Datasheet CY7C63310 Datasheet (CYPRESS)

Page 1
CY7C63310 CY7C638xx CY7C639xx
enCoRe™ II
Low-S peed USB Peripheral Controller

1.0 Features

• enCoRe II USB—“enhanced Component Reduction” —Crystalless oscillator with support for an external
—Internal 3.3V regulator and internal USB pull-up
resistor
—Configurable IO for real-world interface without
external components
• USB Specification Compliance —Conforms to USB Specification, Version 2.0
—Conforms to USB HID Specification, Version 1.1 —Supports one Low-Speed USB device address —Supports one control endpoint and two data
endpoints
—Integrated USB transceiver
• Enhanced 8-bit microcontroller —Harvard architecture —M8C CPU speed can be up t o 24 M Hz or s ourced b y
an external crystal, resonator, or signal
• Internal memory —Up to 256 bytes of RAM —Up to eight Kbytes of Flash including EEROM
emulation
• Interface can auto-configure to opera te as PS/2 or USB —No external component s for switching between PS/2
and USB modes
—No GPIO pins needed to manage dual-mode
capability
• Low power consumption —Typically 10 mA at 6 MHz
—10-µA sleep
• In-system re-programmability —Allows easy firmware update
• General-purpose I/O ports —Up to 36 General Purpose I/O (GPIO) pins
—High current drive on GPIO pins. Configurable 8- or
50-mA/pin current sink on designated pins
—Each GPIO port supports high-impedance inputs,
configurable pull-up, open d rain output, CM OS/TTL inputs, and CMOS output
—Maskable interrupts on all I/O pins
• 125-mA 3.3V volt age regulator can power exter nal 3.3V
devices
• 3.3V I/O pins —4 I/O pins with 3.3V logic levels
—Each 3.3V pin supports high-impedance input,
internal pull-up, open drain output or traditional CMOS output
• SPI serial communication —Master or slave operation
—Configurable up to 2-Mbit/second transfers —Supports half duplex single data line mode for
optical sensors
• 2-channel 8-bit or 1-channel 16-bit capture timer.
Capture timers registers store both rising and falling edge times
—Two registers each for two input pins —Separate registe rs for rising and falling edge capture —Simplifies interface to RF inputs for wireless
applications
• Internal low-power wake-up timer during suspend
mode
—Periodic wake-up with no external components
• Programmable Interval Timer interrupts
• Reduced RF emissions at 27 MHz and 96 MHz
• Advanced development tools based on Cypress
MicroSystems PSoC™ tools
• Watchdog timer (WDT)
• Low-voltage detection with user-configurable
threshold voltages
• Improved output drivers to reduce EMI
• Operating voltage from 4.0V to 5.25VDC
• Operating temperature from 0–70°C
• Availa ble in 16/18/24/40-pin PDIP , 16/18/24-pin SOI C, 24-
pin QSOP, 28/48-pin SSOP, and DIE form
• Industry standard programmer support

1.1 Applications

The CY7C633xx/CY7C638xx/CY7C639xx is targeted for the following applications:
PC HID devicesMice (optomechanical, optical, trackball)
Keyboards
GamingJoysticks
Game padsConsole keyboards
General-purposeBarcode scanners
POS terminalConsumer electronicsToysRemote controls
Cypress Semiconductor Corporation 3901 North First Street San Jose, CA 95134 408-943-2600 Document 38-08035 Rev. *E Revised March 29, 2005
Page 2
CY7C63310 CY7C638xx CY7C639xx

2.0 Introduction

Cypress has reinvented its leadership position in the low­speed USB market with a new family of innovative microcon­trollers. Introducin g enCoRe II USB “enhanced Component Reduction. Cypress has leveraged its design expertise in USB solutions to advance its family of low-speed USB micro­controllers, which ena ble peripheral de velopers to desi gn new products with a minimum number of components. The enCoRe II USB technology builds on to the enCoRe family. The enCoRe family has an integrated oscilla tor that eliminates the external crystal or resonator, reducing overall cost. Also integrated into this chip are other external components commonly found in low-speed USB applications such as pull­up resistors, wake-up circuitry, and a 3.3V regulator.
All of this adds up to a lower system cost. The enCoRe II is an 8-bit Flash -programmable microc ontroller
with integrated low-speed USB interface. The instruction set has been optimiz ed spec ifically for USB and PS/2 operations, although the microcontro llers can be used for a variety of other embedded applications.
The enCoRe II features up to 36 general-purpose I/O (GPIO) pins to support USB, PS/2 and other applicatio ns. The I/O pins are grouped into five port s (Port 0 to 4). The pins on Port 0 and Port 1 may each be configured individually while the pins on Ports 2, 3, and 4 may only be configured as a group. Each GPIO port support s hig h-im pe da nce inp ut s , c onfi gurable pull­up, open drain output, CMOS/TTL inputs, and CMOS output with up to five pins that support programmable drive strength of up to 50-mA sink current. G PIO Port 1 features four pins t hat interface at a voltage level of 3.3 volts. Additionally, each I/O pin can be used to gener ate a GPIO interrup t to the microc on­troller. Each GPIO port has its own GPIO interrupt vector with the exception of GPIO Port 0 . GPIO Port 0 has three dedicated pins that have independent interrupt vectors (P0.2 - P0.4).
The enCoRe II features an internal oscillator. With the presence of USB traffic, the internal oscillator can be set to precisely tune to USB timing requirements (24 MHz ±1.5%). Optionally , an external 12-MH z or 24-MHz cry stal can b e used to provide a higher precisi on reference for USB operation. T he clock generator provides the 12-MHz and 24-MHz clocks that remain internal to the microcontroller.
The enCoRe II has up to eight Kbytes of Fla sh for users code and up to 256 bytes of RAM for stack space and user variables.
In addition, the enCoRe II includes a Watchdog timer, a vectored interrupt co ntroller , a 16-bit Free-Running T imer , and Capture T imers. The Power-o n reset circuit detects logic w hen power is applied to the de vic e, generates resets the logi c to a known state, and begins executing instructions at Flash address 0x0000. When power falls below a programmable trip voltage generates reset or may be configured to generate interrupt. There is a Low-voltage detect circuit that detects when V configurable to generate an LVD interrupt to inform the processor about the low-voltage event. POR and LVD share
drops below a program mable trip volt age. It may be
CC
the same interrupt. There is no separate interrupt for each. The Watchdo g timer can be used t o ensure the firmware never gets stalled in an infinite loop.
The microcontroller supports 23 maskable interrupts in the vectored interrupt controller. Interrupt sources include a USB bus reset, LVR/POR, a programmable interval timer, a
1.024-ms output from the Free Running Timer, three USB endpoints, two capture timers, five GPIO Ports, three GPIO pins, two SPI, a 16-bit free running timer wrap, an internal wake-up timer, and a bus active interrupt. The wake-up timer causes periodic interrupts when enabled. The USB endpoints interrupt after a USB transaction complete is on the bus. The capture timers interrupt whenever a new timer value is saved due to a selected GPIO edge event. A total of eight GPIO interrupts support both TTL or CMOS thresholds. For additional flexibility, on the edge sensitive GPIO pins, the interrupt polarity is programm able to b e either ri sing or f alling.
The free-running 16-bit timer provides two interrupt sources: the programmable interval timer with 1-µs resolution and the
1.024-ms outputs. The timer can be used to measure the duration of an event under firmware control by reading the timer at the start and at the end of an event, then calculating the difference between the two values. The two 8-bit capture timers save a programmable 8-bit range of the free-running timer when a GPIO edge occurs on the two captur e pins (P0.5, P0.6). The two 8-bit captures can be ganged into a single 16-bit capture.
The enCoRe II includes an integrated USB serial interface engine (SIE) that allows the chip to easily interface to a USB host. The hardware supports one USB device address with three endpoints.
The USB D+ and D– pins can optionally be used as PS/2 SCLK and SDA TA signals so that products can be designed to respond to either USB or PS/2 modes of operation. PS/2 operation is supported with internal 5-K pull-up resistors on P1.0 (D+) and P1.1 (D–) and an interrupt to signal the start of PS/2 activity. In USB mode, the integrated 1.5-KΩ pull-up resistor on D– can be controlled under firmware. No external components are necessary for dual USB and PS/2 systems, and no GPIO pins need to be de dicated to switching between modes. Slow edge ra tes operate in bot h modes to red uce EMI.
The enCoRe II supports in-system programming by using the D+ and D– pins as the serial programming mode interface. The programming protocol is not USB.

3.0 Conventions

In this document, bit positions in the registers are shaded to indicate which me mbers of the enCoRe II family implement t he bits.
Available in all enCoRe II family members CY7C639xx and CY7C638xx only CY7C639xx only
Document 38-08035 Rev. *E Page 2 of 68
Page 3

4.0 Logic Block Diagram

Low-Speed
3.3V
Regulator
Internal 24 MHz
Oscillator
USB/PS2 Transceiver and Pull-up
Low-Speed
USB SIE
Interrupt
Control
4 3VIO/SPI
Pins
16 Extend ed
I/O Pins
16 GPIO
Pins
CY7C63310 CY7C638xx CY7C639xx
Wakeup
Timer
Crystal
Oscillator
Clock
Control
POR /
Low-Voltage
Detect
Vdd
M8C CPU
Watchdog
Timer
RAM
Up to 256
Byte
Flash
Up to 8 K
Byte
Figure 4-1. CY7C633xx/CY7C638xx/CY7C639xx Block Diagram
12-bit Timer
Capture
Timers
Document 38-08035 Rev. *E Page 3 of 68
Page 4

5.0 Packages/Pinouts

CY7C63310 CY7C638xx CY7C639xx
Top View
SSEL/P1.3
SCLK/P1.4 SMOSI/P1.5 SMISO/P1.6
P0.6/TIO1 P0.5/TIO0
INT2/P0.4
INT1/P0.3
SSEL/P1.3
SCLK/P1.4 SMOSI/P1.5 SMISO/P1.6
P1.7
P0.7 TIO1/P0.6 TIO0/P0.5
INT2/P0.4
CY7C63801
16-pin PDIP
CY7C63310
16-pin PDIP
1
16 15
2 3
14 13
4
12
5
11
6
10
7
9
8
CY7C63813
18-pin PDIP
1
18 17
2 3
16 15
4
14
5
13
6
12
7
11
8
10
9
P1.2 V
CC
P1.1/D– P1.0/D+ V
SS
P0.0 P0.1 P0.2/INT0
P1.2/VREG V
CC
P1.1/D– P1.0/D+ V
SS
P0.0 P0.1 P0.2/INT0 P0.3/INT1
P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1 P0.2/INT0
P0.1 P0.0
V
P0.7 P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1
P0.2/INT0
P0.1
P0.0
V
CY7C63801
16-pin SOIC
CY7C63310
16-pin SOIC
1
16 15
2 3
14 13
4
12
5
11
6
10
7
9
8
SS
CY7C63813
18-pin SOIC
1
18 17
2 3
16 15
4
14
5
13
6
12
7
11
8
10
9
SS
P1.6/SMISO
P1.5/SMOSI
P1.4/SCLK P1.3/SSEL
P1.2
V
CC
P1.1/D– P1.0/D+
P1.7 P1.6/SMISO P1.5/SMOSI P1.4/SCLK P1.3/SSEL P1.2/VREG V
CC
P1.1/D– P1.0/D+
P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1
P0.1 P0.0
V
P3.0 P3.1
SCLK/P1.4 SMOSI/P1.5 SMISO/P1.6
P1.7
NC NC
P0.7 TIO1/P0.6 TIO0/P0.5 INT2/P0.4
CY7C63803
16-pin SOIC
16
1
15
2
14
3
13
4
12P0.2/INT0
5
11
6
10
7
9
8
SS
CY7C63823
24-pin PDIP
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
P1.6/SMISO P1.5/SMOSI
P1.4/SCLK P1.3/SSEL P1.2/VREG V
CC
P1.1/D– P1.0/D+
P1.3/SSEL P1.2/VREG
V
CC
P1.1/D– P1.0/D+ V
SS
P2.0 P2.1 P0.0 P0.1 P0.2/INT0
P0.3/INT1
NC
P0.7 TIO1/P0.6 TIO0/P0.5
INT2/P0.4 INT1/P0.3 INT0/P0.2
P0.1
P0.0
P2.1
P2.0
V
CY7C63823
24-pin SOIC
1 2 3 4 5 6 7 8 9 10 11 12
SS
24 23NCP1.7
P1.6/SMISO
22 21
P1.5/SMOSI
P1.4/SCLK
20
P3.1
19 18
P3.0
17
P1.3/SSEL
16
P1.2/VREG V
15
CC
P1.1/D–
14
P1.0/D+
13
CY7C63823
24-pin QSOP
NC
P0.7 TIO1/P0.6 TIO0/P0.5 INT2/P0.4 INT1/P0.3 INT0/P0.2
P0.1
P0.0
P2.1
P2.0
NC
1 2 3 4 5 6
7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
P1.7
P1.6/SMISO
P1.5/SMOSI
P1.4/SCLK
P3.1
P3.0 P1.3/SSEL P1.2/VREG
V
CC
P1.1/D–
P1.0/D+
V
SS
Figure 5-1. Package Configurations
V P2.7 P2.6 P2.5 P2.4 P0.7
TIO1/P0.6 TIO0/P0.5 INT2/P0.4 INT1/P0.3 INT0/P0.2
CLKOUT/P0.1
CLKIN/P0.0
V
CY7C63903
28-pin SSOP
1 2 3 4 5 6 7 8 9 10 11 12
13 14
28 27 26 25 24 23 22 21 20 19 18 17
16 P1.1/D– 15
CC
SS
V
SS
P3.7 P3.6
P3.5 P3.4 P1.7 P1.6/SMISO P1.5/SMOSI P1.4/SCLK P1.3/SSEL
P1.2/VREG V
CC
P1.0/D+
Document 38-08035 Rev. *E Page 4 of 68
Page 5
V P4.1 P4.0 P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 P0.7
P0.6/TIO1 P0.5/TIO0
P0.4/INT2 P0.3/INT1 P0.2/INT0
P0.1/CLKOUT
P0.0/CLKIN
V
CY7C63913
40-pin PDIP
1
CC
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
SS
40
39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
V
SS
P4.3 P4.2 P3.7 P3.6 P3.5 P3.4 P3.3 P3.2 P3.1 P3.0 P1.7 P1.6/SMISO P1.5/SMOSI P1.4/SCLK P1.3/SSEL P1.2/VREG V
CC
P1.1/D– P1.0/D+
NC NC NC NC
V P4.1 P4.0 P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 P0.7
P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1
P0.2/INT0
P0.1/CLKOUT
P0.0/CLKIN
V
Top View
CY7C63923
48-pin SSOP
1
48 47
2
46
3
45
4
44
5
CC
SS
43
6
42
7
41
8
40
9
39
10
38
11 12 13
36 35
14
34
15
33
16
32
17
31
18
30
19
29
20
28
21
27
22
26
23 24
NC NC
NC NC V
SS
P4.3 P4.2 P3.7 P3.6 P3.5 P3.4 P3.337 P3.2 P3.1
P3.0 P1.7 P1.6/SMISO P1.5/SMOSI P1.4/SCLK P1.3/SSEL P1.2/VREG V
CC
P1.1/D– P1.0/D+25
P4.0
P2.7
P2.6
P2.5 P2.4 P2.3
P2.2
P2.1 P2.0
P0.7 P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1 P0.2/INT0
P0.1/CLKOUT
CY7C63923-XC
CC
NC
V
P4.1
5
6
4
7
8 9
10
11
12
13
14
15
16
17
18 19
20
21
22
NC
3
NC
2
CY7C63310 CY7C638xx CY7C639xx
DIE
SS
V
P4.2
P4.3
NC
NC
NC
NC
1
47
43
46
44
48
23
P0.0/CLKIN
42
26
24
25
SS
V
P1.1/D–
P1.0/D+
P3.7 41
40
P3.6
39
P3.5
38
P3.4
37
P3.3
36
P3.2
35
P3.1
34
P3.0
33
P1.7
32
P1.6/SMISO
31
P1.5/SMOSI
30
P1.4/SCLK
29
P1.3/SSEL
28
P1.2/VREG
27
V
CC
Figure 5-1 Package Configurations (continued)

5.1 Pinouts Assignments

Table 5-1. Pin Assignments
48
SSOP
40
PDIP
SSOP
7 3 7 P4.0 GPIO Port 4 – configured as a group
62 6P4.1 42 38 42 P4.2 43 39 43 P4.3
34 30 18 1 34 P3.0 GPIO Port 3 – configured as a group 35 31 20 19 2 35 P3.1 36 32 19 36 P3.2 37 33 37 P3.3 38 34 24 38 P3.4 39 35 25 39 P3.5 40 36 26 40 P3.6 41 37 27 41 P3.7
15 11 11 11 18 15 P2.0 GPIO Port 2 – configured as a group 14 10 10 10 17 14 P2.1 13 9 13 P2.2 12 8 12 P2.3 11 7 5 11 P2.4 10 6 4 10 P2.5
953 9P2.6
842 8P2.7
28
24
24
QSOP
SOIC24PDIP18SIOC18PDIP16SOIC16PDIP
Die
Pad
Name Description
(nibble)
(byte)
(byte)
Document 38-08035 Rev. *E Page 5 of 68
Page 6
CY7C63310 CY7C638xx CY7C639xx
Table 5-1. Pin Assignments (continued)
48
SSOP
40
PDIP
SSOP
25 21 15 14 13 20 10 15 9 13 25 P1.0/D+ GPIO Port 1 bit 0 / USB D+ 26 22 16 15 14 21 11 16 10 14 26 P1.1/D– GPIO Port 1 bit 1 / USB D– 28 24 18 17 16 23 13 18 12 16 28 P1.2/VREG GPIO Port 1 bit 2—C onfigured individually .
29 25 19 18 17 24 14 1 13 1 29 P1.3/SSEL GPIO Port 1 bit 3—Configured individually .
30 26 20 21 20 3 15 2 14 2 30 P1.4/SCLK GPIO Po rt 1 bit 4Configured individually .
31 27 21 22 21 4 16 3 15 3 31 P1.5/SMOSI GPIO P ort 1 bi t 5Configured individually.
32 28 22 23 22 5 17 4 16 4 32 P1.6/SMISO GPIO P ort 1 bi t 6Configured individually.
33 29 23 24 23 6 18 5 33 P1.7 GPIO Po rt 1 bit 7Configured individually .
28
24
24
QSOP
SOIC24PDIP18SIOC18PDIP16SOIC16PDIP
Die
Pad
Name Description
[1] [1]
3.3V if regulator is enabled. (The 3.3V regulator is not available in the CY7C63310 and CY7C63801.)
Alternate function is SSEL signal of the SPI bus TTL voltage thresholds
Alternate function is SCLK signal of the SPI bus TTL voltage thresholds
Alternate function is SMOSI signal of the SPI bus TTL voltage thresholds
Alternate function is SMISO signal of the SPI bus TTL voltage thresholds
TTL voltage threshold.
23 19 13 9 9 16 8 13 7 11 23 P0.0/CLKIN GPIO Por t 0 bit 0—Configured individually .
On CY7C639xx, optional Clock In when external crystal oscillator is disabled or crystal input when external crystal oscil­lator is enabled. On CY7C638xx and CY7C63310, oscil­lator input when configured as Clock In
22 18 12 8 8 15 7 12 6 10 22 P0.1 /
CLKOUT
GPIO Port 0 bit 1Configured individually On CY7C639xx, optional clock out when external crystal oscillator is disabled or crystal output drive when externa l cryst al oscillator is enabled . On CY7C638xx and CY7C63310, oscil­lator output when confi gured as Clock out.
21 17 11 7 7 14 6 11 5 9 21 P0.2/INT0 GPIO port 0 bit 2Configured individually
Optional rising edge interrupt INT0
20 16 10 6 6 13 5 10 4 8 20 P0.3/INT1 GPIO port 0 bit 3Configured individually
Optional rising edge interrupt INT1
19 15 9 5 5 12 4 9 3 7 19 P0.4/INT2 GPIO port 0 bit 4Configured individually
Optional rising edge interrupt INT2
18 14 8 4 4 1 1 3 8 2 6 18 P0.5/TIO0 GPIO port 0 bit 5Configured individually
Alternate function T imer capture input s or Timer output TIO 0
17 13 7 3 3 10 2 7 1 5 17 P0.6/TIO1 GPIO port 0 bit 6Configured individually
Alternate function T imer capture input s or Timer output TIO 1
16 12 6 2 2 9 1 6 16 P0.7 GPIO port 0 bit 7Configured individually
Not in 16 pin PDIP or SOIC package
1,2,3,
4
Note:
1. P1.0(D+) and P1.1(D-) pins should be in I/O mode when used as GPIO and in I
117 1,2,
NC No connect
3,4
mode.
SB
Document 38-08035 Rev. *E Page 6 of 68
Page 7
Table 5-1. Pin Assignments (continued)
48
SSOP
45,46,
47,48
40
PDIP
SSOP
24
28
QSOP
24
SOIC24PDIP18SIOC18PDIP16SOIC16PDIP
12 24 8 45,
Die
Pad
46, 47,
48
51 5V 27 23 1 16 15221217111527 44 40 –––– 44 V 24 20 28 13 12 19 9 14 8 12 24
Name Description
NC No connect
CC
SS
Power
Ground
CY7C63310 CY7C638xx CY7C639xx

6.0 CPU Architecture

This family of m icrocontrollers i s based on a high performance, 8-bit, Harvard-architecture microprocessor. Five registers control the primary operati on of the CPU core. These regi sters are affected by var ious instructi ons, but are not direct ly acces­sible through the register space by the us er.
Table 6-1. CPU Registers and Register Names
Register Register Name
Flags CPU_F Program Counter CPU_PC Accumulator CPU_A Stack Pointer CPU_SP Index CPU_X
The 16-bit Program Counter Register (CPU_PC) allows for direct addressing of the full eight Kbytes of program memory space.
The Accumulator Register (CPU_A) is the general-purpose register that holds the results of instructions that specify any of the source addressing modes.
The Index Register (C PU_X) holds an o ffset va lue that is us ed in the indexed address ing modes. Typically, this is used to address a block of data within the data memory space.
The St ack Pointer Regi ster (CPU_SP) holds th e address of the current top-of-sta ck in the data memo ry space. It is af fected by the PUSH, POP, LCALL, CALL, RETI, and RET instructions, which manage the software stack. It can also be affected by the SWAP and ADD instructions.
The Flag Register (CPU _F) has three st atus bit s: Zero Flag bit [1]; Carry Flag bit [2]; Supervisory State bit [3]. The Global Interrupt Enable bit [0] is used to globally enable or disable interrupts. The user cannot manipulate the Supervisory State status bit [3]. The flags are affected by arithmetic, logic, and shift operations. The manner in which each flag is changed is dependent upon the instruction being executed (i.e., AND, OR, XOR). See Table 8-1.
Document 38-08035 Rev. *E Page 7 of 68
Page 8
CY7C63310 CY7C638xx CY7C639xx

7.0 CPU Registers

7.1 Flags Register

The Flags Register can only be set or reset with logical instruction.
Table 7-1. CPU Flags Register (CPU_F) [R/W]
Bit # 7 6 5 4 3 2 1 0
Field Reserved XIO Super Carry Zero Global IE
Read/Write –––R/W R RW RW RW
Default 00000010
Bit [7:5]: Reserved Bit 4: XIO
Set by the user to select between the register banks 0 = Bank 0 1 = Bank 1 Bit 3: Super Indicates whether the CPU is executing user code or Supervisor Code. (This code cannot be accessed directly by the user) 0 = User Code 1 = Supervisor Code Bit 2: Carry Set by CPU to indicate whether there has been a carry in the previous logical/arithmetic operation 0 = No Carry 1 = Carry Bit 1: Zero Set by CPU to indicate whether there has been a zero result in the previous logical/arithmetic operation 0 = Not Equal to Zero 1 = Equal to Zero Bit 0: Global IE Determines whether all interrupts are enabled or disabled 0 = Disabled 1 = Enabled Note: CPU_F register is only readable with explicit register address 0xF7. The OR F, expr and AND F, expr instructions must be used to set and clear the CPU_F bits

7.1.1 Accumulator Register

Table 7-2. CPU Accumulator Register (CPU_A)
Bit # 7 6 5 4 3 2 1 0 Field CPU Accumulator [7:0]
Read/Write ––––––––
Default 00000000
Bit [7:0]: CPU Accumulator [7:0]
8-bit data value holds the result of any logical/arithmetic instruction that uses a source addressing mode

7.1.2 Index Register

Table 7-3. CPU X Register (CPU_X)
Bit # 7 6 5 4 3 2 1 0 Field X [7:0]
Read/Write ––––––––
Default 00000000
Bit [7:0]: X [7:0]
8-bit data value holds an index for any instruction that uses an indexed addressing mode
Document 38-08035 Rev. *E Page 8 of 68
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CY7C63310 CY7C638xx CY7C639xx

7.1.3 Stack Pointer Register

Table 7-4. CPU Stack Pointer Register (CPU_SP)
Bit # 7 6 5 4 3 2 1 0 Field Stack Pointer [7:0]
Read/Write ––––––––
Default 00000000
Bit [7:0]: Stack Pointer [7:0]
8-bit data value holds a pointer to the current top-of-stack

7.1.4 CPU Program Counter High Regi ster

Table 7-5. CPU Program Counter High Register (CPU_PCH)
Bit # 7 6 5 4 3 2 1 0 Field Program Counter [15:8]
Read/Write ––––––––
Default 00000000
Bit [7:0]: Program Counter [15:8]
8-bit data value holds the higher byte of the program counter

7.1.5 CPU Program Counter Low Register

Table 7-6. CPU Program Counter Low Register (CPU_PCL)
Bit # 7 6 5 4 3 2 1 0 Field Program Counter [7:0]
Read/Write ––––––––
Default 00000000
Bit [7:0]: Program Counter [7:0]
8-bit data value holds the lower byte of the program counter

7.2 Addressing Modes

7.2.1 Source Immediate

The result of an instruction using this addressing mode is placed in the A register, the F register, the SP register, or the X register , which is spec ified as p art of the instructi on opcode. Operand 1 is an immediate value that serves as a source for the instruction. Arithmetic instructions require two sources. Instructions using this addressing mode are two bytes in length.
Table 7-7. Source Immediate
Opcode Operand 1
Instruction Immediate Value
Examples
ADD A, 7 ;In this case, the immediate value
;of 7 is added with the Accumulator, ;and the result is placed in the ;Accumulator.
MOV X, 8 ;In this case, the immediate value
;of 8 is moved to the X register.
AND F, 9 ;In this case, the immediate value
;of 9 is logically ANDed with the F ;register and the result is placed ;in the F register.

7.2.2 Source Direct

The result of an instruction using this addressing mode is placed in either the A register or the X register, which is specified as part of the instruction opcode. Operand 1 is an address that points to a location in either the RAM memory space or the register space that is the source for the instruction. Arithmetic instructions require two sources; the second source is the A register or X register specified in the opcode. Instructions using this addressing mode are two bytes in length.
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Table 7-8. Source Direct
Opcode Operand 1
Instructio n Source Address
Examples
ADD A, [7] ;In this case, the ;value in
;the RAM memory location at ;address 7 is added with the ;Accumulator, and the result ;is placed in the Accumulator.
MOV X, REG[8] ;In this case, the value in
;the register space at address ;8 is moved to the X register.

7.2.3 Source Indexed

The result of an instruction using this addressing mode is placed in either the A register or the X register, which is specified as part of the instruction opc ode. Operand 1 is added to the X register forming an addres s that point s to a loc ation in either the RAM memory spac e or the re gister sp ace th at is the source for the instruction. Arithmetic instructions require two sources; the second source is the A register or X register specified in the opcode. Instructions using this addressing mode are two bytes in length.
Table 7-9. Source Indexed
Opcode Operand 1
Instruction Source Index
Examples
ADD A, [X+7] ;In this case, the value in
;the memory location at ;address X + 7 is added with ;the Accumulator, and the ;result is placed in the ;Accumulator.
MOV X, REG[X+8] ;In this case, the value in
;the register space at ;address X + 8 is moved to ;the X register.

7.2.4 Destination Direct

The result of an instruction using this addressing mode is placed within either the RAM memory space or the register space. Operand 1 is an address that points to the location of the result. The so urce for the inst ruction is either the A re gister or the X register, which is specified as part of the instruction opcode. Arithmetic instructions require two sources; the second source is t he locatio n specifie d by Operan d 1. Instru c­tions using this addressing mode are two bytes in length.
Examples
ADD [7], A ;In this case, the value in
;the memory location at ;address 7 is added with the ;Accumulator, and the result ;is placed in the memory ;location at address 7. The ;Accumulator is unchanged.
MOV REG[8], A ;In this case, the Accumula-
;tor is moved to the regis­;ter space location at ;address 8. The Accumulator ;is unchanged.

7.2.5 Destination Indexed

The result of an instruction using this addressing mode is placed within either the RAM memory space or the register space. Operand 1 is added to the X register forming the address that point s to the location o f the result . The source for the instruction is the A regi ste r. Arithmetic instructions require two sources ; the second s ource is the lo cation specifi ed by Operand 1 added with the X register. Instructions using this addressing mode are two bytes in length.
Table 7-11. Destination Indexed
Opcode Operand 1
Instruction Destination Index
Example
ADD [X+7], A ;In this case, the value in the
;memory location at address X+7 ;is added with the Accumulator, ;and the result is placed in ;the memory location at address ;x+7. The Accumulator is ;unchanged.

7.2.6 Destination Direct Immediate

The result of an instruction using this addressing mode is placed within either the RAM memory space or the register space. Operand 1 is th e ad d res s of th e re su lt. Th e sou rce fo r the instruction is Operand 2, which is an immediate value. Arithmetic instructi ons require two s ources; the second source is the location specified by Operand 1. Instructions using this addressing mode are three bytes in length.
Table 7-12. Destination Direct Immediate
Opcode Operand 1 Operand 2
Instruction Destination Address Immediate Value
Table 7-10. Destination Direct
Opcode Operand 1
Instruction Destination Address
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Examples
ADD [7], 5 ;In this case, value in the mem-
;ory location at address 7 is ;added to the immediate value of ;5, and the result is placed in ;the memory location at address 7.
MOV REG[8], 6 ;In this case, the immediate
;value of 6 is moved into the ;register space location at ;address 8.

7.2.7 Destination Indexed Immediate

The result of an instruction using this addressing mode is placed within either the RAM memory space or the register space. Operand 1 is added to the X register to form the address of the result. The sou rce for the ins truction is Opera nd 2, which is an imm ediate va lue. Arithm etic inst ructions r equire two sources; the second source is the location specified by Operand 1 added with the X register. Instructions using this addressing mode are three bytes in length.
Table 7-13. Destination Indexed Immediate
Opcode Operand 1 Operand 2
Instruction Destination Index Immediate Value
Examples
ADD [X+7], 5 ;In this case, the value in
;the memory location at ;address X+7 is added with ;the immediate value of 5, ;and the result is placed ;in the memory location at ;address X+7.
MOV REG[X+8], 6 ;In this case, the immedi-
;ate value of 6 is moved ;into the location in the ;register space at ;address X+8.

7.2.8 Destination Direct

The result of an instruction using this addressing mode is placed within the RAM memory. Operand 1 is the address of the result. Oper and 2 is an ad dres s tha t points to a loc ati on in the RAM memory that is the source for the instruction. This addressing mode is only valid on the MOV instruction. The instruction us ing this a ddressing mode is t hree bytes in length.
Table 7-14. Destination Direct
Opcode Operand 1 Operand 2
Instruction Destination Address Source Address
Example
MOV [7], [8] ;In this case, the value in the
;memory location at address 8 is ;moved to the memory location at ;address 7.

7.2.9 Source Indirect Post Increment

The result of an instruction using this addressing mode is placed in the Accumulator. Operand 1 is an address pointing to a location within the memory space, which contains an address (the indi rect address) for the source of the instruc tion. The indirect address is incremented as part of the instruction execution. This addressing mode is only valid on the MVI instruction. The instruction using this addressing mode is two bytes in length. Refer to the PSoC Designer: Assembly Language User Guide for further details on MVI instruction.
Table 7-15. Source Indirect Post Increment
Opcode Operand 1
Instruction Source Address Address
Example
MVI A, [8] ;In this case, the value in the
;memory location at address 8 is ;an indirect address. The memory ;location pointed to by the indi­;rect address is moved into the ;Accumulator. The indirect ;address is then incremented.

7.2.10 Destination Indirect Post Increment

The result of an instruction using this addressing mode is placed within the memory space. Operand 1 is an address pointing to a locati on within the memory space, which c ontains an address (the indirect address) for the destination of the instruction. The indirect address is incremented as part of the instruction execution. The source for the instruction is the Accumulator. This addressing mode is only valid on the MVI instruction. The instruction using this addressing mode is two bytes in length.
Table 7-16. Destination Indirect Post Increment
Opcode Operand 1
Instruction Destination Address Address
Example
MVI [8], A ;In this case, the value in
;the memory location at ;address 8 is an indirect ;address. The Accumulator is ;moved into the memory loca­;tion pointed to by the indi­;rect address. The indirect ;address is then incremented.
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8.0 Instruction Set Summary

The instruction set is summarized in Table8-1 by numerically and serves as a quick reference. If more information is
Table 8-1. Instruction Set Summary Sorted Numerically by Opcode Order
Opcode Hex
00 15 1 SSC 2D 8 2 OR [X+expr], A Z 5A 5 2 MOV [expr], X 01 4 2 ADD A, expr C, Z 2E 9 3 OR [expr], expr Z 5B 4 1 MOV A, X Z 02 6 2 ADD A, [expr] C, Z 2F 10 3 OR [X+expr], expr Z 5C 4 1 MOV X, A 03 7 2 ADD A, [X+expr] C, Z 30 9 1 HALT 5D 6 2 MOV A, reg[expr] Z 04 7 2 ADD [exp r], A C, Z 31 4 2 XOR A, expr Z 5E 7 2 MOV A, reg[X+expr] Z 05 8 2 ADD [X +expr ], A C, Z 32 6 2 XOR A, [expr] Z 5F 10 3 MOV [expr], [expr] 06 9 3 ADD [exp r], expr C, Z 33 7 2 XOR A, [X+expr] Z 60 5 2 MOV reg[expr], A 07 10 3 ADD [X+expr ], expr C, Z 34 7 2 XOR [expr], A Z 61 6 2 MOV reg[X+expr], A 08 4 1 PUSH A 35 8 2 XOR [X+expr], A Z 62 8 3 MOV reg[expr], expr
09 4 2 ADC A, expr C, Z 36 9 3 XOR [expr], expr Z 63 9 3 MOV reg[X+expr], expr 0A 6 2 ADC A, [expr] C, Z 37 10 3 XOR [X+expr], expr Z 64 4 1 ASL A C, Z 0B 7 2 ADC A, [X+expr] C, Z 38 5 2 ADD SP, expr 65 7 2 ASL [expr] C, Z
0C 7 2 ADC [expr], A C, Z 39 5 2 CMP A, expr 0D 8 2 ADC [X+expr], A C, Z 3A 7 2 CMP A, [expr] 67 4 1 ASR A C, Z
0E 9 3 ADC [expr], expr C, Z 3B 8 2 CMP A, [X+expr] 68 7 2 ASR [expr] C, Z 0F 10 3 ADC [X+expr], expr C, Z 3C 8 3 CMP [expr], expr 69 8 2 ASR [X+expr] C, Z
10 4 1 PUSH X 3D 9 3 CMP [X+expr], expr 6A 4 1 RLC A C, Z
11 4 2 SUB A, expr C, Z 3E 10 2 MVI A, [ [expr]++ ] Z 6B 7 2 RLC [expr] C, Z
12 6 2 SUB A, [expr] C, Z 3F 10 2 MVI [ [expr]++ ], A 6C 8 2 RLC [X+expr] C, Z
13 7 2 SUB A, [X+expr] C, Z 40 4 1 NOP 6D 4 1 RRC A C, Z
14 7 2 SUB [expr], A C, Z 41 9 3 AND reg[expr], expr Z 6E 7 2 RRC [expr] C, Z
15 8 2 SUB [X+expr], A C, Z 42 10 3 AND reg[X+expr], expr Z 6F 8 2 RRC [X+expr] C, Z
16 9 3 SUB [expr], expr C, Z 43 9 3 OR reg[expr], expr Z 70 4 2 AND F, expr C, Z
17 10 3 SUB [X+expr], expr C, Z 44 10 3 OR reg[X+expr], expr Z 71 4 2 OR F, expr C, Z
18 5 1 POP A Z 45 9 3 XOR reg[expr], expr Z 72 4 2 XOR F, expr C, Z
19 4 2 SBB A, expr C, Z 46 10 3 XOR reg[X+expr], expr Z 73 4 1 CPL A Z 1A 6 2 SBB A, [expr] C, Z 47 8 3 TST [expr], expr Z 74 4 1 INC A C, Z 1B 7 2 SBB A, [X+expr] C, Z 48 9 3 TST [X+expr], expr Z 75 4 1 INC X C, Z
1C 7 2 SBB [expr], A C, Z 49 9 3 TST reg[expr], expr Z 76 7 2 INC [expr] C, Z 1D 8 2 SBB [X+expr], A C, Z 4A 10 3 TST reg[X+expr], expr Z 77 8 2 INC [X+expr] C, Z
1E 9 3 SBB [exp r], expr C, Z 4B 5 1 SWAP A, X Z 78 4 1 DEC A C, Z 1F 10 3 SBB [X+expr], expr C, Z 4C 7 2 SWAP A, [expr] Z 79 4 1 DEC X C, Z
20 5 1 POP X 4D 7 2 SWAP X, [expr] 7A 7 2 DEC [expr] C, Z
21 4 2 AND A, expr Z 4E 5 1 SWAP A, SP Z 7B 8 2 DEC [X+expr] C, Z
22 6 2 AND A, [expr] Z 4F 4 1 MOV X, SP 7C 13 3 LCALL
23 7 2 AND A, [X+expr] Z 50 4 2 MOV A, expr Z 7D 7 3 LJMP
24 7 2 AND [exp r], A Z 51 5 2 MOV A, [expr] Z 7E 10 1 RETI C, Z
25 8 2 AND [X+expr ], A Z 52 6 2 MOV A, [X+expr] Z 7F 8 1 RET
26 9 3 AND [exp r], expr Z 53 5 2 MOV [expr], A 8x 5 2 JMP
27 10 3 AND [X+expr ], expr Z 54 6 2 MOV [X+expr], A 9x 11 2 CALL
28 11 1 ROMX Z 55 8 3 MOV [expr], expr Ax 5 2 JZ
29 4 2 OR A, expr Z 56 9 3 MOV [X+expr], expr Bx 5 2 JNZ 2A 6 2 OR A, [expr] Z 57 4 2 MOV X, expr Cx 5 2 JC 2B 7 2 OR A, [X+expr] Z 58 6 2 MOV X, [expr] Dx 5 2 JNC
2C 7 2 OR [expr], A Z 59 7 2 MOV X, [X+expr] Ex 7 2 JACC
Notes:
2. Interrupt routines take 13 cycles before execution resumes at interrupt vector table.
3. The number of cycles required by an instruction is increased by one for instructions that span 256-byte boundaries in the Flash memory space.
Instruction Format Flags
Cycles
Bytes
Opcode Hex
Instruction Format Flags
Cycles
Bytes
needed, the Instruction Set Summary tables are described in detail in the PSoC Designer Assembly Language User Guide (available on the www.cypress.com web site).
[2, 3]
Opcode Hex
66 8 2 ASL [X+expr] C, Z
if (A=B) Z=1 if (A<B) C=1
Fx 13 2 INDEX Z
Instruction Format Flags
Cycles
Bytes
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9.0 Memory Organization

9.1 Flash Program Memory Organization

after reset Address
16-bit PC 0x0000 Program execution begins here after a reset
0x0004 POR/LVD 0x0008 INT0
0x000C SPI Transmitter Empty
0x0010 SPI Receiver Full 0x0014 GPIO Port 0 0x0018 GPIO Port 1
0x001C INT1
0x0020 EP0 0x0024 EP1 0x0028 EP2
0x002C USB Reset
0x0030 USB Active 0x0034 1 ms Interval timer 0x0038 Programmable Interval Timer
0x003C Timer Capture 0
0x0040 Timer Capture 1 0x0044 16 Bit Free Running Timer Wrap 0x0048 INT2
0x004C PS2 Data Low
0x0050 GPIO Port 2 0x0054 GPIO Port 3 0x0058 GPIO Port 4
0x005C Reserved
0x0060 Reserved 0x0064 Sleep Timer 0x0068 Program Memory begins here (if below interrupt s not used,
CY7C63310 CY7C638xx CY7C639xx
program memory can start lower)
0x0BFF 3-KB ends here (CY7C63310)
0x0FFF 4-KB ends here (CY7C63801)
0x1FFF 8-KB ends here (CY7C639xx and CY7C638x3)
Figure 9-1. Program Memory Space with Interrupt Vector Table
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9.2 Data Memory Organization

The CY7C633xx/638xx/639xx microcontrollers provide up to 256 bytes o f data R AM. In norma l usag e, t he SRAM is part i­tioned into two areas: stack, and user variables:
after reset Address
8-bit PSP 0x00 Stack begins here and grows upward (user can modify)
Top of RAM Memory 0xFF
Figure 9-2. Data Memory Organization
CY7C63310 CY7C638xx CY7C639xx
The user determines the amount of memory needed for Stack
User Variables

9.3 Flash

This section des cribes the F lash blo ck of the enCoRe II. Much of the user-visible Flash functionality including programming and security ar e implemente d in the M8C Supervi sory Read Only Memory (SRO M ).

9.3.1 Flash Programming and Security

All Flash programming is performed by code in the SROM. The registers that control the Flash programming are only visible to the M8C CPU w hen it is executing out of SROM. This m akes it impossible to read, write or erase th e Flash by bypass ing the security mec hanisms implemented in the S ROM.
Customer firmware can only program the Flash via SROM calls. The data or code images can be sourced via any interface with the appropriate support firmware. This type of programming requires a boot-loader’—a piece of firmware resident on the Flash. For safety reasons this boot-loader should not be overwritten during firmware rewrites.
The Flash provides four extra auxiliary rows that are used to hold Flash block pro tec tion fl ags, b oot time c alibrat ion value s, configurati on tables, an d any devic e values. The routin es for accessing these auxiliary rows are documented in the SROM section. The auxiliary rows are not affected by the device erase function.

9.3.2 In-System Programming

Most designs that include an enCoRe II part will have a USB connector attached to the USB D+/D– pins on the device. These designs require the ability to program or reprogram a part through these two pins alone. The programming protocol is not USB.
enCoRe II devi ces enabl e t his t ype o f in-s ystem prog ramming by using the D+ and D – pins as the serial prog ramming mo de interface. This allows an external controller to cause the
enCoRe II part to enter serial programming mode and then to use the test queue to issue Flash access functions in the SROM.

9.4 SROM

The SROM holds code that is used to boot the part, calibrate circuitry, and perform Flash operations. (Table 9-1 lists the SROM functions.) The functions of the SROM may be accessed in normal user code or operating from Flash. The SROM exists in a separat e memory space from user code. The SROM fun ctions ar e accessed b y executin g the Super ­visory System Call instruction (SSC), which has an opc od e of 00h. Prior to executing t he SSC the M8C’s accumulator needs to be loaded with the desired SROM function code from Table 9-1. Undefined functions wi ll cause a HA L T if called from user code. The SROM functions are executing code with calls; therefore, the functions require stack space. With the exception of Reset, all of the SROM functions have a parameter block in SRAM that must be configured before executing the SSC. Table 9-2 lists all possible pa rameter block variables. The meaning of each parameter, with regards to a specific SROM function, is described later in this chapter.
Table 9-1. SROM Function Codes
Function Code Function Name Stack Space
00h SWBootReset 0 01h ReadBlock 7 02h WriteBlock 10 03h EraseBlock 9 05h EraseAll 11 06h TableRead 3 07h CheckSum 3
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Two important variables that are used for all functions are KEY1 and KEY2. These variables are used to help discrim­inate between valid SSCs and inadvertent SSCs. KEY1 must always have a value of 3Ah, whil e KEY2 m ust hav e the same value as the stack pointer when the SROM function begins execution. This would be the Stack Pointer value when the SSC opcode is executed, plus three. If either of the keys do not match the expected values, the M8C will halt (with the exception of the SWBootReset function). The following code puts the correct value in KEY1 an d KEY2. The code starts with a halt, to forc e the program to jump directly into the setup code and not run into it.
halt SSCOP: mov [KEY1], 3ah mov X, SP mov A, X add A, 3 mov [KEY2], A
Table 9-2. SROM Function Parameters
Variable Name SRAM Address
Key1 / Counter / Return Code 0,F8h Key2 / TMP 0,F9h BlockID 0,FAh Pointer 0,FBh Clock 0,FCh Mode 0,FDh Delay 0,FEh PCL 0,FFh
The SROM also features Return Codes and Lockouts.

9.4.1 Return C odes

Return codes aid in the determination of success or failure of a particular function. The return code is stored in KEY1’s position in the parameter block. The CheckSum and TableRead functions do not have return codes because KEY1s position in the parameter block is used to return other data.
Table 9-3. SROM Return Codes
Return Code Description
00h Success 01h Function not allowed due to level of protec tion
on block. 02h Software reset without hardware reset. 03h Fatal error, SROM halted.
Read, write, and erase operations may fail if the target block is read or write protected. Block protection levels are set during device programmin g.
The EraseAll functio n overwrites dat a in addition t o leaving the entire user Flash in the erase state. The EraseAll function loops through the number of Flash macros in the product, executing the following sequence: erase, bulk program all zeros, erase. After all the user space in all the Flash macros
are erased, a second loop erases and then programs each protection block with zeros.

9.5 SROM Function Descriptions

9.5.1 SWBootReset Function

The SROM function, SWBootReset, is the function that is responsible for transitioning the device from a reset state to running user code. The SWBootReset function is executed whenever the SROM is entered with an M8C accumulator value of 00h: the SRAM parameter block is not used as an input to the function. This will happen, by design, after a hardware reset, because the M8C's accumulator is reset to 00h or when user code executes the SSC instruction with an accumulator value of 00 h. Th e SWBo otR e se t fun cti on wi ll n ot execute when the SSC instruction i s executed with a bad key value and a non-zero function code. An enCoRe II device will execute the HALT instruction if a bad value is given for either KEY1 or KEY2.
The SWBootReset function verifies the integrity of the calibration data by way of a 16-bit checksum, before releasing the M8C to run user code.

9.5.2 ReadBlock Function

The ReadBlock function is used to read 64 contiguous bytes from Flash: a block.
The first thing this fu nction does is to check th e prot ectio n bit s and determine if the desired BLOCKID is readable. If read protection is turned on, the ReadBlock function wil l exit setting the accumulator and KEY2 back to 00h. KEY1 will have a value of 01h, indicating a read failure. If read protection is not enabled, the function will read 64 bytes from the Flash using a ROMX instruction and store the results in SRAM using an MVI instruction. The first of the 64 bytes will be s tored in SRAM at the address indicated by the value of the POINTER parameter. When the ReadBlock completes successfully the accumulator, KEY1 and KEY2 will all have a value of 00h.
Table 9-4. ReadBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value, when SSC is
executed. BLOCKID 0,FAh Flash block number POINTER 0,FBh First of 64 addresses in SRAM
where returned data should be
stored

9.5.3 WriteBlock Function

The WriteBlock function is used to store data in th e Flash. Data is moved 64 bytes at a time from SRAM to Flash using this function. The first thing the WriteBlock function does is to check the protection bits and determine if the desired BLOCKID is writable. If w rite protection is turned on, the Write­Block function will exi t setting the acc umulator and KEY2 b ack to 00h. KEY1 will have a value of 01h, indicating a write fa ilure. The configuration of the WriteBlock function is straightforward. The BLOCKID of the Flash block, where the data is stored, must be determined and stored at SRAM address FAh.
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The SRAM address of the first of the 64 bytes to be stored in Flash must be in dicated using th e POINTER variabl e in the parameter block (SRAM address FBh). Finally, the CLOCK and DELAY value must be set correctly. The CLOCK value determines the length of the write pulse that will be used to store the data in th e Flash. The CLOCK and DELA Y val ues are dependent on the CP U speed and m ust be set co rrectly . Refer to Clocking Section for additional information.
Table 9-5. WriteBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value, when SSC is
executed.
BLOCKID 0,FAh 8KB Flash block number (00h–7Fh)
4KB Flash block number (00h–3Fh) 3KB Flash block number (00h–2Fh)
POINTER 0,FBh First of 64 addresses in SRAM, where
the data to be stored in Flash is located prior to calling WriteBlock.
CLOCK 0,FCh Clock divider used to set the write
pulse width.
DELAY 0,FEh For a CPU speed of 12 MHz set to 56h

9.5.4 EraseBlock Function

The EraseBlock function is used to erase a block of 64 contiguous bytes in Flash. The first thing the EraseBlock function does is to check the protection bits and determine if the desired BLOCKID is writable. If write protection is turned on, the EraseBlock function will exit setting the accumulator and KEY2 back to 00h. KEY1 will have a value of 01h, indicating a write failure. The EraseBlock function is only useful as the first step in programming. Erasing a block will not cause data in a block to be one hundred percent unreadable. If the objectiv e is to obl iterate dat a in a b lock, th e b est meth od is to perform an EraseBlock followed by a WriteBlock of all zeros.
To set up the parameter block for the EraseBlock function, correct key values must be stored in KEY1 and KEY2. The block number to be erased must be stored in the BLOCKID variable and the CLOCK and DELA Y val ues must be set based on the current CPU speed.
Table 9-6. EraseBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value, when SSC is
executed. BLOCKID 0,FAh Flash block number (00h–7Fh) CLOCK 0,FCh Clock divider used to set the erase
pulse width. DELAY 0,FEh For a CPU speed of 12 MHz set to
56h

9.5.5 ProtectBlock Function

The enCoRe II devices offer Flash protection on a block-by­block basis. Table 9-7 lists the protection modes available. In the table, ER and EW are used to indicate the abi lity to perform external reads and writes. For internal writes, IW is used.
Internal reading is always permitted by way of the ROMX instruction. The ability to read by way of the SROM ReadBl ock function is indicated by SR. The protection level is stored in two bits accor din g to Table 9-7. These bits are bit packed into the 64 bytes o f the protection b lock. Therefore, ea ch protection block byte stores the protection level for four Flash blocks . The bits are packed into a byte, with the lowest numbered block’s protection level stored in the lowest numbered bits Table 9-7.
The first address of the protection block contains the protection level for blocks 0 through 3; the second address is for blocks 4 through 7. The 64th byte will store the protection level for blocks 252 through 255.
Table 9-7. Protection Modes
Mode Settings Description Marketing
00b SR ER EW IW Unprotected Unprotected 01b SR 10b SR
11b SR
76543210
Block n+3 Block n+2 Block n+1 Block n
The level of pro tection is on ly decreased by an EraseAll, whic h places zeros in all loc at ions of the protection block . To set the level of protection, the ProtectBlock function is used. This function takes data from SRAM, starting at address 80h, and ORs it with the current values in the protection block. The result of the OR operation is then stored in the protection block. The EraseBlock function does not change the protection level for a block. Because the SRAM location for the protection data is fixed and there is only one protection block per Flash macro, the ProtectBlock function expects very few variables in the parameter block to be set prior to calling the function. The p arameter block v alues that must be set, besides the keys, are the CLOCK and DELAY values.
Table 9-8. ProtectBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value when SSC is
CLOCK 0,FCh Clock divider used to set the write
DELA Y 0,FEh For a CPU speed of 12 MHz set to 56h

9.5.6 EraseAll Function

The EraseAl l fu nct ion perf orm s a se ries of s teps t hat d est roy the user data in the Flash macros and resets the protection block in each Fl ash m acro to all zeros (the unprote cted s ta te). The EraseAll function does not affect the three hidden blocks above the protection block, in each Flash macro. The first of these four hidden blocks is used to store the protection table for its eight Kbytes of user data.
The EraseAll function begin s by eras ing the us er sp ace of the Flash macro with the highest address range. A bulk program of all zeros i s then performed on the same Flas h macro, to
ER EW IW Re ad protect Factory upgrade ER EW IW Disable external
write
ER EW IW Disable internal
write
executed.
pulse width.
Field upgrade
Full protection
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destroy all traces of the previous contents. The bulk program is followed b y a se cond eras e th at l eave s th e Flas h mac ro i n a state ready f or writing . The erase , program, e rase sequ ence is then performed on the next lowest Flash macro in the address space if it exists. Following the erase of the user space, the protection block for the Flash macro with the highest address range is erased. Following the erase of the protection block, zeros are written into every bit of the protection table. The next lowest Flash macro in the address space then has its protection block erased and filled with zeros.
The end result of the EraseAll function is that all user data in the Flash is destroyed and the Flash is left in an unpro­grammed state, ready to accept one of the various write commands. The prote cti on bits for all user dat a a re a ls o res et to the zero state
The parameter block values that must be set, besides the keys, are the CLOCK and DELAY values.
Table 9-9. EraseAll Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value when SSC is
executed.
CLOCK 0,FCh Clock divider used to set the write puls e
width.
DELAY 0,FEh For a CPU speed of 12 MHz set to 56h

9.5.7 TableRead Function

The TableRead function gives the user ac cess to p a rt-spec ific data stored in the Flash during manufacturing. It also returns a Revision ID for the die (not to be confused with the Silicon ID).
Table 9-10. Table Read Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value when SSC is
executed.
BLOCKID 0,FAh Table number to read.
The table space for the enCoRe II is simply a 64-byte row broken up into eight tables of eight bytes. The tables are numbered zero through seven. All user and hidden blocks in the CY7C638xx and CY7C639xx parts consist of 64 bytes.
An internal table holds the Sili co n ID a nd r eturns the Revision ID. The Silicon ID is returned in SRAM, while the Revision ID is returned in the CPU_A and CP U_X registers. The Si licon ID is a value placed in the t able by programming the Flash and is controlled by Cypress Semiconductor Product Engineering. The Revision ID is hard coded into the SROM. The Revision ID is discussed in more detail later in this section.
An internal table holds alternate trim values for the device and returns a one-byte internal revision counter. The internal revision counter starts out with a value of zero and is incre­mented each time one of the other revision numbers is not incremented. It is reset to zero each time one of the other revision numbers is incremented. The internal revision count is returned in the CPU_A register. The CPU_X register will
always be set to FFh when trim values are read. The BLOCKID value, in the parameter block, is used to indicate which table should be returned to the user. Only the three least significant bits of the BLOCKID parameter are used by TableRead function for the CY7C638xx and CY7C639xx. The upper five bits are ignored . When th e func tion is calle d, it tran sfers b ytes from the table to SRAM addresses F8h–FFh.
The M8Cs A and X registers are used by the TableRead function to return the die’s Revision ID. The Revi sion ID is a 16-bit value hard coded in to the SROM that uniq uely identifie s the dies design.

9.5.8 Checksum F unction

The Checksum function calculates a 16-bit checksum over a user specifiable number of blocks, w ithin a single Fla sh macro (Bank) starti ng from bloc k zero. The BL OCKID paramet er is used to pass in the number of blocks to calculate the checksum over. A BLOCKID value of 1 will calculate the checksum of only block 0, while a BLOCKID value of 0 will calculate the checksum of all 256 user blocks. The 16-bit checksum is returned in KEY1 and KEY2. The parameter KEY1 holds the lower eight bits of the checksum and the parameter KEY2 holds the upper eight bits of the checksum.
The checksum algorithm executes the following sequence of three instructions over the number of blocks times 64 to be checksummed.
romx add [KEY1], A adc [KEY2], 0
Table 9-11. Checksum Parameters
Name Address Description
KEY1 0,F8h 3Ah KEY2 0,F9h Stack Pointer value when SSC is
executed.
BLOCKID 0,FAh Number of Fl ash blocks to calculate
checksum on.

10.0 Clocking

The enCoRe II internal oscillator outputs two frequencies, the Internal 24-MHz Oscillator and the 32-KHz Low-power Oscil­lator.
The Internal 24-MH z Oscillato r is designe d such that it may be trimmed to an output frequency of 24 MHz over temperature and voltage variation. With the presence of USB traffic, the Internal 24-MHz O scillator c an be se t to preci sely tune t o USB timing requirement s (24 MHz ± 1.5%). Withou t USB traffic, the Internal 24-MHz Oscillator a ccuracy is 24 MHz ± 5% (between 0°–70°C). No external components are required to achieve this level of accuracy.
The internal low- speed oscilla tor of nominally 32 KHz provides a slow clock sourc e for the enCoRe II i n suspend mode, p artic­ularly to generate a periodic wake-up interrupt and also to provide a clock to s equential logic duri ng power-up and power­down events when the main clock is stopped. In addition, this oscillator can also be used as a clocking source for the Interval Timer clo ck (ITMRCLK) and Capt ure Timer clock (TCAPCLK). The 32-KHz Low-power Oscillator can operate in low-power mode or can provide a more accurate clock in normal mode.
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The Internal 32-KHz Low-power Oscillator accuracy ranges from –85% to +120% (between 0°–70° C).
For applications that require a higher clock accuracy, the CY7C639xx part can optionally be sourced from an external crystal oscillator. When operating in USB mode, the supplied crystal oscillator must be either 12 MHz or 24 MHz in order for the USB blocks to function properly. In non-USB mode, the external oscillator can be up to 24 MHz.

10.1 Clock Architecture Description

The enCoRe II clock selection circuitry allows the selection of independent clocks for the CPU, USB, Interval Timers and Capture Timers.
On the CY7C639xx, the external oscillator can be sourced by the crystal o scillato r or when t he cryst al osc illator is disabled it is sourced directly from the CLKIN pin. The external crystal oscillator is fed through the EFTB block, which can optionally be bypassed.
The CPU clock, CPUCLK, can be sourced from the external crystal oscillator or the Internal 24-MHz Oscillator. The selected clock sou rce can op tional ly be div ided by 2 is 0-5,7 (see Table 10-5).
USBCLK, which must be 12 MHz for the USB SIE to function properly, can be sourced by the Internal 24-MHz Oscillator or
Table 10-1. IOSC Trim (IOSCTR) [0x34] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field foffset[2:0] Gain[4:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 D D D D D
The IOSC Calibrate register is used to calibrate the internal oscillator. The reset value is undefined but during boot the SROM writes a calibration valu e that is determi ned during manu facturing test. This va lue should not req uire change durin g normal use. This is the meaning of ‘D’ in the Default field Bit [7:5]: foffset [2:0] This value is used to trim the freq uency of the internal oscillat or. These bits are not used in factory calibration and will be zero. Setting each of these bits causes the appropriate fine offset in oscillator frequency. foffset bit 0 = 7.5 KHz foffset bit 1 = 15 KHz foffset bit 2 = 30 KHz Bit [4:0]: Gain [4:0] The effective freq uency change of the of fset input is contro lled through the gain input. A lower value of the ga in setting increases the gain of the offset input. This value sets the size of each offset step for the internal oscillator. Nominal gain change (KHz/offsetStep) at each bit, typical conditions (24 MHz operation): Gain bit 0 = –1.5 KHz Gain bit 1 = –3.0 KHz Gain bit 2 = –6 KHz Gain bit 3 = –12 KHz Gain bit 4 = –24 KHz
n
where n
the external cryst al os cillat or. An optional divide by two allows the use of 24-MHz source.
The Interval T imer clock (ITMRCLK) , can be sourced from the external crystal oscillator, the Internal 24-MHz Oscillator, the Internal 32-KHz Low-power Oscillator, or from the timer capture clock (TCAPCLK). A prog ram ma bl e presc ale r of 1 , 2, 3, 4 then divides the selected source.
The Tim er Capture clock (TCAPCLK) can b e sourced from t he external crystal oscillator, Internal 24-MHz Oscillator, or the Internal 32-KHz Low-power Oscillator.
When it is not be ing us ed by the ex ternal cryst al o scillat or, the CLKOUT pin can be driven from one of ma ny sourc es. This is used for test and can also be used in some applications. The sources that can drive the CLKOUT are:
CLKIN after the optional EFTB filter
Internal 24-MHz Oscillator
Internal 32-KHz Low-power Oscillator
CPUCLK after the programmable divider

10.1.1 Clock Control Registers

10.1.2 Internal Clock Trim

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10.1.3 External Clock Trim

Table 10-2. XOSC Tr im (XOSCTR) [0x35] [R/W]
CY7C63310 CY7C638xx CY7C639xx
Bit # 7 6 5 4 3 2 1 Field Reserved XOSC XGM [2:0] Reserved Mode
Read/Write R/W R/W R/W R/W
Default 0 0 0 D D D 0 D
0
This register is us ed to c al ibra te the external crysta l os c ill ator. Th e re set va lue is un defined but during boot the SROM writes a calibration value that is determined during manufacturing test. This is the meaning of ‘D’ in the Default field
Bit [7:5]: Reserved Bit [4:2]: XOSC XGM [2:0]
Amplifier transconductance setting. The Xgm settings are recommended for resonators with frequencies of interest for the enCoRe II as below
Resonator XGM Setting Worst Case R (Ohms)
6-MHz Crystal 001 403 12-MHz Crystal 011 201 24-MHz Crystal 111 101 6-MHz Ceramic 001 70.4
12-MHz Ceramic 011 41
Bit 1: Reserved Bit 0: Mode
0 = Oscillator Mode 1 = Fixed Maximum Bias test Mode

10.1.4 LPOSC Trim

Table 10-3. LPOSC Trim (LPOSCTR) [0x36] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field 32-KHz Low
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default D D D D DDD D
Power
Reserved 32-KHz Bias Trim [1:0] 32-KHz Freq Trim [3:0]
This register is us ed to calibrate the 32-KHz Low -speed Oscillat or. The reset valu e is undefined but during boo t the SROM wri tes a calibration value that is dete rmi ned duri ng m anu fac turi ng test. This value should not require change during norma l use. Th is is the meaning of ‘D’ in the Default field. If the 32-KHz Low-power bit needs to be written, care should be taken not to disturb the 32-KHz Bias Trim and the 32-KHz Freq Trim fields from their factory calibrated values Bit 7: 32-KHz Low Power 0 = The 32-KHz Low-speed Oscillator operates in normal mode 1 = The 32-KHz Low-speed Oscillator operates in a low-power mode. The oscillator continues to function normally but with reduced ac curacy
Bit 6: Reserved Bit [5:4]: 32-KHz Bias Trim [1:0]
These bits c ontrol the bi as current of the low-power oscillator. 0 0 = Mid bias 0 1 = High bias 1 0 = Reserved 1 1 = Disable (off) Important Note: D o not program the 32-KH z Bias Tri m [1:0] field with the reserved 10b val ue as the oscillat or does not osci llate at all corner conditions with this setting Bit [3:0]: 32-KHz Freq Trim [3:0] These bits are used to trim the frequency of the low-power oscillator
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10.1.5 CPU/USB Clock Configuration

Table 10-4. CPU/USB Clock Config CPUCLKCR) [0x30] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved USB CLK /2
Read/Write R/W R/W R/W
Default 0 0 0 0 0 0 0 0
Bit 7: Reserved Bit 6: USB CLK/2 Disable
This bit only affects the USBCLK when the source is the external crystal oscillator. When the USBCLK source is the Internal 24-MHz Oscillator, the divide by two is always enabled 0 = USBCLK source is divided by two. This is the correct setting to use when the Internal 24-MHz Oscillator is used, or when the external source is used with a 24-MHz clock 1 = USBCLK is undivided. Use this setting only with a 12-MHz external clock Bit 5: USB CLK Select This bit controls the clock source for the USB SIE 0 = Internal 24-MHz Os cillator . Wi th the presenc e of USB traffi c, the Internal 24-MHz Osci llator can be t rimmed to me et the USB requirement of 1.5% to lerance (see Table 10-6) 1 = External clockexternal oscillator on CLKIN and CLKOUT if the external oscillator is enabled (the XOSC Enable bit set in the CLKIOCR RegisterTable 10-8), or the CLKIN input if the external oscillator is disabled. Internal Oscillator is not trimmed to USB traffic. Proper USB SIE operation requires a 12-MHz or 24-MHz clock accurate to <1.5%.
Bit [4:1]: Reserved Bit 0: CPU CLK Select
0 = Internal 24-MHz Oscillator. 1 = External crystal oscillatorExternal crystal oscillator on CLKIN and CLKOUT if the external crystal oscillator is enabled, CLKIN input if the external crystal oscillator is disabled Note: the CPU speed selection is configured using the OSC_CR0 Register (Table 10-5)
Disable
USB CLK Select Reserved CPUCLK Select
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10.1.6 OSC_CR0 Cloc k Configuration

Table 10-5. OSC Control 0 (OSC_CR0) [0x1E0] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved No Buzz Sleep Timer [1:0] CPU Speed [2:0]
Read/Write R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
Bit [7:6]: Reserved Bit 5: No Buzz
During sleep (the Sleep bit is set in the CPU_SCR RegisterTable 11-1), the LVD and POR detection circuit is turned on periodically to detect any POR and LVD events on the VCC pin (the Sleep Duty Cycle bits in the ECO_TR are used to control the duty cycleTable 13-3). To facilitate the detection of POR and LVD events, the No Buzz bit is used to force the LVD and POR detection circui t to b e con tinuou sly e nable d duri ng sl eep. Th is re sult s in a fa ster respons e to a n LVD or POR event during sleep at the expense of a slightly higher than average sleep current 0 = The LVD and POR detection circuit is turned on periodically as configured in the Sleep Duty Cycle 1 = The Sleep Duty Cycle value is overridden. The LVD and POR detection circuit is always enabled
Note: The periodic Sleep Duty Cycle enabling is independent with the sleep interval shown in the Sleep [1:0] bits below Bit [4:3]: Sleep Timer [1:0]
Sleep Timer
[1:0]
00 512 Hz 1.95 m s 6 ms 01 64 Hz 15.6 ms 47 ms 10 8 Hz 125 ms 375 ms 11 1 Hz 1 sec 3 sec
Note: Sleep intervals are approximate Bit [2:0]: CPU Speed [2:0]
The enCoRe II may operate over a range of CPU clock speeds. The reset value for the CPU Speed bits is zero; therefore, the default CPU speed is one-eighth of the internal 24 MHz, or 3 MHz Regardless of the CPU S peed bit’s setting, if the actual CPU speed is greater than 12 MHz, the 24-MH z operating requ irements apply. An example of this scenario is a device that is configured to use an external clock, which is supplying a frequency of 20 MHz. If the CPU speed registers value is 0b0 11, the CPU clock will be 20 M Hz. Therefore the supp ly vo lt a ge re quirements for the device are the same as if the part was operating at 24 MHz. The operating voltage requirements are not relaxed until the CPU speed is at 12 MHz or less
CPU Speed
[2:0]
000 3 MHz (Default) Clock In / 8 001 6 MHz Clock In / 4 010 12 MHz Clock In / 2 011 24 MHz Clock In / 1 100 1.5 MHz Clock In / 16 101 750 KHz Clock In / 32 110 187 KHz Clock In / 128
111 Reserved Reserved
Important Note: Correct USB operation s require the CPU cloc k speed to be at least eight times gre ater than the USB cloc k. If the two clocks have the same source then the CPU clock divider should not be set to divide by more than 8. If the two clocks have different sources, care must be taken to ensure that the maximum ratio of USB Clock/CPU Clock can never exceed 8 across the full specif ication rang e of both clock sources
Sleep Timer Clock Frequency (Nominal)
CPU when Internal Oscillator is selected External Clock
Sleep Period (Nominal)
Watchdog Period (Nominal)
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10.1.7 USB Oscillator Lock Configuration

Table 10-6. USB Osclock Clock Configuration (OSCLCKCR) [0x39] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Fine Tune Only USB Osclock
Read/Write R/W R/W
Default 0 0 0 0 0 0 0 0
This register is used to trim the Internal 24-MHz Oscillator using received low-speed USB packets as a timing reference. The USB Osclock circuit is active when the Internal 24-MHz Oscillator provides the USB clock
Bit [7:2]: Reserved Bit 1: Fine Tune Only
0 = Enable 1 = Disable the oscillator lock from performing the course-tune portion of its retuning. The oscillator lock must be allowed to perform a course tuning in order to t une the os cillator f or correct USB SIE ope ration. Af ter the os cillator i s properly tun ed this b it can be set to reduce variance in the internal oscillator frequency that would be caused course tuning Bit 0: USB Osclock Disable 0 = Enable. With the presence of USB traffic, the Internal 24-MHz Oscillator precisely tunes to 24 MHz ± 1.5% 1 = Disable. The Internal 24-MHz Oscillator is not trimmed based on USB packets. This setting is useful when the internal oscillator is not sourcing the USBSIE clock

10.1.8 Timer Clock C onfiguration

Table 10-7. Timer Clock Config (TMRCLKCR) [0x31] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field TCAPCLK Divider TCAPCLK Select ITMRCLK Divider ITMRCLK Select
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 1 0 0 0 1 1 1 1
Bit [7:6]: TCAPCLK Divider [1:0]
TCAPCLK Divider controls the TCAPCLK divisor 0 0 = Divider Value 2 0 1 = Divider Value 4 1 0 = Divider Value 6 1 1 = Divider Value 8 Bit [5:4]: TCAPCLK Select The TCAPCLK Select field controls the source of the TCAPCLK 0 0 = Internal 24-MHz Oscillator 0 1 = External crystal oscillatorexternal crystal oscillator on CLKIN and CLKOUT if the external crystal oscillator is enabled, CLKIN input if the external crystal oscillator is disabl ed (the XOSC Enable bit of th e C L KIOCR R egi st er i s cl eare d Table 10-8) 1 0 = Internal 32-KHz Low-power Oscillator 1 1 = TCAPCLK Disabled Note: The 1024-µs interval timer is based on the assumption that TCAPCLK is running at 4 MHz. Changes in TCAPCLK frequency will cause a corresponding change in the 1024-µs interval timer frequency Bit [3:2]: ITMRCLK Divider ITMRCLK Divider controls the ITMRCLK divisor. 0 0 = Divider value of 1 0 1 = Divider value of 2 1 0 = Divider value of 3 1 1 = Divider value of 4 Bit [1:0]: ITMRCLK Select 0 0 = Internal 24-MHz Oscillator 0 1 = External crystal oscillator – external crystal oscillator on CLKIN and CLKOUT if the external crystal oscillator is enabled, CLKIN input if the external crystal oscillator is disabled 1 0 = Internal 32-KHz Low-power Oscillator 1 1 = TCAPCLK
Disable
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10.1.9 Clock In / Clock Out Configuration

Table 10-8. Clock I/O Config (CLKIOCR) [0x32] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved XOSC
Read/Write R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
Select
XOSC
Enable
EFTB
Disabled
CLKOUT Select
Bit [7:5]: Reserved Bit 4: XOSC Select
This bit when set, selects the external crystal oscillator clock as clock source of external clock. Care needs to be taken while selecting the crystal oscillator clock. First enable the crystal oscillator and wait for few cycles, which is oscillator stabilization period. Then select the cry stal clock as clock source. Similarly, while deselect crys t al cl ock , fi rst des el ec t cry stal clock as clock source then disable the cryst al osc il lat or. 0 = Not select external crystal oscillator clock 1 = Select the external crystal oscillator clock Bit 3: XOSC Enable This bit when set enables the external crystal oscillator. The external crystal oscillator shares pads CLKIN and CLKOUT with two GPIOsP0.0 and P0.1, respectively. When the external crystal oscillator is enabled, the CLKIN signal comes from the external crystal os ci ll ator block and the output enables on th e G PIO s for P0.0 and P0.1 are dis ab led , e li mi nati ng th e p os si bil ity of contention. When the external crystal oscillator is disabled the source for CLKIN signal comes from the P0.0 GPIO input. 0 = Disable the external oscillator 1 = Enable the external oscillator
Note: The external crystal oscillator startup time takes up to 2 ms. Bit 2: EFTB Disabled
This bit is only available on the CY7C639xx 0 = Enable the EFTB filter 1 = Disable the EFTB filter, causing CLKIN to bypass the EFTB filter Bit [1:0]: CLKOUT Select 0 0 = Internal 24-MHz Oscillator 0 1 = External crystal oscillator – external crystal oscillator on CLKIN and CLKOUT if the external crystal oscillator is enabled, CLKIN input if the external oscillator is disabled 1 0 = Internal 32-KHz Low-power Oscillator 1 1 = CPUCLK

10.2 CPU Clock During Sleep Mode

When the CPU enters sl eep mod e th e CP UC LK Sel ect (Bit 1, Table 10-4) is forced to the Internal Oscillator, and the oscil­lator is stopped. When the CPU com es ou t of sleep mode it i s running on the internal oscillator. The internal oscillator recovery time is three clo ck cycles of the Internal 32-KH z Low­power Oscillator.
If the system requires the CPU to run off the external clock after awaking from sleep mode, firmware will need to switch the clock sour ce for the CPU. If t he external c lock source is the external oscillator and the oscillator is disabled, firmware will need to enab le the external oscillator, wait for it to stabilize , and then cha nge the clock source.

11.0 Reset

The microcontroller supports two types of resets: Power-on Reset (POR) and Watchdog Reset (WDR). When reset is initiated, all regi sters are rest ored to their def ault states and all interrupts are disabled.
The occurrence of a reset is recorde d in the System Sta tus and Control Register (CPU_SCR). Bits within this register record the occurrence of POR and WDR Reset respectively. The firmware can interrogate these bits to determine the cause of a reset.
The microcontroller resumes execution from Flash address 0x0000 after a reset . The interna l clocking mod e is active af ter a reset, until changed by user firmware.
Note: The CPU clock defaults to 3 MHz (Internal 24-MHz Oscillator divide -by-8 mode) at POR to guarantee operation at the low V
that might be present during the supply ramp.
CC
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Table 11-1. System Status and Control Register (CPU_SCR) [0xFF] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field GIES Reserved WDRS PORS Sleep Reserved Stop
Read/Write R R/C
Default 0 0 0 1 000 0
The bits of the CPU_SC R re gis ter a r e us ed to co nv ey st a tus and con trol of ev en ts for various functio ns o f an e nC oRe II devic e Bit 7: GIES The Global Interrupt Enable Status bit is a read only status bit and its use is discouraged. The GIES bit is a legacy bit, which was used to provide the ab ili ty to read the GIE bit of t he CP U_ F register. However, the CPU_F regi ste r is no w rea dab le. Whe n this bit is set, it indicates that the GIE bit in the CPU_F register is also set which, in turn, indicates that the microprocessor will service interrupts 0 = Global interrupts disabled 1 = Global interrupt enabled
Bit 6: Reserved Bit 5: WDRS
The WDRS bit is set by th e CPU to indic ate tha t a WDR event has occu rred. The user c an read this b it to de termin e the type of reset that has occurred. The user can clear but not set this bit 0 = No WDR 1 = A WDR event has occurred Bit 4: PORS The PORS bit is set by the CP U to indi cate that a POR event has oc cur r ed. T he us er c an read this bit to de term in e the typ e of reset that has occurred. The user can clear but not set this bit 0 = No POR 1 = A POR event has occurred. (Note that WDR events will not occur until this bit is cleared) Bit 3: SLEEP Set by the user to enable CPU sleep s tate. CP U will remain in sleep mode unti l any interrupt is pendin g. The Sleep bit is c overed in more detail in the Sleep Mode section 0 = Normal operation 1 = Sleep
Bit [2:1]: Reserved Bit 0: STOP
This bit is set by the user to halt the CPU. The CPU will remain halted until a reset (WDR, POR, or external reset) has taken place. If an application wants to stop code execution until a reset, the preferred method would be to use the HALT instruction rather than writing to this bit 0 = Normal CPU operation 1 = CPU is halted (not recommended)
[4]
R/C
[4]
R/W R/W

11.1 Power-on Reset

POR occurs every ti me the power to the dev ice is switched on. POR is released when the supply is typically 2.6V for the upward suppl y transition, with ty pically 50 mV of hysteres is during the power-on transient. Bit 4 of the System Status and Control Register (CPU_SCR) is set to record this event (the register contents are set to 00010000 by the POR). After a POR, the microprocessor is held off for approximately 20 ms for the V instruction at address 0x00 in the Flash. If the V drops below the POR downward supply trip point, POR is reasserted. The V 4V in 0 to 200 ms.
supply to stabilize before executing the first
CC
supply needs to ramp linearly from 0 to
CC
voltage
CC
Important: The PORS status bit is set at POR and can only be cleared by the user. It cannot be set by firmware.

11.2 Watchdog Timer Reset

The user has the option to enable the WDT. The WDT is enabled by clearing the PORS bit. Once the PORS bit is
Note:
4. C = Clear. This bit can only be cleared by the user and cannot be set by firmware.
cleared, the WDT cannot be disabled. The only exception to this is if a POR ev ent ta kes place, w hich wil l disabl e the WDT.
The sleep timer is u se d to ge nera te t he s le ep time period and the Watchdog time period. The sleep timer uses the Internal 32-KHz Low-power Oscillator system clock to produce the sleep time period. T he user ca n program the sleep time p eriod using the Sleep Timer bits of the OSC_CR0 Register (Table 10-5). When the sleep time elapses (sleep timer overflows), an interrupt to t he Sleep Timer Interrupt Vector will be generated.
The Watchdog Timer period is automatically set to be three counts of the Sleep T imer overflows . This represen ts betwe en two and th ree sleep in tervals de pending on the count in the Sleep Timer at the previous WDT clear. When this timer reaches three, a WDR is generated.
The user can either clear th e WDT, or the WDT and the Sle ep Timer. Whenever the user writes to the Reset WDT Register (RES_WDT), the WDT will be cleared. If the da ta that is written is the hex value 0x38, the Sleep Timer will also be cleared at the same time.
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Table 11-2. Reset Watchdog Timer (RESWDT) [0xE3] [W]
Bit # 7 6 5 4 3 2 1 0 Field Reset Watchdog Timer [7:0]
Read/Write W W W W WWW W
Default 0 0 0 0 000 0
Any write to this register will clear Watchdog Timer, a write of 0x38 will also clear the Sleep Timer
Bit [7:0]: Reset Watchdog Timer [7:0]

12.0 Sleep Mode

The CPU can only be put to sleep by the firmware. This is accomplished by se tting the Sleep bit i n the System S tatus and Control Register (CPU_SCR). This stops the CPU from executing instru ctions, and the CP U will remain asleep until an interrupt comes pending, or there is a reset event (either a Power-on Reset, or a Watchdog Timer Reset).
The Low-voltage Detection circuit (LVD) drops into fully functional power-reduced states, and the latency for the LVD is increased. The actual latency can be traded against power consumption by changing Sleep Duty Cycle field of the ECO_TR Register.
The Internal 32-KHz Low-speed Oscillator remains running. Prior to entering suspend mode, firmware can optionally configure the 32-KHz Low-speed Oscillator to operate in a low­power mode to help reduce the over all power consumption (Using Bi t 7, Table 10-3). This will help save approximately 5 µA; however, the trade off is that the 32-KHz Low-speed Oscillator will be less accurate (–85% to +120% deviation).
All interrupts rem ain active. Only the occu rrence of an interrupt will wake the part from sleep. The Stop bit in the System Status and Control Register (CPU_SCR) must be cleared for a part to resume out of sleep. The Global Interrupt Enable bit of the CPU Flags Register (CPU_F) does not have any effect. Any unmasked interrupt will wake the system up. As a result, any
interrupts not intended for waking should be disabled through the Interrupt Mask Registers.
When the CPU enters sl eep mod e the CP UCL K Sele ct (Bit 1, Table 10-4) is forced to the Internal Oscillator. The internal oscillator r ecovery time is thre e clock cycles of the Internal 32-KHz Low-power Oscillator. The Internal 24-MHz Oscillator restarts immediately on exiting Sleep mode. If the external crystal oscilla tor is used, firmware will need to switc h the clock source for the CPU.
Unlike the Internal 2 4-MHz Os cilla tor, the external oscillator is not automati ca l ly sh ut do wn du r ing sl e ep . S ys t em s th at n ee d the external oscillator disabled in sleep mode will need to disable the external oscillator prior to entering sleep mode. In systems where the CPU runs off the external oscillator, firmware will need to switch the CPU to the internal oscillator prior to disabling the external oscillator.
On exiting sleep mode , onc e the clo ck is s t ab le and the delay time has expired, the instruction immediately following the sleep instruction is executed before the interrupt service routine (if enabled).
The Sleep interrupt allows the microcontroller to wake up periodically and poll system components while maintaining very low average power consumption. The Sleep interrupt may also be us ed to provide pe riodic interrupts during non­sleep modes.
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13.0 Low-voltage Detect Control

Table 13-1. Low-voltage Control Register (LVDCR) [0x1E3] [R/W]
Bit # 7 6 5 4 3 2 1 0
Field Reserved PORLEV[1:0] Reserved VM[2:0]
Read/Write R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
This register controls the configuration of the Power-on Reset / Low-voltage Detection block
Bit [7:6]: Reserved Bit [5:4]: PORLEV[1:0]
This field controls the level below which the precision power-on-reset (PPOR) detector generates a reset 0 0 = 2.7V Range (trip near 2.6V) 0 1 = 3V Range (trip near 2.9V) 1 0 = 5V Range, >4.75V (trip near 4.65V) 1 1 = PPOR will not generate a reset, but values read from the Voltage Monitor Comparators Register (Table 13-2) give the internal PPOR comparator state with trip point set to the 3V range setting
Bit 3: Reserved Bit [2:0]: VM[2:0]
This field controls the level below which the low- voltage -detect tripsp ossibly ge nerating an int errupt and the le vel at whic h the Flash is enabled for operation.
VM[2:0]
000 001 010 011 3.11 3.13 3.15 100 101 110 4.70 4.73 4.76
111
LVD Trip Point
(V) Min
2.69 2.70 2.72
2.90 2.92 2.94
3.00 3.02 3.04
4.46 4.48 4.51
4.61 4.64 4.67
4.78 4.82 4.85
LV D Trip
Point (V) Typ
LVD T rip Point
(V) Max

13.0.1 POR Compare State

Table 13-2. Voltage Monitor Comparators Register (VLTCMP) [0x1E4] [R]
Bit # 7 6 5 4 3 2 1 0 Field Reserved LVD PPOR
Read/Write ––R R
Default 0 0 0 0 000 0
This read-only register allows reading the current state of the Low-voltage-Detection and Precision-Power-On-Reset compar­ators
Bit [7:2]: Reserved Bit 1: LVD
This bit is set to indicate th at the low- v ol t age -de tec t com parator has tripped, indicating that the supply vo ltage has gone below the trip point set by VM[2:0] (See Table 13-1) 0 = No low-voltage-detect event 1= A low-voltage-detect has tripped Bit 0: PPOR This bit is set to indicate that the precision-power-on-reset comparator has tripped, indicating that the supply voltage is below the trip point set by PORLEV[1:0] 0 = No precision-power-on-reset event 1= A precision-power-on-reset event has tripped
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13.0.2 ECO Trim Register

Table 13-3. ECO (ECO_TR) [0x1EB] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Sleep Duty Cycle [1:0] Reserved
Read/Write R/W R/W
Default 0 0 0 0 000 0
This register controls the ratio s (in nu mb ers of 32-KHz cl oc k peri od s) of “on” tim e versus “off” time for LVD and POR detection circuit Bit [7:6]: Sleep Duty Cycle [1:0] 0 0 = 128 periods of the Internal 32-KHz Low-speed Oscillator 0 1 = 512 periods of the Internal 32-KHz Low-speed Oscillator 1 0 = 32 periods of the Internal 32-KHz Low-speed Oscillator 1 1 = 8 periods of the Internal 32-KHz Low-speed Oscillator

14.0 General-purpose I/O Ports

14.1 Port Data Registers

14.1.1 P0 Data

Table 14-1. P0 Data Register (P0DATA)[0x00] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field P0.7 P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1 P0.2/INT0 P0.1/CLKOUT P0.0/CLKIN
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
This register contains the data for Port 0. W riting to this regis ter sets the bit va lues to be output on ou tput enabled pins. R eading from this register returns the current state of the Port 0 pins. Bit 7: P0.7 Data P0.7 only exists in the CY7C638xx and CY7C639xx Bit [6:5]: P0.6–P0.5 Data / TIO1 and TIO0 Beside their use as the P0.6–P0.5 GPIO s, these pins can also be used for the alternate functions as the Capture T imer in put or Timer output pins (TIO1 and TIO0). T o configure the P0.5 and P0. 6 pins, refer to the P0.5/TIO0–P0.6/TIO1 Co nfiguration Register (Table 14-9) The use of the pins as the P0.6–P0.5 GPIOs and the alternate functions exist in all the enCoRe II parts Bit [4:2]: P0.4–P0.2 Data / INT2 – INT0 Beside their use as the P0.4–P0.2 GPIOs, these pins can also be used for the alternate functions as the Interrupt pins (INT0–INT2). To configure the P0.4–P0.2 pins, refer to the P0.2/INT0–P0.4/INT2 Configuration Register (Table 14-8) The use of the pins as the P0.4–P0.2 GPIOs and the alternate functions exist in all the enCoRe II parts Bit 1: P0.1/CLKOUT Beside its use as th e P0.1 GP IO, th is pi n can als o be u sed for the altern ate fu nction as the CLK OUT pin. To configure the P0.1 pin, refer to the P0.1/CLKOUT Configuration Register (Table 14-7) Bit 0: P0.0/CLKIN Beside its use as the P0.0 GPIO, this pin can also be used for the alternate function as the CLKIN pin. To configure the P0.0 pin, refer to the P0.0/CLKIN Configuration Register (Table 14-6)
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14.1.2 P1 Data

Table 14-2. P1 Data Register (P1DATA) [0x01] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field P1.7 P1.6/SMISO P1.5/SMOSI P1.4/SCLK P1.3/SSEL P1.2/VREG P1.1/D– P1.0/D+
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
This register contains the data for Port 1. W riting to this regis ter sets the bit va lues to be output on ou tput enabled pins. R eading from this register returns the current state of the Port 1 pins. Bit 7: P1.7 Data P1.7 only exists in the CY7C638xx and CY7C639xx Bit [6:3]: P1.6–P1.3 Data/SPI Pins (SMISO, SMOSI, SCLK, SSEL) Beside their use as the P1.6–P1.3 GPIOs, these pins can also be used for the alternate function as the SPI interface pins. To configure the P1.6–P1.3 pins, refer to the P1.3–P1.6 Configuration Register (Table 14-14) The use of the pins as the P1.6–P1.3 GPIOs and the alternate functions exist in all the enCoRe II parts. Bit 2: P1.2/VREG On the CY7C639xx, this pin can be used as the P1.2 GPIO or the VREG output. If the VREG output is enabled (Bit 0 Table 19-1 is set), a 3.3V source is placed on the pin and the GPIO function of the pin is disabled On the CY7C63813, this pin c an only be used as the VREG output whe n USB mode is enab led. In non-USB mo de, this pin can be used as the P1.2 GPIO The VREG output is not available in the CY7C63310 and CY7C63801 Bit [1:0]: P1.1–P1.0 / D– and D+ When USB mode is disabled (Bit 7 in Table 21-1 is clear), the P1.1 and P1.0 bits are used to control the state of the P1.0 and P1.1 pins. When the USB mode is enabled, the P1.1 and P1.0 pins are used as the D– and D+ pins respectively. If the USB Force State bit (Bit 0 in Table 18-1) is set, the state of the D– and D+ pins can be controlled by writing to the D– and D+ bits

14.1.3 P2 Data

Table 14-3. P2 Data Register (P2DATA) [0x02] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field P2.7–P2.2 P2.1–P2.0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
This register contains the data for Port 2. W riting to this regis ter sets the bit va lues to be output on ou tput enabled pins. R eading from this register returns the current state of the Port 2 pins Bit [7:2]: P2 Data [7:2] P2.7–P2.2 only exist in the CY7C639xx. Note that the CY7C63903-PVXC (28 pin SSOP package) only has P2.7–P2.4 Bit [1:0]: P2 Data [1:0] P2.1–P2.0 only exist in the CY7C63823 and CY7C639xx (except the CY7C63903-PVXC 28 pin SSOP pa ckage)

14.1.4 P3 Data

Table 14-4. P3 Data Register (P3DATA) [0x03] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field P3.7–P3.2 P3.1–P3.0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
This register contains the data for Port 3. W riting to this regis ter sets the bit va lues to be output on ou tput enabled pins. R eading from this register returns the current state of the Port 3 pins Bit [7:2]: P3 Data [7:2] P3.7–P3.2 only exist in the CY7C639xx. Note that the CY7C63903-PVXC 28 pin SSOP package only has P3.7–P3.4 Bit [1:0]: P3 Data [1:0] P3.1–P3.0 only exist in the CY7C63823 and CY7C639xx (except the CY7C63903-PVXC 28 pin SSOP pa ckage)
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14.1.5 P4 Data

Table 14-5. P4 Data Register (P4DATA) [0x04] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved P4.3–P4.0
Read/Write R R R R R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
This register contai ns the data fo r Port 4. Wri ting to this registe r sets the bi t values to be o utput on output-e nabled pins. Reading from this register returns the current state of the Port 2 pins
Bit [7:4]: Reserved Bit [3:0]: P4 Data [3:0]
P4.3–P4.0 only exist in the CY7C639xx except the CY7C63903-PVXC

14.2 GPIO Port Configuration

All the GPIO configuration registers have common configu­ration controls. The foll owing are the bit definiti ons of the GPIO configuration registers

14.2.1 Int Enable

When set, the Int Enable bit allows the GPIO to generate inter­rupts. Interrupt generate can occur regardless of whether the pin is configured for input or output. All interrupts are edge sensitive, however for any interrupt that is shared by multiple sources (i.e., Ports 2, 3, and 4) all inputs must be deasserted before a new interrupt can occur.
When clear , the corres ponding interru pt is disabled on the pin. It is possible to configure GPIOs as outputs, enable the
interrupt on the pin and then to generate the interrupt by driving the approp riate pin st ate. This is usefu l in test an d may have value in applications as well.

14.2.2 Int Act Low

When set, the corresponding interrupt is active on the falling edge.
When clear, the corresponding interrupt is active on the ri si ng edge.

14.2.3 TTL Thresh

When set, the input has TTL threshold. When clear, the input has standard CMOS threshold.

14.2.4 Hi gh Sink

When set, the output can sink up to 50 mA. When clear, the output can sink up to 8 mA. On the CY7C639xx, only the P3.7, P2.7 , P0.1, and P0 .0 have
50-mA sink drive capability. Other pins have 8-mA sink drive capability.
On the CY7C638 xx, only the P1.7 –P1.3 have 50-mA sink drive capability. Other pins have 8-mA sink drive capability.

14.2.5 Open Drain

When set, the output o n the pin is d etermined by the Port Data Register. If the corresponding bit in the Port Data Register is
set, the pin is in high-impe dance stat e. If the correspond ing bit in the Port Data Register is clear, the pin is driven low.
When clear, the output is driven low or high.

14.2.6 Pull-up Enable

When set the pin has a 7K pull-up to V with V3.3 enabled).
When clear, the pull-up is disabled.

14.2.7 Output Enable

When set, the output driver of the pin is enabled. When clear, the output driver of the pin is disabled. For pins with shared functions there are some s pec ia l c ase s. P0.0(CLKIN) and P0.1(CLKOUT) can not be output enabled
when the crystal osci llator is enabled. Output enable s for these pins are overridden by XOSC Enable.
P1.2(VREG), P1.3(SSEL), P1.4(SCLK), P1.5(SMOSI) and P1.6(SMISO) can be used for their dedicated functions or for GPIO. To enable the pin for GPIO use clear the co rresponding SPI Use bit or the Output Enable will have no effect.

14.2.8 VREG Output / SPI Use

The P1.2(VREG), P1.3(SSEL), P1.4(SCLK), P1.5(SMOSI) and P1.6(SMISO) pins can be used for their dedicated functions or for GPIO. To enable the pin for GPIO, clear the corresponding VREG Out put or SPI Use bit . The SPI func ti on controls the output e nable for i ts d edicated function pin s when their GPIO enable bit is clear. The VREG output is not available on the CY7C63801 and CY7C63310.

14.2.9 3.3V Drive

The P1.3(SSEL), P1.4(SCLK), P1.5(SMOSI) and P1.6(SMISO) pins have an alternate voltage source from the voltage regul ator. If the 3.3V Drive bi t is set a high level is driven from the voltage regulator instead of from V the 3.3V Drive bit does not enable the voltage regulator. That must be done explicitly by setting the VREG Enable bit in the VREGCR Register (Table 19-1).
(or VREG for ports
CC
. Setting
CC
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3.3V Drive
(On Designated
Pins Only)
Pull-Up Enable
Output Enable
VREG
Open Drain
Port Data
High Sink
VREG GND Vsupply GND
Data In
TTL Threshold
Figure 14-1. Block Diagram of a GPIO

14.2.10 P0.0/CLKIN Configuration

Table 14-6. P0.0/CLKIN Configuration (P00CR) [0x05] [R/W]
VREG
VCC
Vsupply
Data Out
R
UP
GPIO PIN
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull-up Enable Output Enable
Read/Write -- R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
This pin is shared betw een the P0.0 GPIO use and the CLKIN pin for th e external cr ysta l oscillator. When the external oscillator is enabled the settings of this register are ignored The use of the pin as the P0 .0 GPIO is availab le in all the enCoR e II p arts. T he alterna te functi on of the pin as th e CLKIN is only available in the CY7C639xx. When the external oscillator is enabled (the XOSC Enable bit of the CLKIOCR Register is setTable 10-8), the GPIO function of the pin is disabled The 50-mA sink dr ive capability is only available i n the CY7C639xx. In the CY7C638xx, onl y 8-mA sink drive capability is a vailable on this pin regardless of the setting of the High Sink bit

14.2.11 P0.1/CLKOUT Configuration

Table 14-7. P0.1/CLKOUT Configuration (P01CR) [0x06] R/W]
Bit # 7 6 5 4 3 2 1 0 Field CLK Output Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
This pin is shared between the P0.1 GPIO use and the CLKOUT pin for the external crystal oscilla tor. When the ex ternal oscillator is enabled the settings of this register are ignored. When CLK output is set, the internally selected clock is sent out onto P0.1CLKOUT pin. The use of the pin as the P0.1 GPIO is avai la ble in all the en C oRe II p arts. The alternate function of the pin as the CLKOUT is only available in the CY7C639xx. When the external oscillator is enabled (the XOSC Enable bit of the CLKIOCR Register is setTable 10-8), the GPIO function of the pin is disabled The 50-mA sink dr ive capability is only available i n the CY7C639xx. In the CY7C638xx, onl y 8-mA sink drive capability is a vailable on this pin regardless of the setting of the High Sink bit Bit 7: CLK Output 0 = The clock output is disabled 1 = The clock selected by the CLK Select field (Bit [1:0] of the CLKIOCR RegisterTable 10-8) is driven out to the pin
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14.2.12 P0.2/INT0 – P0.4/INT2 Configuration

Table 14-8. P0.2/INT0–P0.4/INT2 Configuration (P02CR–P04CR) [0x07–0x09] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Act Low TTL Thresh Reserved Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
These registers contro l the operatio n of pins P0.2–P0.4 respectively. These pins are shared betwee n the P0.2–P0.4 GPI Os and the INT0–INT2. These registers exist in all enCoRe II parts. The INT0–INT2 interrupts are different than all the other GPIO interrupts. These p ins are connected di rectly to the interrupt con troller to provide three edge-sensitive interrupt s with independent interrupt vectors. These interru pts occur on a rising ed ge when Int act Low is clear and on a fall ing edge when Int act Low is set. These pins are enabled as interrupt sources in the interrupt controller registers (Table 17-8 and Table 17-6). To use these pins as interrupt inputs configure them as inputs by clearing the corresponding Output Enable. If the INT0–INT2 pins are configure d as output s with inte rrupts ena bled, firmware can generat e an interrupt by writing the appropri ate value to the P0.2, P0.3 and P0.4 data bits in the P0 Data Register Regardless of wheth er the pins are us ed as Inte rrupt or GPIO pins the In t Enab le, Int act Low, TTL Threshold, Open Drain, and Pull-up Enable bits control the behavior of the pin The P0.2/INT0–P0.4/INT2 pins are individually configured with the P02CR (0x07), P03CR (0x08), and P04CR (0x09) respec­tively. Note: Changing the state of the Int Act Low bit can cause an unintentional interrupt to be generated. When configuring these interrupt sources, it is best to follow the following procedure:
1. Disable interrupt source
2. Configure interrupt source
3. Clear any pending interrupts from the source
4. Enable interrupt source

14.2.13 P0.5/TIO0 – P0.6/TIO1 Configuration

Table 14-9. P0.5/TIO0 – P0.6/TIO 1 Configura tion (P05CR–P06CR) [0x0A–0x0B] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field TIO Output Int Enable Int Act Low TTL Thresh Reserved Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
These registers control the operation of pins P0.5 through P0.6, respectively. These registers exist in all enCoRe II parts. P0.5 and P0.6 are share d with TIO0 and TIO1, re spectively. T o use these pi ns as Capture T imer in puts, configu re them as input s by clearing the correspond ing Ou tput Enabl e. To use TIO0 and TIO1 as T i mer outp uts , set the TIO x Out put and Outpu t Enable bits. If these pins are configured as outputs and the TIO Output bit is clear, firmware can control the TIO0 and TIO1 inputs by writing the value to the P0.5 and P0.6 data bits in the P0 Data Register Regardless of whether eit her pin is used as a TIO or GPI O pin the Int Enable, Int ac t Low , TTL T hreshold, O pen Drain, an d Pull­up Enable control the behavior of the pin. TIO0(P0.5) when enabled ou tputs a posit ive pulse from th e 1024-µs interv al timer . This is the same signal tha t is used internal ly to generate the 1024-µs timer interrupt. This signal is not gated by the interrupt enable state. TIO1(P0.6) when enabled outputs a positive pulse from the programmable interval timer. This is the same signal that is used internally to generate the programmable timer interval interrupt. This signal is not gated by the interrupt enable state The P0.5/TIO0 and P0.6/TIO1 pins are individually configured with the P05CR (0x0A) and P06CR (0x0B), respectively

14.2.14 P0.7 Configuration

Table 14-10. P0.7 Configuration (P07CR) [0x0C] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low TTL Thresh Reserved Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
This register controls the operation of pin P0.7. The P0.7 pin only exists in the CY7C638xx and CY7C639xx
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14.2.15 P1.0/D + Configuration

Table 14-11. P1.0/D+ Configuration (P10CR) [0x0D] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low Reserved PS/2 Pull-up
Read/Write R/W R/W R/W ––R/W R/W
Default 0 0 0 0 000 0
Enable
This register controls the operation of the P1.0 (D+) pin when the USB interface is not enabled, allowing the pin to be used as a PS2 interface or a GPIO. See Table 21-1 for information o n enabl ing U SB. When USB i s enabl ed, non e of the c ontrol s in this register have any affect on the P1.0 pin.
Note: The P1.0 is an open drain only output. It can actively drive a signal low, but cannot actively drive a signal high. Bit 1: PS/2 Pull-up Enable
0 = Disable the 5K-ohm pull-up resistors 1 = Enable 5K-ohm pull-u p resis tors f or both P1.0 and P1.1. En able th e use of the P 1.0 (D +) and P1.1 (D –) pi ns as a PS 2 st yle interface

14.2.16 P1.1/D Configuration

T a ble 14-1 2. P1.1/D– Configuration (P11CR) [0x0E] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low Reserved Open Drain Reserved Output Enable
Read/Write R/W R/W R/W R/W
Default 0 0 0 0 000 0
This register controls the operation of the P1.1 (D–) pin when the USB interface is not enabled, allowing the pin to be used as a PS2 interface or a GPIO. See Table 21-1 for information o n enabl ing U SB. When USB i s enabl ed, non e of the c ontrol s in this register have any affect on the P1.1 pin. When USB is disabled, the 5-Kohm pull-up resistor on this pin can be enabled by the PS/2 Pull-up Enable bit of the P10CR Register (Table 14-11) Note: There is no 2-mA sourcing capability on this pin. The pin can only sink 5 mA at V
(Section 26.0)
OL3
Output Enable

14.2.17 P1.2 Configuration

Table 14-13. P1.2 Configuration (P12CR) [0x0F] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field CLK Output Int Enable Int Act Low TTL Threshold Reserved Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
This register controls the operation of the P1.2 Bit 7: CLK Output 0 = The internally selected clock is not sent out onto P1.2 pin 1 = This CLK Output is use d to observe conne cted external crystal osci llator clock connected in CY7 C639xx. When C LK Output is set, the internally selected clock is sent out onto P1.2 pin

14.2.18 P1.3 Configuration (SSEL)

Table 14-14. P1.3 Configuration (P13CR) [0x10] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low 3.3V Drive High Sink Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
This register controls the operation of the P1.3 pin. This register exists in all enCoRe II parts The P1.3 GPIOs threshold is always set to TTL When the SPI hardware is enab led, the output en able and output s tate of the pi n is co ntrolled by the SPI circuit ry. When the SPI hardware is disabled, the pin is controlled by the Output Enable bit and the corresponding bit in the P1 data register. Regardless of whether the p in is used as an SPI or GPIO pin the Int Enable, Int a ct Low , 3.3V Drive , High Sink, Open Drain, and Pull-up Enable control the behavior of the pin The 50-mA sink dr ive capability is only available i n the CY7C638xx. In the CY7C639xx, onl y 8-mA sink drive capability is a vailable on this pin regardless of the setting of the High Sink bit
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14.2.19 P1.4 – P1.6 Configuration (SCLK, SMOSI, SMISO)

T a ble 14-1 5. P1.4–P1.6 Configuration (P14CR–P16CR) [0x11–0x13] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field SPI Use Int Enable Int Act Low 3.3V Drive High Sink Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
These registers control the operation of pins P1.4–P1.6, respectively. These registers exist in all enCoRe II parts The P1.4–P1.6 GPIO’s threshold is always set to TTL When the SPI hardware is enable d, pins that are con figured as SPI Use have their output enable and ou tput stat e controlle d by the SPI circuitry. When the SPI hardware is disabled or a p in has it s SPI Use bi t clear, the pin is controlled by the Output En able bit and the corresponding bit in the P1 data register. Regardless of whether any pin is used as an SPI or GPIO pin the Int Enable, Int act Low, 3.3V Drive, High Sink, Open Drain, and Pull-up Enable control the behavior of the pin The 50-mA sink dr ive capability is only available i n the CY7C638xx. In the CY7C639xx, onl y 8-mA sink drive capability is a vailable on this pin regardless of the setting of the High Sink bit Bit 7: SPI Use 0 = Disable the SPI alternate function. The pin is used as a GPIO 1 = Enable the SPI function. The SPI circuitry controls the output of the pin
Important Note for Comm Modes 01 or 10 (SPI Master or SPI Slave, see Table 15-2):
When configured for SPI (SPI Use = 1 and Comm Modes [1:0] = SPI Master or SPI Slave mode), the input/output direction of pins P1.3, P1.5, an d P1 .6 is s et a uto ma tic all y by th e SPI lo gic. However, pin P1.4's input/output direction i s NOT au tom ati ca lly set; it must be explici tly se t by firm ware . For SPI M as ter mod e, p in P1 .4 mus t be con fig ured as an o utpu t; fo r SPI Sla ve m od e, pin P1.4 must be configured as an input.

14.2.20 P1.7 Configuration

Table 14-16. P1.7 Configuration (P17CR) [0x14] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 1 0
This register controls the operation of pin P1.7. This register only exists in CY7C638xx and CY7C639xx The 50-mA sink dr ive capability is only available i n the CY7C638xx. In the CY7C639xx, onl y 8-mA sink drive capability is a vailable on this pin regardless of the setting of the High Sink bit The P1.7 GPIOs threshold is always set to TTL

14.2.21 P2 Configuration

Table 14-17. P2 Configuration (P2CR) [0x15] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 0 0
This register only exists in CY7C638xx and CY7C639xx. In CY7C638xx this register controls the operation of pins P2.0–P2.1. In the CY7C639xx, this register controls the operation of pins P2.0–P2.7 The 50-mA sink drive capability is only available on pin P2.7 and only on the CY7C639xx. In the CY7C638xx, only 8-mA sink drive capability is available on this pin regardless of the setting of the High Sink bit

14.2.22 P3 Configuration

Table 14-18. P3 Configuration (P3CR) [0x16] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 0 0 1 0
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Table 14-18. P3 Configuration (P3CR) [0x16] [R/W] (continued)
This register exist s in CY7 C638xx and CY7C639x x. In CY7C6 38xx this register con trols the op eration of pins P3.0 –P3.1. In the CY7C639xx, this register controls the operation of pins P3.0–P3.7 The 50-mA sink drive capability is only available on pin P3.7 and only on the CY7C639xx. In the CY7C638xx, only 8-mA sink drive capability is available on this pin regardless of the setting of the High Sink bit

14.2.23 P4 Configuration

Table 14-19. P4 Configuration (P4CR) [0x17] [R/W]
Bit # 7 6 5 4 3 2 1 0
Field Reserved Int Enable Int Act Low TTL Thresh Reserved Open Drain Pull-up Enable Output Enable
Read/Write R/W R/W R/W R/W R/W- R/W
Default 0 0 0 0 0 0 0 0
This register exists only in the CY7C639xx. This register controls the operation of pins P4.0–P4.3

15.0 Serial Peripheral Interface (SPI)

The SPI Ma ster/Slave Interface core lo gic runs on the SP I clock domain, making its functionality independent of system clock speed. SPI is a four pin serial interface comprised of a clock, an enable and two data pins.

15.1 SPI Data Register

Table 15-1. SPI Data Register (SPIDATA) [0x3C] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field SPIData[7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
When read, this register returns the contents of the receive buffer. When written, it loads the transmit holding register Bit [7:0]: SPI Data [7:0]
When an interrupt occ urs to indi cate to firmware th at a byt e of receive data is available, or the transmitter holding register is empty, firmware has 7 SPI clocks to manage the buffers—to
empty the receiver buffer, or to refill the transmit holding register. Failure to meet this timing requirement will result in incorrect data transfer.
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15.2 SPI Configure Register

Table 15-2. SPI Configure Register (SPICR) [0x3D] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Swap LSB First Comm Mode CPOL CPHA SCLK Select
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit 7: Swap
0 = Swap function disabled 1 = The SPI block swa ps its use of SMOSI and SMISO. Among oth er thin gs, thi s ca n be us eful i n imple mentin g sin gle wire SPI-
like communicatio ns Bit 6: LSB First 0 = The SPI transmits and receives the MSB (Most Significant Bit) first 1 = The SPI transmits and receives the LSB (Least Significant Bit) first. Bit [5:4]: Comm Mode [1:0] 0 0: All SPI communication disabled 0 1: SPI master mode 1 0: SPI slave mode 1 1: Reserved Bit 3: CPOL This bit controls the SPI clock (SCLK) idle polarity 0 = SCLK idles low 1 = SCLK idles high Bit 2: CPHA The Clock Phase bit controls the phase of the clock on which data is sampled. Table 15-3 below shows the timin g for the various
combinations of LSB First, CPOL, and CPHA Bit [1:0]: SCLK Select This field selects the speed of the master SCLK. When in master mode, SCLK is generated by dividing the base CPUCLK
Important Note for Comm Modes 01b or 10b (SPI Master or SPI Slave):
When configured for SPI, (SPI Use = 1Table 14-15), the input/output direction of pins P1.3, P1.5, and P1.6 is set automati- cally by the SPI logic. Howev er, pin P1.4's input/output direction i s NOT auto ma tic all y s et; it must be e xpl icitl y s et by firm ware. For SPI Master mode, pin P1.4 must be configured a s a n ou tput ; for SPI Slav e m od e, p in P1 .4 m us t be con fig ured as an i np ut.
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Table 15-3. SPI Mode Timing vs. LSB First, CPOL and CPHA
LSB First CPHA CPOL Diagram
000
SCL K
SSEL
DATA
001
010
X XMSB Bit 2Bi t 3Bi t 4Bit 5Bi t 6Bit 7 LSB
SCLK
SSEL
X X
DATA
MSB Bit 2Bit 3Bit 4Bi t 5Bi t 6Bi t 7 LS B
SCLK
SSEL
X X
DATA
011
MSB Bit 2Bit 3Bit 4Bi t 5Bit 6Bit 7 LSB
SCLK
CY7C63310 CY7C638xx CY7C639xx
100
101
110
111
SSEL
DATA
SCLK
SSEL
DATA
SCLK
SSEL
DATA
SCLK
SSEL
DATA
SCLK
SSEL
X XMSB Bit 2Bit 3Bit 4Bit 5Bit 6Bit 7 LSB
X XMSBBit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7LSB
X X
X X
MSBBit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7LSB
MSBBit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7LSB
DATA
X MSB XBit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7LSB
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Table 15-4. SPI SCLK Frequency
SCLK Select
00 6 2 MHz 4 MHz 01 12 1 MHz 2 MHz 10 48 250 KHz 500 KHz 11 96 125 KHz 250 KHz
CPUCLK Divisor
SCLK Frequency when CPUCLK = 12 MHz 24 MHz

15.3 SPI Interface Pins

The SPI interface uses the P1.3–P1.6 pins. These pins are configured using the P1.3 and P1.4–P1.6 Configuration.

16.0 Timer Registers

All timer functions of the enCoRe II are provided by a single timer block. The timer block is asynchronous from the CPU clock.

16.1 Registers

16.1.1 Free-running Timer Low-order Byte

CY7C63310 CY7C638xx CY7C639xx
Table 16-1. Free-running Timer Low-order Byte (FRTMRL) [0x20] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Free-running Timer [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Free-running Timer [7:0]
This register holds the low-order byte of the 16-bit free-running timer. Reading this register causes the high-order byte to be moved into a holding register allowing an automatic read of all 16 bits simultaneously. For reads, the actua l read oc curs in the cycl e when the low order i s read. Fo r writes, the actual t ime the w rite occ urs is the cycle when the high order is written. When reading the Free Runn ing T imer , the low-orde r byte should b e read first and the hig h-order second . When writing, the low­order byte should be written first then the high-order byte

16.1.2 Free-running Timer High-order Byte

Table 16-2. Free-running Timer High-order Byte (FRTMRH) [0x21] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Free-running Timer [15:8]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Free-running Timer [15:8]
When reading the Free-runn ing T imer, the low-order byte should be read first an d the high-order se cond. W hen writing, the low­o order byte should be written first then the high-order byte

16.1.3 Timer Capture 0 Rising

Table 16-3. Timer Capture 0 Rising (TCAP0R) [0x22] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Capture 0 Rising [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Capture 0 Rising [7:0]
This register holds the v alue of the Free-ru nning T imer when the last rising edg e occurred on th e TCAP0 input. When Cap ture 0 is in 8-bit mode, the bits that are stored here are selected by the Prescale [2:0] bits in the Timer Configuration register. When Capture 0 is in 16-bit mode this register holds the lower order 8 bits of the 16-bit timer
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16.1.4 Capture 1 Rising

Table 16-4. Timer Capture 1 Rising (TCAP1R) [0x23] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Capture 1 Rising [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Capture 1 Rising [7:0]
This register holds the valu e of the F ree-runni ng T imer when the l ast rising e dge occ urred on the T CAP1 inp ut. The bi ts tha t are stored here are selected by the Prescale [2:0] bits in the Timer Configuration register. When Capture 0 is in 16-bit mode this register holds the hi gh-orde r 8 bit s of the 16 -bit tim er from the last Ca ptur e 0 ri sing edge. When Ca ptur e 0 is i n 16-bi t mod e this register will be loaded with high-order 8 bits of the 16-bit timer on TCAP0 rising edge

16.1.5 Timer Capture 0 Falling

Table 16-5. Timer Capture 0 Falling (TCAP0F) [0x24] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Capture 0 Falling [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Capture 0 Falling [7:0]
This register holds the value of the Fre e-running Timer when the last falling edge occurred on the TCAP0 inpu t. When Cap ture 0 is in 8-bit mo de , th e b it s t hat are stored here are s ele ct ed by th e Pre sc al e [ 2:0 ] bi t s in the Timer Co nfi guration register. When Capture 0 is in 16-bit mode this register holds the lower-order 8 bits of the 16-bit timer

16.1.6 Timer Capture 1 Falling

Table 16-6. Timer Capture 1 Falling (TCAP1F) [0x25] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Capture 1 Falling [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Capture 1Falling [7:0]
This register holds the value of the Free-running Timer when the last falling edge occurred on the TCAP1 input. The bits that are stored here are s electe d by the Pre scal e [2:0] bit s in the Timer Configuration register. When capture 0 is in 16 -bit mod e this register holds the high -order 8 b its of the 1 6-bit timer from the las t Capture 0 fa lling edg e. When C apture 0 is in 16-bit mode this register will be loaded with high-order 8 bits of the 16-bit timer on TCAP0 falling edge

16.1.7 Programmable Interval Low Byte

Table 16-7. Programmable Interval Timer Low (PITMRL) [0x26] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Prog Interval Timer [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Prog Interval Timer [7:0]
This register holds the low- order byte of the 12-bit program mable interval timer . Reading this register caus es the high-order byte to be moved into a holding register allowing an automatic read of all 12 bits simultaneously
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16.1.8 Programmable Interval High Byte

Table 16-8. Programmable Interval Timer High (PITMRH) [0x27] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Prog Interval Timer [11:8]
Read/Write R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:4]: Reserved Bit [3:0]: Prog Internal Timer [11:8]
This register holds the high-order nib ble of the 12-b it pro gram m abl e inte rva l tim er. Reading this register returns the high-order nibble of the 12-bit timer at the instant that the low-order byte was last read

16.1.9 Programmable Interval Reload Low Byte

Table 16-9. Programmable Interval Reload Low (PIRL) [0x28] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Prog Interval [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:0]: Prog Interval [7:0]
This register holds the lower 8 bits of the timer . While writing into the 12-bit reload register , write lower byte first then the higher nibble

16.1.10 Programmable Interval Reload High Byte

Table 16-10. Programmable Interval Reload High (PIRH) [0x29] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Prog Interval[11:8]
Read/Write R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit [7:4]: Reserved Bit [3:0]: Prog Interval [11:8]
This register holds the higher 4 bits of the timer. While writing into the 12-bit reload register , write lower byte first then the higher nibble
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16.1.11 Timer Configuration

Table 16-11. Timer Configuration (TMRCR) [0x2A] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field First Edge Hold 8-bit Capture Prescale [2:0] Cap0 16bit
Read/Write R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Enable
Bit 7: First Edge Hold The First Edge Hold function applies to all four capture timers. 0 = The time of the most recen t edge is held in th e Capture Timer Data Register . If mul tiple ed ges hav e occu rred sin ce readi ng the capture timer, the time for the most recent one will be read 1 = The time of the first occurrence of an edge is held in the Capture Timer Data Register until the data is read. Subsequent edges are ignored until the Capture Timer Data Register is read. Bit [6:4]: 8-bit Capture Prescale [2:0] This field controls which 8 bits of the 16 Free Running Timer are captured when in bit mode 0 0 0 = capture timer[7:0] 0 0 1 = capture timer[8:1] 0 1 0 = capture timer[9:2] 0 1 1 = capture timer[10:3] 1 0 0 = capture timer[11:4] 1 0 1 = capture timer[12:5] 1 1 0 = capture timer[13:6] 1 1 1 = capture timer[14:7] Bit 3: Cap0 16-bit Enable 0 = Capture 0 16-bit mode is disabled 1 = Capture 0 16-b it mode is enabled. C apture 1 is disable d and the Capture 1 r ising and falling reg isters are used as an e xtension to the Capture 0 registersextending them to 16 bits Bit [2:0]: Reserved
Reserved

16.1.12 Capture Interrupt Enable

Table 16-12. Capture Interrupt Enable (TCAPINTE) [0x2B] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Cap1 Fall
Read/Write ––––R/W R/W R/W R/W
Default 0 0 0 0 000 0
Enable
Cap1 Rise
Enable
Cap0 Fall
Enable
Bit [7:4]: Reserved Bit 3: Cap1 Fall Enable
0 = Disable the capture 1 falling edge interrupt 1 = Enable the capture 1 falling edge interrupt Bit 2: Cap1 Rise Enable 0 = Disable the capture 1 rising edge interrupt 1 = Enable t he capture 1 rising edge interrupt Bit 1: Cap0 Fall Enable 0 = Disable the capture 0 falling edge interrupt 1 = Enable the capture 0 falling edge interrupt Bit 0: Cap0 Rise Enable 0 = Disable the capture 0 rising edge interrupt 1 = Enable t he capture 0 rising edge interrupt
Cap0 Rise
Enable
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16.1.13 Capture Interrupt Status

Table 16-13. Capture Interrupt Status (TCAPINTS) [0x2C] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Cap1 Fall
Read/Write ––––R/W R/W R/W R/W
Default 0 0 0 0 000 0
Active
Bit [7:4]: Reserved Bit 3: Cap1 Fall Active
0 = No event 1 = A falling edge has occurred on Cap1 Bit 2: Cap1 Rise Active 0 = No event 1 = A rising edge has occurred on Cap1 Bit 1: Cap0 Fall Active 0 = No event 1 = A falling edge has occurred on Cap0 Bit 0: Cap0 Rise Active 0 = No event 1 = A rising edge has occurred on Cap0
Cap1 Rise
Active
Cap0 Fall
Active
Cap0 Rise
Active

17.0 Interrupt Controller

The interrupt controller and its associated registers allow the users code to respond to an interrupt from almost every functional block in the enCoRe II devices. The registers associated with the interrupt controller allow interrupts to be disabled either globally or individually. The registers also provide a mechanism by which a user may clear all pending and posted interrupts, or clear individual posted or pending interrupts.
The following t abl e lis ts all interru pts and the p rio rities th at are available in the enCoRe II devices.
Table 17-1. Interrupt Numbers, Priorities, Vectors
Interrupt
Priority
0 0000h Reset 1 0004h POR/LVD 2 0008h INT0 3 000Ch SPI Transmitter Empty 4 0010h SPI Receiver Full 5 0014h GPIO Port 0 6 0018h GPIO Port 1 7 001Ch INT1 8 0020h EP0
9 0024h EP1 10 0028h EP2 11 002Ch USB Reset 12 0030h USB Active 13 0034h 1-mS Interval timer 14 0038h Programmable Interval Timer 15 003Ch Timer Capture 0 16 0040h Timer Capture 1
Interrupt Address Name
Table 17-1. Interrupt Numbers, Priorities, Vectors (contin-
Interrupt
Priority
Interrupt Address Name
17 0044h 16-bit Free Running Timer Wrap 18 0048h INT2 19 004Ch PS2 Data Low 20 0050h GPIO Port 2 21 0054h GPIO Port 3 22 0058h GPIO Port 4 23 005Ch Reserved 24 0060h Reserved 25 0064h Sleep Timer

17.1 Archi tect ural Desc rip tio n

An interrupt is posted when its interrupt conditions occur. This results in the flip-flop in Figure 17-1 clocking in a ‘1’. The interrupt will remain posted until the interrupt is taken or until it is cleared by writing to the appropriate INT_CLRx register.
A posted interrupt is not p ending unless i t is enabled by setti ng its interrupt mask bit (in the appropriate INT_MSKx register). All pending interrup ts are proces sed by the Prio rity Encoder to determine the highest priority interrupt which will be taken by the M8C if the Global Interrupt Enable bit is set in the CPU_F register.
Disabling an interrupt by clearing its interrupt mask bit (in the INT_MSKx register) does not clear a posted interrupt, nor does it prevent an interrupt from being posted. It simply prevents a posted interrupt from becoming pending.
Nested interrupts can be accomplished by re-enabling inter­rupts inside an interrupt service routine. To do this, set the IE bit in the Flag Register.
A block diagram of the enCoR e II Interrupt Control ler is shown in Figure 17-1.
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Interrupt Taken
or
INT_CLRx Write
Posted
Interrupt
DRQ1
Interrupt
Source
(Timer,
GPIO, etc.)
INT_MSKx
M ask Bi t Se tting
Figure 17-1. Interrupt Controller Block Diagram
Pending
Interrupt

17.2 Interrupt Processing

The sequence of e vents that occ ur during inte rrupt processi ng is as follows:
1. An interrupt becomes active, either because: a. The interrupt condition occurs (e.g., a timer expires) b. A previously posted interrupt is enabled through an up-
date of an interrupt mask register
c. An interrupt is pending and GIE is set from 0 to 1 in the
CPU Flag register.
2. The current executing instruction finishes.
3. The internal in terrupt is dispatched, ta king 13 cycles. During
this time, the following actions occur: he MSB and LSB of Program Counter and Flag registers (CPU_PC and CPU_F) are stored on to the program sta ck by an automati c CALL instruction (13 cy cles) generated duri ng the interrupt acknowledge proces s.
a. The PCH, PCL, and Flag register (CPU_F) are stored
onto the program stack (in that order) by an automatic CALL instruction (13 cy cles ) generate d during the inter­rupt acknowledge proces s
b. The CPU_F register is then cleared. Sin ce this clears the
GIE bit to 0, additional interrupts are temporarily dis-
abled c. The PCH (PC[15:8]) is cleared to zero d. The interrupt v ec tor is re ad from th e i nte rrupt c ontroller
and its value placed into PCL (PC[7:0]). This sets the
program counter to point to the appropriate address in
the interrupt table (e.g., 0004h for the POR/LVD inter-
rupt)
4. Program exe cution v ectors to the interru pt t able. Typically, a LJMP instruction i n the interrupt t able send s execution to the users Interrupt Service Routine (ISR) for this interrupt
5. The ISR executes. Note that interrupts are disabled since GIE = 0. In the ISR, interrupts ca n be re-enabled if desired
Priority
Encoder
...
Inte r ru p t Ve cto r
Interrupt Request
M8C Co re
...
CPU_F[0]
GIE
by setting GIE = 1 (care must be taken to avoid stack overflow).
6. The ISR ends with a RETI instruction which restores the Program Counter and Flag registers (CPU_PC and CPU_F). The restored Flag register re-enables interrupts, since GIE = 1 again.
7. Execution resumes at the next instruc tion, after the one tha t occurred before the interrupt. However, if there are more pending interrupts, the subsequent interrupts will be processed before the next normal program instruction.

17.3 Interrupt Latency

The time between the assertion of an enabled interrup t and the start of its ISR can be calculated from the following equation.
Latency = Time for current instruction to finish + Time for internal interrupt routine to execute + Time for LJMP instruction in interrupt table to execute.
For example, if the 5-cycl e JMP instruc tion is executing when an interrupt becomes active, the total number of CPU clock cycles before the ISR begins would be as follows:
(1 to 5 cycles for JMP to finish) + (13 cycles for interrupt routine) + (7 cycles for LJMP) = 21 to 25 cycles.
In the example abo ve , at 2 4 M H z, 2 5 c loc k c yc le s t a ke 1.042 ms.

17.4 Interrupt Registers

17.4.1 I nter rupt C lea r Regist er

The Interrupt Clear Regist ers (INT_ C LRx) are used to enab le the individual interrupt sources ability to clear posted inter­rupts.
When an INT_CLRx register is read, any bits that are set indicates an interrupt has been posted for that hardware resource. Therefore , reading these regi sters gives the user t he ability to determine all posted interrupts.
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Table 17-2. Interrupt Clear 0 (INT_CLR0) [0xDA] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field GPIO Port 1 Sleep Timer INT1 GPIO Port 0 SPI Receive SPI Transmit INT0 POR/LVD
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
When reading this register, 0 = Theres no posted interrupt for the corresponding hardware 1 = Posted interrupt for the corresponding hardware present Writing a ‘0’ to the bits will clear the posted interrupts f or the corresponding hardware. Writi ng a ‘1’ to the bits AND to the ENSWINT (Bit 7 of the INT_MSK3 Register) will post the corresponding hardware interrupt
Table 17-3. Interrupt Clear 1 (INT_CLR1) [0xDB] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field TCAP0 Prog Interval
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Timer
When reading this register, 0 = Theres no posted interrupt for the corresponding hardware 1 = Posted interrupt for the corresponding hardware present Writing a ‘0’ to the bits will clear the posted interrupts f or the corresponding hardware. Writi ng a ‘1’ to the bits AND to the ENSWINT (Bit 7 of the INT_MSK3 Register) will post the corresponding hardware interrupt
1-ms Timer USB Active USB Reset USB EP2 USB EP1 USB EP0
Table 17-4. Interrupt Clear 2 (INT_CLR2) [0xDC] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved GPIO Port 4 GPIO Port 3 GPIO Port 2 PS/2 Data Low INT2 16-bit Counter
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Wrap
TCAP1
When reading this register, 0 = Theres no posted interrupt for the corresponding hardware 1 = Posted interrupt for the corresponding hardware present Writing a ‘0’ to the bits will clear the posted interrupts f or the corresponding hardware. Writi ng a ‘1’ to the bits AND to the ENSWINT (Bit 7 of the INT_MSK3 Register) will post the corresponding hardware interrupt

17.4.2 Interrupt Mask Registers

The Interrupt Mas k Regi sters (I NT_M SKx) are us ed to e nable the individual inter rupt sourc es abi lity to cre ate pendi ng inter­rupts.
There are four Interrupt Mask Registers (INT_MSK0, INT_MSK1, INT_MSK2, and INT_MSK3) which may be referred to in general as INT_MSKx. If cleared, each bit in an INT_MSKx register pre vents a post ed interrupt from be coming a pending interrup t (input to the priority enco der). However , an interrupt can still post even if its mask bit is zero. All INT_MSKx bits are independent of all other INT_MSKx bits.
If an INT_MSKx bit is set, the interru pt sour ce ass ociat ed with that mask bit may generate an interrupt that will become a
The Enable Software Interrup t (ENSWINT) bit in INT_MSK3[7] determines the way an individual bit value written to an INT_CLRx register is interpreted. When is cleared, writing 1's to an INT_CLRx regi ster ha s no ef fec t. Ho wever, writing 0's to an INT_CLRx register, when ENSWINT is cleared, will cause the corresponding interrupt to clear. If the ENSWINT bit is set, any 0s written to the INT_CLRx registers are ignored. However, 1s written to an INT_CLRx register , while ENSWINT is set, will cause an interrupt to post for the corresponding interrupt.
Software interrupts can aid in debugging interrupt service routines by eliminating the need to create system level inter­actions that are sometimes necessary to create a hardware­only interrupt.
pending interrupt.
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Table 17-5. Interrup t Mask 3 (INT_MSK3) [0xDE] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field ENSWINT Reserved
Read/Write R/W
Default 0 0 0 0 000 0
Bit 7: Enable Software Interrupt (ENS WINT)
0= Disable. Writing 0s to an INT_CLRx register, when ENSWINT is cleared, will cause the corresponding interrupt to clear 1= Enable. Writing 1s to an INT_CLRx register, when ENSWINT is set, will cause the corresponding interrupt to post.
Bit [6:0]: Reserved
Table 17-6. Interrup t Mask 2 (INT_MSK2) [0xDF] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserv ed GPIO Port 4
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Int Enable
Bit 7: Reserved Bit 6: GPIO Port 4 Interrupt Enable
0 = Mask GPIO Port 4 interrupt 1 = Unmask GPIO Port 4 interrupt Bit 5: GPIO Port 3 Interrupt Enable 0 = Mask GPIO Port 3 interrupt 1 = Unmask GPIO Port 3 interrupt Bit 4: GPIO Port 2 Interrupt Enable 0 = Mask GPIO Port 2 interrupt 1 = Unmask GPIO Port 2 interrupt Bit 3: PS/2 Data Low Interrupt Enable 0 = Mask PS/2 Data Low interrupt 1 = Unmask PS/2 Data Low interrupt Bit 2: INT2 Interrupt Enable 0 = Mask INT2 interrupt 1 = Unmask INT2 interrupt Bit 1: 16-bit Counter Wrap Interrupt Enable 0 = Mask 16-bit Counter Wrap interrupt 1 = Unmask 16-bit Counter Wrap interrupt Bit 0: TCAP1 Interrupt Enable 0 = Mask TCAP1 interrupt 1 = Unmask TCAP1 interrupt
GPIO Port 3
Int Enable
GPIO Port 2
Int Enable
PS/2 Data Low
Int Enable
INT2
Int Enable
16-bit Counter
Wrap Int Enable
TCAP1
Int Enable
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Table 17-7. Interrup t Mask 1 (INT_MSK1) [0xE0] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field TCAP0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Int Enable
Bit 7: TCAP0 Interrupt Enable 0 = Mask TCAP0 interrupt 1 = Unmask TCAP0 interrupt Bit 6: Prog Interval Timer Interrupt Enable 0 = Mask Prog Interval Timer interrupt 1 = Unmask Prog Interval Timer interrupt Bit 5: 1-ms Timer Interrupt Enable 0 = Mask 1-ms interrupt 1 = Unmask 1-ms interrupt Bit 4: USB Active Interrupt Enable 0 = Mask USB Active interrupt 1 = Unmask USB Active interrupt Bit 3: USB Reset Interrupt Enable 0 = Mask USB Reset interrupt 1 = Unmask USB Reset interrupt Bit 2: USB EP2 Interrupt Enable 0 = Mask EP2 interrupt 1 = Unmask EP2 interrupt Bit 1: USB EP1 Interrupt Enable 0 = Mask EP1 interrupt 1 = Unmask EP1 interrupt Bit 0: USB EP0 Interrupt Enable 0 = Mask EP0 interrupt 1 = Unmask EP0 interrupt
Prog Interval
Timer
Int Enable
1-ms Timer
Int Enable
USB Active
Int Enable
USB Reset
Int Enable
USB EP2
Int Enable
USB EP1
Int Enable
USB EP0
Int Enable
Table 17-8. Interrupt Mask 0 (INT_MSK0) [0xE1] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field GPIO Port 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Int Enable
Sleep Timer
Int Enable
INT1
Int Enable
GPIO Port 0
Int Enable
SPI Receive
Int Enable
SPI Transmit
Int Enable
INT0
Int Enable
Bit 7: GPIO Port 1 Interrupt Enable 0 = Mask GPIO Port 1 interrupt 1 = Unmask GPIO Port 1 interrupt Bit 6: Sleep Timer Interrupt Enable 0 = Mask Sleep Timer interrupt 1 = Unmask Sleep Ti mer interrupt Bit 5: INT1 Interrupt Enable 0 = Mask INT1 interrupt 1 = Unmask INT1 interrupt Bit 4: GPIO Port 0 Interrupt Enable 0 = Mask GPIO Port 0 interrupt 1 = Unmask GPIO Port 0 interrupt Bit 3: SPI Receive Interrupt Enable 0 = Mask SPI Receive interrupt 1 = Unmask SPI Receive interrupt Bit 2: SPI Transmit Interrupt Enable 0 = Mask SPI Transmit interrupt 1 = Unmask SPI Transmit interrupt Bit 1: INT0 Interrupt Enable 0 = Mask INT0 interrupt 1 = Unmask INT0 interrupt Bit 0: POR/LVD Interrupt Enable 0 = Mask POR/LVD interrupt 1 = Unmask POR/LVD interrupt
POR/ LVD Int Enable
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17.4.3 Interrupt Vector Clear Register

Table 17-9. Interrupt Vector Clear Register (INT_VC) [0xE2] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Pending Interrupt [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
The Interrupt V ecto r Clear Reg ister (INT_VC ) holds th e interrupt vector for t he highes t priority pending i nterrupt when read, and when written will clear all pending interrupts Bit [7:0]: Pending Interrupt [7:0] 8-bit data value holds the interrupt vector for the highest priority pending interrupt. Writing to this register will clear all pending interrupts.

18.0 USB/PS2 Transceiver

Although the USB transceiver has features to assist in inter­facing to PS/2 these features are not controlled using these registers. These registers only control the USB interfacing features. PS/2 interfac ing options are con trolled by the D+/D– GPIO Configuration register (See Section Table 14.2.15).

18.1 USB Transceiver Configuration

Table 18-1. USB Transceiver Configure Register (USBXCR) [0x74] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field USB Pull-up
Read/Write R/W R/W
Default 0 0 0 0 000 0
Enable
Reserved USB Force State
Bit 7: USB Pull-up Enable 0 = Disable the pull-up resistor on D– 1 = Enable the pull-up resistor on D–. This pull-up is to VCC IF VREG is not enabled or to the internally generated 3.3V when
VREG is enabled
Bit [6:1]: Reserved Bit 0: USB Force State
This bit allows the state of the USB I/O pins D- and D+ to be forced to a state while USB is enabled 0 = Disable USB Force State
1 = Enable USB Force State. Allows the D- and D+ pins to be controlled by P1.1 and P1.0 respectively when the USBIO is in USB mode. Refer to Section 14.2.15 for more information
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19.0 USB Regulator Output

19.1 VREG Control

Table 19-1. VREG Control Register (VREGCR) [0x73] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Reserved Keep Alive VREG Enable
Read/Write R/W R/W
Default 0 0 0 0 000 0
Bit [7:2]: Reserved Bit 1: Keep Alive
Keep Alive when set allows the voltage regulator to source up to 20µA of current when voltage regulator is disabled, P12CR[0],P12CR[7] should be cleared.
0 = Disabled 1 = Enabled Bit 0: VREG Enable This bit turns on the 3.3V voltage regulator. The voltage regulator only functions within specifications when V
This block should not be enabled when V 0 = Disable the 3.3V voltage regulator output on the VREG/P1.2 pin
1 = Enable t he 3.3V voltage regulator output on the VREG/P1.2 pin. GPIO functionality of P1.2 is disabled Note: Use of the alternate drive on pins P1.3–P1.6 requires that the VREG Enable bit be set to enable the regulator and pro- vide the alternate voltage
is below 4.35Valthough no damage or irregularities will occur if it is enabled below 4.35V
CC
is above 4.35V.
CC

20.0 USB Serial Interface Engine (SIE)

The SIE allows the microcontroller to communicate with the USB host at low-speed data rates (1.5 Mbps). The SIE simplifies the interface between the microcontroller and USB by incorporating hard ware that han dles the f ollowin g USB bus activity independently of the microcontroller:
Trans late the encoded re ceived data an d format the data to be transmitted on the bus.
CRC checking and generation. Flag the microcontroller if errors exist during transmission.
Address checking. Ignore the transactions not addressed to the device.
Send appropriate ACK/NAK/STALL handshakes.
Token type identification (SETUP, IN, or OUT). Set the
appropriate token bit once a valid token is received.
Place valid receive d data in the appropriate endpoint FIFOs.
Send and update the data toggle bit (Data1/0).
Bit stuffing/unstuffing.
Firmware is required to handle the rest of the USB interface with the following tasks:
Coordinate enum eration by decoding U SB device requests.
Fill and empty the FIFOs.
Suspend/Resume coordination.
Verify and select Data toggle values.
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21.0 USB Device

21.1 USB Device Addr ess

Table 21-1. USB Device Address (USBCR) [0x40] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field USB Enable Device Address[6:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
The conten t of this register is cleared when a USB Bus Reset condition occurs Bit 7: USB Enable
This bit must be enabled by firmware befo re the seria l interface engine (SIE) will respond to USB traf fic at the address sp ecified in Device Address [6:0]. When this bit is cleared, the USB transceiver enters power-down state. Users firmware should clear this bit prior to entering sleep mode to save power
0 = Disable USB device address and put the USB transceiver into power-down state 1 = Enable USB device address and put the USB transceiver into normal operating mode
Bit [6:0]: Device Address [6:0] These bits must be set by firmware during the USB enumeration process (i.e., SetAddress) to the non-zero address assigned
by the USB host

21.2 Endpoint 0, 1, and 2 Count

Table 21-2. Endpoint 0, 1, and 2 Count (EP0CNT–EP2CNT) [0x41, 0x43, 0x45] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Data Toggle Data Valid Reserved Byte Count[3:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 0 000 0
Bit 7: Data Toggle
This bit selects the DATA packets toggle state. For IN transacti ons , fi rmwa re m ust s et t his bi t to the s ele ct the transmitted Data Toggle. For OUT or SETUP transactions, the hardware sets this bit to the state of the received Data Toggle bit.
0 = DATA0 1 = DATA1
Bit 6: Data Valid This bit is used for OUT and SETUP tokens only. This bit is cleared to ‘0’ if CRC, bitstuff, or PID errors have occurred. This bit
does not update for some endpoi nt mo de settings 0 = Data is invalid. If enabled, the endpoint interrupt will occur even if invalid data is received 1 = Data is valid
Bit [5:4]: Reserved Bit [3:0]: Byte Count Bit [3:0]
Byte Count Bits i ndicate the number of da ta byt es in a tran saction: For IN transaction s, firmware lo ads the co unt with the nu mber of bytes to be transmitted to the host from the en dpoint FIFO. Valid values are 0 to 8 inclusive. For OUT or SETU P transacti ons, the count is updated by hardware to the number of data bytes r eceived, plus 2 for the CRC bytes. V alid values are 2–10 i nclusive. For Endpoint 0 Count Register, whenever the count updates from a SETUP or OUT transaction, the count register locks and cannot be written by the CPU. Reading the register unlocks it. This prevents firmware from overwriting a status update on it.
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21.3 Endpoint 0 Mode

Because both firmware and the SIE are allow ed to write to the Endpoint 0 Mode and Count Registers the SIE provides an interlocking mechanism to prevent accidental overwriting of
When the SIE writes to these regist ers they are locked and the processor cannot write to them until after it has read them. Writing to this register clears the upper four bits regardless of the value written.
data.
Table 21-3. Endpoint 0 Mode (EP0MODE) [0x44] [R/W]
Bit # 7 6 5 4 3 2 1 0
Field Setup Received IN Received OUT Received ACKd Trans Mode[3:0]
Read/Write R/C[4] R/C
Default 0 0 0 0 000 0
[4]
R/C
[4]
R/C
[4]
R/W R/W R/W R/W
Bit 7: SETUP Received This bit is set by hardware when a valid SETUP packet is received. It is forced HIGH from the start of the data packet phase of
the SETUP transactions until the end of the data phase of a control write transfer and cannot be cleared during this interval. While this bit is set to ‘1’, the CPU cannot write to the EP0 FIFO. This prevents firmware from overwriting an incoming SETUP transaction before firmware has a chance to read the SETUP data.
This bit is cleared by any non-locked writes to the register. 0 = No SETUP received
1 = SETUP received Bit 6: IN Received
This bit when set indica tes a valid IN pa cket has be en receiv ed. This bit is upd ated to ‘1’ af ter the host ack nowledges an IN data packet.When clear, it indicates either no IN has been received or that the host didnt acknowledge the IN data by sending ACK handshake.
This bit is cleared by any non-locked writes to the register. 0 = No IN received
1 = IN received Bit 5: OUT Received
This bit when set indicates a valid OUT packet has been received and ACKed. This bit is updated to ‘1’ after the last received packet in an OUT transaction. When clear, it indicates no OUT received.
This bit is cleared by any non-locked writes to the register. 0 = No OUT received
1 = OUT received Bit 4: ACKd Transaction The ACKd transaction bi t is set w henever th e SIE engag es in a t ransaction to the regis ters endpoint that com pletes with a ACK
packet. This bit is cleared by any non-locked writes to the register 1 = The transaction completes with an ACK
0 = The transaction does not complete with an ACK Bit [3:0]: Mode [3:0]
The endpoint modes determine how the SIE responds to USB traffic that the host sends to the endpoint. The mode controls how the USB SIE responds to t raf fic and how the USB SIE will ch ange the mode of that endpoint as a result of host packets to the endpoint.
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21.4 Endpoint 1 and 2 Mode

Table 21-4. Endpoint 1 and 2 Mode (EP1MODE – EP2MODE) [0x45, 0x46] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Stall Reserved NAK Int Enable ACKd
Read/Write R/W R/W R/W R/C (Note 4) R/W R/W R/W R/W
Default 0 0 0 0 000 0
Transaction
Bit 7: Stall When this bit is set the SIE will stall an OUT packet if the Mode Bits are set to ACK-OUT, and the SIE will stall an IN packet if
the mode bits are set to ACK-IN. This bit must be clear for all other modes
Bit 6: Reserved Bit 5: NAK Int Enable
This bit when set causes an endpoint interrupt to be generated even when a transfer completes with a NAK. Unlike enCoRe, enCoRe II family members do not generate an endpoint interrupt under these conditions unless this bit is set
0 = Disable interrupt on NAKd transactions 1 = Enable interrupt on NAK’d transaction
Bit 4: ACKd Transaction The ACKd transaction bit is set whenever the SIE engages in a transaction to the registers endpoint that completes with an
ACK packet. This bit is cleared by any writes to the register 0 = The transaction does not complete with an ACK
1 = The transaction completes with an ACK Bit [3:0]: Mode [3:0]
The endpoint modes determine how the SIE responds to USB traffic that the host sends to the endpoint. The mode controls how the USB SIE responds to traffic and how the USB SIE will change the mode of that endpoint as a result of host packets to the endpoint.
Mode[3:0]

21.4.1 Endpoint 0, 1, and 2 Data Buffer

Table 21-5. Endpoint 0 Data (EP0DATA) [0x50-0x57] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Endpoint 0 Data Buffer [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default Unknown Unknown Unknown Unknown Unknown Unknown Unknown Unknown
The Endpoint 0 buffer is comprised of 8 bytes located at address 0x50 to 0x57
Table 21-6. Endpoint 1 Data (EP1DATA) [0x58-0x5F] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Endpoint 1 Data Buffer [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default Unknown Unknown Unknown Unknown Unknown Unknown Unknown Unknown
The Endpoint 1buffer is comprised of 8 bytes located at address 0x58 to 0x5F
Table 21-7. Endpoint 2 Data (EP2DATA) [0x60-0x67] [R/W]
Bit # 7 6 5 4 3 2 1 0 Field Endpoint 2 Data Buffer [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default Unknown Unknown Unknown Unknown Unknown Unknown Unknown Unknown
The Endpoint 2 buffer is comprised of 8 bytes located at address 0x60 to 0x67
The three data buffers used to hold data for both IN and OUT transactions. Each data buffer is 8 bytes long.
Unlike past enCoRe parts the USB data buffers are only accessible in the I/O space of the processor.
The reset values of the End point Data Registe rs are unknown.
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22.0 USB Mode Tables

Mode Encoding SETUP IN OUT Comments
DISABLE 0000 Ignore Ignore Ignore Ignore all USB traffic to this endpoint. Used by Data and
NAK IN/OUT 0001 Accept NAK NAK NAK IN and OUT token. Control endpoint only
STA TUS OUT ONL Y 0010 Accept STALL Check STALL IN and ACK zero byte OUT . Control endpoint only
STALL IN/OUT 0011 Accept STALL STALL STALL IN and OUT token. Control endpoint only
STATUS IN ONLY 0110 Accept TX0 byte STALL STALL OUT and send zero byte data for IN token. Con-
ACK OUT – ST ATUS
ACK O UT (STALL = 0) 1001 Ignore Ignore ACK This mode is changed by the SIE to mode 1000 on is-
ACK OUT (ST ALL = 1) 1001 Ignore Ignore STALL STALL the OUT transfer
ACK IN (STALL = 0) 1101 Ignore TX Count Ignore This mode is changed by the SIE to mode 1100 after
ACK IN (STALL = 1) 1101 Ignore STALL Ignore STALL the IN transfer. Data endpoint only
IN
ACK IN – STATUS
OUT
NAK OUT 1000 Ignore Ignore NAK Send NAK handshake to OUT token. Data endpoint only
NAK IN 1100 Ignore NAK Ignore Send NAK handshake for IN token. Data endpoint only
1011 Accept TX0 byte ACK ACK the OUT token or send zero byte data for IN token.
11 1 1 Accept TX Count Check Respond to IN data or St atus OUT . Control endpoint only
Control endpoints
trol endpoint only
Control endpoint only
suance of ACK handshake to an OUT. Data endpoint only
receiving ACK handshake to an IN data. Data endpoint only
Reserved 0101 Ignore I gnore Ignore These modes are not supported by SIE. Firmware Reserved 0111 Ignore Ignore Ignore Reserved 1010 Ignore Ignore Ignore Reserved 0100 Ignore Ignore Ignore Reserved 1110 Ignore Ignore Ignore
Mode Column
The ’Mode’ column contains the mnemonic nam es given to the modes of the endpoint. The mode of the endpoint is deter­mined by the four-bit binaries in the ’Encoding’ column as discussed below . The S t atus IN and S tatu s OUT represent the status IN or OUT stage of the control transfer.
Encoding Column
The contents of the ’Encoding’ column represent the Mode Bits [3:0] of the Endpoint Mode Registers (Table 21-3 and Table 21-4). The endpoint modes determine how the SIE responds to different tokens that the host sends to the endpoints. For example, if the Mode Bits [3:0] of the Endpoint 0 Mode Register are set to ’0001, which is NAK IN/OUT mode, the SIE will send an ACK handshake in response to SETUP tokens and NAK any IN or OUT tokens.
SETUP, IN, and OUT Columns
Depending on the mode specified in the ’Encoding column, the SETUP, IN, and OUT’ columns contain the SIE’s responses when the endpoint receives SETUP, IN, and OUT tokens, respectively.
A Check in the Out column means that upon receiving an OUT token the SIE checks to see whether the OUT is of zero length and has a Data Toggle (Data1/0) of 1. If these condi­tions are true, the SIE responds with an ACK. If any of the above condition s is not met, the SIE will respond w it h ei the r a STALL or Ignore.
A TX Count’ entry in the IN column means that the SIE will transmit the number of bytes specified in the Byte Count Bit [3:0] of the Endpoint Count Register (Table 21-2) in response to any IN token.
should not use this mode in Control and Data endpoints
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23.0 Details of Mode for Differing Traffic Conditions
Control Endpoint
SIE Bus Event SIE EP0 Mode Register EP0 Count Register EP0 Interrupt Comments
Mode Token Count Dval D0/1 Response S I O A MODE DTOG DVAL COUNT FIFO
DISABLED
0000 x x x x Ignore All
STALL_IN_OUT
0011 SETUP >10 x x junk Ignore 0011 SETUP <=10 invalid x junk Ignore 0011 SETUP <=10 valid x ACK 1 1 0001 update 1 update data Yes ACK SETUP 0011 IN x x x STALL Stall IN 0011 OUT >10 x x Ignore 0011 OUT <=10 invalid x Ignore 0011 OUT <=10 valid x STALL Sta ll OUT
NAK_IN_OUT
0001 SETUP >10 x x junk Ignore 0001 SETUP <=10 invalid x junk Ignore 0001 SETUP <=10 valid x ACK 1 1 0001 update 1 update data Yes ACK SETUP 0001 IN x x x NAK NAK IN 0001 OUT >10 x x Ignore 0001 OUT <=10 invalid x Ignore 0001 OUT <=10 valid x NAK NAK OUT
ACK_IN_STATUS_OUT
1111 SETUP >10 x x junk Ignore 1111 SETUP <=10 invalid x junk Ignore 1111 SETUP <=10 valid x ACK 1 1 0001 update 1 update data Yes ACK SETUP 1111 IN x x x TX Host Not ACK’d 1111 IN x x x TX 1 1 0001 Yes Host ACK’d 1111 OUT >10 x x Ignore 1111 OUT <=10 invalid x Ignore 1111 OUT <=10, <>2 valid x STALL 0011 Yes Bad Status 1111 OUT 2 valid 0 STALL 0011 Yes Bad Status 1111 OUT 2 valid 1 ACK 1 1 0010 1 1 2 Yes Good Status
STATUS_OUT
0010 SETUP >10 x x junk Ignore 0010 SETUP <=10 invalid x junk Ignore 0010 SETUP <=10 valid x ACK 1 1 0001 update 1 update data Yes ACK SETUP 0010 IN x x x STALL 0011 Yes Stall IN 0010 OUT >10 x x Ignore 0010 OUT <=10 invalid x Ignore 0010 OUT <=10, <>2 valid x STALL 0011 Yes Bad Status 0010 OUT 2 valid 0 STALL 0011 Yes Bad Status 0010 OUT 2 valid 1 ACK 1 1 1 1 2 Yes Good Status
ACK_OUT_STATUS_IN
1011 SETUP >10 x x junk Ignore 1011 SETUP <=10 invalid x junk Ignore 1011 SETUP <=10 valid x ACK 1 1 0001 update 1 update data Yes ACK SETUP 1011 IN x x x TX 0 Host Not ACK’d 1011 IN x x x TX 0 1 1 0011 Yes Host ACK’d
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23.0 Details of Mode for Differing Traffic Conditions (continued)
1011 OUT >10 x x junk Ignore 1011 OUT <=10 invalid x junk Ignore 1011 OUT <=10 valid x ACK 1 1 0001 update 1 update data Yes Good OUT
STATUS_IN
0110 SETUP >10 x x junk Ignore 0110 SETUP <=10 invalid x junk Ignore 0110 SETUP <=10 valid x ACK 1 1 0001 update 1 update data Yes ACK SETUP 0110 IN x x x TX 0 Host Not ACK’d 0110 IN x x x TX 0 1 1 0011 Yes Host ACK’d 0110 OUT >10 x x Ignore 0110 OUT <=10 invalid x Ignore 0110 OUT <=10 valid x STALL 0011 Yes Stall OUT
Data Out Endpoints
SIE Bus Event SIE EP0 Mode Register EP0 Count Register EP0 Interrupt Comments
Mode Token Count Dval D0/1 Response S I O A MODE DTOG DVAL COUNT FIFO
ACK OUT (STALL Bit = 0)
1001 IN x x x Ignore 1001 OUT >MAX x x junk Ignore 1001 OUT <=MAX invalid invalid junk Ignore 1001 OUT <=MAX valid valid ACK 1 1000 update 1 update data Yes ACK OUT
ACK OUT (STALL Bit = 1)
1001 IN x x x Ignore 1001 OUT >MAX x x Ignore 1001 OUT <=MAX invalid invalid Ignore 1001 OUT <=MAX valid valid STALL Stall OU T
NAK OUT
1000 IN x x x Ignore 1000 OUT >MAX x x Ignore 1000 OUT <=MAX invalid invalid Ignore 1000 OUT <=MAX valid valid NAK If Enabled NAK OUT
Data In Endpoints
SIE Bus Event SIE EP0 Mode Register EP0 Count Register EP0 Interrupt Comments
Mode Token Count Dval D0/1 Response S I O A MODE DTOG DVAL COUNT FIFO
ACK IN (STALL Bit = 0)
1101 OUT x x x Ignore 1101 IN x x x Host Not ACK’d 1101 IN x x x TX 1 1100 Yes Host ACK’d
ACK IN (STALL Bit = 1)
1101 OUT x x x Ignore 1101 IN x x x STALL Stall IN
NAK IN
1100 OUT x x x Ignore 1100 IN x x x NAK If Enabled NAK IN
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24.0 Register Summary
Addr Name 7 6 5 4 3 2 1 0 R/W Default
00 P0DATA
01 P1DATA
P0.7 P0.6/TIO1 P0.5/TIO0 P0.4/INT2 P0.3/INT1 P0.2/INT0 P0.1/CLK-
P1.7 P1.6/SMISOP1.5/SMOSIP1.4/SCLK P1.3/SSEL P1.2/VREG P1.1/D– P1.0/D+ bbbbbbbb 00000000
P0.0/CLKINbbbbbbbb 00000000
OUT
02 P2DATA 03 P3DATA 04 P4DATA 05 P00CR Reserved Int
06 P01CR CLK
07–09 P02CR–
0A–0B P05CR–
0C P07CR
0D P10CR Reserved Int
0E P11CR Reserved Int
0F P12CR
10 P13CR Reserved Int
11–13 P14CR–
14 P17CR
15 P2CR
16 P3CR
17 P4CR
20 FRTMRL Free Running Timer [7:0] bbbbbbbb 00000000 21 FRTMRH Free Running Timer [15:8] bbbbbbbb 00000000 22 TCAP0R Capture 0 Rising [7:0] bbbbbbbb 00000000 23 TCAP1R Capture 1 Rising [7:0] bbbbbbbb 00000000 24 TCAP0F Capture 0 Falling [7:0] bbbbbbbb 00000000 25 TCAP1F Capture 1 Falling [7:0] bbbbbbbb 00000000 26 PITMRL Prog Interval Timer [7:0] bb bbb bb b 0 00 000 00 27 PITMRH Reserved Prog Interval Timer [11:8] ----bbbb 00000000 28 PIRL Prog Interval [7:0] bbbbbbbb 00000000 29 PIRH Reserved Prog Interval [11:8] ----bbbb 00000000 2A TMRCR First Edge
2B TCAPINTE Reserved Cap1 Fall
2C TCAPINTS Reserved Cap1 Fall
30 CPUCLKCR Reserved USB CLK
31 ITMRCLKCR TCAPCLK Divider TCAPCLK Select ITMRCLK Divider ITMRCLK Select bbbbbbbb 10001111 32 CLKIOCR Reserved
34 IOSCTR foffset[2:0] Gain[4:0] bbbbbbbb 000ddddd 35 XOSCTR Reserved 36 LPOSCTR 32-KHz
P04CR
P06CR
P16CR
Output
Reserved Reserved Int Act
TIO
Output
Reserved Int
CLK
Output
SPI Use Int
Reserved Int
Reserved Int
Reserved Int
Reserved Int Enable Int Act
Hold
Low
Power
Res P4.3–P4.0 ----bbbb 00000000
Enable
Int
Enable
Int
Enable
Enable
Enable
Enable
Int
Enable
Enable
Enable
Enable
Enable
Enable
8-bit capture Prescale Cap0 16bit
/2 Disable
Reserved 32-KHz Bias Trim [1:0] 32-KHz Freq Trim [3:0] b-bbbbbb dddddddd
P2.7–P2.2 P2.1–P2.0 bbbbbbbb 00000000 P3.7–P3.2 P3.1–P3.0 bbbbbbbb 00000000
Int Act
Low
Int Act
Low
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Int Act
Low
Low
USB CLK
Select
TTL Thresh
TTL Thresh
TTL Thresh Reserved Open Drain Pull-up
TTL Thresh Reserved Open Drain Pull-up
TTL Thresh Reserved Open Drain Pull-up
TTL Thresh Reserved Open Drain Pull-up
3.3V Drive
3.3V Drive
TTL Thresh High Sink Open Drain Pull-up
TTL Thresh High Sink Open Drain Pull-up
TTL Thresh High Sink Open Drain Pull-up
TTL Thresh Reserved Open Drain Pull-up
XOSC Select
High Sink Open Drain Pull-up
High Sink Open Drain Pull-up
Reserved PS/2 Pull-
Reserved Open Drain Reserved Output
High Sink Open Drain Pull-up
High Sink Open Drain Pull-up
Enable
Active
Active
XOSC
Enable
XOSC XGM [2:0] Reserved Mode ---bbb-b 000ddd0d
Cap1 Rise
Active
Cap1 Rise
Active
Reserved CPU
EFTB
Disable
Enable
Enable
Enable
Enable
Enable
up Enable
Enable
Enable
Enable
Enable
Enable
Enable
Enable
Reserved bbbbb--- 00000000
Cap0 Fall
Active
Cap0 Fall
Active
CLKOUT Select ---bbbbb 00000000
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Enable
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Output
Enable
Cap0 Rise
Active
Cap0 Rise
Active
CLK Select
-bbbbbbb 00000000
bbbbbbbb 00000000
--bbbbbb 00000000
bbbbbbbb 00000000
-bbbbbbb 00000000
-bb---bb 00000000
-bb--b-b 00000000
bbbbbbbb 00000000
-bbbbbbb 00000000
bbbbbbbb 00000000
-bbbbbbb 00000000
-bbbbbbb 00000000
-bbbbbbb 00000000
-bbb-bbb 00000000
----bbbb 00000000
----bbbb 00000000
-bb----b 00010000
Document 38-08035 Rev. *E Page 54 of 68
Page 55
CY7C63310 CY7C638xx CY7C639xx
24.0 Register Summary (continued)
Addr Name 7 6 5 4 3 2 1 0 R/W Default
39 OSCLCKCR Reserved Fine Tune
3C SPIDAT A SPIData[7:0] bbbbbbbb 00000000 3D SPICR Swap LSB First Comm Mode CPOL CPHA SCLK Select bbbbbbbb 00000000 40 USBCR USB
41 EP0CNT Data
42 EP1CNT Data
43 EP2CNT Data
44 EP0MODE Setup
45 EP1MODE Stall Reserved NAK Int
46 EP2MODE Stall Reserved NAK Int
50–57 EP0DATA Endpoint 0 Data Buffer [7:0] bbbbbbbb ????????
58–5F EP1DATA Endpoint 1 Data Buffer [7:0] bbbbbbbb ????????
60–67 EP2DATA Endpoint 2 Data Buffer [7:0] bbbbbbbb ????????
73 VREGCR Reserved Keep Alive VREG
74 USBXCR USB Pull-
DA INT_CLR0 GPIO Port 1Sleep
DB INT_CLR1 TCAP0 Prog
DC INT_CLR2 Reserved GPIO Port 4GPIO Port 3GPIO Port 2 PS/2 Data
DE INT_MSK3 ENSWINT Reserved b------- 00000000 DF INT_MSK2 Reserved GPIO Port
E0 INT_MSK1 TCAP0
E1 INT_MSK0 GPIO Port
E2 INT_VC Pending Interrupt [7:0] bbbbbbbb 00000000 E3 RESWDT Reset Watchdog Timer [7:0] wwwwwwww 00000000
-- CPU_A Temporary Register T1 [7:0] -------- 00000000
-- CPU_X X[7:0] -------- 00000000
-- CPU_PCL Program Counter [7:0] -------- 00000000
-- CPU_PCH Program Counter [15:8] -------- 00000000
-- CPU_SP Stack Pointer [7:0] -------- 00000000
- CPU_F Reserved XOI Super Carry Zero Global IE ---brwww 00000010
FF CPU_SCR GIES Reserved WDRS PORS Sleep Reserved Reserved Stop r-ccb--b 00010000 1E0 OSC_CR0 Reserved No Buzz Sleep Timer [1:0] CPU Speed [2:0] --bbbbbb 00000000 1E3 LVDCR Reserved PORLEV[1:0] Reserved VM[2:0] --bb-bbbb 00000000
1EB ECO_TR Sleep Duty Cycle [1:0] Reserved bb------ 00000000
1E4 VLTCMP Reserved LVD PPOR ------rr 00000000
Note: In the R/W column, b = Both Read and Write r = Read Only w = Write Only c = Read/Clear ? = Unknown d = calibration value. Should not change during normal use
Enable
Toggle
Toggle
Toggle
rcv’d
up Enable
Int Enable
1
Int Enable
Data Valid Reserved Byte Count[3:0] bbbbbbbb 00000000
Data Valid Reserved Byte Count[3:0] bbbbbbbb 00000000
Data Valid Reserved Byte Count[3:0] bbbbbbbb 00000000
IN rcvdOUT rcv’dACK’d trans Mode[3:0] ccccbbbb 00000000
Ackd trans Mode[3:0] b-bcbbbb 00000000
Ackd trans Mode[3:0] b-bcbbbb 00000000
INT1 GPIO Port 0SPI
1-ms
USB Active USB Reset USB EP2 USB EP1 USB EP0 bbbbbbbb 00000000
Timer
GPIO Port 2
3
1-ms
USB Active
Timer
INT1
GPIO Port 0
Timer
Interval
Timer
4
Int Enable
Prog
Interval
Timer
Int Enable
Sleep Timer
Int Enable
Enable
Enable
GPIO Port Int Enable
Int Enable
Int Enable
Device Address[6:0] bbbbbbbb 00000000
Reserved USB Force
SPI Transmit INT0 POR/LVD bbbbbbbb 00000000
Low
SPI
INT2 16-bit
INT2
Int Enable
USB EP2
Int Enable
SPI Transmit
Int Enable
Int Enable
Int Enable
Int Enable
Receive
PS/2 Data
Low Int Enable
USB Reset
Int Enable
Receive
Int Enable
Only
Counter
Wrap
16-bit
Counter
Wrap
Int Enable
USB EP1
Int Enable
INT0
Int Enable
USB
Osclock
Disable
Enable
State
TCAP1 -bbbbbbb 00000000
TCAP1
Int Enable
USB EP0
Int Enable
POR/ LVD
Int Enable
------bb 00000000
------bb 00000000
b------b 00000000
-bbbbbbb 00000000
bbbbbbbb 00000000
bbbbbbbb 00000000
Document 38-08035 Rev. *E Page 55 of 68
Page 56
CY7C63310 CY7C638xx CY7C639xx

25.0 Absolute Maximum Ratings

Storage Temperature .................................–65°C to +150°C
Ambient Temperature with Power Applied..... –0°C to +70°C
Supply Voltage on VCC Relative to VSS.........–0.5V to +7.0V
DC Input Volt a ge.................................–0.5V to + V
+ 0.5V
CC
DC Voltage Applied to Outputs in
High-Z State....................................... –0.5V to + V
CC
+ 0.5V
26.0 DC Characteristics
Description
Parameter
V
CC1
V
CC2
V
CC3
T
FP
I
CC1
I
CC2
I
SB1
Low-voltage Detect
V
LVD
3.3V Regulator
I
VREG
I
FA
V
REG1
V
REG2
USB Interface
V
ON
V
OFF
V
DI
V
CM
V
SE
C
IN
I
IO
PS/2 Interface
V
OLP
R
PS2
Notes:
5. Keep-alive mode regulator output voltage min. 2.35V, max 3.80V
Operating V olt age No USB ac t ivity, CPU spe ed < 12 MHz 4.0 5.25 V Operating Voltage USB activity, CPU speed < 12 MHz.
Flash programming Operating Voltage USB activity, CPU speed < 24 MHz 4.75 5.25 V Operating Temp Flash Programming 0 70 °C VCC Operating Supply Current VCC = 5.25V, no GPIO loading,
24 MHz VCC Operating Supply Current VCC = 5.0V, no GPIO loading, 6 MHz 10 mA Standb y Cu rren t Internal and External Osci lla tors ,
Bandgap, Flash, CPU Clock, Timer
Clock, USB Clock all disabled
Low-voltage detect Trip Voltage (8 programmable trip points)
Max Regulator Output Current VCC > 4.35V 125 mA Keep Alive Current
[5]
When regulator is disabled with
keep alive enable V
Output Voltage VCC > 4.35V, 0 < temp < 40°C,
REG
V
Output Voltage VCC > 4.35V, 0 < temp < 40°C,
REG
I
VREG
I
VREG
Static Output High 15K ± 5% Ohm to V Static Output Low RUP is enabled 0.3 V Differential Input Sensitivity 0.2 V Differential Input Common Mode
Range Single Ended Receiver Threshold 0.8 2 V Transceiver Capacitance 20 pF Hi-Z State Data Line Leakage 0V < VIN < 3.3V –10 10 µA
Static Output Low SDATA or SCLK pins 0.4 V Internal PS/2 Pull-up Resistance SDATA, SCLK pins, PS/2 Enabled 3 7 K
Maximum Total Sink Output Current into Port 0
and 1 and Pins.............................................................70 mA
Maximum Total Source Output Current into GPIO Pins30 mA Maximum On-chip Power Dissipation
on any GPIO Pin.........................................................50 mW
Power Dissipation ....................................................300 mW
Static Discharge Voltage .............................................2200V
Latch-up Current ...................................................... 200 mA
Conditions Min. Typical Max. UnitGeneral
4.35 5.25 V
2.681 4.872 V
3.0 3.6 V
< 125 mA (3.3V ± 8%)
3.15 3.45 V
< 25 mA (3.3V ± 4%)
SS
2.8 3.6 V
0.8 2.5 V
40 mA
10 µA
20 µA
Document 38-08035 Rev. *E Page 56 of 68
Page 57
26.0 DC Characteristics (continued)
Description
Parameter
General Purpose I/O Interface
R
UP
V
ICR
V
ICF
V
HC
V
ILTTL
V
IHTTL
V
OL1
V
OL2
V
OL3
V
OH
Pull-up Resistance 4 12 K Input Threshold Voltage Low, CMOS
mode Input Threshold Voltage Low, CMOS
mode Input Hysteresis V oltage , CMOS Mode High to low edge 3% 10% V Input Low Voltage, TTL Mode I/O-pin Supply = 2.9-3.6V 0.8 V Input HIGH Voltage, TTL Mode I/O-pin Supply = 4.0-5.5V 2.0 V Output Low Voltage, High Drive Output Low Voltage, High Drive Output Low Voltage, Low Drive Output Hi gh Voltage
[7]
[7]
27.0 AC Characteristics
Conditions Min. Typical Max. UnitGeneral
Low to High edge 40% 65% V
High to Low edge 30% 55% V
[6]
I
= 50 mA 0.8 V
[6]
OL1
I
= 25 mA 0.4 V
OL1
I
= 8 mA 0.4 V
OL2
IOH = 2 mA VCC –
0.5
CY7C63310 CY7C638xx CY7C639xx
CC
CC
CC
V
Parameter Description Conditions Min. Typical Max. Unit
Clock
T
ECLKDC
T
ECLK1
T
ECLK2
External Clock Duty Cycle 4 5 55 % External Clock Frequency
External Clock Frequency
External clock is the source of the CPUCLK External clock is not th e source of the
0.187 0
24 24
MHz MHz
CPUCLK
USB Driver
T T T T T V
R1 R2 F1 F2 R CRS
Transition Rise Time C Transition Rise Time C Transition Fall Time C Transition Fall Time C Rise/Fall Time Matching 80 125 % Output Signal Crossover Voltage 1.3 2.0 V
= 200 pF 75 ns
LOAD
= 600 pF 300 ns
LOAD
= 200 pF 75 ns
LOAD
= 600 pF 300 ns
LOAD
USB Data Timing
T
DRATE
T
DJR1
T
DJR2
T
DEOP
T
EOPR1
T
EOPR2
T
EOPT
T
UDJ1
T
UDJ2
T
LST
Notes:
6. Available only onCY7C639XX
7. Except for pins P1.0, P1.1 in GPIO mode.
Low-speed Data Rate Ave. Bit Rate (1.5 Mbps ± 1.5%) 1.4775 1.5225 Mbps Receiver Data Jitter Tolerance To next transition –75 75 ns Receiver Data Jitter Tolerance To pair transition –45 45 ns Differential to EOP Transition Skew –40 100 ns EOP Width at Receiver Rejects as EOP 330 ns EOP Width at Receiver Accept as EOP 675 ns Source EOP Width 1.25 1.5 us Differential Driver Jitter To next transition –95 95 ns Differential Driver Jitter To pair transition –95 95 ns Width of SE0 during Diff. Transition 210 ns
P2.7, P3.7, P0.0, P0.1; CY7C638XX P1.3,P1.4,P1.5,P1.6,P1.7.
Document 38-08035 Rev. *E Page 57 of 68
Page 58
CY7C63310 CY7C638xx CY7C639xx
27.0 AC Characteristics (continued)
Parameter Description Conditions Min. Typical Max. Unit
Non-USB Mode Driver Characteristics
T
FPS2
SPI Timing
T
SMCK
T
SSCK
T
SCKH
T
SCKL
T
MDO
T
MDO1
T
MSU
T
MHD
T
SSU
T
SHD
T
SDO
T
SDO1
T
SSS
T
SSH
SDATA/SCK Transition Fall Time 50 300 ns
SPI Master Clock Rate F
/6 2 MHz
CPUCLK
SPI Slave Clock Rate 2.2 MHz SPI Clock High Time High for CPOL = 0, Low for CPOL = 1 125 ns SPI Clock Low Time Low for CPOL = 0, High for CPOL = 1 125 ns Master Data Output Time Master Data Output Time,
[8]
SCK to data valid –25 50 ns Time before leading SCK edge 100 ns
First bit with CPHA = 0 Master Input Data Set-up time 50 ns Master Input Data Hold time 50 ns Slave Input Data Set-up Time 50 ns Slave Input Data Hold Time 50 ns Slave Data Output Time SCK to data valid 100 ns Slave Data Output Time,
Time after SS LOW to data valid 100 ns
First bit with CPHA = 0 Slave Select Set-up Time Before first SCK edge 150 ns Slave Select Hold Time After last SCK edge 150 ns
T
CYC
T
CH
CLOCK
T
CL
Figure 27-1. Clock Timing
90%
T
F
10%
T
D+
V
oh
V
crs
V
ol
D
R
90%
10%
Figure 27-2. USB Data Signal Timing
Note:
8. In Master mode first bit is available 0.5 SPICLK cycle before Master clock edge available on the SCLK pin.
Document 38-08035 Rev. *E Page 58 of 68
Page 59
Differential Data Lines
T
PERIOD
Differential Data Lines
T
PERIOD
T
JR
Consecutive
Transitions
PERIOD
+ T
JR1
N * T
Paired
Transitions
PERIOD
+ T
N * T
Figure 27-3. Receiver Jitter Tolerance
Crossover
Crossover
Point
Point Extended
CY7C63310 CY7C638xx CY7C639xx
T
JR1
JR2
T
JR2
Diff. Data to
N * T
SE0 Skew
+ T
PERIOD
DEOP
Source EOP Width: T Receiver EOP Width: T
EOPT
EOPR1
, T
EOPR2
Figure 27-4. Differential to EOP Transition Skew and EOP Width
T
PERIOD
Crossover
Differential
Points
Data Lines
Consecutive
Transitions
N * T
Figure 27-5. Differential Data Jitter
PERIOD
+ T
xJR1
Transitions
N * T
Paired
PERIOD
+ T
xJR2
Document 38-08035 Rev. *E Page 59 of 68
Page 60
CY7C63310 CY7C638xx CY7C639xx
SS
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
MISO
SS
T
MDO
(SS is under firmware control in SPI Master mode)
T
SCKL
T
SCKH
MSB
MSB LSB
T
T
MSU
MHD
Figure 27-6. SPI Master Timing, CPHA = 1
LSB
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
MISO
T
SSS
T
SDO
T
SCKL
T
SCKH
MSB LSB
T
T
SSU
SHD
MSB
Figure 27-7. SPI Slave Timing, CPHA = 1
LSB
T
SSH
Document 38-08035 Rev. *E Page 60 of 68
Page 61
CY7C63310 CY7C638xx CY7C639xx
SS
SCK (CPOL=0)
SCK (CPOL=1)
T
MOSI
MISO
SS
MDO1
T
MSU
T
MHD
(SS is under firmware control in SPI Master mode)
T
SCKL
T
SCKH
T
MDO
MSB
Figure 27-8. SPI Master Timing, CPHA = 0
LSB
LSBMSB
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
T
SDO1
MISO
T
SSS
T
SSU
T
SHD
T
SCKL
T
SCKH
T
SDO
MSB
Figure 27-9. SPI Slave Timing, CPHA = 0
T
SSH
LSBMSB
LSB
Document 38-08035 Rev. *E Page 61 of 68
Page 62

28.0 Ordering Information

Ordering Code FLASH Size RAM Size Package Type
CY7C63923-PVXC 8K 256 48-SSOP CY7C63913-PXC 8K 256 40-PDIP CY7C63903-PVXC 8K 256 28-SSOP CY7C63923-XWC 8K 256 Die CY7C63823-PXC 8K 256 24-PDIP CY7C63823-SXC 8K 256 24-SOIC CY7C63823-QXC 8K 256 24-QSOP CY7C63813-PXC 8K 256 18-PDIP CY7C63813-SXC 8K 256 18-SOIC CY7C63803-SXC 8K 256 16-SOIC CY7C63801-PXC 4K 256 16-PDIP CY7C63801-SXC 4K 256 16-SOIC CY7C63310-PXC 3K 128 16-PDIP CY7C63310-SXC 3K 128 16-SOIC
29.0 Package Diagrams
CY7C63310 CY7C638xx CY7C639xx
16-Lead (300-Mil) Molded DIP P1
51-85009-*A
Document 38-08035 Rev. *E Page 62 of 68
Page 63
29.0 Package Diagrams (continued)
16 Lead (150 Mil) SOIC
CY7C63310 CY7C638xx CY7C639xx
16-Lead (150-Mil) SOIC S16.15
18
916
0.386[9.804]
0.393[9.982]
0.050[1.270] BSC
0.0138[0.350]
0.0192[0.487]
PIN 1 ID
0.150[3.810]
0.157[3.987]
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.230[5.842]
0.244[6.197]
SEATING PLANE
0.004[0.102]
18-Lead (300-Mil) Molded DIP P3
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
0°~8°
0.016[0.406]
0.035[0.889]
PART #
0.010[0.254]
0.016[0.406]
MAX.
X 45°
0.0075[0.190]
0.0098[0.249]
51-85068-*B
51-85010-*A
Document 38-08035 Rev. *E Page 63 of 68
Page 64
29.0 Package Diagrams (continued)
24 Lead (300 Mil) SOIC - S13
CY7C63310 CY7C638xx CY7C639xx
0.050[1.270] TYP.
18 Lead (300 Mil) SOIC - S3
10 18
0.447[11.353]
0.463[11.760]
0.013[0.330]
0.019[0.482]
18-Lead(300-Mil) Molded SOICS3
PIN 1 ID
19
0.291[7.391]
0.300[7.620]
0.026[0.660]
0.032[0.812]
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
*
0.394[10.007]
0.419[10.642]
SEATING PLANE
*
0.004[0.101]
DIMENSIONS IN INCHES[MM]
REFERENCE JEDEC MO-119
S18.3 STANDARD PKG.
SZ18.3 LEAD FREE PKG.
0.015[0.381]
0.050[1.270]
PART #
MIN. MAX.
0.0091[0.231]
0.0125[0.317]
51-85023-*B
*
0.050[1.270] TYP.
24-Lead (300-Mil) SOIC S13
PIN 1 ID
112
0.291[7.391]
0.300[7.620]
13 24
0.597[15.163]
0.615[15.621]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
0.0118[0.299]
0.092[2.336]
0.105[2.667]
*
0.394[10.007]
0.419[10.642]
*
SEATING PLANE
0.004[0.101]
DIMENSIONS IN INCHES[MM]
REFERENCE JEDEC MO-119
PACKAGE WEIGHT 0.65gms
S24.3 STANDARD PKG.
SZ24.3 LEAD FREE PKG.
0.015[0.381]
0.050[1.270]
PART #
MIN. MAX.
0.0091[0.231]
0.0125[0.317]
51-85025-*B
*
Document 38-08035 Rev. *E Page 64 of 68
Page 65
29.0 Package Diagrams (continued)
CY7C63310 CY7C638xx CY7C639xx
24 Lead (300 Mil) PDIP–P13
SEATING
PLANE
0.004
0.228
0.244
0.053
0.069
0.150
0.157
0.010
0.004
0.033 REF.
0.025 BSC.
0.337
0.344
24-lead QSOP O241
PIN 1 ID
0.008
0.012
112
2413
0.007
0.010
DIMENSIONS IN INCHES MIN.
0.016
0.034
0°-8°
51-85013-*B
MAX.
51-85055-*B
Document 38-08035 Rev. *E Page 65 of 68
Page 66
29.0 Package Diagrams (continued)
28-Lead (5.3 mm) Shrunk Small Outline Package O28
CY7C63310 CY7C638xx CY7C639xx
40-Lead (600-Mil) Molded DIP P17
51-85079-*C
51-85019-*A
Document 38-08035 Rev. *E Page 66 of 68
Page 67
29.0 Package Diagrams (continued)
48-Lead Shrunk Small Outline Package O48
CY7C63310 CY7C638xx CY7C639xx
51-85061-*C
PSoC is a trademark of Cypress MicroSy stem s. enCoRe is a tradema rk of Cy press Semic onduc tor Corpora tion. All product an d company names mentioned in this document are the trademarks of their respective holders.
Document 38-08035 Rev. *E Page 67 of 68
© Cypress Semiconductor Corporation, 2005. The informat i on cont ained her ein i s subject to change with out notice. Cy pr ess Semiconducto r Corporation assum es no respo nsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Page 68
CY7C63310 CY7C638xx CY7C639xx
Document History Page
Document Title: CY7C63310/CY7C638xx/CY7C639xx enCoRe II Low-Speed USB Peripheral Controller Document Number: 38-08035
Rev. ECN No. Issue Da te
** 131323 12/11/03 XGR New data sheet
*A 221881 See ECN KKU Added Register descriptions and pa ck age info rma t io n, c han ged from advanc e
*B 271232 See ECN BON Reformatted
*C 299179 See ECN BON Corrected 24-PDIP pinout typo in Table 5.1 Added Table 10-1.
*D 322053 See ECN TVR
*E 341277 See ECN BHA Corrected VIH TTL value in DC Characteristics table
Orig. of
Change Description of Change
information to preliminary
Updated with the latest information
Updated Table 9-5, Table 10-4, Table 13-1, Table 17-2, Table 17-4, Table 17-6. and Table 15-2. Added various updates to the GPIO Section (Section 14.0). Corrected Table 15-3. Corrected Figure 27-6 and Figure 27-7. Added the 16-pin PDIP package diagram (Section 29.0).
Introduction section: Last para removed Low-voltage reset. There is no LVR there is only LVD (Low voltage detect). explained more about LVD and POR. Changed capture pins from P0.0,P0.1 to P0.5,P0.6. T able 6-1: Change d table heading (Remove d Mnemonics and made as Re gister names). Table 9-5: Included #of rows for different flash sizes Section10-1: Changed CPUCLK selectable options from n=0-5,7,8 to n=0-5,7. Clocks section: C ha nge d ITMRCLK division to 1,2,3,4. updated the sources to ITMRCLK, TCAPCLKs. Ment ioned P17 is T TL enabled permanently. Corrected FRT, PIT data write order. Updated INTCLR,INTMSK registers. in the register table also. DC spec sheet: changed LVR to LVD included max min program­mable trip points based on char data. Updated the 50ma sink pins on 638xx, 639xx. Keep-alive voltage mentioned corresponding to Keep-alive current of
BON
20uA. Included Notes regarding VOL,VOH on P1.0,P1.1 and TMDO spec. AC Spe cs: T
Section 5: Removed the VREG from the CY7C63310 and CY7C63801. Removed SCLK and SDATA. Created a separate pinout diagram for the CY7C63813. Added the GPIO Block Diagram (Figure 14-1.) Table 10-5: Changed the Sleep Timer Clock unit from 32 KHz count to Hz Table 21-1: Added more descriptions to the register
Updated VIL TTL value. Added footnote to pin description table for D+/D- pins. Added Typical Values to Low Voltage Detect table. Corrected Pin label on 16-pin PDIP package. Corrected minor typos
MDO1
, T
In description column changed Phase to 0.
SDO1
Document 38-08035 Rev. *E Page 68 of 68
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