The CXP87740A/87748A is a CMOS 8-bit microcomputer which consists of A/D converter, serial
interface, timer/counter, time base timer, vector
interruption, high precision timing pattern generation
circuit, PWM generator, PWM for tuner, VISS/VASS
circuit, 32kHz timer/event counter, remote control
receiving circuit, VCR vertical sync separation circuit
and the measuring circuit which measure signals of
capstan FG and drum FG/PG and other servo systems,
as well as basic configurations like 8-bit CPU, ROM,
RAM and I/O port. They are integrated into a single chip.
Also CXP87740A/87748A provides sleep/stop function
which enables to lower power consumption and ultra-low
speed instruction mode in 32kHz operation.
Features
• A wide instruction set (213 instructions) which cover various types of data
— 16-bit arithmetic instruction/multiplication and division instructions/boolean bit operation instruction
• Minimum instruction cycleDuring operation 333ns/12MHz (Supply voltage 3.0 to 5.5V)
During operation 250ns/16MHz (Supply voltage 4.5 to 5.5V)
During operation 122µs/32kHz
• Incorporated ROM capacity40K bytes (CXP87740A)
48K bytes (CXP87748A)
• Incorporated RAM capacity1344 bytes
• Peripheral functions
— A/D converter8-bit, 12-channel, successive approximation system
(Conversion time 20.0µs/16MHz)
— Serial interfaceIncorporated 8-bit and 8-stage FIFO, 1-channel
(1 to 8 bytes auto transfer)
8-bit serial I/O, 1-channel
— Timer8-bit timer, 8-bit timer/counter, 19-bit time base timer,
32kHz timer/counter
— High precision timing pattern generatorPPG 19 pins 32-stage programmable
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Input pin to request external interruption and non
maskable interruption. Active when falling edge.
Serial clock (CH1) I/O pin.
PI6/SO1
PI7/SI1
PJ0 to PJ7
EXTAL
XTAL
TEX
TX
RST
MP
AVDD
AVREF
AVss
VDD
Vss
I/O/output
I/O/input
I/O
Input
Output
Input
Output
Input
Input
Input
Serial data (CH1) output pin.
Serial data (CH1) input pin.
(Port J)
8-bit I/O port. Function as standby release input can be specified by bit
unit. I/O can be specified by bit unit.
Connecting pin of crystal oscillator for system clock. When supplying
the external clock, input the external clock to EXTAL pin and input
opposite phase clock to XTAL pin.
Connecting pin of crystal oscillator for 32kHz timer clock. When used
as event counter, input to TEX pin and leave TX pin open. (Feedback
resistor is not removed.)
System reset pin of active "L" level.
Microprocessor mode input pin. Always connect to GND.
Positive power supply pin of A/D converter.
Reference voltage input pin of A/D converter.
GND pin of A/D converter.
Positive power supply pin.
GND pin. Connect both Vss pins to GND.
– 6 –
Page 7
Input/Output Circuit Formats for Pins
CXP87740A/87748A
Pin
PA0/PPO0
to
PA7/PPO7
PB0/PPO8
to
PB7/PPO15
16 pins
PC0/PPO16
to
PC2/PPO18
PC3/RTO3
to
PC7/RTO7
Port A
Port B
Data bus
Port C
PPO data
Port A or Port B
RD
PPO, RTO data
Port C data
Port C direction
Circuit format
Output becomes active from high
impedance by data writing to port register.
RST pin specifies the input current when the pull-up resistor is selected, and specifies leakage current
CIN
DD
AVss
Clock 1MHz
, and
0V other than the measured pins
10
20
when non-resistor is selected.
∗2
When entire output pins are open.
∗3
When setting upper 2 bits (CPU clock selection) of clock control register CLC (address: 00FEH) to "00" and
operating in high speed mode (1/2 dividing clock).
mA
mA
µA
µA
µA
pF
– 14 –
Page 15
CXP87740A/87748A
DC Characteristics (VDD = 3.0 to 3.6V)(Ta = –20 to +75°C, Vss = 0V)
ItemSymbolPinsConditionsMin.
High level
output voltage
Low level
output voltage
VOH
VOL
IIHE
PA to PD,
PE2 to PE7,
PF4 to PF7,
PH (VOL only)
PI1 to PI7
PJ, SO0, SCK0
RST pin specifies the input current when the pull-up resistor is selected, and specifies leakage current
CIN
DD
AVss
Clock 1MHz
, and
0V other than the measured pins
10
20
when non-resistor is selected.
∗2
When entire output pins are open.
∗3
When setting upper 2 bits (CPU clock selection) of clock control register CLC (address: 00FEH) to "00" and
operating in high speed mode (1/2 dividing clock).
mA
mA
µA
pF
– 15 –
Page 16
A
A
A
AC Characteristics
(1) Clock timing
CXP87740A/87748A
(Ta = –20 to +75°C, VDD = 3.0 to 5.5V, Vss = 0V)
ItemSymbolPinsConditionsUnit
System clock frequency
System clock input pulse width
System clock input
rise and fall times
Event count clock input
pulse width
Event count clock input
rise and fall times
System clock frequency
Event count clock input
pulse width
Event count clock input
rise and fall times
∗
tsys indicates three values according to the contents of the clock control register (address; 00FEH) upper
Resolution
Linearity error
Absolute error
Conversion time
Sampling time
Reference input voltage
Analog input voltage
tCONV
tSAMP
VREF
VIAN
IREF
AVREF current
IREFS
(Ta = –20 to +75°C, VDD = AVDD = 3.0 to 3.6V, AVREF = 2.7 to AVDD, Vss = AVSS = 0V)
ItemSymbolPins
Resolution
Linearity error
Absolute error
Conversion time
Sampling time
Reference input voltage
Analog input voltage
tCONV
tSAMP
VREF
VIAN
IREF
AVREF current
IREFS
(Ta = –20 to +75°C, VDD = AVDD = 4.5 to 5.5V, AVREF = 4.0 to AVDD, Vss = AVSS = 0V)
8
Bits
Ta = 25°C
±1±2LSB
VDD = AVDD = AVREF = 5.0V
LSB
µs
µs
mA
10µA
AVREF
AN0 to AN11
AVREF
VSS = AVSS = 0V
Operating mode
SLEEP mode
STOP mode
160/fADC
12/fADC
∗
∗
AVDD – 0.5
0
0.6
AVDD
1.0
32kHz operating mode
Conditions
Ta = 25°C
Min.
Typ.Max.Unit
8
Bits
±1±2LSB
VDD = AVDD = AVREF = 3.3V
LSB
µs
µs
mA
µA
AVREF
AN0 to AN11
AVREF
VSS = AVSS = 0V
Operating mode
SLEEP mode
STOP mode
160/fADC
12/fADC
∗
AVDD – 0.3
0
∗
0.4
0.7
10
32kHz operating mode
V
V
VAVDD
Fig. 6. Definitions of A/D converter terms
FFH
FEH
Digital conversion value
01H
00H
Linearity error
Analog input
∗
The value of fADC is as follows by selecting ADC
operation clock (MSC: Address 01FFH bit 0).
When PS2 is selected, fADC = fc/2
When PS1 is selected, fADC = fc
V
FTVZT
– 22 –
Page 23
(4) Interruption, reset input(Ta = –20 to +75°C, VDD = 3.0 to 5.5V, Vss = 0V)
Those marked with an asterisk (∗) signify types with built-in ground capacitance (C1, C2).
Mask option table
Item
Reset pin pull-up resistor
Input circuit format
∗
In PG4/SYNC0 pin and PG5/SYNC1 pin, the input circuit format can be selected to every pin.
However, TTL schmitt can not be selected when the supply voltage (VDD) ranges from 3.5V to 5.5V.
∗
Non-existent
C-MOS schmitt
Content
Existent
TTL schmitt
– 25 –
Page 26
Characteristics Curve
CXP87740A/87748A
(fc = 16MHz, Ta = 25°C, Typical)
IDD vs. VDD
20.0
10.0
5.0
1.0
0.5
– Supply current [mA]
DD
I
0.1
(100µA)
0.05
(50µA)
0.01
(10µA)
DD – Supply voltage [V]
V
3
45
1/2 dividing mode
1/4 dividing mode
1/16 dividing mode
SLEEP mode
32kHz mode
(instruction)
32kHz mode
SLEEP
72
6
(VDD = 5V, Ta = 25°C, Typical)
20
15
– Supply current [mA]
10
DD
I
5
0
5
fc – System clock [MHz]
IDD vs. fc
10
1/2 dividing mode
1/4 dividing mode
1/16 dividing mode
SLEEP mode
16
(fc = 12MHz, Ta = 25°C, Typical)
IDD vs. VDD
20.0
10.0
5.0
1.0
0.5
– Supply current [mA]
DD
I
0.1
(100µA)
0.05
(50µA)
0.01
(10µA)
DD – Supply voltage [V]
V
3
45
1/2 dividing mode
1/4 dividing mode
1/16 dividing mode
SLEEP mode
6
72
(VDD = 3.3V, Ta = 25°C, Typical)
20
15
– Supply current [mA]
10
DD
I
5
0
510 16
fc – System clock [MHz]
IDD vs. fc
1/2 dividing mode
1/4 dividing mode
1/16 dividing mode
SLEEP mode
– 26 –
Page 27
Package OutlineUnit: mm
100PIN QFP (PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
+ 0.4
17.9 ± 0.4
14.0 – 0.01
+ 0.1
0.15 – 0.05
15.8 ± 0.4
CXP87740A/87748A
A
SONY CODE
EIAJ CODE
JEDEC CODE
76
75
0.65
0° to 15°
±0.12
0.15
(16.3)
DETAIL A
QFP-100P-L01
∗QFP100-P-1420-A
0.8 ± 0.2
100PIN LQFP (PLASTIC)
16.0 ± 0.2
∗ 14.0 ± 0.1
M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
51
50
+ 0.35
2.75 – 0.15
EPOXY RESIN
SOLDER PLATING
COPPER / 42 ALLOY
1.4g
100
0.5 ± 0.08
SONY CODE
EIAJ CODE
JEDEC CODE
(15.0)
A
26
1
+ 0.08
0.18 – 0.03
(0.22)
25
+ 0.2
1.5 – 0.1
+ 0.05
0.127 – 0.02
0.5 ± 0.2
0.1
0.1 ± 0.1
NOTE: Dimension “∗” does not include mold protrusion.
0° to 10°
DETAIL A
LQFP-100P-L01
∗QFP100-P-1414-A
0.5 ± 0.2
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY/PHENOL RESIN
SOLDER PLATING
42 ALLOY
– 27 –
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