Datasheet CY25901 Datasheet (CYPRESS)

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CY25901
Spread Spectrum Clock Generator
Features
• Supports clock requirements for Spread Spectrum
• 40-MHz Spread Spectrum clock output
• Two spread bandwidths: 1% , 3%
• External clock or Cera-Lock input
• 3.3V operation
• 8-pin SOIC package
Ta ble 1. Function Table
SSSEL SSON REFOUT
00XIN= XIN ± 0.35% (0.7% center) = XIN ± 0.5% (1.0% center) 1 0 XIN = XIN ± 1.20% (2.4% center) = XIN ± 1.5% (3.0% center)
X (dont care) 1 XIN = XIN (No Spread) = XIN (No Spread)
Block Diagram
XIN
Oscillator
XOUT
REFOUT
Description
The CY25901 clock generator provi des a low-elec tromagnetic interference (EMI) clock output. It features Spread Spectrum technology, a modulation technique designed specifically for reducing EMI at the fund amental frequency and it s harmonics.
CLKOUT (Spread Spectrum)
CY25901SC CY25901SC-1
Pin Configuration
CLKOUT
VDD
VSS
XIN
1 2 3 4
8 7 6 5
SSON# REFOUT SSSEL XOUT
SSON
SSSEL
Cypress Semiconductor Corporation 3901 North First Street San Jose, CA 95134 408-943-2600 Document #: 38-07521 Rev. ** Revised February 18, 2003
PLL
CLKOUT
SSCG
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CY25901
Pin Description
Pin No. Name I/O Description
1CLKOUTOSpread Spectrum Clock Output. See Table 1 for frequency selections. 2VDD PWRPower Supply. 3 VSS PWR Common Ground. 4XIN IOscillator Buffer Input. Connect to an external parallel resona nt crystal or externally ge nerated
5XOUT OOscill ator Buffer Output. Connect to an external p arallel resonant cryst al. Do not connect when
6 SSSEL I Spread Spectrum Select Input. See Table 1. internally pulled up. 7REFOUTOBuffered Output of XIN. 8 SSON# I Spread Spectrum Enable Input. When asserted low, Spread Spectrum is enabled.
reference clock.
an externally generated reference clock is applied at XIN.
Internally pulled down.
Spread Spectrum Clock Generator
Spread Spectrum Clock Generator (SSCG) is a frequency modulation techniqu e used to reduce EMI radiatio n generated by repetitive digital signals, mainly cl ocks. A clock radiates EM energy at its fundamental frequency as well as its harmonics. Spread Spectrum distributes this energy over a small frequency bandwidth, and decreasing the peak value of
Figure 1. Modulation Frequency Profile
0
-10
-20
-30
-40
dBm
-50
-60
-70
-80 38 38 39 39 40 41 41 42 43
Frequ ency( MHz)
radiated energy over the spectrum . This technique is achieved by modulating the clock around or below the center of its reference frequency by a certain percentage (which also determine s the energy distribution bandwidth).
The SSCG function is enabled when SSON pin is set to low. Resulting in a spread ban dwidth tha t is center spread, amount as selected by SSSEL (see Table 1).
Spread S pec t rum
SS-ON SS-OFF
Figure 2. Spread Spectrum
Document #: 38-07521 Rev. ** Page 2 of 5
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CY25901
Absolute Maximum Ratings
Parameter Description Condition Min. Max. Unit
V
DD
V
IN
T
S
T
A
T
J
ESD
HBM
UL–94 Flammability Rating @1/8 in. V–0 MSL Moisture Sensitivity Level 1
DC Specifications
Parameter Description Condition Min. Typ. Max. Unit
V
DD
V
IL
V
IH
VthXIN XIN Threshold Voltage XIN 0.3*VDDC 0.5*VDDC 0.7*VDDC V I
DD
I
IL
I
IH
V
OL
V
OH
C
IN
C
X
PU/PD Pull-up/Pull-down Resist anc e
Core Supply Voltage –0.5 4.6 V Input Voltage Relative to V
SS
–0.5 VDD+0.5 VDC Temperature, Storage Non Functional –65 150 °C Temperature, Operating Ambient Functional –10 85 °C Temperature, Junction Functional 150 °C ESD Protection (Human Body Model) MIL-STD-883, Method 3015 2000 V
Operating Voltage 3.3V @ ±10% 2.97 3.3 3.63 V Input Low Voltage Input High Voltage
Dynamic Supply Current V
[1]
[1]
SSON# and SSSEL ––0.8 V Inputs 2.2 ––V
= 3.3V and CL = 0 20 25 mA
DD
Input Low Current SSSEL = VSS –55 –30 µA Input High Current SSON = V Output Low Voltage I Output High Voltage I
= 4.0 mA ––0.4 V
OL
= –4.0 mA 2.4 ––V
OH
DD
30 55 µA
Input Capacitance SSON# and SSSEL Inputs 510pF XIN, XOUT Capacitance
[2]
XIN and XOUT 5 pF
[1]
SSON# and SSSEL Inputs 50 100 200 k
AC Specifications
[3]
Parameter Description Condition Min. Typ. Max. Unit
F
IR
E
RXIN
T
DCXIN
T
R
T
F
Input Frequency Range 36 40 44 MHz XIN Edge Rate XIN driven by external clock 1 V/nS XIN Duty Cycle XIN driven by external clock 40 50 60 %
[4]
[4]
REFOUT, CLKOUT ––3ns REFOUT, CLKOUT ––3ns
Outputs Rise Time
Outputs Fall Time BW%1 CY25901SC, Spread % SSON=0,SSSEL = 0 0.5 0.7 0.9 % BW%2 CY25901SC, Spread % SSON=0,SSSEL = 1 1.7 2.4 3.1 % BW%3 CY25901SC–1, Spread % SSON=0,SSSEL = 0 0.7 1 1.3 % BW%4 CY25901SC–1, Spread % SSON=0,SSSEL = 1 2.1 3 3.9 %
[5]
[5]
All output clocks ––3ms CL = 15pF 45 50 55 %
[5]
CL = 15pF 110 200 ps
[5]
CL = 15pF 110 200 ps
T T T T
PU DC CCJ CCJ
Power up to Stable Output
CLKOUT Duty Cycle
REFOUT Cycle to Cycle jitter
CLKOUT Cycle to Cycle jitter Fmod Frequency Modulation Rate SSON# = GND Internally pulled down 31 kHz
Notes:
1. SSSEL has internal pull-up and SSON has pull-down resistors.
2. In applications if a crystal is used for the input reference clock, refer to crystal manufacturers specifications for the required crystal load capacitor value.
3. Parameters are guaranteed by design and characterization. Not 100% tested in production. All parameters specified with fully loaded outputs. All outputs loaded with 15 pF.
4. Measured between 0.2*VDD and 0.8*VDD Volts.
5. Triggering is done at 1.5V VDDC.
Document #: 38-07521 Rev. ** Page 3 of 5
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Application Schematic
CY25901
0.1µF
R1
CLKOUT
1
VDD
2
VSS
3
XIN XOUT
4
CL1 CL2
REFOUT
XTAL
SSON#
SSSEL
8
R2
7
6
5
CLKOUT
VDD(3.3V) REFOUT
Figure 3. Application Schematic
Use crystal or cera-lock filter manufacturers recommended values for CL1 and CL2 load capacitors. 0.1-µF bypass capacitor for power pins should always be used and placed close to their V resistors for impedance matching.
pin. R1 and R2 are series termination
DD
Ordering Information
Part Number Package Type Production Flow
CY25901SC–1 8-pin SOIC Commercial, –10°C to +85°C CY25901SC–1T 8-pin SOIC – Tape and Reel Commercial, –10°C to +85°C CY25901SC 8-pin SOIC Commercial, –10°C to +85°C CY25901SCT 8-pin SOIC –Tape and Reel Commercial, –10°C to +85°C
Package Drawing and Dimensions
8-lead (150-Mil) SOIC S8
51-85066-A
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-07521 Rev. ** Page 4 of 5
© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than cir cuitry embodi ed in a Cypress S emiconductor product . Nor does it convey or imply any license un der patent or other righ ts. Cypre ss Semiconductor does not autho rize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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Document History Page
Document Title: CY25901 Spread Spectrum Clock Generator Document Number: 38-07521
REV. ECN NO. Issue Date
** 124075 02/19/03 RGL New Data Sheet
Orig. of
Change Description of Change
CY25901
Document #: 38-07521 Rev. ** Page 5 of 5
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