Datasheet CY74FCT16244T, CY74FCT162244T, CY74FCT162H244T Specification

1CY74FCT16444T/2
H244T

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

SCCS028B - December 1987 - Revised September 2001

Features

•I

supports partial-power-down mode operation

off

• Edge-rate control circuitry for significantly improved
noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages

• Industrial temperature range of –40˚C to +85˚C

• V

= 5V ± 10%

CC

CY74FCT16244T Features:

• 64 mA sink current, 32 mA source current

• Typical V
<1.0V at VCC = 5V, TA = 25˚C

CY74FCT162244T Features:

• Balanced output drivers: 24 mA

• Reduced system switching noise

• Typical V
<0.6V at VCC = 5V, TA= 25˚C

CY74FCT162H244T Features:

• Bus hold on data inputs

• Eliminates the need for external pull-up or pull-down
resistors

(ground bounce)

OLP

(ground bounce)

OLP

16-Bit Buffers/Line Drivers

Functional Description

These 16-bit buffers/line drivers are designed for use in
memory driver,clockdriver,or otherbusinterfaceapplications,
where high-speed and low power are required. With
flow-through pinout and small shrink packaging board layout
is simplified. The three-state controls are designed to allow
4-bit, 8-bit or combined 16-bit operation.

This device is fully specified for partial-power-down
applications using I
preventing damaging current backflow through the device
when it is powered down.

The CY74FCT16244T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.

The CY74FCT162244T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for mini­mal undershoot and reduced ground bounce. The
CY74FCT162244T is ideal for driving transmission lines.

TheCY74FCT162H244T isa 24-mAbalanced output part that
has “bus hold” on the data inputs. The device retains the in­put’s last state whenever the input goes to high impedance.
This eliminates the need for pull-up/down resistors and pre­vents floating inputs.

. The I

off

circuitry disables the outputs,

off

Logic Block Diagrams CY74FCT16244T, CY74FCT162244T,
CY74FCT162H244T

OE

1

1A1

1A2

1A3

1A4

2

OE

2A1

2A2

2A3

2A4

1Y1

1Y2

1Y3

1Y4

FCT16244–1 FCT16244–2

2Y1

2Y2

2Y3

2Y4

FCT16244–3

OE

3

3A1

3A2

3A3

3A4

OE

4

4A1

4A2

4A3

4A4

3Y1

3Y2

3Y3

3Y4

4Y1

4Y2

4Y3

4Y4

FCT16244–4

Pin Configuration

SSOP/TSSOP

Top View

16244T
162244T
162H244T

FCT16244–5

48

OE

2

47

1A1

46

1A2

GND

45
44

1A3

43

1A4

V

42

2A1

41

2A2

40

GND

39

2A3

38
37

2A4

36

3A1

35

3A2

34

GND

33

3A3

32

3A4

31

V

30

4A1

29

4A2

GND

28
27

4A3

26

4A4

OE

3

25

OE

1

1Y1
1Y2

GND

1Y3
1Y4

V

2Y1
2Y2

GND

2Y3
2Y4
3Y1
3Y2

GND

3Y3
3Y4

V

4Y1
4Y2

GND

4Y3
4Y4

OE

4

1
2
3
4
5
6

CC

7
8
9
10
11
12

13
14

15
16
17
18

CC

19
20
21
22
23
24

CC

CC

Copyright © 2001, Texas Instruments Incorporated

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

Maximum Ratings

[3,4]

Pin Description

Name Description

OE Three-State Output Enable Inputs (Active LOW)
A Data Inputs

[1]

Y Three-State Outputs

Function Table

[2]

Inputs Outputs

OE A Y

L L L
L H H

H X Z

Notes:

1. On CY74FCT162H244T these pins have “bus hold.”

2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Importance.

3. Operationbeyondthe limitssetforthmay impairtheuseful life ofthedevice. Unlessotherwise noted, these limits areover the operatingfree-air temperature range.

4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V

(Above which the useful life may be impaired. For user
guidelines, not tested.)

Storage Temperature................................. –55°C to +125°C

Ambient Temperature with

Power Applied............................................. –55°C to +125°C

DC Input Voltage ........................................... –0.5V to +7.0V

DC Output Voltage......................................... –0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin) ........................–60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Ordering Range

Range

Industrial – 40°C to +85°C 5V ± 10%

or ground.

CC

Ambient

Temperature V

CC

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.

V

IH

V

IL

V

H

V

IK

I

IH

I

IL

I

BBH

I

BBL

I

BHHO

I

BHLO

I

OZH

I

OZL

I

OS

I

O

I

OFF

Input HIGH Voltage 2.0 V
Input LOW Voltage 0.8 V
Input Hysteresis

[6]

Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V
Input HIGH Current Standard VCC=Max., VI=V

CC

Bus Hold ±100

Input LOW Current Standard VCC=Max., VI=GND ±1 µA

Bus Hold ±100 µA

Bus Hold Sustain Current on Bus Hold Input

[7]

VCC=Min. VI=2.0V –50 µA

VI=0.8V +50

Bus Hold Overdrive Current on Bus Hold Input

High Impedance Output Current
(Three-State Output pins)

High Impedance Output Current
(Three-State Output pins)

Short Circuit Current
Output Drive Current

[8]
[8]

Power-Off Disable VCC=0V, V

[7]

VCC=Max., VI=1.5V TBD mA

VCC=Max., V

VCC=Max., V

VCC=Max., V
VCC=Max., V

=2.7V ±1 µA

OUT

=0.5V ±1 µA

OUT

=GND –80 –140 –200 mA

OUT

=2.5V –50 –180 mA

OUT

[9]

≤4.5V

OUT

[5]

Max. Unit

100 mV

±1 µA

±1 µA

2

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

Output Drive Characteristics for CY74FCT16244T

Parameter Description Test Conditions Min. Typ.

V

OH

Output HIGH Voltage VCC=Min., IOH=–3 mA 2.5 3.5 V

VCC=Min., IOH=–15 mA 2.4 3.5 V
VCC=Min., IOH=–32 mA 2.0 3.0 V

V

OL

Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

Output Drive Characteristics for CY74FCT162244T, CY74FCT162H244T

Parameter Description Test Conditions Min. Typ.

I

ODL

I

ODH

V

OH

V

OL

Notes:

5. Typical values are at V

6. This parameter is specified but not tested.

7. Pins with bus hold are described in Pin Description.

8. Not more than oneoutput should be shorted at a time. Durationof short should not exceed one second. Theuse ofhigh-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
ofa high output mayraisethe chip temperature well abovenormal and therebycause invalidreadings in other parametrictests.Inanysequenceof parameter
tests, I

9. Tested at +25˚C.

Output LOW Current
Output HIGH Current
Output HIGH Voltage VCC=Min., IOH=–24 mA 2.4 3.3 V
Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

=5.0V, TA = +25˚C ambient.

CC

tests should be performed last.

OS

[8]

[8]

VCC=5V, VIN=VIH or VIL, V
VCC=5V, VIN=VIH or VIL, V

=1.5V 60 115 150 mA

OUT

=1.5V –60 –115 –150 mA

OUT

[5]

[5]

Max. Unit

Max. Unit

3

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

Capacitance

[6]

(TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.

C
C

IN
OUT

Input Capacitance VIN = 0V 4.5 6.0 pF
Output Capacitance V

= 0V 5.5 8.0 pF

OUT

Power Supply Characteristics

Parameter Description Test Conditions Typ.

I

CC

∆I

CC

I

CCD

I

C

Notes:

10. Per TTL driven input (V

11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

12. I

C=IQUIESCENT

IC=ICC+∆ICCDHNT+I
I

CC

I

CC

D

H

N

T

I

CCD

f

0

f

1

N

1

All currents are in milliamps and all frequencies are in megahertz.

13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.

Quiescent Power Supply Current VCC=Max. VIN≤0.2V,

Quiescent Power Supply Current

VCC=Max. VIN=3.4V

(TTL inputs HIGH)
Dynamic Power Supply

Current

[11]

Total Power Supply Current

VCC=Max.,One InputToggling,
50% Duty Cycle, Outputs
Open,

OE=GND

[12]

VCC=Max., f1=10 MHz,
50% Duty Cycle, Outputs
Open, One Bit Toggling,
OE=GND

VCC=Max., f1=2.5 MHz, 50%
DutyCycle, Outputs Open,Six­teen Bits Toggling,
OE=GND

= 3.4V); all other inputs at VCC or GND.

IN

+ I

= Quiescent Current with CMOS input levels
= Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
= Number of TTL inputs at D
= Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
= Input signal frequency
= Number of inputs changing at f

INPUTS

+ I

DYNAMIC

CCD(f0

/2 + f1N1)

H

1

V

IN≤VCC

-0.2V

[10]

VIN=VCC or
V

=GND

IN

VIN=VCC or
V

=GND

IN

VIN=3.4V or
V

=GND

IN

VIN=VCC or
V

=GND

IN

VIN=3.4V or
V

=GND

IN

[5]

Max. Unit

[5]

Max. Unit

5 500 µA

0.5 1.5 mA

60 100 µA/MHz

0.6 1.5 mA

0.9 2.3 mA

2.4 4.5

6.4 16.5

[13]

[13]

mA

mA

4

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

SSwitching Characteristics Over the Operating Range

[14]

CY74FCT16244AT

CY74FCT16244T

CY74FCT162244T

Parameter Description

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

t

SK(O)

Propagation Delay Data to Output 1.5 6.5 1.5 4.8 ns 1, 3

Output Enable Time 1.5 8.0 1.5 6.2 ns 1, 7, 8

Output Disable Time 1.5 7.0 1.5 5.6 ns 1, 7, 8

Output Skew

[16]

Min. Max. Min. Max. Unit Fig. No.

Switching Characteristics Over the Operating Range

[14]

(continued)

0.5 0.5 ns —

CY74FCT162244AT

CY74FCT162H244AT

CY74FCT16244CT

CY74FCT162244CT

CY74FCT162H244CT

Parameter Description

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

t

SK(O)

Notes:

14. Minimum limits are specified but not tested on Propagation Delays.

15. See “Parameter Measurement Information” in the General Information section.

16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

Propagation Delay Data to Output 1.5 4.1 ns 1, 3

Output Enable Time 1.5 5.8 ns 1, 7, 8

Output Disable Time 1.5 5.2 ns 1, 7, 8

Output Skew

[16]

Min. Max. Unit Fig. No.

0.5 ns —

[15]

[15]

5

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

Ordering Information CY74FCT16244

Speed

(ns) Ordering Code

4.1 CY74FCT16244CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16244CTPVC/PVCT O48 48-Lead (300-Mil) SSOP

4.8 CY74FCT16244ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16244ATPVC/PVCT O48 48-Lead (300-Mil) SSOP

6.5 CY74FCT16244TPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16244TPVC/PVCT O48 48-Lead (300-Mil) SSOP

Ordering Information CY74FCT162244

Speed

(ns) Ordering Code

4.1 74FCT162244CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162244CTPVC O48 48-Lead (300-Mil) SSOP
74FCT162244CTPVCT O48 48-Lead (300-Mil) SSOP

4.8 74FCT162244ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162244ATPVC O48 48-Lead (300-Mil) SSOP
74FCT162244ATPVCT O48 48-Lead (300-Mil) SSOP

6.5 CY74FCT162244TPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162244TPVC/PVCT O48 48-Lead (300-Mil) SSOP

Package

Name Package Type

Package

Name Package Type

Operating

Range

Operating

Range

Ordering Information CY74FCT162H244

Speed

(ns) Ordering Code

4.1 74FCT162H244CTPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial

4.8 74FCT162H244ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial

Document #: 38-00396-C

Package

Name Package Type

Operating

Range

6

Package Diagrams

CY74FCT16244T

CY74FCT162244T

CY74FCT162H244T

48-Lead Shrunk Small Outline Package O48

48-Lead Thin Shrunk SmallOutline Package

Z48

7

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device

74FCT162244ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT162244ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

74FCT162244ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

74FCT162244CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT162244CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

74FCT162244CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

74FCT162244ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI
74FCT162244ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI

74FCT162244TPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT162244TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT162244TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

74FCT162244TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

74FCT16244ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT16244ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT16244ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

74FCT16244ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

74FCT16244CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

74FCT16244CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

& no Sb/Br)

(2)

Lead/

Ball Finish

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

MSL Peak Temp

20-Aug-2011

(3)

Samples

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Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

74FCT16244CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

(2)

Lead/

Ball Finish

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT16244TPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT16244TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT16244TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT16244TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT162H244ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT162H244CTPVC ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT162H244CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

74FCT162H244ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI

74FCT162H244ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI

74FCT162H244ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI
74FCT162H244ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI
CY74FCT162244ATPVC ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

CY74FCT162244CTPVC ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)
CY74FCT162244ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI
CY74FCT162244ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI
CY74FCT162244TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

CY74FCT162244TPVC ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)
CY74FCT162244TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)
CY74FCT16244ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

MSL Peak Temp

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(3)

Samples

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Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

CY74FCT16244ATPVC ACTIVE SSOP DL 48 25 Green (RoHS

(2)

Lead/

Ball Finish

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)
CY74FCT16244ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)
CY74FCT16244CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

CY74FCT16244CTPVC ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

CY74FCT16244ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI

CY74FCT16244ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI

CY74FCT16244ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI

CY74FCT16244ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI

CY74FCT16244TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

CY74FCT16244TPVC ACTIVE SSOP DL 48 25 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

CY74FCT16244TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162244ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162244ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162244ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162244CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162244CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162244CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)
FCT162H244ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

FCT162H244ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

CU NIPDAU Level-1-260C-UNLIM

& no Sb/Br)

MSL Peak Temp

20-Aug-2011

(3)

Samples

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Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

FCT162H244CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

FCT162H244CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

& no Sb/Br)

& no Sb/Br)

(2)

Lead/

Ball Finish

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

MSL Peak Temp

(3)

(Requires Login)

20-Aug-2011

Samples

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Jul-2011

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

74FCT162244ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162244ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
74FCT162244CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162244CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

74FCT162H244ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

74FCT162H244CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

CY74FCT162244TPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

CY74FCT162244TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT16244ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16244ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT16244CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

CY74FCT16244TPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16244TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Quadrant

Pin1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Jul-2011

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74FCT162244ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0
74FCT162244ATPVCT SSOP DL 48 1000 346.0 346.0 49.0
74FCT162244CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0

74FCT162244CTPVCT SSOP DL 48 1000 346.0 346.0 49.0
74FCT162H244ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0
74FCT162H244CTPVCT SSOP DL 48 1000 346.0 346.0 49.0
CY74FCT162244TPACT TSSOP DGG 48 2000 346.0 346.0 41.0
CY74FCT162244TPVCT SSOP DL 48 1000 346.0 346.0 49.0

CY74FCT16244ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0
CY74FCT16244ATPVCT SSOP DL 48 1000 346.0 346.0 49.0

CY74FCT16244CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0

CY74FCT16244TPACT TSSOP DGG 48 2000 346.0 346.0 41.0

CY74FCT16244TPVCT SSOP DL 48 1000 346.0 346.0 49.0

Pack Materials-Page 2

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

48 PINS SHOWN

0.025 (0,635)

48

1

0.110 (2,79) MAX

0.0135 (0,343)

0.008 (0,203)
25

0.299 (7,59)

0.291 (7,39)

24

A

0.008 (0,20) MIN

0.005 (0,13)

0.420 (10,67)

0.395 (10,03)

Seating Plane

0.004 (0,10)

M

0.010 (0,25)

0.005 (0,13)

Gage Plane

0.010 (0,25)

0°–ā8°

0.040 (1,02)

0.020 (0,51)

PINS **

DIM

A MAX

A MIN

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118

0.380

(9,65)

0.370

(9,40)

4828

0.630

(16,00)

0.620

(15,75)

56

0.730

(18,54)

0.720

(18,29)

4040048/E 12/01

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998

DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

48 PINS SHOWN

0,50

48

1

1,20 MAX

0,27
0,17

25

24

A

0,15
0,05

0,08

M

6,20

8,30

6,00

7,90

Seating Plane

0,10

0,15 NOM

Gage Plane

0,25

0°–8°

0,75
0,50

DIM

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153

PINS **

A MAX

A MIN

48

12,60

12,40

56

14,10

13,90

64

17,10

16,90

4040078/F 12/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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