over 70% when deselected. The CY6264 is packaged in a
450-mil (300-mil body) SOIC.
• 55, 70 ns access times
• CMOS for optimum speed/power
• Easy memory expansion with CE
tures
, CE2, and OE fea-
1
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
Functional Description
An active LOW write enable signal (WE
ing/reading operation of the memory. When CE
puts are both LOW and CE
input/output pins (I/O
location addressed by the address present on the address
pins (A
selecting the device and enabling the outputs, CE
through A12). Reading the device is accomplished by
0
0
is HIGH, data on the eight data
2
through I/O7) is written into the memory
active LOW, CE2 active HIGH, whil e WE remains inacti ve or
) controls the writ-
HIGH. Under these conditions, the contents of the location adThe CY6264 is a high-performance CMOS static RAM organized as 8192 words by 8 bits. Easy memory expansion is
provided by an active LOW chip enable (CE
chip enable (CE
three-state drivers. Both devices have an automatic power-down feature (CE
), and active LOW output enable (OE) and
2
), reducing the power consumption by
1
), an active HIGH
1
dressed by the information on address pins is present on the
eight data input/output pins.
The input/output pins remain in a high-impedance state unle ss
the chip is selected, outputs are enabled, and write enable
(WE
) is HIGH. A die coat is used to insure alpha immunity.
Logic Block DiagramPin Configuration
SOIC
Top View
NC
1
A
4
2
A
5
3
A
6
A
A
A
I/O
I/O
I/O
GND
4
A
7
5
A
8
6
A
9
7
10
8
11
9
12
10
0
11
1
12
2
13
14
I/O
0
INPUT BUFFER
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
256 x 32 x 8
ARRAY
I/O
I/O
I/O
I/O
I/O
1
2
3
4
5
V
28
WE
27
CE
26
A
25
A
24
A
23
OE
22
A
21
CE
20
I/O
19
I/O
18
I/O
17
I/O
16
I/O
15
and WE in-
1
and OE
1
CC
2
3
2
1
0
1
7
6
5
4
3
CY6264-2
I/O
6
CE
CE
WE
OE
1
2
COLUMN DECODER
POWER
DOWN
I/O
CY6264-1
7
Selection G uide
CY6264-55CY6264-70
Maximum Access Time (ns)5570
Maximum Operating Current (mA)100100
Maximum Standby Current (mA)20/1520/15
Shaded area contains advanced information.
Cypress Semiconductor Corporation•3901 North First Street•San Jose•CA 95134•408-943-2600
October 1994 – Revised June 1996
Page 2
PRELIMINARY
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature . ................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage to Ground Potential...............–0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State
DC Input Voltage
Electrical CharacteristicsOver the Operating Range
ParameterDescri pti onTest Conditions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
OS
I
CC
I
SB1
I
SB2
Shaded ar ea con tai ns adv a nced informat ion.
[1]
............................................–0.5V to +7.0V
[1]
.........................................–0.5V to +7.0V
Output HIGH VoltageVCC = Min., IOH = –4.0 mA2.42.4V
Output LOW VoltageVCC = Min., IOL = 8.0 mA0.40.4V
Input HIGH Voltage2.2V
Input LOW Voltage
Input Load CurrentGND < VI < V
Output Leakage
Current
Output Short
Circuit Current
VCC Operating
Supply Current
Automatic CE
Power–Down Current
Automatic CE
Power–Down Current
[1]
CC
GND < VI < VCC,
Output Disabled
[2]
1
1
VCC = Max.,
V
= GND
OUT
V
= Max.,
CC
I
= 0 mA
OUT
Max. VCC, CE1 > V
Min. Duty Cy cle=100%
IH,
Max. VCC, CE1 > VCC – 0.3V,
V
> VCC – 0.3V or VIN < 0.3 V
IN
CY6264
Output Current into Outputs (LOW)............................. 20 mA
Latch-Up Current.................................................... >200 mA
Operating Range
Range
Commercial
6264-556264-70
–0.50.8–0.50.8V
–5+5–5+5µA
–5+5–5+5µA
Ambient
TemperatureV
CC
0°C to +70°C 5V ± 10%
UnitMin.Max.Min.Max.
CC
2.2V
CC
V
–300–300mA
100100mA
2020mA
1515mA
Capacitance
[3]
ParameterDesc rip tionTest ConditionsMax.Unit
C
IN
C
OUT
Notes:
1. Minimum voltage is equal to -3.0V for pulse durations less than 30 ns.
2. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
3. Tested initially and after any design or process changes that may affect these parameters.
Input CapacitanceTA = 25°C, f = 1 MHz,
V
= 5.0V
Output Capacitance7pF
CC
AC Test Loads and Waveforms
R1 481
5V
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Equivalent to:T HÉVENIN EQUIV ALENT
OUTPUT1.73V
Ω
R2
255Ω
(a)(b)
167Ω
5V
OUTPUT
INCLUDING
JIG AND
SCOPE
5
pF
R1 481Ω
R2
255Ω
CY6264-3
2
3.0V
GND
<
10%
5ns
7pF
ALL INPUT PULSES
90%
90%
10%
<
CY6264-4
5ns
Page 3
PRELIMINARY
Switching Characteristics Over the Operating Range
[4]
CY6264
6264-556264-70
ParameterDescripti on
UnitMin.Max.Min.Max.
READ CYCLE
t
RC
t
AA
t
OHA
t
ACE1
t
ACE2
t
DOE
t
LZOE
t
HZOE
t
LZCE1
t
LZCE2
t
HZCE
t
PU
t
PD
WRITE CYCLE
t
WC
t
SCE1
t
SCE2
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
HZWE
t
LZWE
Shaded area contains advanced information.
Notes:
4. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V , and output loading of the specified
I
and 30-pF load capacitance.
OL/IOH
5. t
HZOE, tHZCE
6. At any given temperature and voltage condition, t
7. The internal write time of the memory is defined by the overlap of CE
signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
Read Cycle Time5570ns
Address to Data Valid5570ns
Data Hold from Address Change55ns
CE1 LOW to Data Valid5570ns
CE2 HIGH to Data Valid4070ns
OE LOW to Data Valid2535ns
OE LOW to Low Z35ns
OE HIGH to High Z
CE1 LOW to Low Z
[5]
[6]
55ns
2030ns
CE2 HIGH to Low Z35ns
CE1 HIGH to High Z
[5, 6]
2030ns
CE2 LOW to High Z
CE1 LOW to Power-Up00ns
CE1 HIGH to Power-Down2530ns
[7]
Write Cycle Time5070ns
CE1 LOW to Write End4060ns
CE2 HIGH to Write End3050ns
Address Set-Up to Write End4055ns
Address Hold from Write End00ns
Address Set-Up to Write Start00ns
WE Pulse Width2540ns
Data Set-Up to Write End2535ns
Data Hold from Write End00ns
WE LOW to High Z
[5]
2030ns
WE HIGH to Low Z55ns
, and t
are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
HZWE
is less than t
HZCE
for any given device.
LZCE
LOW , CE2 HIGH, and WE LOW. Both signals must be LOW to initiate a write and either
1
3
Page 4
Switching Waveforms
Read Cycle No.1
ADDRESS
DATA OUTPREVIOUS DATA VALID
Read Cycle No. 2
CE
CE
OE
OE
DATA OUT
V
CC
SUPPLY
CURRENT
[8, 9]
[10, 11]
1
2
t
ACE
t
LZOE
HIGH IMPEDANCE
t
LZCE
t
PU
PRELIMINARY
t
t
OHA
t
50%
DOE
AA
t
RC
CY6264
t
RC
DATA VALID
CY6264-5
t
HZO E
t
DATA VALID
HZCE
t
PD
50%
HIGH
IMPEDANCE
CY6264-6
ICC
ISB
Write Cycle No.1 (WE Controlled)
[9, 11]
ADDRESS
CE
1
CE
2
OE
t
WE
SA
DATA IN
DATA I/O
Notes:
8. Device is continuously selected. OE
9. Address valid prior to or coincident with CE transition LOW.
10. WE is HIGH for read cycle.
11. Data I/O is High Z if OE = VIH, CE1 = VIH, or WE = VIL.
DATA UNDEFINED
, CE = VIL. CE2 = V
IH.
t
t
SCE2
t
SCE1
AW
t
WC
t
HZWE
t
PWE
t
SD
DATAINVALID
t
HA
t
LZWE
HIGH IMPEDANCE
t
HD
CY6264-7
4
Page 5
PRELIMINARY
Switching Waveforms (continued)
Write Cycle No. 2 (CE Cont rolled)
ADDRESS
CE
1
CE
2
WE
DATA IN
DATA I/O
Note:
12. If CE
goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.