes to Ordering Guide.......................................................... 18
2/02—Rev. A to Rev. B
Edits to SPECIFICATIONS............................................................. 2
Edits to ABSOLUTE MAXIMUM RATING ................................ 3
Edits to ORDERING GUIDE.......................................................... 3
Edits to WAFER TEST LIMITS...................................................... 5
Edit to Figure 13 ............................................................................... 8
Edits to Figures 14 and 15 ............................................................... 9
Rev. C | Page 2 of 20
DAC08

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

VS = ±15 V, I DAC08C, unless otherwise noted. Output characteristics refer to both I
Table 1.
DAC08A/DAC08H DAC08E DAC08C Parameter
Resolution 8 8 8 Bits Monotonicity 8 8 8 Bits Nonlinearity NL ±0.1 ±0.19 ±0.39 %FS Settling Time t
Propagation Delay
Each Bit t
All Bits Switched t Full-Scale Tempco1 TCI DAC08E ±50 Output Voltage
Compliance V
(True Compliance) Change <1/2 LSB, R
Full Range Current I
Full Range Symmetry I Zero-Scale Current I Output Current
Range I
V V− = −12 V Output Current
Noise Logic Input Levels
Logic 0 V
Logic 1 V Logic Input Current VLC = 0 V
Logic 0 I
Logic 1 I Logic Input Swing V Logic Threshold
Range Reference Bias
Current Reference Input dI/dt REQ = 200 Ω 4 8 4 8 4 8 mA/µs
Slew Rate RL = 100 Ω C Power Supply
Sensitivity PSSI I
= 2.0 mA, –55°C ≤ TA ≤ +125°C for DAC08/DAC08A, 0°C ≤ TA ≤ +70°C for DAC08E and DAC08H, −40°C to +85°C for
REF
I
OUT
Symbol
S
PLH
PHL
FS
OC
and
OUT
Conditions Min Typ Max Min Typ Max Min Typ Max Unit
To ±1/2 LSB, all bits switched on or off,
1
= 25°C
T
A
85 135 85 150 85 150 ns
TA = 25°C1 35 60 35 60 35 60 ns 35 60 35 60 35 60 ns ±10 ±50 ±10 ±80 ±10 ±80 ppm/°C
Full-scale current
>
OUT
−10 +18 −10 +18 –10 +18 V
.
20 MΩ typ V
FR4
FRS
ZS
I
OR1
OR2
= 10.000 V R14, R15 =
REF
5.000 kΩ T I
FR4
− I
= 25°C
A
FR2
0.1 1 0.2 2 0.2 4 µA R14, R15 = 5.000 kΩ 2.1 2.1 2.1 mA
V
= +15.0 V,
REF
1.984 1.992 2.000 1.94 1.99 2.04 1.94 1.99 2.04 mA
±0.5 ±4 ±1 ±8 ±2 ±16 µA
V− = −10 V
= +25.0 V, 4.2 4.2 4.2 mA
REF
I
IL
IL
IL
IH
IS
V
THR
I
15
PSSI
FS+
FS–
= 2 mA 25 25 25 nA
REF
VLC = 0 V 0.8 0.8 0.8 V 2 2 2 V
VIN = −10 V to +0.8 V −2 −10 −2 −10 −2 −10 µA VIN = 2.0 V to 18 V 0.002 10 0.002 10 0.002 10 µA V− = −15 V −10 +18 −10 +18 −10 +18 V VS = ±15 V1 −10 +13.5 −10 +13.5 −10 +13.5 V
−1 −3 −1 −3 −1 −3 µA
= 0 pF. See Figure 7.
C
1
V+ = 4.5 V to 18 V ±0.0003 ±0.01 ±0.0003 ±0.01 ±0.0003 ±0.01 %∆IO/%∆V+
V− = −4.5 V to −18 V ±0.002 ±0.01 ±0.002 ±0.01 ±0.002 ±0.01 %∆IO/%∆V−
= 1.0 mA
REF
Rev. C | Page 3 of 20
DAC08
DAC08A/DAC08H DAC08E DAC08C Parameter
Power Supply Current I+ VS = ±5 V, I I− −4.3 −5.8 −4.3 −5.8 −4.3 −5.8 mA I+ VS = +5 V, −15 V, 2.4 3.8 2.4 3.8 2.4 3.8 mA I− I I+ VS = ±15 V, 2.5 3.8 2.5 3.8 2.5 3.8 mA I− I Power Dissipation P
I
135 174 135 174 135 174 mW
1
Guaranteed by design.

TYPICAL ELECTRICAL CHARACTERISTICS

VS = ±15 V, and I
Table 2.
Parameter Symbol Conditions All Grades Typical Unit
Reference Input Slew Rate dI/dt 8 mA/µs Propagation Delay t Settling Time t
Symbol
D
= 2.0 mA, unless otherwise noted. Output characteristics apply to both I
REF
Conditions Min Typ Max Min Typ Max Min Typ Max Unit
= 1.0 mA 2.3 3.8 2.3 3.8 2.3 3.8 mA
REF
= 2.0 mA −6.4 −7.8 −6.4 −7.8 −6.4 −7.8 mA
REF
= 2.0 mA −6.5 −7.8 −6.5 −7.8 −6.5 −7.8 mA
REF
±5 V, I
= 1.0 mA +5 V,
REF
−15 V, = 2.0 mA ±15 V, I
REF
2.0 mA
, t
PLH
PHL
S
REF
33 48 33 48 33 48 mW
=
108 136 103 136 108 136 mW
TA = 25°C, any bit 35 ns To ±1/2 LSB, all bits switched on or
= 25°C
off, T
A
OUT
and
.
I
OUT
85 ns
Rev. C | Page 4 of 20
DAC08

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
Operating Temperature
DAC08AQ, DAC08Q −55°C to +125°C DAC08HQ, DAC08EQ, DAC08CQ,
0°C to +70°C
DAC08HP, DAC08EP
DAC08CP, DAC08CS −40°C to +85°C Junction Temperature (TJ) −65°C to +150°C Storage Temperature Q Package −65°C to +150°C Storage Temperature P Package −65°C to +125°C Lead Temperature (Soldering, 60 sec) 300°C V+ Supply to V− Supply 36 V Logic Inputs V− to V− + 36 V V
LC
V− to V+ Analog Current Outputs (at VS− = 15 V) 4.25 mA Reference Input (V
to V15) V− to V+
14
Reference Input Differential Voltage
(V14 to V15) ±18 V
Reference Input Current (I14) 5.0 mA
Package Type θ
1
JA
θ
Unit
JC
16-Lead CERDIP (Q) 100 16 °C/W 16-Lead PDIP (P) 82 39 °C/W 20-Terminal LCC (RC) 76 36 °C/W 16-Lead SOIC (S) 111 35 °C/W
1
θJA is specified for worst-case mounting conditions, that is, θJA is specified for
device in socket for CERDIP, PDIP, and LCC packages; θ device soldered to printed circuit board for SOIC package.
is specified for
JA
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 5 of 20
DAC08

PIN CONNECTIONS

1
V
LC
I
2
OUT
V–
3
OUT
B2 B3 B4
DAC08
4
TOP VIEW
(Not To Scale)
5
6
7
8
I
(MSB) B1
Figure 2. 16-Lead Dual In-Line Package
(Q and P Suffixes)
16
COMP V
15
V
14
V+
13
12
B8 (LSB) B7
11
10
B6
9
B5
REF
REF
(–) (+)
00268-C-002
V
REF
V
REF
COMP
I
I
(+) (–)
V
OUT
OUT
V+
LC
V–
1
2
3
DAC08
4
TOP VIEW
(Not To Scale)
5
6
7
8
16
B8 (LSB) B7
15
B6
14
B5
13
12
B4 B3
11
10
B2
9
B1 (MSB)
00268-C-003
Figure 3. 16-Lead SOIC
(S Suffix)
(–)
LC
REF
V
NC
V
COMP
20 19123
V
18
REF
V+
17
NC
16 15
B8 (LSB) B7
14
B5
B6
B4
NC
I
OUT
NC
(MSB) B1
OUT
I
4
V–
5
DAC08
TOP VIEW
6
(Not To Scale)
7
B2
8
10 11 12 13
9
B3
NC = NO CONNECT
Figure 4. DAC08RC/883 20-Lead LCC
(RC Suffix)
(+)
00268-C-004
Rev. C | Page 6 of 20
DAC08

TEST AND BURN-IN CIRCUITS

R
0V TYPICALVALUES:
=5k
R
IN
=10V
+V
IN
+V
REF
OPTIONAL RESISTOR
R
REF
EQ
P
14
15 16
FOR OFFSET INPUTS
NO CAP
IN
R 200
R
Figure 5. Pulsed Reference Operation
R
4
2
L
R
L
00268-C-006
C2
C1 R1
16 15 14 13 12 11 10 9
+18V
R1 = 9k C1 = 0.001µF C2, C3 = 0.01µF
DAC08
12345678
C3
–18V MIN
Figure 6. Burn-In Circuit
00268-C-007
Rev. C | Page 7 of 20
DAC08

TYPICAL PERFORMANCE CHARACTERISTICS

1V
2.5V
0.5V
–0.5mA
I
OUT
–2.5mA
0mA
1.0mA
2.0mA
100mV
R
EQ
R
L
C
C
200 = 100 = 0
200ns/DIVISION
Figure 7. Fast Pulsed Reference Operation
200ns
I
I
OUT
OUT
00268-C-008
OUTPUT
SETTLING
, OUTPUT CURRENT (mA)
FS
I
2.4V
0.4V
–1/2LSB
0V
+1/2LSB
SETTLINGTIMEFIXTURE I
FS
1/2LSB= 4µA
5
TA = T
MIN
ALL BITS HIGH
4
3
2
1
ALL BITS SWITCHED ON
1V
10mV
=2mA,RL=1k
Figure 10. Full-Scale Settling Time
TO T
MAX
LIMIT FOR V– = –5V
LIMIT FOR
V– = –15V
50ns
50ns/DIVISION
00268-C-011
(0000|0000) (1111|1111)
I
REF
= 2mA
00268-C-009
Figure 8. True and Complementary Output Operation
100mV
2V
50ns/DIVISION
50ns
00268-C-010
2.4V
0.4V
8µA
5mV
0V
0
Figure 9. LSB Switching
0
0
1234 5
I
, REFERENCE CURRENT (mA)
REF
00268-C-012
Figure 11. Full-Scale Current vs. Reference Current
500
400
300
200
PROPAGATION DELAY (ns)
100
0
1LSB = 7.8µA
0.005 0.02 0.10 0.50 2.00
IFS, OUTPUT FULL-SCALE CURRENT (mA)
Figure 12. LSB Propagation Delay vs. I
1LSB = 61nA
FS
10.000.01 0.05 0.20 1.00 5.00
00268-C-013
Rev. C | Page 8 of 20
DAC08
10
R14 = R15 = 1k
8
500V
R
L
6
ALL BITS ON
= 0V
V
R15
4 2
0 –2 –4
CC = 15pF, VIN = 2.0V p-p
–6
CENTERED AT +1.0V
RELATIVE OUTPUT (dB)
–8
LARGE SIGNAL
–10
= 15pF, VIN = 50mV p-p
C
C
CENTERED AT +200mV
–12
SMALL SIGNAL
–14
0.1
0.2
0.5
1.0
FREQUENCY (MHz)
Figure 13. Reference Input Frequency Response
4.0 TA = T
TO T
MIN
3.6
3.2
2.8
2.4
2.0
1.6
1.2
OUTPUT CURRENT (mA)
0.8
0.4
0
–14
MAX
NOTE: POSITIVE COMMON-MODE RANGE IS ALWAYS (V+) –1.5V
V– = –15V V– = –5V V+ = +15V
–10 –6
V15, REFERENCE COMMON-MODE VOLTAGE (V)
–2 2 6
Figure 14. Reference Amp Common-Mode Range
10
8
6
4
LOGIC INPUT (µA)
2
0
–12
8–40481216
LOGIC INPUT VOLTAGE (V)
Figure 15. Logic Input Current vs. Input Voltage
2
1
2.0 10.0
I
REF
ALL BITS ON
I
= 2mA
REF
I
= 1mA
REF
= 0.2mA
10 14
5.0
18
00268-C-014
00268-C-015
00268-C-016
2.0
1.6
1.2
(V)
LC
–V
TH
0.8
V
0.4
0
–50
0 50 100 150
TEMPERATURE (°C)
Figure 16. V
− VLC vs. Temperature
TH
00268-C-017
4.0 TA = T
3.6
3.2
2.8
2.4
2.0
1.6
1.2
OUTPUT CURRENT (mA)
0.8
0.4
0
–14
TO T
MIN
MAX
V– = –15V V– = –5V I
–10 –6
–2 2 6 10 14
OUTPUTVOLTAGE (V)
I
REF
I
REF
REF
ALL BITS ON
= 2mA
= 1mA
= 0.2mA
18
00268-C-018
Figure 17. Output Current vs. Output Voltage (Output Voltage Compliance)
28
24
20
16
12
SHADED AREA INDICATES PERMISSIBLE OUTPUT VOLTAGE RANGE FOR V– = –15V.
8
I
2.0mA.
REF
4
FOR OTHER V– OR I SEE OUTPUT CURRENT VS. OUTPUT
0
OUTPUT V OLTAGE ( V)
VOLTAGE CURVE.
–4
–8
–12
–50 0 50 100 150
,
REF
TEMPERATURE (°C)
00268-C-019
Figure 18. Output Voltage Compliance vs. Temperature
Rev. C | Page 9 of 20
DAC08
1.8
1.6
1.4
1.2
1.0
0.8
0.6
OUTPUT CURRENT (mA)
0.4
0.2
0
–12 0 4 8 16–8
10
8 7
6
5
4
3
2
POWER SUPPLY CURRENT (mA)
1 0
01020
B1
I
= 2.0mA
REF
B2
= 0.0V).
LC
B4
V– = –5V

V– = –15V
–4 12
NOTE: B1 THROUGH B8 HAVE IDENTICAL TRANSFER CHARACTERISTICS. BITS ARE FULLY SWITCHED WITH LESS THAN 1/2 LSB ERROR, AT LESS THAN ±100mV FROM ACTUAL THRESHOLD. THESE SWITCHING POINTS ARE GUARANTEED TO LIE BETWEEN 0.8V AND 2.0V OVER THE OPERATING TEMPERATURE RANGE (V
LOGIC INPUT VOLTAGE (V)
B5
B3
Figure 19. Bit Transfer Characteristics
ALL BITS HIGH OR LOW
I–
I+
294 6 8 12 14 16 18
V+, POSITIVE POWER SUPPLY (V dc)
Figure 20. Power Supply vs. V+
00268-C-020
00268-C-021
10
BITS MAY BE HIGH OR LOW
8 7
6
5
4 3
2
POWER SUPPLY CURRENT (mA)
1 0
0––29–4 –6 –8 –10 –12 –14 –16 –18
V–, NEGATIVE POWER SUPPLY (V dc)
I– WITH I
I– WITH I
I– WITH I
REF
REF
REF
= 2mA
= 1mA
= 0.2mA
I+
20
00268-C-022
Figure 21. Power Supply Current vs. V−
10
ALL BITS HIGH OR LOW
9
8
7
6
5
4
3 2
POWER SUPPLY CURRENT (mA)
1
0
–50 0 50 100 150
V– = –15V
I
= 2.0mA
REF
V+ = +15V
TEMPERATURE (°C)
I–
I+
00268-C-023
Figure 22. Power Supply Current vs. Temperature
Rev. C | Page 10 of 20
DAC08
V
V
A

BASIC CONNECTIONS

+V
REF
R
REF
I
REF
I
IN
14
IN
R
R15
REF
IN
+V
R
IN
I
REF
REF
HIGH INPUT
IMPEDANCE
R
R15
(OPTIONAL)
MUST BE ABOVE PEAK POSITIVE SWING OF V
+V
REF
14
15
15
PEAK NEGATIVE SWING OF I
REF
14
15
Figure 23. Accommodating Bipolar References
V
REF
10V
I
REF
39k 10k
= 2.000mA
I
REF
POT
MSB
B1 B2 B3 B4B5 B6 B7
14
= 2.000mA
LOW T.C.
4.5k (+) 2mA
I
REF
1V
APPROX
5k
MSB
B1
B2 B3 B4 B5 B6 B7
14
14
15
LSB
B8
I
I
O
O
Figure 27. Recommended Full-Scale Adjustment Circuit
IN
IN
00268-C-024
IO + IO = IFR FOR
E
O
5.000k
4
5.000k
2
E
O
FULL RANGE HALF SCALE +LSB HALF SCALE HALF SCALE –LSB ZERO SCALE +LSB ZERO SCALE
Figure 25. Basic Unipolar Negative Operation
LSB
B8
I
I
O
O
10V
10k 10k
4
E
O
2
E
O
POS. FULL RANGE POS. FULL RANGE –LSB ZERO SCALE +LSB ZERO SCALE ZERO SCALE –LSB NEG. FULL SCALE +LSB NEG. FULL SCALE
Figure 26. Basic Bipolar Output Operation
00268-C-028
I
+V
I
FR
LL LOGIC STATES
REF
REF
R
REF
(R14)
R15
+V
255
REF
=
×
R
256
REF
B3
B2
B1
1
1
1
0
0
1
0
0
1
1
1
0
0
0
0
0
0
0
B1
1 1 1 1 0 0 0
–V
Figure 24. Basic Positive Reference Operation
B4
B2
REF
IFS≈
1 0 0 1 0 0
1 1 0 0 1 0 0
V
V
REF
REF
0.1µF
B5
B3
MSB
B1
B2B3 B4 B5 B6 B7
(+)
56789101112
14
(–)
15
316131
V– V+
C
0.1µF
V–
B8
B7
B6
1
1
1
1 1 1 0 0 0
1 1 0 0 1 0 0
–V
R
1
0
0
0
0
0
1
1
1
1
0
0
0
0
0
B4
B5
B6
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
R
REF
14
R15
15
NOTE
REF
R
REF
REF
BIAS CURRENT CANCELLATION.
C
COMP
1.992
1.008
1.000
0.992
0.008
0.000
B7
1 1 0 0 1 0 0
SETS IFS; R15 IS FOR
LSB
B8
I
O
4
2
I
O
FOR FIXED REFERENCE, TTL OPERATION, TYPICAL VALUES ARE:
= 10.000V
V
REF
= 5.000k
R
REF
R15 = R CC = 0.01µF V
V
V+
LC
I
I
O
O
0.000
–9.960
0.984
–5.040
0.992
–5.000
1.000
–4.960
1.984
–0.040
1.992
0.000
B8
E
O
–9.920
1
–9.840
0
–0.080
1
0.000
0
+0.080
1
+9.920
1
+10.000
0
= 0V (GROUND)
LC
E
O
–0.000 –4.920 –4.960 –5.000 –9.920 –9.960
E
O
+10.000
+9.920 +0.160 +0.080
0.000 –9.840 –9.920
4
2
REF
E
O
00268-C-027
Figure 28. Basic Negative Reference Operation
I
O
I
O
00268-C-026
00268-C-029
00268-C-025
Rev. C | Page 11 of 20
DAC08
.
.
T
15V
2
10V
REF01*
4
*OR ADR01
5.000k
6
V
O
5
5.0k
+15V –15V
10k
MSB
B1
B2 B3 B4 B5 B6 B7
C
–V
V+
LSB
B8
I
O
4
2
I
V
O
LC
C
Figure 29. Offset Binary Operation
R
L
I
O
4
I
2
FOR COMPLEMENTARY OUTPUT (OPERATION AS A NEGATIVE LOGIC DAC) CONNECT INVERTING INPUT OF OP AMP TO IO (PIN 2): CONNECT IO (PIN 4) TO GROUND.
AD8671
O
0 TO –I
IFR = I
255 256
E
O
×
R
FR
L
REF
Figure 30. Positive Low Impedance Output Operation
V
= VLC 1.4V
TH
15V CMOS V
= 7.6V
15V
TH
TTL, DTL,
=1.4V
V
TH
V
LC
1
9.1k
6.2k
0.1µF
V
LC
5.0k
+15V
AD8671
–15V
00268-C-031
13k
39k
B1
B2
B3
B4
B5
B6
B7
POS. FULL RANGE
E
ZERO SCALE
O
NEG. FULL SCALE +1LSB NEG. FULL SCALE
1
1
1
1
1
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
B8
1
1
1
0
0
0
0
0
1
0
0
0
I
O
4
I
O
2
FOR COMPLEMENTARY OUTPUT (OPERATION AS A NEGATIVE LOGIC DAC) CONNECT NONINVERTING INPUT OF OP AMP TO IO (PIN 2): CONNECT IO (PIN 4)
O GROUND.
AD8671
R
0 TO –I
L
IFR = I
Figure 31. Negative Low Impedance Output Operation
V
LC
CMOS, HTL, NMOS
V+
20k
2N3904
"A"
20k
3k
2N3904
TO PIN 1
V
LC
R3 400
µ
A
"A"
ECL
2N3904
2N3904
3k
TO PIN 1
6.2k
E
O
+4.960
0.000 –4.960 –5.000
255 256
FR
00268-C-030
E
O
×
R
L
REF
00268-C-032
–5.2V
TEMPERATURE COMPENSATING VLC CIRCUITS
00268-C-033
Figure 32. Interfacing with Various Logic Families
Rev. C | Page 12 of 20
DAC08

APPLICATION INFORMATION

REFERENCE AMPLIFIER SETUP

The DAC08 is a multiplying D/A converter in which the output current is the product of a digital number and the input reference current. The reference current may be fixed or may vary from nearly zero to 4.0 mA. The full-scale output current is a linear function of the reference current and is given by
255
256
REF
= I
14
where I
In positive reference applications, an external positive reference voltage forces current through R14 into the V (Pin 14) of the reference amplifier. Alternatively, a negative reference may be applied to V flows from ground through R14 into V reference case. This negative reference connection has the advantage of a very high impedance presented at Pin 15. The voltage at Pin 14 is equal to and tracks the voltage at Pin 15 due to the high gain of the internal reference amplifier. R15 (nomi­nally equal to R14) is used to cancel bias current errors; R15 may be eliminated with only a minor increase in error.
Bipolar references may be accommodated by offsetting V Pin 15. The negative common-mode range of the reference amplifier is given by V The positive common-mode range is V+ less 1.5 V.
When a dc reference is used, a reference bypass capacitor is recommended. A 5.0 V TTL logic supply is not recommended as a reference. If a regulated power supply is used as a reference, R14 should be split into two resistors with the junction bypas­sed to ground with a 0.1 µF capacitor.
For most applications, the tight relationship between I eliminates the need for trimming I trimming can be accomplished by adjusting the value of R14, or by using a potentiometer for R14. An improved method of full­scale trimming that eliminates potentiometer T.C. effects is shown in the recommended full-scale adjustment circuit (Figure 27).
Using lower values of reference current reduces negative power supply current and increases reference amplifier negative common-mode range. The recommended range for operation with a dc reference current is 0.2 mA to 4.0 mA.
II ×=
REFFR
REF(–)
– = V− plus (I
CM
terminal
REF(+)
at Pin 15; reference current
as in the positive
REF(+)
or
REF
× 1 kΩ) plus 2.5 V.
REF
and IFS
REF
If required, full-scale
REF.
REFERENCE AMPLIFIER COMPENSATION FOR MULTIPLYING APPLICATIONS
AC reference applications require the reference amplifier to be compensated using a capacitor from Pin 16 to V−. The value of this capacitor depends on the impedance presented to Pin 14; for R14 values of 1.0 kΩ, 2.5 kΩ, and 5.0 kΩ, minimum values
are 15 pF, 37 pF, and 75 pF. Larger values of R14 require
of C
C
proportionately increased values of C so the ratio of C
(pF) to R14 (kΩ) = 15.
C
for proper phase margin,
C
For fastest response to a pulse, low values of R14 enabling small
values should be used. If Pin 14 is driven by a high impedance
C
C
such as a transistor current source, none of the preceding values suffice, and the amplifier must be heavily compensated, which decreases overall bandwidth and slew rate. For R14 = 1 kΩ and
= 15 pF, the reference amplifier slews at 4 mA/µs, enabling a
C
C
transition from I
= 0 to I
REF
= 2 mA in 500 ns.
REF
Operation with pulse inputs to the reference amplifier can be accommodated by an alternate compensation scheme. This technique provides lowest full-scale transition times. An internal clamp allows quick recovery of the reference amplifier from a cutoff (I
= 0) condition. Full-scale transition (0 mA to 2 mA)
REF
occurs in 120 ns when the equivalent impedance at Pin 14 is 200 Ω and C which is relatively independent of the R
= 0. This yields a reference slew rate of 16 mA/µs,
C
and VIN values.
IN

LOGIC INPUTS

The DAC08 design incorporates a unique logic input circuit that enables direct interface to all popular logic families and provides maximum noise immunity. This feature is made possible by the large input swing capability, 2 µA logic input current, and completely adjustable logic threshold voltage. For V− = −15 V, the logic inputs may swing between −10 V and +18 V. This enables direct interface with 15 V CMOS logic, even when the DAC08 is powered from a 5 V supply. Minimum input logic swing and minimum logic threshold voltage are given by
V− + (I
The logic threshold may be adjusted over a wide range by placing an appropriate voltage at the logic threshold control pin (Pin 1,
). Figure 16 shows the relationship between VLC and VTH
V
LC
over the temperature range, with V For TTL and DTL interface, simply ground Pin 1. When interfacing ECL, an I other logic families, see Figure 32. For general set-up of the logic control circuit, note that Pin 1 sources 100 µA typical; external circuitry should be designed to accommodate this current.
× 1 kΩ) + 2.5 V
REF
= 1 mA is recommended. For interfacing
REF
nominally 1.4 above VLC.
TH
Rev. C | Page 13 of 20
DAC08
Fastest settling times are obtained when Pin 1 sees a low impedance. If Pin 1 is connected to a 1 kΩ divider, for example, it should be bypassed to ground by a 0.01 µF capacitor.

ANALOG OUTPUT CURRENTS

Both true and complemented output sink currents are provided
I
O
+
where I a 1 (logic high) is applied to each logic input. As the binary count increases, the sink current at Pin 4 increases proportionally, in the fashion of a positive logic DAC. When a 0 is applied to any input bit, that current is turned off at Pin 4 and turned on at Pin 2. A decreasing logic count increases inverted logic DAC. Both outputs may be used simultaneously. If one of the outputs is not required, it must be connected to ground or to a point capable of sourcing I unused output pin open.
Both outputs have an extremely wide voltage compliance enabling fast direct current-to-voltage conversion through a resistor tied to ground or other voltage source. Positive compli­ance is 36 V above V− and is independent of the positive supply. Negative compliance is given by
V− + (I
The dual outputs enable double the usual peak-to-peak load swing when driving loads in quasi-differential fashion. This feature is especially useful in cable driving, CRT deflection and in other balanced applications such as driving center-tapped coils and transformers.

POWER SUPPLIES

The DAC08 operates over a wide range of power supply voltages from a total supply of 9 V to 36 V. When operating at supplies of ±5 V or lower, I reference current operation decreases power consumption and increases negative compliance (Figure 11), reference amplifier negative common-mode range (Figure 14), negative logic input range (Figure 15), and negative logic threshold range (Figure 16). For example, operation at −4.5 V with I recommended because negative output compliance would be reduced to near zero. Operation from lower supplies is possible; however, at least 8 V total must be applied to ensure turn-on of the internal bias network.
Symmetrical supplies are not required, as the DAC08 is quite insensitive to variations in supply voltage. Battery operation is feasible because no ground connection is required: however, an artificial ground may be used to ensure logic swings, etc., remain between acceptable limits. Power consumption is calculated as follows:
A useful feature of the DAC08 design is that supply current is constant and independent of input logic states. This is useful in
= IFS. Current appears at the true (IO) output when
O
I
O
as in a negative or
; do not leave an
FS
× 1 kΩ) + 2.5 V
REF
≤ 1 mA is recommended. Low
REF
= 2 mA is not
REF
()( )()( )
D
+++= VIVIP
cryptographic applications and further reduces the size of the power supply bypass capacitors.

TEMPERATURE PERFORMANCE

The nonlinearity and monotonicity specifications of the DAC08 are guaranteed to apply over the entire rated operating tempera­ture range. Full-scale output current drift is low, typically ±10 ppm/°C, with zero-scale output current and drift essentially negligible compared to 1/2 LSB.
The temperature coefficient of the reference resistor R14 should match and track that of the output resistor for minimum overall full-scale drift. Settling times of the DAC08 decrease approxi­mately 10% at –55°C. At +125°C, an increase of about 15% is typical.
The reference amplifier must be compensated by using a capacitor from Pin 16 to V−. For fixed reference operation, a
0.01 µF capacitor is recommended. For variable reference applications, refer to the Reference Amplifier Compensation for Multiplying Applications section.

MULTIPLYING OPERATION

The DAC08 provides excellent multiplying performance with an extremely linear relationship between I
and I
FS
over a
REF
range of 4 µA to 4 mA. Monotonic operation is maintained over a typical range of I
from 100 µA to 4.0 mA.
REF

SETTLING TIME

The DAC08 is capable of extremely fast settling times, typically 85 ns at I board layout must be used to obtain full performance potential during testing and application. The logic switch design enables propagation delays of only 35 ns for each of the 8 bits. Settling time to within 1/2 LSB of the LSB is therefore 35 ns, with each progressively larger bit taking successively longer. The MSB settles in 85 ns, thus determining the overall settling time of 85 ns. Settling to 6-bit accuracy requires about 65 ns to 70 ns. The output capacitance of the DAC08, including the package, is approximately 15 pF; therefore the output RC time constant dominates settling time if R
Settling time and propagation delay are relatively insensitive to logic input amplitude and rise and fall times, due to the high gain of the logic switches. Settling time also remains essentially constant for I values lies in the ability to attain a given output level with lower load resistors, thus reducing the output RC time constant.
Measuring the settling time requires the ability to accurately resolve ±4 µA; therefore a 1 kΩ load is needed to provide adequate drive for most oscilloscopes. The settling time fixture shown in Figure 33 uses a cascade design to permit driving a 1 kΩ load with less than 5 pF of parasitic capacitance at the measurement node. At I
= 2.0 mA. Judicious circuit design and careful
REF
> 500 Ω.
L
values. The principal advantage of higher I
REF
values of less than 1.0 mA, excessive
REF
REF
Rev. C | Page 14 of 20
DAC08
+
RC damping of the output is difficult to prevent while main­taining adequate sensitivity. However, the major carry from 01111111 to 10000000 provides an accurate indicator of settling time. This code change does not require the normal 6.2 time constants to settle to within ±0.2% of the final value, and thus settling time is observed at lower values of I
REF
.
DAC08 switching transients or “glitches” are very low and can be further reduced by small capacitive loads at the output at a
V
V
0.7V
REF
FORTURN-ON,V FORTURN-OFF,VL=0.7V
CL
V
R
R15
REF
0.1µF
14
15
0.1µF
513678 9 10 11 12
+15V
IN
DAC08
316
–15V
L
MINIMUM
CAPACITANCE
4
2
0.01µF
0.1µF
Figure 33. Settling Time Measurement
=2.7V
I
OUT
minor sacrifice in settling time. Fastest operation can be obtained by using short leads, minimizing output capacitance and load resistor values, and by adequate bypassing at the supply, reference, and V
terminals. Supplies do not require
LC
large electrolytic bypass capacitors because the supply current drain is independent of input logic states; 0.1 µF capacitors at the supply pins provide full transient protection.
Q1
V
L
1k
1µF
1k
2k100k
50µF
1µF
+5V
Q2
–15V
15k
V
OUT
PROBE
1
×
+0.4V
0V 0V
–0.4V
0.1µF
00268-C-034
Rev. C | Page 15 of 20
DAC08

ADI CURRENT OUTPUT DACS

Table 4 lists the latest DACS available from Analog Devices.
Table 4.
Model Bits Outputs Interface Package Comments
AD5425 8 1 SPI, 8-bit load MSOP-10 Fast 8-bit load; see also AD5426 AD5426 8 1 SPI MSOP-10 See also AD5425 fast load AD5450 8 1 SPI SOT23-8 See also AD5425 fast load AD5424 8 1 Parallel TSSOP-16 AD5429 8 2 SPI TSSOP-16 AD5428 8 2 Parallel TSSOP-20 AD5432 10 1 SPI MSOP-10 AD5451 10 1 SPI SOT23-8 AD5433 10 1 Parallel TSSOP-20 AD5439 10 2 SPI TSSOP-16 AD5440 10 2 Parallel TSSOP-24 AD5443 12 1 SPI MSOP-10 See also AD5452 and AD5444 AD5452 12 1 SPI SOT23-8 Higher accuracy version of AD5443; see also AD5444 AD5445 12 1 Parallel TSSOP-20 AD5444 12 1 SPI MSOP-10 Higher accuracy version of AD5443; see also AD5452 AD5449 12 2 SPI TSSOP-16 AD5415 12 2 SPI TSSOP-24 Uncommitted resistors AD5447 12 2 Parallel TSSOP-24 AD5405 12 2 Parallel LFCSP-40 Uncommitted resistors AD5453 14 1 SPI SOT23-8 AD5553 14 1 SPI MSOP-8 AD5556 14 1 Parallel TSSOP-28 AD5446 14 1 SPI MSOP-10 MSOP version of AD5453; compatible with AD5443, AD5432, AD5426 AD5555 14 2 SPI TSSOP-16 AD5557 14 2 Parallel TSSOP-38 AD5543 16 1 SPI MSOP-8 AD5546 16 1 Parallel TSSOP-28 AD5545 16 2 SPI TSSOP-16 AD5547 16 2 Parallel TSSOP-38
Rev. C | Page 16 of 20
DAC08

OUTLINE DIMENSIONS

0.785 (19.94)
0.765 (19.43)
0.745 (18.92)
16 1
0.100 (2.54) BSC
0.015 (0.38)
0.180 (4.57) MAX
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
Figure 34. 16-Lead PDIP (N-16)
Dimensions shown in inches and (mm)
10.00 (0.3937)
9.80 (0.3858)
4.00 (0.1575)
3.80 (0.1496)
0.25 (0.0098)
0.10 (0.0039)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
16
1
BSC
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
1.27 (0.0500)
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MS-012AC
Figure 36. 16-Lead SOIC (R-16A)
Dimensions shown in inches and (mm)
9 8
MIN
9
6.20 (0.2441)
5.80 (0.2283)
8
SEATING PLANE
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
SEATING PLANE
0.25 (0.0098)
0.17 (0.0067)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
8° 0°
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
× 45°
0.005
(0.13)
MIN
0.200 (5.08) MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.098 (2.49) MAX
16
PIN 1
18
0.840 (21.34) MAX
0.100 (2.54)
BSC
9
0.070 (1.78)
0.030 (0.76)
0.310 (7.87)
0.220 (5.59)
0.060 (1.52)
0.015 (0.38)
0.150 (3.81) MIN
SEATING PLANE
Figure 35. 16-Lead CERDIP (Q-16)
Dimensions shown in inches and (mm)
0.075 (1.91)
0.100 (2.54)
0.064 (1.63)
0.358 (9.09)
0.342 (8.69) SQ
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.358
(9.09)
MAX
0.088 (2.24)
0.054 (1.37)
SQ
0.095 (2.41)
0.075 (1.90)
0.011 (0.28)
0.007 (0.18) R TYP
0.075 (1.91) REF
0.055 (1.40)
0.045 (1.14)
REF
19
18
14
13
20
1
BOTTOM
VIEW
0.150 (3.81) BSC
Figure 37. 20-Terminal Leadless Chip Carrier (E-20)
Dimensions shown in inches and (mm)
0.320 (8.13)
0.290 (7.37)
15°
0.200 (5.08) REF
0.100 (2.54) REF
0.015 (0.38) MIN
3
4
0.028 (0.71)
0.022 (0.56)
0.050 (1.27)
8
BSC
9
45° TYP
0.015 (0.38)
0.008 (0.20)
Rev. C | Page 17 of 20
DAC08

ORDERING GUIDE

1
Model
DAC08AQ ±0.10% DAC08AQ/883C2±0.10% DAC08HP ±0.10% 0°C to 70°C PDIP-16 N-16 25 DAC08HQ ±0.10% 0°C to 70°C CERDIP-16 Q-16 25 DAC08Q ±0.19% DAC08RC/883C2±0.19% DAC08EP ±0.19% 0°C to 70°C PDIP-16 N-16 25 DAC08EQ ±0.19% 0°C to 70°C CERDIP-16 Q-16 25 DAC08ES ±0.19% 0°C to 70°C SOIC-16 R-16A (Narrow Body) 47 DAC08ES-REEL ±0.19% 0°C to 70°C SOIC-16 R-16A (Narrow Body) 2500 DAC08ESZ
3
DAC08ESZ-REEL3±0.19% 0°C to 70°C SOIC-16 R-16A (Narrow Body) 2500 DAC08CP ±0.39% DAC08CPZ
3
DAC08CS ±0.39% DAC08CS-REEL ±0.39% DAC08CSZ
3
DAC08CSZ-REEL3±0.39%
1
Devices processed in total compliance to MIL-STD-883. Consult the factory for the 883 data sheet.
2
For availability and burn-in information on the SOIC and PLCC packages, contact your local sales office.
3
Z = Pb-free part.
NL Temperature Range Package Description Package Option No. Parts Per Container
55°C to +125°C
55°C to +125°C
55°C to +125°C
55°C to +125°C
CERDIP-16 Q-16 25 CERDIP-16 Q-16 25
CERDIP-16 Q-16 25 LCC-20 E-20 55
±0.19% 0°C to 70°C SOIC-16 R-16A (Narrow Body) 47
PDIP-16 N-16 25 PDIP-16 N-16 25 SOIC-16 R-16A (Narrow Body) 47 SOIC-16 R-16A (Narrow Body) 2500 SOIC-16 R-16A (Narrow Body) 47 SOIC-16 R-16A (Narrow Body) 2500
±0.39%
±0.39%
40°C to +85°C
40°C to +85°C
40°C to +85°C
40°C to +85°C
40°C to +85°C
40°C to +85°C
Rev. C | Page 18 of 20
DAC08
NOTES
Rev. C | Page 19 of 20
DAC08
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C00268–0–11/04(C)
Rev. C | Page 20 of 20
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