Datasheet CXP85640, CXP85632 Datasheet (Sony)

Page 1
CXP85632/85640
For the availability of this product, please contact the sales office.
CMOS 8-bit Single Chip Microcomputer
Description
The CXP85632/85640 is a CMOS 8-bit micro­computer which consists of A/D converter, serial interface, timer/counter, time-base timer, closed caption decoder, data slicer, on-screen display function, I2C bus interface, PWM output, remote control receiver, HSYNC counter and watchdog timer as well as basic configuration like 8-bit CPU, ROM, RAM and I/O port.
Also this IC provides power-on reset function and sleep function which enables to lower power consumption.
Features
• A wide instruction set (213 instructions) to cover various types of data.
— 16-bit arithmetic/multiplication and division/boolean bit operation instructions
• Minimum instruction cycle 333ns at 12MHz operation
• Incorporated ROM 32K bytes (CXP85632)
40K bytes (CXP85640)
• Incorporated RAM 1888 bytes
(excluding the closed caption decoder and on-screen display VRAM)
• Peripheral functions
— A/D converter 8 bits, 6 channels, successive approximation method
(Conversion time of 26.7µs/12MHz) — Serial interface 8-bit clock, sync type, 1 channel — Timer 8-bit timer, 8-bit timer/counter, 19-bit time-base timer — Closed caption decoder
Incorporated decode slicer,
conforming to FCC, 8 × 13 dots, 192 character types, 15 character colors,
4 lines of 34 characters, italic, underline, vertical scroll,
15 frame background colors/half blanking — On-screen display (OSD) function
12 × 16 dots, 128 character types, 15 character colors, 4 lines of 24 characters,
8 frame background colors/half blanking, edging per line (half dot), vertical scroll
jitter elimination circuit — I2C bus interface — PWM output 8 bits, 4 channels — Remote control receiver circuit
Incorporated 6-stage FIFO 8-bit pulse measurement counter — HSYNC counter 2 channels — Watchdog timer
• Interruption 15 factors, 15 vectors, multi-interruption possible
• Standby mode SLEEP
• Package 64-pin plastic SDIP/QFP
• Piggyback/evaluation chip CXP85690 64-pin ceramic PSDIP (accommodates custom font)
64 pin SDIP (PIastic) 64 pin QFP (PIastic)
Structure
Silicon gate CMOS IC
Purchase of Sony's I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conform to the I2C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E95510-PS
Page 2
Vss V
DD
MP RST XTAL EXTAL
PA0 to PA78PB0 to PB78PC0 to PC78PD0 to PD78PE0 to PE23PF0 to PF7
8
PORT A
PORT B
PORT C
PORT D
PORT E
PORT F
RAM
1888 BYTES
SYSTEM CONTROL
CLOCK GENERATOR/
CXP85632/85640
PWM0 to PWM3
DD
INT2 INT1 INT0
CVss CV Cap Rex
SPC700 CPU CORE
2
DATA SLICER
CC DECODER
ROM
32K/40K BYTES
3
2
ON SCREEN DISPLAY
PRESCALER/
TIME BASE TIMER
INTERRUPT CONTROLLER
SERIAL INTERFACE UNIT
WATCHDOG TIMER
FIFO
8BIT TIMER 1
8BIT TIMER/COUNTER 0
REMOCON
HSYNC COUNTER 0
8BIT PWM 4CH
C BUS
2
I
INTERFACE UNIT
HSYNC COUNTER 1
A/D CONVERTER 6CH
SCL1 SCL0
SDA1 SDA0
VIN
Block Diagram
XLC
R
EXLC
I
B
G
YS
YM
VSYNC
HSYNC
SI
SO
SCK
EC
TO
RMC
HSC0
HSC1
AN0 to AN5
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Page 3
Pin Assignment (Top View) 64-pin SDIP
CXP85632/85640
PC3 PC2
PC1 PC0
EC/PD7
RMC/PD6
HS1/PD5 HS0/PD4
SI/PD3
SO/PD2
SCK/PD1
INT2/PD0
HSYNC/PA7
VSYNC/PA6
RST
Vss
XTAL
EXTAL PA5/AN5 PA4/AN4 PA3/AN3
PA2/AN2 PA1/AN1 PA0/AN0
CVss
Cap Rex
VIN
CV
INT1/PB7
PB6 PB5
DD
10 11 12 13 14 15 16 17 18 19 20
23
26
29 30
32
21 22
24 25
27 28
31
1
2 3 4
5 6 7 8 9
64
63
62
61 60
59
58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
43
42
41 40 39
38 37 36 35
34 33
PC4 PC5
PC6 PC7
PF0/PWM0
PF1/PWM1 PF2/PWM2 PF3/PWM3 PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 PE0/TO
PE1 PE2/INT0 MP Vss VDD NC EXLC XLC YM
YS I B G R
PB0 PB1 PB2
PB3 PB4
Note) 1. NC (Pin 46) must be connected to VDD.
2. Vss (Pins 16 and 48) must be connected to GND.
3. MP (Pin 49) must be connected to GND.
4. Cap (Pin 26) must be connected to CVSS via a capacitor.
5. Rex (Pin 27) must be connected to CVDD via a resistor of 33kΩ.
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Page 4
Pin Assignment (Top View) 64-pin QFP
PD6/RMC
PD7/EC
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PF0/PWM0
PF2/PWM2
PF1/PWM1
CXP85632/85640
HS1/PD5 HS0/PD4
SI/PD3
S0/PD2
SCK/PD1
INT2/PD0
HSYNC/PA7 VSYNC/PA6
RST
Vss
XTAL
EXTAL
PA5/AN5
PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0
CVss
10
11 12 13 14 15 16 17 18 19
62
64
63
61
60
59
1 2
3
4 5
6
7 8
9
58
57
56
55
54
53
52
51 50 49 48 47 46 45 44
42
40 39
37 36 35
33
43
41
38
34
PF3/PWM3 PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 PE0/TO PE1
PE2/INT0 MP Vss
V
DD
NC EXLC XLC YM YS I
B G
20
Cap
21
Rex
22
VIN
23
DD
CV
25
24
PB6
INT1/PB7
26
PB5
27
PB4
28
PB3
29
PB2
30
PB1
31
PB0
Note) 1. NC (Pin 40) must be connected to VDD.
2. Vss (Pins 10 and 42) must be connected to GND.
3. MP (Pin 43) must be connected to GND.
4. Cap (Pin 20 ) must be connected to CVSS via a capacitor.
5. Rex (Pin 21) must be connected to CVDD via a resistor of 33kΩ.
32
R
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Page 5
Pin Functions
CXP85632/85640
Pin name
PA0/AN0
to
PA5/AN5 PA6/VSYNC PA7/HSYNC
PB0 to PB6
PB7/INT1
PC0 to PC7
PD0/INT2 PD1/SCK
PD2/SO PD3/SI PD4/HS0 PD5/HS1 PD6/RMC
I/O
I/O/Analog input
I/O/Input I/O/Input
I/O
I/O/Input
I/O
I/O/Input I/O/I/O
I/O/Output I/O/Input I/O/Input I/O/Input I/O/Input
Functions
(Port A) 8-bit I/O port. I/O
Analog inputs to A/D converter. (6 pins)
can be set in a unit of single bits. (8 pins)
OSD display vertical sync signal input. OSD display horizontal sync signal input.
(Port B) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins)
Input for external interruption request. Active at the falling edge.
(Port C) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins)
Input for external interruption request. Active at the falling edge.
(Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Capable of driving 12mA sync current. (8 pins)
Serial clock I/O. Serial data output. Serial data input. HSYNC counter (CH0) input. HSYNC counter (CH1) input.
Remote control receiver circuit input. PD7/EC PE0/TO PE1
PE2/INT0 PF0/PWM0
to
PF3/PWM3 PF4/SCL0
PF5/SCL1 PF6/SDA0
PF7/SDA1 R, G, B, I, YS, YM
I/O/Input I/O/Output I/O
I/O/Input
Output/Output
Output/I/O
Output/I/O Output
External event input for timer/counter.
(Port E)
Rectangular wave output for timer/counter.
3-bit I/O port. I/O can be set in a unit of single bits. (3 pins)
(Port F) 8-bit output port with large current
Input for external interruption request.
Active at the falling edge.
8-bit PWM outputs.
(4 pins)
(12mA) N-ch open drain output.
Transfer clock I/O for I2C bus interface. (2 pins)
Lower 4 bits are 12V drive and upper 4 bits are 5V drive.
Transfer data I/O for I2C bus interface. (2 pins)
OSD display 6-bit outputs. (6 pins)
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Page 6
CXP85632/85640
Pin name EXLC XLC
VIN
Cap
Rex CVDD
CVSS EXTAL XTAL
RST
MP NC
I/O Functions Input Output
Input
—
—
OSD display clock oscillation I/O. Oscillator frequency is determined by external L and C.
Input of external composite video signal. Input a 2Vp-p signal via a capacitor.
Capacitor connection for the data slicer. Connect a capacitor between Cap and CVSS.
Resistor connection for the data slicer. Connect a 33kΩ resistor between Rex and CVDD.
Positive power supply for data slicer.
GND for data slicer. Input Output
System clock oscillator crystal connection. When using an external
clock, input to EXTAL pin and leave XTAL pin open.
Low level active system reset. This pin acts as I/O pin and outputs low I/O
level through incorporated power-on reset function when the power
turned on. (Mask option) Input
Test mode input. Must be connected to GND.
Not connected.
Under normal conditions, connect to VDD.
VDD Vss
Positive power supply.
GND. Connect two VSS pins to GND.
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Page 7
I/O Circuit Format for Pins
Pin When resetCircuit format
Port A
CXP85632/85640
Port A data
PA0/AN0
to
PA5/AN5
6 pins
PA6/VSYNC PA7/HSYNC
Data bus
Port A function selection
“0” when reset
A/D converter
Port A
Data bus
Port A direction “0” when reset
RD (Port A)
RD (Port A)
Input multiplexer
Port A data
Port A direction
Schmitt input
IP
IP
Input protection circuit
Hi-Z
Hi-Z
2 pins
PB0 to PB6 PB7/INT1 PC0 to PC7
16 pins
VSYNC, HSYNC
Port B Port C
Data bus
Port B, C data
Port B, C direction
“0” when reset
RD (Port B, C)
INT1
Input polarity
"0" when reset
IP
Hi-Z
Schmitt input
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Page 8
Pin When resetCircuit format
Port D
Port D data
PD0/INT2 PD3/SI PD4/HS0 PD5/HS1
Port D direction
“0” when reset
PD6/RMC PD7/EC
6 pins
Data bus
RD (Port D)
INT2, SI, HS0, HS1, RMC, EC
Port D
SCK, SO
Serial output enable
Schmitt input
∗
∗
IP
Large current 12mA
CXP85632/85640
Hi-Z
PD1/SCK PD2/SO
2 pins
PE0/TO PE1 PE2/INT0
Port E
Port D data
Port D direction
“0” when reset
Data bus
RD (Port D)
SCK only
TO
Port E function selection
“1” when reset
Port E data
“1” when reset for PE0, 1
Port E direction
“1” when reset for PE0, 1 “0” when reset for PE2
Data bus
Schmitt input
∗
Large current 12mA
Schmitt input only for PE2
∗
IP
Hi-Z
PE0, PE1:
IP
High
PE2: Hi-Z
3 pins
RD (Port E)
INT0
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Page 9
Pin When resetCircuit format
CXP85632/85640
PF0/PWM0
to
PF3/PWM3
4 pins
PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1
4 pins
Port F
Port F
PWM0 to PWM3
Port F selection
“0” when reset
Port F data
“1” when reset
SCL, SDA
I2C output enable
Port F data
“1” when reset
SCL, SDA
2
C circuit)
(I
Schmitt input
Hi-Z
∗
∗
12V drive voltage
Large current 12mA
∗
Hi-Z
IP
BUS SW
To internal I
(To SCL1 for SCL0)
∗
Large current 12mA
2
C pins
R G B
I
YS
YM
6 pins
EXLC XLC
2 pins
R, G, B, I, YS, YM
Output polarity “0” when reset
EXLC
XLC
Hi-Z
Output becomes active by data writing to output polarity register.
IP
Oscillator control
Oscillation
halted
IP
OSD display clock
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Page 10
Pin When resetCircuit format
A
EXTAL
EXTAL
IP
XTAL
XTAL
2 pins
Pull-up resistor
RST
Mask option
OP
Schmitt input
1 pin
• Diagram indicates equivalent circuit during oscillation.
• Feedback resistor is disconnected during STOP. (This device does not enter in the STOP mode.)
From power-on reset circuit (Mask option)
CXP85632/85640
Oscillation
Low level
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Page 11
CXP85632/85640
Absolute Maximum Ratings (Vss = 0V reference)
Item Symbol Ratings Unit Remarks Supply voltage Input voltage Output voltage Medium voltage tolerance output voltage High level output current High level total output current
VDD VIN VOUT VOUTP IOH ΣIOH
IOL
–0.3 to +7.0 –0.3 to +7.0 –0.3 to +7.0
–0.3 to +15.0
–5
–50
15
∗1 ∗1
V V V
V mA mA
mA
PF0 to PF3 pins
Total of all output pins Excludes large current output
port (value per pin)
Low level output current
IOLC
Low level total output current Operating temperature Storage temperature
Allowable power dissipation
∗1
VIN and VOUT should not exceed VDD + 0.3V.
∗2
The large current output port is Port D (PD) and Port F (PF).
ΣIOL Topr Tstg
PD
20
100
–20 to +75
–55 to +150
1000
600
mA mA
mW mW
Large current output port (value per pin∗2)
Total of all output pins °C °C
SDIP
QFP
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
better take place under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI.
Recommended Operating Conditions (Vss = 0V reference)
Item Symbol Min. Max. Unit Remarks
Guaranteed operation range for 1/2 or 1/4
4.5
Supply voltage
VDD
3.5
2.5
Data slicer supply voltage
CVDD
VIH High level input voltage
VIHS
VIHEX
VIL Low level input voltage
VILS
VILEX Operating temperature
∗1
This device does not enter in the STOP mode.
∗2
PA, PB, PC, PE0, PE1, SCL0, SCL1, SDA0, SDA1 pins.
∗3
INT2, SCK, SO, SI, HS0, HS1, RMC, EC, INT1, HSYNC, VSYNC, RST pins.
∗4
Specifies only during external clock input.
∗5
CVDD and VDD should be set to the same voltage.
Topr
4.5
0.7VDD
0.8VDD
VDD – 0.4
0 0
–0.3
–20
5.5
5.5
5.5
5.5
VDD VDD
VDD + 0.3
0.3VDD
0.2VDD
0.4
+75
V
frequency dividing mode Guaranteed operation range for 1/16
V
frequency dividing or SLEEP mode
V
Guaranteed data hold range for STOP mode
∗5
V
∗2
V
∗3
V V V V V
EXTAL pin
∗2 ∗3
EXTAL pin
∗4
∗4
°C
∗1
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Page 12
CXP85632/85640
DC Characteristics (Ta = –20 to +75°C, Vss = 0V reference)
Item
High level output voltage
Low level output voltage
Input current
I/O leakage current
Open drain output leak current (N-ch Tr off case)
Symbol
VOH
VOL
IIHE
IIHL
IILR
IIZ
ILOH
Pin Condition Min. Typ. Max. Unit
PA to PD, PE, R, G, B, I, YS, YM
PA to PD, PE, R, G, B, I, YS, YM, PF0 to PF3, RST
∗1
PD, PF PF4 to PF7
(SCL0, SCL1, SDA0, SDA1)
EXTAL
∗2
RST PA to PE, HSYNC,
VSYNC, R, G, B, I, YS, YM, RST
∗2
PF0 to PF3 PF4 to PF7
VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA
VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA
VDD = 4.5V, IOL = 12.0mA VDD = 4.5V, IOL = 3.0mA
VDD = 4.5V, IOL = 4.0mA VDD = 5.5V, VIH = 5.5V
VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VIL = 0.4V
VDD = 5.5V, VI = 0, 5.5V
VDD = 5.5V, VOH = 12.0V VDD = 5.5V, VOH = 5.5V
4.0
3.5
0.5 –0.5 –1.5
0.4
0.6
1.5
0.4
0.6 40
–40
–400
±10
50 10
V V
V V
V V
V
µA µA µA
µA
µA µA
I2C bus switch connection impedance (Output Tr off case)
RBS
SCL0: SCL1 SDA0: SDA1
VDD = 4.5V VSCL0 = VSCL1 = 2.25V VSDA0 = VSDA1 = 2.25V
120
1/2 frequency dividing mode
IDD
VDD = 5.5V 12MHz crystal oscillation
18
30
(C1 = C2 = 15pF) SLEEP mode
VDD = 5.5V, 12MHz crystal oscillation
0.9
3
Supply current
IDDSL
VDD
∗3
(C1 = C2 = 15pF)
∗4
—
—
—
IDDST
STOP mode VDD = 5.5V, termination of 12MHz oscillation
ICVDD
Input capacitance
∗1
RST pin is specified only when the power-on reset circuit is selected with mask option.
∗2
In RST pin, the input current is specified when the pull-up resistor is selected; the leakage current when no
CIN
CVDD PA to PE, SCL, SDA,
EXLC, EXTAL, VIN, RST
VDD = 5.5V
1MHz clock 0V for all pins excluding measured pins
—
5.0
10
10.0
20
resistor is selected.
∗3
When all pins are open. Specifies only when the OSD oscillation stops.
∗4
This device does not enter in the STOP mode.
Ω
mA
mA
µA
mA
pF
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Page 13
AC Characteristics
A
A
(1) Clock timing
CXP85632/85640
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item System Pin Condition Min. Max. Unit
System clock frequency
System clock input pulse width
System clock rise and fall times
Event counter input clock pulse widtth
Event counter input clock rise and fall times
∗
1
tsys indicates three values according to the contents of the clock control register (CLC: 00FEH) upper
2 bits. (CPU clock selection)
fC
tXL, tXH
tCR, tCF
tEH, tEL
tER, tEF
XTAL EXTAL
EXTAL
EXTAL
EC
EC
Fig. 1, Fig. 2
Fig. 1, Fig. 2 External clock drive
Fig 1, Fig 2 External clock drive
Fig. 3
Fig. 3
tsys
37.5
∗1
+ 50
Typ.
12.0
200
20
tsys (ns) = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
Fig. 1. Clock timing
1/fc
MHz
ns
ns
ns
ms
EXTAL
Fig. 2. Clock applied condition
Crystal oscillator Ceramic oscillator
EXTAL
AA
C
1 C2
Fig. 3. Event count clock timing
EC
t
XH tXLtCF tCR
External clock
XTAL
EH tELtEF tER
t
EXTAL
AA
XTAL
OPEN
DD – 0.4V
V
0.4V
0.8VDD
0.2VDD
– 13 –
Page 14
CXP85632/85640
(2) Serial transfer (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
SCK cycle time
SCK high and low level widths
SI input set-up time (for SCK↑)
SI input hold time (for SCK↑)
System Pin Condition Min. Max. Unit
tKCY
tKH tKL
tSIK
tKSI
SCK
Input mode Output mode SCK input mode
SCK
SCK output mode SCK input mode
SI
SCK output mode SCK input mode
SI
SCK output mode
1000
8000/fc
400
4000/fc – 50
100 200 200 100
SCK input mode
SCK ↓ → SO delay time
tKSO
SO
SCK output mode
Note) The load condition for the SCK output mode, SO output delay time is 50pF + 1TTL.
Fig. 4. Serial transfer timing
tKCY
200 100
ns ns ns ns ns ns ns ns ns ns
SCK
SI
SO
tKL tKH
tSIK
Input data
tKSO
0.8VDD
0.2VDD
0.8VDD
0.2VDD
tKSI
0.8VDD
0.2VDD
Output data
– 14 –
Page 15
CXP85632/85640
(3) A/D converter characteristics (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item Symbol Pin Condition Min. Typ. Max. Unit Resolution Linearity error Zero transition
voltage Full-scale transition
voltage Conversion time Sampling time Analog input voltage
∗1
VZT
∗2
VFT
tCONV tSAMP
VIAN
AN0 to AN5
Fig. 5. Definitions for A/D converter terms
FF
H
FEH
Digital conversion value
Linearity error
8
±1
Ta = 25°C VDD = 5.0V
–50
10
70
Vss = 0V
4910
160/fADC
12/fADC
∗3
∗3
0
∗1
VZT: Digital conversion values change between 00H←→01H.
∗2
VFT: Digital conversion values change between 0EH←→0FH.
∗3
fADC indicates the below values due to the bit 6 (CKS) of
4970
5030
VDD
A/D control registor (ADC: 00F9H) and the bit 7 (PCK1) and bit 6 (PCK0) of clock control registor (CLC: 00FEH)
Bits
LSB
mV
mV
µs µs
V
01H 00H
VZT VFT
Analog input
PCK1, 0
00 (φ = fEX/2) 01 (φ = fEX/4) 11 (φ = fEX/16)
CKS
0 (φ/2 selection) 1 (φ selection)
fADC = fC/2 fADC = fC/4
fADC = fC/16
fADC = fC fADC = fC/2 fADC = fC/8
– 15 –
Page 16
(4) Interrupt, reset input (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item Symbol Pin Condition Min. Max. Unit
CXP85632/85640
External interrupt high and low level widths
Reset input low level width
Fig. 6. Interrupt input timing
INT0 INT1 INT2 (falling edge)
Fig. 7. RST input timing
RST
tIH tIL
tRSL
INT0 INT1 INT2
RST
tIH tIL
0.8VDD
tRSL
0.2VDD
1
32/fc
µs
µs
0.2VDD
(5) Power-on reset
∗1
Item Symbol Pin Condition Min. Max. Unit
Power supply rise time
tR
Power-on reset
VDD
Power supply cutt-off time
∗1
Specified only when power-on reset function is selected.
tOFF
Repeated power-on reset
Fig. 8. Power-on reset
DD
V
4.5V
0.2V
tR tOFF
Take care when turning on power.
(Ta = –20 to +75°C, Vss = 0V reference)
0.05 1
50 ms
ms
0.2V
– 16 –
Page 17
CXP85632/85640
(6) I2C bus timing (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item SCL clock frequency Bus-free time before starting transfer Hold time for starting transfer Clock low level width Clock high level width Set-up time for repeated transfers Data hold time Data set-up time SDA, SCL rise time SDA, SCL fall time Set-up time for transfer completion
∗1
For data hold time, the SCL rise time is not taken into account so that 300ns must be exceeded.
Symbol Pin Condition Min. Max. Unit
fSLC
tBUF tHD; STA tLOW tHIGH tSU; STA tHD; DAT tSU; DAT tR tF tSU; STO
SCL SDA, SCL SDA, SCL SCL SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL
0
4.7
4.0
4.7
4.0
4.7
∗1
0
250
4.7
Fig. 9. I2C bus transfer data timing
100
1
300
kHz
µs µs µs µs µs µs ns µs ns µs
SDA
t
BUF
SCL
tHD; STA
SP
tLOW
Fig. 10. I2C device recommended circuit
I2C
device
RS RS RS RS RP RP
SDA0 (or SDA1)
SCL0 (or SCL1)
I2C
device
tFtR
tSU; DATtHIGHtHD; DAT
tHD; STA
tSU; STA
t
SU; STO
PSt
• A pull-up resistor must be connected to SDA0 (or SDA1), and SCL0 (or SCL1).
• The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300Ω or less) can be used to reduce spike
noise caused by CRT flashover.
– 17 –
Page 18
(7) OSD (On Screen Display) timing (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
CXP85632/85640
Item
OSD clock frequency
HSYNC pulse width HSYNC after-write
rise and fall times VSYNC before-write
rise and fall times
Fig. 11. OSD timing
For OPOL register (01FDH)
HSYNC
bit 7 at “0”
Symbol
fOSC
tHWD tHCG
tVCG
Pin Condiiton
EXLC XLC
HSYNC HSYNC
VSYNC
tVCG
Fig. 12
Fig. 11 Fig. 11
Fig. 11
tHWD
Min. Max.
4
16.5
1.2 200
1.0
tHCG
0.8VDD
0.2VDD
Unit
MHz
µs ns
µs
For OPOL register (01FDH)
VSYNC
bit 6 at “0”
0.8VDD
0.2VDD
Fig. 12. LC oscillator circuit connection
EXLC XLC
∗
1
L
∗1
The XLC series resistor can reduce the occurrence of undersired radiation.
R
2C1
C
– 18 –
Page 19
CXP85632/85640
(8) Data slicer external circuit (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
VIN pin coupling capacitor
Cap pin capacitor
Rex pin pull-up resistor Composite video signal input
Symbol Pin Min. Unit
CVIN
Ccap
Rrex Video In
VIN
Cap
Rex VIN
Fig. 13. Data slicer external recommeded circuit
5.0V
Rrex
CVDD
Rex
Typ. Max.
0.47
4700
33
2.0
µF
pF
kΩ
Vp-p
Remarks
B or more of temperature characteristics is recommended.
B or more of temperature characteristics is recommended.
CVIN R1
IN
V
C
1R2Video In
Cap
Ccap
CVss
[Recommended Constant]
R1 = 100Ω (error: 5%; allowable power dissipation: 1/8 W or more) R2 = 1MΩ (error: 5%; allowable power dissipation: 1/8 W or more) C1 = 820pF (ceramic), B or more of temperature characteristics is recommended.
– 19 –
Page 20
Supplement
A
A
Fig. 14. SPC700 Series recommended oscillation circuit
(i)
EXTAL
EXTAL
AA
AA
XTAL
XTAL
Rd
Rd
C2C1
CXP85632/85640
Manufacturer
RIVER ELETEC CO., LTD.
KINSEKI LTD.
∗1
The XTAL series resistor can reduce the effect of electrostatic discharge noise.
Mask Option Table
Item Reset pin pull-up resistor Power-on reset circuit
Model fc (MHz)
HC-49/U03 HC-19/U (-S)
Non-existent Non-existent
12.0
12.0
Inclusion
C1 (pF) C2 (pF)
5
15
Existent Existent
5
15
Rd (Ω)
∗1
0
∗1
0
Circuit
example
(i) (i)
– 20 –
Page 21
Fig. 15. Characteristics curves
CXP85632/85640
100
10
Supply current [mA]
DD –
I
1
(fc = 12MHz, Ta = 25°C, Typical)
IDD vs. VDD
1
frequency dividing mode
2
frequency
1
dividing mode
4
frequency
1
dividing mode
16
SLEEP mode
50
45
40
35
30
25
Supply current [mA]
20
DD –
I
15
10
(VDD = 5V, Ta = 25°C, Typical)
IDD vs. fc
1
frequency dividing mode
2
frequency
1
dividing mode
4
1
frequency dividing mode
16
0.1 23456
V
DD – Supply voltage [V]
Parameter curve for OSD oscillation L vs. C
(theoretically calculated value)
100
10
Inductance [µH]
–
L
f
OSC = C = C1 // C2
0
2π LC
C1, C2 – Capacitance [pF]
5
0
– System clock [MHz]
fc
1
50 100
SLEEP mode
161284
10MHz 12MHz 14MHz
16MHz
– 21 –
Page 22
Package Outline Unit: mm
CXP85632/85640
64PIN SDIP (PLASTIC) 750mil
+ 0.4
57.6 – 0.1
64
33
+ 0.3
19.05
17.1 – 0.1
+ 0.1
132
1.778 + 0.4
4.75 – 0.1
0.5 MIN
0.5 ± 0.1
3 MIN
0.9 ± 0.15
PACKAGE STRUCTURE
EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY
8.6g
SONY CODE EIAJ CODE JEDEC CODE
SDIP-64P-01
SDIP064-P-0750-A
MOLDING COMPOUND
LEAD TREATMENT LEAD MATERIAL
PACKAGE WEIGHT
0.25 – 0.05
0° to 15°
52
64
SONY CODE
EIAJ CODE
JEDEC CODE
64PIN QFP(PLASTIC)
23.9 ± 0.4 + 0.4
20.0 – 0.1
51
1
1.0
+ 0.15
0.4 – 0.1
33
32
+ 0.4
14.0 – 0.1
17.9 ± 0.4
20
19
± 0.12
+ 0.35
2.75 – 0.15
M
PACKAGE STRUCTURE
QFP–64P–L01
∗
QFP064–P–1420
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN SOLDER/PALLADIUM
COPPER /42 ALLOY
1.5g
0.15 – 0.05
+ 0.2
0.1 – 0.05
PLATING
+ 0.1
0.15
16.3
0.8 ± 0.2
– 22 –
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