The D171-Type PIN Photodetectors feature a rear-illuminated
planar diode structure with a low-capacitance 4-mil active
area for maximum responsivity and speed.
FastLight
™
PIN Photodetectors
Features
Low-profil e, 4-lead mini-DIL pa ckage
■
— Suitable for SONET applications
High per formance
■
— High speed (<0.5 ns typical rise and fall time)
— High responsivity (0.85 A/W typical)
— Low dark current
Planar st ructure for high reliability
■
Wavelength : 1.1 µm—1.6 µm
■
50 µm core multimode fiber
■
Wide operating temperature range :
■
–40 °C to +85 °C
Wide bandwidth
■
Qualification program : Bellcor e TA-NWT-983
■
Applications
Long-reach SONET OC-3/OC-12 systems and
■
SDH STM-1/STM-4 systems
Secure digital data systems
■
Benefits
Compact si ze
■
Easily board mounted
■
Page 2
D171-Type
FastLight
Advance Data Sheet
PIN PhotodetectorsMarch 1999
Description
The D171-Type Photodetector consists of a PIN coupled to a multimode fiber pigail. The device is available
in a 4-pin mini-DIL configuration (see Figure 3 and/or
Table 1) and is ideal for long-reach (SONET) and other
high-speed digital applications.
The D171-Type PIN Photodetector is a rear-illuminated
planar diode structure with a low-capacitance active
area for maximum responsivity and speed.
This device incorporates the new Laser 2000 manufacturing process from the Optoelectronics Products unit
of Lucent Technologies Microelectronics Group. Laser
2000 is a low-cost platform that targets high-volume
manufacturing and tight product distributions on all
optical subassemblies. This platform incorporates an
advanced optical design that is produced on Opto’s
highly automated production lines. The Laser 2000
platform is qualified for central office and uncontrolled
environments, and can be used for applications requiring high perfomance and low cost.
PIN 2
10 V
N
P
LOAD
LN
RN
N
P
RP
Notes:
This equivalent circuit is intended for modeling the package
capacitance. Minimum capacitance is achieved by connecting the Nside to ground, applying a negative voltage to the P-side, and allowing
the package to float (i.e., not connected to ground).
Typical values are as follows:
CO = 0.3 pF to 0.5 pF.
LN, LP = 3.0 nH.
RN, RP = 5 Ω.
CN = 0.4 pF.
CP = 0.1 pF.
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
ParameterSymbolMinMaxUnit
Operating Temperature RangeT
Storage Temperature RangeT
Forward VoltageV
Reverse Voltage*V
A
stg
F
R
–4085
–4090
°
C
°
C
—0V
—30V
Photocurrent——4mA
Humidity——95%
* The recommended reverse bias voltage is 5 V to 15 V.
Handling Precautions
Electrostatic Discharge
CAUTION:This device is susceptible to damage as a result of electrostatic discharge. Take proper
precautions during both handling and testing. Follow guidelines such as JEDEC Publication
No. 108-A (Dec. 1988).
Although protection circuitry is designed into the device, take proper precautions to avoid exposure to ESD.
The D171-Type PIN Photodetector has completed the following qualification tests and meets the intent of Bellcore
TR-NWT-000468 for interoffice environments and TA-NWT-000983 for outside plant environments.
Table 2. D171-Type PIN Photodetector Qualification Test Plan
Section 5.23
Damp Heat40 °C, 95% RH, 1344 hrs.11 MIL-STD-202
Method 103
Internal Moisture<5000 ppm water vapor11 MIL-STD-883
Method 1018
Flammability——TR357
Sec. 4.4.2.5
ESD Threshold—6Bellcore 983
Section 5.22
Lucent Technologies Inc.
5
Page 6
Advance Data Sheet
D171-Type
FastLight
PIN PhotodetectorsMarch 1999
Ordering Information
Device CodeDescriptionComcode
D171C004BAAPIN 4-Lead Package, 50 µm, MM Fiber, SC Connector108156654
D171C004BAFPIN 4-Lead Package, 50 µm, MM Fiber, FC Connector108156662
D171C004CANPIN 4-Lead Package, SM Fiber, No Connector108271699
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET:
E-MAIL:
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
CHINA:Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
JAPAN:Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
EUROPE:Data Requests: MICROELECTRONICS GROUP DATALINE:
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.