Datasheet CY29FCT52CTSOCT, CY29FCT52CTSOC, CY29FCT52CTQCT, CY29FCT52CTQC Datasheet (Texas Instruments)

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Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
CY29FCT52T
SCCS010 - May 1994 - Revised February 2000
Function, pinout, and drive compatible with FCT,
F Logic and AM2952
FCT-C speed at 6.3 ns max. (Com’l)
Reduced V
FCT functions
(typically = 3.3V) versions of equivalent
OH
Edge-rate control circuitry for significantly improved
noise characteristics
ESD > 2000V
Power-off disable feature
Matched rise and fall times
Logic Block Diagram
CPA
CEA
OEA
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
D D D D D D
D D
Q Q Q Q Q Q Q Q
0 1 2 3 4 5
6 7
0 1 2 3 4 5 6 7
CE CP
CE CP
Q
0
Q
1
Q
2
Q
3
Q
4
Q
5
Q
6
Q
7
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
8-Bit Registered Transceive
Fully compatible with TTL input and output logic levels
Sink Current 64 mA (Com’l)
Source Current 32 mA (Com’l)
Functional Description
The CY29FCT52T has two 8-bit back-to-back registers that store data flowing in both directions between two bidirectional buses. Separate clock, clock enable, and three-state output enable signals are provided for each register. Both A outputs and B outputs are specified to sink 64 mA.
The outputs are designed with a power-off disable feature to allow for live insertion of boards.
Pin Configurations
OEB B
0
B
1
B
2
B
3
B
4
B
5
B
6
B
7
CPB CEB
OEB
CPA
CEA
GND
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
SOIC/QSOP
Top View
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15
14 13
V
CC
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
OEA CPB
CEB
]
Function Table
[1]
Inputs
Internal Q FunctionD CP CE
X X H NC Hold Data L
H
Note:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care
L L
L
Load Data
H
Output Control
OE Internal Q Y-Outputs Function
H X Z Disable Outputs
L L
L
H
L
Enable Outputs
H
Copyright © 2000, Texas Instruments Incorporated
Page 2
CY29FCT52T
Pin Description
Name Description
A A register inputs or B register outputs. B B register inputs or A register outputs. CPA Clockforthe A register.When CEA is LOW,data is entered into the A register on the LOW-to-HIGHtransition of the
CEA ClockEnable fortheAregister.When CEAisLOW,data is entered into theAregisteron the LOW-to-HIGHtransition
OEA OutputEnable for the A register.When OEAis LOW,theAregisteroutputsare enabledontotheB lines.WhenOEA
CPB Clockforthe B register.When CEB is LOW,data is entered into the B register on the LOW-to-HIGHtransition of the
CEB ClockEnable fortheBregister.When CEBisLOW,data is entered into theBregisteron the LOW-to-HIGHtransition
OEB OutputEnable for the B register.When OEBis LOW,theBregisteroutputsare enabledontotheA lines.WhenOEB
CPA signal.
of the CPA signal. When
CEA is HIGH, the A register holds its contents regardless of CPA signal transitions.
is HIGH, the A outputs are in the high impedance state.
CPB signal.
of the CPB signal. When
CEB is HIGH, the B register holds its contents regardless of CPA signal transitions.
is HIGH, the B outputs are in the high impedance state.
Maximum Ratings
[2, 3]
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
DC Output Current (Maximum Sink Current/Pin) ......120 mA
Power Dissipation..........................................................0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Operating Range
Power Applied.............................................–65°C to +135°C
Supply Voltage to Ground Potential...............–0.5V to +7.0V
DC Input Voltage............................................–0.5V to +7.0V
Range Range
Commercial All –40°C to +85°C 5V ± 5%
DC Output Voltage.........................................–0.5V to +7.0V
Notes:
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
4. TA is the “instant on” case temperature.
or ground.
CC
Ambient
Temperature V
CC
2
Page 3
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
V
V V V V V I
I
I
IH
I
IL
I
OS
I
OFF
OH
OL IH IL H IK
Output HIGH Voltage VCC=Min., IOH=–32 mA Com’l 2.0 V
VCC=Min., IOH=–15 mA Com’l 2.4 3.3 V Output LOW Voltage VCC=Min., IOL=64 mA Com’l 0.3 0.55 V Input HIGH Voltage 2.0 V Input LOW Voltage 0.8 V Hysteresis
[6]
All inputs 0.2 V Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V Input HIGH Current VCC=Max., VIN=V
CC
Input HIGH Current VCC=Max., VIN=2.7V ±1 µA Input LOW Current VCC=Max., VIN=0.5V ±1 µA Output Short Circuit Current Power-Off Disable VCC=0V, V
[7]
VCC=Max., V
=0.0V –60 –120 –225 mA
OUT
=4.5V ±1 µA
OUT
CY29FCT52T
[5]
Max. Unit
5 µA
Capacitance
Parameter Description Typ.
C
IN
C
OUT
Notes:
5. Typical values are at V
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatusand/or sample and hold techniques are preferablein order to minimize internal chipheating and more accurately reflect operational values. Otherwise prolonged shortingof a high output may raise the chip temperature well abovenormal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, I
[6]
Input Capacitance 5 10 pF Output Capacitance 9 12 pF
=5.0V, TA=+25˚C ambient.
CC
tests should be performed last.
OS
[5]
Max. Unit
3
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Power Supply Characteristics
Parameter Description Test Conditions Typ.
I
CC
I
CC
I
CCD
I
C
Notes:
8. Per TTL driven input (V
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. I
C
IC=ICC+ICCDHNT+I I
CC
I D N I
CCD
f
0
f
1
N All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
Quiescent Power Supply Current VCC=Max., VIN< 0.2V, VIN> VCC–0.2V 0.1 0.2 mA Quiescent Power Supply Current
VCC=Max., VIN=3.4V, f1=0, Outputs Open
[8]
(TTL inputs HIGH)
[10]
[9]
VCC=Max.,OneInputToggling,50%DutyCycle, Outputs Open, V
< 0.2V or VIN> VCC–0.2V
IN
OEA or OEB=GND,
VCC=Max., f0=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling at f OEA or OEB=GND, V
< 0.2V or VIN> VCC–0.2V
IN
=5 MHz,
1
Dynamic Power Supply Current
Total Power Supply Current
VCC=Max., 50% Duty Cycle, Outputs Open, f
=10 MHz, One Bit Toggling at f1=5 MHz,
0
OEA or OEB=GND, VIN=3.4V or VIN=GND VCC=Max., 50% Duty Cycle, Outputs Open,
f
=10 MHz, Eight Bits Toggling at f1=2.5 MHz,
0
OEA or OEB=GND, V
< 0.2V or VIN> VCC–0.2V
IN
VCC=Max., 50% Duty Cycle, Outputs Open, f
=10 MHz, Eight Bits Toggling at f1=2.5 MHz,
0
OEA or OEB=GND, VIN=3.4V or VIN=GND
=3.4V); all other inputs at VCC or GND.
IN
=I
QUIESCENT
= Quiescent Current with CMOS input levels = Power Supply Current for a TTL HIGH input (VIN=3.4V)
CC
= Duty Cycle for TTL inputs HIGH
H
= Number of TTL inputs at D
T
= Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero = Input signal frequency = Number of inputs changing at f
1
+ I
INPUTS
CCD(f0
+ I
DYNAMIC
/2 + f1N1)
H
1
CY29FCT52T
[5]
Max. Unit
0.5 2.0 mA
0.06 0.12 mA/MHz
0.7 1.4 mA
1.2 3.4 mA
1.6 3.2
3.9 12.2
[11]
[11]
mA
mA
4
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CY29FCT52T
Switching Characteristics Over the Operating Range
Parameter Description
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
S
t
H
t
S
t
H
t
W
Propagation Delay CPA, CPB to A, B
Output Enable Time OEA or OEB to A or B 1.5 7.0 ns 1, 7, 8
Output Disable Time OEA or OEB to A or B
Set-Up Time HIGH or LOW, A, B to CPA, CPB
Hold Time HIGH or LOW, A, B to CPA, CPB
Set-Up Time HIGH or LOW, CEA, CEB to CPA, CPB
Hold Time HIGH or LOW, CEA, CEB to CPA, CPB
Pulse Width,
[6]
HIGH or LOW, CPA or CPB
[12]
29FCT52CT
Commercial
Min. Max.
Unit Fig. No.
2.0 6.3 ns 1, 5
1.5 6.5 ns 1, 7, 8
2.5 ns 4
1.5 ns 4
3.0 ns 4
2.0 ns 4
ns 5
[13]
Ordering Information
Speed
(ns) Ordering Code
6.3 CY29FCT52CTQCT Q13 24-Lead (150-Mil) QSOP Commercial CY29FCT52CTSOC/SOCT S13 24-Lead (300-Mil) Molded SOIC
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
Document #: 38-00262-B
Package
Name Package Type
Operating
Range
5
Page 6
Package Diagrams
CY29FCT52T
24-Lead Quarter Size Outline Q13
24-Lead (300-Mil) Molded SOIC
S13
6
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Copyright 2000, Texas Instruments Incorporated
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