tum-well (DFB-MQW)1510 nm or 1550 nm laser
with single-mode fiber pigtail
■
Operating temperature range: –25 ° C to +70 ° C
(–25 ° C to +85 ° C versions under development)
No TEC required
■
■
High output power: typical 2.0 mW peak power
coupled into single-mode fiber
■
Hermetically sealed active components
Internal back-facet monitor
■
■
Built-in thermistor and Bias T
■
25 Ω input impedance
Internal isolator
■
■
Telcordia Technologies
gram
■
Bandwidth > 3 GHz
* TA-983 qualification pro-
Description
The D572-Type Uncooled Laser Module consists of a
laser diode coupled to a single-mode fiber pigtail.
The device is available in a standard, 8-pin configuration (see Figure 1 and/or Table 1) and is ideal for
long-reach (SONET) and other high-speed digital
applications.
The module includes a narrow linewidth (<1 nm)
DFB-MQW single-mode laser and an InGaAs PIN
photodiode back-facet monitor in a hermetically
sealed package.
This package is optimized for a 25 Ω input impedance and allows for dc biasing through an internal
bias tee. A thermistor has been included for feedback
to board-level bias circuitry, if needed.
*
T elcordia Technologies
Research, Inc.
is a trademark of Bell Communications
Page 2
°
°
D572-Type 1.5 µm Uncooled DFB
FastLight
Laser ModuleAdvance Data Sheet
for 2.5 Gbits/s and High-Bandwidth ApplicationsFebruary 2000
Description
(continued)
The device characteristics listed in this document are
met at 2.0 mW output power. Higher- or lower-power
operation is possible. Under conditions of a fixed
photodiode current, the change in optical output is typically ± 0.5 dB over an operating temperature range of
–25 ° C to +70 ° C.
This device incorporates the new Laser 2000 manufacturing process from the Optoelectronic Products unit of
Lucent Technologies Microelectronics Group. Laser
2000 is a low-cost platform that targets high-volume
manufacturing and tighter product distributions on all
optical subassemblies. This platform incorporates an
advanced optical design that is produced on one of the
highly automated production lines at the Opotelectronic
manufacturing facility. The Laser 2000 platform is qualified for the central office and uncontrolled environments, and can be used for applications requiring high
performance and low cost.
Figure 1. D572-Type Uncooled DFB Mini 8-Pin Laser Module Schematic, Top View
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
ParameterSymbolMinMaxUnit
Maximum Peak Laser Drive Current or
Maximum Fiber Power*
Peak Reverse Laser Voltage:
Laser
Monitor
Monitor Forward CurrentI
Operating Case Temperature RangeT
Storage Case Temperature RangeT
Lead Soldering Temperature/Time——260/10 ° C/s
Relative Humidity (noncondensing)RH—85%
* Rating varies with temperature.
I
OP
P
MAX
RL
V
RM
V
FD
C
stg
—
—
—
—
150
10
2
20
mA
mW
V
V
—2mA
–4085
–4085
C
C
22
Lucent Technologies Inc.
Page 3
°
∆λ
µ
Ω
µ
Advance Data SheetD572-Type 1.5 µm Uncooled DFB
FastLight
Laser Module
February 2000for 2.5 Gbits/s and High-Bandwidth Applications
Handling Precautions
CAUTION: This device is susceptible to damage as a result of electrostatic discharge (ESD). Take proper
precautions during both handling and testing. Follow
EIA
* Standard
EIA
-625.
Although protection circuitry is designed into the device, take proper precautions to avoid exposure to ESD.
*
EIA
is a registered trademark of Electronic Industries Association.
Electro-Optical Characteristics
Table 2. Electro-Optical Characteristics (over operating temperature range unless otherwise noted)
At bias coil—1.01.6V
Input ImpedanceR——25—
Monitor CurrentI
Monitor Dark CurrentI
Wav elength Tempera-
MON
D
———0.090.12nm/ ° C
5
V
= 5 V100—1000
R
5
V
= 5 V—10200nA
R
A
ture Coefficient
1.BOL value; EOL = 80 mA.
2.The slope efficiency is used to calculate the modulation current for a desired output power . This modulation current plus the threshold current
comprise the total operating current for the device.
3 1510 nm wavelength also available.
4.Corrected for electrical pulse fall time.
5.V
= reverse voltage.
R
Lucent Technologies Inc.
3
Page 4
D572-Type 1.5 µm Uncooled DFB
FastLight
Laser ModuleAdvance Data Sheet
for 2.5 Gbits/s and High-Bandwidth ApplicationsFebruary 2000
Qualification Information
The D572-Type Laser Module is scheduled to complete the following qualification tests and meets the intent of
Telcordia Technologies
ments.
Table 3. D572-Type Laser Module Qualification Test Plan
Qualification TestConditionsSample SizeReference
Mechanical Shock
Vibration
Solderability
Thermal Shock
Fiber Pull
Accelerated (Biased) Aging
High-temperature Storage
Temperature Cycling
Cyclic Moisture Resistance
Damp Heat
Internal Moisture
Flammability
ESD Threshold
TR-NWT-000468 for interoffice environments and TA-TSY-000983 for outside plant environ-
500 G
20 g, 20 Hz—2,000 Hz
—
Delta T = 100 ° C
1 kg; 3 times
85 °C, 5,000 hrs.
85 °C, 2,000 hrs.
500 cycles
10 cycles
40 °C, 95% RH,
1344 hrs.
<5,000 ppm water vapor
—
—
11MIL-STD-883
Method 2002
11MIL-STD-883
Method 2007
11MIL-STD-883
Method 2007
11MIL-STD-883
Method 2003
11Bellcore 983
25Bellcore 983
Section 5.18
11Bellcore 983
11Bellcore 983
Section 5.20
11Bellcore 983
Section 5.23
11MIL-STD-202
Method 103
11MIL-STD-883
Method 1018
—TR357
Section 4.4.2.5
6Bellcore 983
Section 5.22
4
Lucent Technologies Inc.
Page 5
Advance Data SheetD572-Type 1.5 µm Uncooled DFB
FastLight
Laser Module
February 2000for 2.5 Gbits/s and High-Bandwidth Applications
Outline Diagram
Dimensions are in inches and (millimeters).
0.300 (7.62)
0.100 (2.54)
TRADEMARK, CODE, LASER SERIAL NUMBER,
0.169 (4.30)
0.29 (7.37)
AND/OR DATE CODE IN APPROXIMATE AREA SHOWN
0.169 (4.30)
0.20 (5.00)
0.02 (0.50)
0.52 (13.21)
1.06 (27.0)
MIN
39.37 (1000) MIN
(PIGTAIL LENGTH)
0.045 (1.143)
0.17
(4.32)
1.925.e
Lucent Technologies Inc.
5
Page 6
D572-Type 1.5 µm Uncooled DFB
FastLight
Laser ModuleAdvance Data Sheet
for 2.5 Gbits/s and High-Bandwidth ApplicationsFebruary 2000
Laser Safety Information
Class IIIb Laser Product
FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser
Safety requirements. All versions are Class IIIb laser products per
fied with the FDA under accession number 8720010.
This product complies with 21 CFR 1040.10 and 1040.11.
8.3 µm single-mode pigtail or connector
Wavelength = 1.5 µm
Maximum power = 10 mW
Because of size constraints, laser safety labeling is not affixed to the module but attached to the outside of the
shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments, and procedures other than those specified herein may result in
hazardous laser radiation exposure.
*
IEC
is a registered trademark of The International Electrotechnical Commission.
IEC
* 60825-1:1993. The device has been certi-
10 mW1.5 µm
6
Lucent Technologies Inc.
Page 7
Advance Data SheetD572-Type 1.5 µm Uncooled DFB
FastLight
Laser Module
February 2000for 2.5 Gbits/s and High-Bandwidth Applications
Ordering Information
Operating Case
Device Code*ComcodePfiberWavelengthConnector
D572-20AS1084012902.0 mW1550 nmSC-PC–25 to +70
D572-20BS1084013082.0 mW1550 nmSC-APC–25 to +70
D572-20FS1084013162.0 mW1550 nmFC-PC–25 to +70
D572-20GS1084013242.0 mW1550 nmFC-APC–25 to +70
D572-20NS1084013322.0 mW1550 nmnone–25 to +70
D572-20SS1086695652.0 mW1550 nmLC–25 to +70
D572-22AS1084013402.0 mW1550 nmSC-PC–5 to +70
D572-22BS1084013572.0 mW1550 nmSC-APC–5 to +70
D572-22FS1084013652.0 mW1550 nmFC-PC–5 to +70
D572-22GS1084013732.0 mW1550 nmFC-APC–5 to +70
D572-22NS1084013812.0 mW1550 nmnone–5 to +70
D572C20AS1084698422.0 mW1510 nmSC–25 to +70
D572C20BS1084698592.0 mW1510 nmSC-APC–25 to +70
D572C20FS1084698672.0 mW1510 nmFC-PC–25 to +70
D572C20GS1084698752.0 mW1510 nmFC-APC–25 to +70
D572C20NS1084698832.0 mW1510 nmnone–25 to +70
D572C20SS—2.0 mW1510 nmLC–25 to +70
D572C22AS1084698912.0 mW1510 nmSC–5 to +70
D572C22BS1084699092.0 mW1510 nmSC-APC–5 to +70
D572C22FS1084699172.0 mW1510 nmFC-PC–5 to +70
D572C22GS1084699252.0 mW1510 nmFC-APC–5 to +70
D572C22NS1084699332.0 mW1510 nmnone–5 to +70
D572C22SS—2.0 mW1510 nmLC–5 to +70
* Trailing S in code indicates the module contains an isolator.
†Connectors will meet
T elcordia Technologies
GR-326-CORE.
†
Temperature
Range (°C)
Lucent Technologies Inc.
7
Page 8
D572-Type 1.5 µm Uncooled DFB
FastLight
Laser ModuleAdvance Data Sheet
for 2.5 Gbits/s and High-Bandwidth Applications February 2000
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET:http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto
E-MAIL:docmaster@micro.lucent.com
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
CHINA:Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
JAPAN:Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
EUROPE:Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368FAX (44) 1189 328 148
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.