Datasheet CYG2217 Datasheet (CPCLA)

1

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CYG2217

DS-CYG2217-R1

Clare’s Cybergate™ CYG2217 DAA module provides a
complete telephone line interface circuit, including a 2-4
wire converter for transmit and receive signal separation
in a small 1.07" x 1.07" x 0.4" package. The module pro­vides a fast and cost effective solution for designs that
require an interface to the telephone line. The module is
designed to meet FCC part 68 requirements thus provid­ing a low risk design solution.

• Modems

• Fax machines

• Remote data acquisition

• Security systems

• Voice mail systems

• PC motherboard

• Computer telephony

• Process control

• Medical

• PBX

• Direct broadcast satellite

• UL recognized file #: E174201

• Low distortion transformer signal coupling

(0.01% max)

• Complete ring detector circuit

• Low power hookswitch

• Electronic inductor/gyrator circuit

• Solid state surge protection

• Transient protection zeners

• Complete hybrid circuit (2-4 wire converter)

included

• Compatible with all modem chip sets

• V.32 bis/V.34 compatible

Applications

Features

Description

Approvals

CYBERGATE™

Ordering Information

Part # Description

CYG2217 DAA Module (18/Tube)

Block Diagram

2 to 4

Wire

Converter

Line

Transformer

Line

Current

Circuit

Hookswitch

Surge

Protection

Ring

Detect

TIP

RING

XMIT+

RCV

OH

RI

Handling and Assembly Recommendations

The CYG2217 products are not hermetically sealed and should not be exposed to any liquid-based rinsing processes. Clare recommends two (2) approaches. The
modem should either use a no clean soldering flux that would mostly evaporate during the normal wave soldering processes, or be soldered in by hand after the rest of
the card is wave soldered.

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CYG2217

Rev. 1

Electrical Characteristics

Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.

Absolute Maximum Ratings (@ 25˚ C)

2

Parameter Conditions Min Typ Max Units

DC Electrical Characteristics

On-Hook Impedance @100V V

DC

across pins 1,2 10 - - MΩ

2,1 (R,T) per FCC 68.312

Off-Hook Line Leakage Current @100V V

DC

across pins 1,2 - - 10 µA
2,1 (R,T) per FCC 68.312
Power Supply Current @ VCC V

CC

=5V 4 5 6 mA

Hookswitch Control Current @ (OH) @V

OH

=2.4V 3.5 4.1 5.0 mA

@V

OH

=5.0V 11.8 12.4 13 mA

Hookswitch Control Voltage

Off-Hook - 2.0 3.0 20 V

On-Hook - - 0.2 0.5 V
AC Signal Path Electrical Characteristics
Return Loss 600Ω, 1800Hz 39 40 - dB
Insertion Loss 600Ω, 1800Hz

Transmit Test Circuit 1 6.0 6.5 7 dB

Receive Test Circuit 2 -1.0 0 +1.0 dB
Frequency Response 300-3500Hz -0.25 - +0.25 dB
Longitudinal Balance

On-Hook Per FCC 68.310 60 - - dB

Off-Hook Per FCC 68.310 40 - - dB
Transhybrid Loss 600Ω, 1800Hz - -32 -10 dB
Total Harmonic Distortion 600Ω, 1800Hz - -80 - dB
DC Loop Current - 20 - 120 mA

Ring Detection Circuit Characteristics

Ringing Voltage Detection Range - 20 - 150 V

RMS

Ringing Frequency Detection Range - 15 - 70 Hz
Ringer Equivalence Number - - 0.8B - ­RING (Pin 5) Output Voltage (Pulsed) V

CC

=+5V
Logic ‘0’, Ring present - - 0.8 V
Logic ‘1’, Ring not present - - V

CC

V

Surge and Isolation Characteristics

Surge Protection Voltage Tip and Ring

(Pins 1,2) - - - 300 V

Isolation Voltage

(Pins 18,17,16,15,14,5,4,to1,2) Per FCC 68.302 1000 - - V

RMS

Parameter Min Typ Max Units

Isolation Voltage - - 1000 V

RMS

Operational Temperature 0 - 70 °C
Storage Temperature 0 - 100 °C
Relative Humidity 10 - 85 %

(Non-Condensing)

Soldering Temperature - - 260 °C
Tip/Ring Load Current

(continuous) - - 120 mA

Hookswitch LED Drive - - 50 mA

Current

Hookswitch LED Reverse - - 5 V

Voltage

Ring Detect Phototransistor

Voltage V

CC

--20V

1

Derate Linearly 1.33 mw / oC

2

Derate Linearly 3.67 mw / oC

CYG2217

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Rev. 1

3

Test Circuits

TIP

RING

+5V

+5V

600

Ω

+V

BATT

ÐV

BATT

OH

RI

10H

10H

600

V

CC

RCV

NC

GND

XMIT+

V

LT

I

LOOP

AC
Source

1. CYG2217 Transmit Insertion Loss

G Log

V

V

TR

LT

T

=

20

Transmit Insertion Loss =

TIP

RING

+5V

OH

RI

V

CC

V

R

RCV

NC

GND

XMIT+

+V

BATT

ÐV

BATT

10H

600

Ω

10H

V

LR

I

LOOP

AC

Source

2. CYG2217 Receive Insertion Loss

G

Log

V
V

RC

R

LR

=

20

Receive Insertion Loss =

+5V

Package Pinout

18
17

1
2

4
5

GND
XMIT+

RCV

14

16
15

VCC
NC

TIP

RING

OH

RI

CYG22XX

CYG2217 Pinouts & Definitions

PIN# Name Function

1 TIP Connection to telephone line Tip connected through an

external fuse.
2 RING Connection to telephone line Ring conductor.
4 OH Driving this pin high asserts the off-hook condition. The

hookswitch LED is current limited by an internal 300Ω resis-

tor.
5 RI Active LOW indicates an incoming ring signal. This is pulsed

LOW by the AC ring signal and is not a steady state LOW

during ringing.

14 RCV Provides the analog output signal from the 2-4 wire convert-

er of the CYG2217. RCV uses a 2.5 volt reference signal and

therefore must be capacitively coupled to host equipment

which uses a ground reference.

15 NC No connection.
16 V

CC

Provides power to the CYG2217. Typically +5V, VCCshould

not exceed 20V.

17 XMIT+ Provides the analog intput signal from the 2-4 wire converter

of the CYG2217. XMIT+ uses a 2.5 volt reference signal and

therefore must be capacitively coupled to host equipment

which uses a ground reference.

18 GND Connection to host system ground.

CYG2217

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85077 Manching
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Worldwide Sales Offices

Specification: DS-CYG2217-R1
©Copyright 2001, Clare, Inc.
All rights reserved. Printed in USA.
1/12/01

Clare cannot assume responsibility for use of any circuitry other
than circuitry entirely embodied in this Clare product. No circuit
patent licenses nor indemnity are expressed or implied. Clare
reserves the right to change the specification and circuitry, with­out notice at any time. The products described in this document
are not intended for use in medical implantation or other direct life
support applications where malfunction may result in direct phys­ical harm, injury or death to a person.