Datasheet CXP845F60 Datasheet (Sony)

Page 1
Description
The CXP845F60 is a CMOS 8-bit microcomputer integrating on a single chip an A/D converter, serial interface, timer/counter, time-base timer, capture timer/counter, PWM output and the like besides the basic configurations of 8-bit CPU, flash EEPROM, RAM and I/O port.
The CXP845F60 also provides a sleep/stop functions that enable to execute the power-on reset function or lower the power consumption.
The CXP845F60 is the flash EEPROM-incorporated version of the CXP84540/84548 with a built-in mask ROM. This enables program writing and erasing. Thus, it is most suitable for evaluation use during system development and for small-quantity production.
Features
• A wide instruction set (213 instructions) which covers various types of data
— 16-bit arithmetic/multiplication and division/Boolean bit operation instructions
• Minimum instruction cycle 143ns at 28MHz operation (4.5 to 5.5V)
• Incorporated flash EEPROM 60K bytes
Rewrite time 100 times
• Incorporated RAM 1472 bytes
• Peripheral functions
— A/D converter 8 bits, 8 channels, successive approximation method
(Conversion time of 1.93µs at 28MHz)
— Serial interface Incorporated 8-bit, 8-stage FIFO (Auto transfer for 1 to 8 bytes,
latch output function, MSB/LSB first selectable), 1 channel 8-bit clock sync type, 1 channel
— Timer 8-bit timer
8-bit timer/counter 19-bit time-base timer 16-bit capture time/counter
— PWM output 8 bits, 2 channels
• Interruption 14 factors, 14 vectors, multi-interruption possible
• Standby mode Sleep/stop
• Package 80-pin plastic QFP Structure
Silicon gate CMOS IC
CMOS 8-bit Single Chip Microcomputer
– 1 –
E96906-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CXP845F60
80 pin QFP (Plastic)
Page 2
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CXP845F60
Block Diagram
8
AN0 to AN7
PWM0
PWM1
CS0
SI0
SO0
SCK0
SI1
SO1
SCK1
TO
CINT
EC1
EC0
A/D CONVERTER
AVss
AV
REF
8 BIT PWM GENERATOR 0
SERIAL
INTERFACE
UNIT 0
FIFO
SERIAL INTERFACE UNIT 1
8 BIT TIMER/COUNTER 0
8 BIT TIMER 1
16 BIT CAPTURE
TIMER/COUNTER 2
INTERRUPT CONTROLLER
INT0
INT1
INT2
INT3
NMI
SPC700
CPU CORE
Flash EEPROM
60K BYTES
CLOCK
GENERATOR/
SYSTEM CONTROL
RAM
1472 BYTES
PRESCALER/ TIME-BASE TIMER
EXTAL
XTAL
V
DD
Vss
PORT A
8
8
8
4 4
8
PA0 to PA7
PB0 to PB7
PC0 to PC7
PD0 to PD7
PE0 to PE3 PE4 to PE7
PF0 to PF7
PG0 to PG7
PI0 to PI7
RST
8
8
8
PORT B
PORT C
PORT D
PORT E
PORT F
PORT G
PORT I
PH0 to PH7
8
PORT H
2
2
LAT0
8 BIT PWM GENERATOR 1
PWE
TETA
TETB
TETC
Page 3
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CXP845F60
Pin Assignment 1 (Top View)
2 3 4
5 6 7 8 9
10 11 12 13 14 15 16 17 18 19
20 21 22 23
24
25
26
27 28
29
30
40
39
38
37
36
35
34
31
32
33
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
70
69
68
67
63
64
65
66
61
62
71
72
73
74
75
76
77
78
79
80
1
PE1/EC1
PI4 PI3/INT3 PI2/INT2 PI1/INT1 PI0/INT0 PE5/TO/PWM1/(TETA) PE4/PWM0/(TETB) PE3/NMI/(TETC) PE2/CINT
PE0/EC0 PB7/SO1
PB6/SI1 PB5/SCK1
PB4/SO0 PB3/SI0 PB2/SCK0 PB1/CS0 PB0/LAT0 PA7/AN7
PA6/AN6 PA5/AN5 PA4/AN4 PA3/AN3
PH3
PH4
PH5
PH6
PH7
RST
EXTAL
XTAL
V
SS
PE6
PE7
AV
SS
AV
REF
PA0/AN0
PA1/AN1
PA2/AN2
PF3 PF4 PF5 PF6
PF7 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PH0 PH1 PH2
PF2
PF1
PF0
PG7
PG6
PG5
PG4
PWE
V
DD
PG3
PG2
PG1
PG0
PI7
PI6
PI5
Notes) 1.PWE (Pin 73) is left open during normal operation.
2.See the Appendix concerning the Pins 57 to 59 (TETA, TETB and TETC).
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CXP845F60
Pin Description
Symbol I/O Description
I/O/Analog input
PA0/AN0
to
PA7/AN7
(Port A) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of the pull-up resistor can be set through the software in a unit of 4 bits. (8 pins)
Analog inputs to A/D converter. (8 pins)
I/OPC0 to PC7
(Port C) 8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA sink current. Incorporation of pull-up resistor can be set through the software in a unit of 4 bits. (8 pins)
I/OPD0 to PD7
(Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull­up resistor can be set through the software in a unit of 4 bits. (8 pins)
I/OPF0 to PF7
(Port F) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the software in a unit of 4 bits. (8 pins)
Input/Input Input/Input Input/Input Input/Input/
(Input) Output/Output/
(Input) Output/Output/
Output/(Input) Output Output
PE0/EC0 PE1/EC1 PE2/CINT PE3/NMI/
(TETC) PE4/PWM0/
(TETB) PE5/TO/
PWM1/(TETA) PE6 PE7
(Port E) 8-bit port. Lower 4 bits are for inputs; upper 4 bits are for outputs. (8 pins)
External event inputs for timer/counter. (2 pins)
Capture trigger input.
I/O/Output I/O/Input I/O/I/O I/O/Input I/O/Output I/O/I/O I/O/Input I/O/Output
PB0/LAT0 PB1/CS0 PB2/SCK0 PB3/SI0 PB4/SO0 PB5/SCK1 PB6/SI1 PB7/SO1
(Port B) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the software in a unit of 4 bits. (8 pins)
Latch output for serial interface (CH0). Chip select input for serial interface (CH0). Serial clock I/O (CH0). Serial data input (CH0). Serial data output (CH0). Serial clock I/O (CH1). Serial data input (CH1). Serial data output (CH1).
Control pins for flash EEPROM write. (3 pins)
Non-maskable interruption request input.
8-bit PWM0 output. Rectangular wave output for 16-bit
timer/counter and 8-bit PWM1 output.
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CXP845F60
Symbol I/O Description
I/OPG0 to PG7
(Port G) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull­up resistor can be set through the software in a unit of 4 bits. (8 pins)
I/OPH0 to PH7
(Port H) 8-bit I/O port. I/O and standby release input function can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the software in a unit of 4 bits. (8 pins)
I/O/Input
PI0/INT0
to
PI3/INT3
I/O
PI4 to PI7
Input
Connects a crystal for system clock oscillation. When the clock is supplied externally, input to EXTAL; opposite phase clock should be input to XTAL.
EXTAL
OutputXTAL I/O
System reset for active at Low level. This pin is I/O pin, and outputs Low level at the power on with the power-on reset function executed.
RST
Flash EEPROM write enable pin. Write is enabled at Low level; write is prohibited at High level. Leave this pin open for normally operation.
PWE
Input
Reference voltage input for A/D converter.
AVREF
A/D converter GND.
AVss
Positive power supply.
VDD
GND
Vss
(Port I) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the software in a unit of 4 bits. (8 pins)
External interruption request inputs. (4 pins)
Input
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CXP845F60
Data bus
RD (Port B)
Port B direction
IP
Port B data
Pull-up resistor
"0" when reset
"0" when reset
LAT0
Latch output enable
∗
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
∗
Data bus
RD (Port B)
Port B direction
IP
Port B data
Pull-up resistor
"0" when reset
"0" when reset
Schmitt input
CS0 SI0 SI1
∗
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
∗
Port B
8 pins
Hi-Z
Hi-Z
When reset
PA0/AN0
to
PA7/AN7
PB0/LAT0
Port B
1 pin
Hi-Z
PB1/CS0 PB3/SI0 PB6/SI1
Data bus
RD (Port A)
Port A direction
IP
Port A data
Pull-up resistor
Port A function selection
Input protection circuit
"0" when reset
"0" when reset
"0" when reset
Input multiplexer
A/D converter
∗
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
∗
Input/Output Circuit Formats for Pins
Port A
Pin
Circuit format
3 pins
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CXP845F60
Port B
2 pins
Hi-Z
Hi-Z
PB2/SCK0 PB5/SCK1
PB4/SO0 PB7/SO1
Port C
2 pins
8 pins
Hi-Z
PC0 to PC7
Data bus
RD (Port B)
IP
Port B function selection
"0" when reset
Schmitt input
SCK0, SCK1 in
Port B data
Port B direction
"0" when reset
Pull-up resistor "0" when reset
SCK OUT
Serial clock output enable
∗
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
∗
Port B
When resetPin
Circuit format
Pull-up resistor
Serial data output enable
Port B function selection
"0" when reset
Port B data
Port B direction
"0" when reset
SO
∗
IP
Data bus
Data bus
RD (Port B)
Pull-up resistor
"0" when reset
Port C data
Port C direction
"0" when reset
RD (Port C)
∗
Pull-up transistor
Approx. 100kΩ (V
∗
1
Large current drive
DD = 4.5 to 5.5V)
*
1
IP
∗
2
12mA (VDD = 4.5 to 5.5V)
∗
2
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Page 8
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CXP845F60
A
A
A
High level High level
at ON
resistance
of pull-up transistor
during
a reset.
4 pins
1 pin
PE0/EC0 PE1/EC1 PE2/CINT PE3/NMI/ (TETC)
PE4/PWM0/ (TETB)
PE5/TO/ PWM1/ (TETA)
1 pin
Low level
PE6, PE7
2 pins
Data bus
RD (Port E)
Port E data
"0" when reset
IP
Schmitt input
RD (Port E)
Data bus
EC0, EC1 CINT, NMI
(to flash EEPROM circuit)
Data bus
Port E function selection
PWM0
Port E data
"0" when reset
"1" when reset
RD (Port E)
(to flash EEPROM circuit)
Port E
Port E
Port E
Port E
Hi-Z
High level
When resetPin
Circuit format
Port E data
"1" when reset
TO
PWM1
Port E function selection
(upper)
AAA
Port E function selection
(lower)
"00" when reset
TO output enable
Internal reset signal
00
AA
MPX 01 1x
AA
(to flash EEPROM circuit)
∗
Pull-up transistor
Approx. 150kΩ (VDD = 4.5 to 5.5V)
∗
Page 9
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CXP845F60
28 pins
PD0 to PD7 PF0 to PF7 PG0 to PG7 PI4 to PI7
IP
Ports D, F, G, I data
"0" when reset
Ports D, F, G, I direction
Pull-up resistor
"0" when reset
RD
Data bus
∗
Pull-up transistor
Approx. 100kΩ (V
DD = 4.5 to 5.5V)
∗
Port I
8 pins
Hi-Z
PH0 to PH7
Data bus
RD (Port H)
Port H direction
IP
Port H data
Pull-up resistor
"0" when reset
"0" when reset
Standby release
Edge detection
∗
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
∗
Port H
4 pins
Hi-Z
PI0/INT0
to
PI3/INT3
Port D
Port F
Port G
Port I
Hi-Z
Data bus
IP
Port I data
"0" when reset
∗
Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
∗
Port I direction
Pull-up resistor
"0" when reset
INT0 INT1 INT2 INT3
RD
Schmitt input
When resetPin
Circuit format
Page 10
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CXP845F60
2 pins
Oscillation
EXTAL XTAL
1 pin
RST
Low level
IP
EXTAL
XTAL
• Diagram shows the circuit composition during oscillation.
• Feedback resistor is removed during stop mode and XTAL
becomes High level.
IP
Schmitt input
Pull-up resistor
IP
from power-on reset circuit
When resetPin
Circuit format
1 pin
PWE
High level
Pull-up resistor
IP
to flash EEPROM circuit
Page 11
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CXP845F60
∗1
VIN and VOUT must not exceed VDD + 0.3V.
∗2
The large current drive transistor is the N-ch transistor of Port C (PC).
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding these conditions may adversely affect the reliability of the LSI.
Input voltage Output voltage High level output current High level total output current
Low level total output current Operating temperature Storage temperature Allowable power dissipation
VDD AVSS VIN VOUT IOH ∑IOH
IOL IOLC
∑IOL Topr Tstg PD
Supply voltage
Low level output current
–0.3 to +7.0 –0.3 to +0.3
–0.3 to +7.0
∗1
–0.3 to +7.0
∗1
–5
–50
15 20
100
–20 to +75
–55 to +150
600
V V V
V mA mA
mA mA
mA
°C °C
mW
Output (value per pin) Total for all output pins All pins excluding large current outputs
(value per pin) Large current outputs (value per pin∗2) Total for all output pins
Item Symbol Ratings Unit Remarks
Absolute Maximum Ratings (Vss = 0V reference)
High level input voltage
Low level input voltage
Operating temperature
Supply voltage
5.5
5.5
5.5 VDD VDD
VDD + 0.3
0.3VDD
0.2VDD +0.4
+75
V V V V V V
°C
V
Item Symbol Min. Max. Unit Remarks
4.5
3.5
2.0
0.7VDD
0.8VDD
VDD – 0.4
0 0
–0.3
–20
VIH VIHS VIHEX VIL VILS VILEX Topr
Guaranteed operation range for 1/2 and 1/4 frequency dividing modes
Guaranteed operation range for 1/16 frequency dividing and sleep modes
Guaranteed data hold range during stop mode
∗1
Hysteresis input
∗2
EXTAL
∗3
∗1
Hysteresis input
∗2
EXTAL
∗3
VDD
∗1
Normal input ports (PA, PB0, PB4, PB7, PC, PE0 to PE3, PD, PF to PH, PI4 to PI7)
∗2
RST, CINT, CS0, SCK0, SCK1, EC0, EC1, SI0, SI1, NMI, INT0, INT1, INT2, INT3
∗3
Specifies only during external clock input.
Recommended Operating Conditions (Vss = 0V reference)
Page 12
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CXP845F60
Electrical Characteristics
DC Characteristics (VDD = 4.5 to 5.5V)
(Ta = –20 to +75°C, Vss = 0V reference)
VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA VDD = 4.5V, IOL = 12.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V
VDD = 5.5V, VIL = 4.0V
High level output voltage
4.0
3.5
0.1 –0.1 –1.5
–2.78
V V V V
V µA µA µA µA µA
µA
PC
PA to PD, PE4 to PE7, PF to PI, RST (only VOL)
EXTAL
RST PA to PD
∗1
PF to PI
∗1
Item Symbol Pin Conditions
Min.
Clock 1MHz 0V for all pins excluding measured pins
VDD
IDD1
IIZ
IDD2 IDDS1
IDDS2
IDDS3
CIN
VOH
VOL
IIHE IILE IILR
IIL
Low level output voltage
Input current
Typ.
0.4
0.6
1.5 25
–25
–400
–50
±10
Max. Unit
∗1
For PA to PD and PF to PI pins, specifies the input current when pull-up resistance is selected; leakage current when no resistance is selected.
∗2
When all output pins are left open.
VDD = 5.5V, 28MHz crystal oscillation (C1 = C2 = 1pF)
Sleep mode
Supply current
∗2
Input capacity
VDD = 4.5V, VIL = 4.0V VDD = 5.5V,
VI = 0, 5.5V For 1/2 frequency dividing mode
I/O leakage current
PA to PD
∗1
PF to PI
∗1
PE0 to PE3
38
2.5
10
66
10
30
20
mA
mA
µA
pF
VDD = 5.5V, 28MHz crystal oscillation (C1 = C2 = 1pF)
Stop mode
VDD = 5.5V, termination of 28MHz crystal oscillation
PA to PD, PE0 to PE3, PF to PI, EXTAL, RST
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CXP845F60
∗1
tsys indicates the three values according to the contents of the clock control register (CLC: 00FEh) upper
2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
EXTAL
t
XH tXLtCF tCR
0.4V
V
DD – 0.4V
1/fc
A
A
Crystal oscillation Ceramic oscillation
EXTAL
XTAL
External clock
EXTAL
XTAL
74HC04
C
1
C2
AC Characteristics
(1) Clock timing
System clock frequency
System clock input pulse width System clock input
rise time, fall time Event count input clock
pulse width Event count input clock
rise time, fall time
fC
tXL, tXH
tCR, tCF
tEH, tEL
tER, tEF
XTAL EXTAL
EXTAL
EXTAL EC0
EC1 EC0
EC1
MHz
ns
ns
ns
ms
Item Symbol Pin Conditions Min. Unit
Fig. 1, Fig. 2 Fig. 1, Fig. 2
External clock drive Fig. 1, Fig. 2
External clock drive Fig. 3
Fig. 3
1
15.6
tsys + 50
∗1
Typ. Max.
28
100
20
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Fig. 2. Clock applied conditions
Fig. 1. Clock timing
tEH tELtEF tER
0.2VDD
0.8VDD
tTH tTLtTF tTR
EC0 EC1
Fig. 3. Event count clock timing
AAA
AA
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CXP845F60
Chip select transfer mode (SCK0 = output mode)
Chip select transfer mode (SCK0 = output mode)
Chip select transfer mode
Chip select transfer mode Chip select transfer mode
Note 1) tsys indicates the three values according to the contents of the clock control register (CLC: 00FEh)
upper 2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
Note 2) The load condition for the SCK0 output mode, SO0 output delay time is 50pF + 1TTL.
(2) Serial transfer (CH0) (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
CS0 ↓ → SCK0 delay time
CS0 ↑ → SCK0 float delay time
CS0 ↓ → SO0 delay time
CS0 ↑ → SO0 float delay time
CS0 High level width
SCK0 cycle time
SCK0 High, Low level width
SI0 input setup time (for SCK0 ↑)
SI0 input hold time (for SCK0 ↑)
SCK0 ↓ → SO0 delay time
tDCSK
tDCSKF
tDCSO
tDCSOF tWHCS
tKCY
tKH tKL
tSIK
tKSI
tKSO
tLADLY
tLAPLS
SCK0
SCK0
SO0
SO0 CS0
SCK0
SCK0
SI0
SI0
SO0
LAT0
LAT0
Input mode Output mode Input mode Output mode SCK0 input mode SCK0 output mode SCK0 input mode SCK0 output mode SCK0 input mode SCK0 output mode Latch output mode
(SCK0 = output mode) Latch output mode
(SCK0 = output mode)
ns
ns
ns
ns ns
Symbol Pin Min.
1.5tsys + 100
1.5tsys + 100
1.5tsys + 100
1.5tsys + 100
tsys + 150
2tsys + 200
8000/fc
tsys + 90
4000/fc – 25
50
100
tsys + 100
50
tKCY
tKCY – 10
ns ns ns ns ns ns ns ns ns ns
ns
ns
tsys + 100
50
tKCY + 50
tKCY + 50
Max. UnitConditions
SCK0 ↑ → LAT0 output delay time
LAT0 data pulse width
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CXP845F60
SCK0
0.2V
DD
0.8VDD
tWHCS
tDCSK
tDCSKF
0.8VDD
0.2VDD
0.8VDD
tKCY
tKL tKH
0.8VDD
0.2VDD
SI0
t
SIK
Input
data
t
DCSO tKSO tDCSOF
Output
data
0.8V
DD
0.2VDD
SO0
CS0
tKSI
tLAPLS
LAT0
tLADLY
0.8VDD
0.8VDD
0.8VDD
Fig. 4. Serial transfer CH0 timing
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CXP845F60
(3) Serial transfer (CH1) (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, VSS = 0V reference)
Item
SCK1 cycle time
tKCY
SCK1
Input mode Output mode Input mode Output mode SCK1 input mode SCK1 output mode SCK1 input mode SCK1 output mode SCK1 input mode SCK1 output mode
500
8000/fc
200
4000/fc – 25
50 100 100
50
100
50
ns ns ns ns ns ns ns ns ns ns
SCK1
SI1
SI1
SO1
tKH tKL
tSIK
tKSI
tKSO
SCK1 High, Low level width
SI1 input setup time (for SCK1 ↑)
SI1 input hold time (for SCK1 ↑)
SCK1 ↓ → SO1 delay time
Symbol Pin Conditions Min. Max. Unit
Note) The load condition for the SCK1 output mode, SO1 output delay time is 50pF + 1TTL.
0.2VDD
0.8VDD
tKL tKH
SO1
tKCY
tSIK
tKSI
0.2VDD
0.8VDD
tKSO
0.2VDD
0.8VDD Output data
Input data
SI1
SCK1
Fig. 5. Serial transfer CH1 timing
Page 17
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CXP845F60
Conversion time Sampling time Reference input voltage Analog input voltage
tCONV tSAMP
VREF VIAN
VZT
∗1
VFT
∗2
IREF
AVREF AN0 to AN7
Ta = 25°C VDD = AVREF = 5.0V VSS = AVSS = 0V
Operation mode Sleep mode
Stop mode
Linearity error Zero transition voltage Full-scale transition
voltage
Resolution
AVREF current
AVREF
IREFS
µs µs
V V
VDD
AVREF
1.0
mA
10 µA
0.6
27/fADC
∗3
6/fADC
∗3
VDD – 0.5
0
Item Symbol Pin Conditions Min. Typ. Max. Unit
Bits
(4) A/D converter characteristics
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, AVREF = 4.0 to VDD, Vss = AVSS = 0V reference)
8
LSB
70 mV
5030
10
4970
–10
4910 mV
±4
Analog input
Linearity error
V
FTVZT
00h
01h
FEh
FFh
Digital conversion value
∗1
VZT: Value at which the digital conversion value changes
from 00H to 01H and vice versa.
∗2
VFT: Value at which the digital conversion value changes
from FEH to FFH and vice versa.
∗3
fADC indicates the values below due to the contents of bit 6 (CKS) of the A/D control register (ADC: 00F9H).
fADC = fc (CKS = "0"), fc/2 (CKS = "1") However, the selection for fADC = fc (CKS = "0") is limited in the clock range of fc = 1 to 14MHz (VDD = 4.5 to 5.5V).
Fig. 6. Definition of A/D converter terms
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CXP845F60
External interruption High, Low level width
Reset input Low level width
INT0 INT1 INT2 INT3 NMI
RST
1
32/fc
µs
µs
Item Symbol Pin Conditions Min. Max. Unit
tIH tIL
tRSL
(5) Interruption, reset input (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
0.2VDD
0.8VDD
tIH tIL
INT0 INT1 INT2 INT3 NMI (Specifies NMI only for the falling edge.)
tIL tIH
0.2VDD
0.8VDD
Fig 7. Interruption input timing
tRSL
0.2VDD
RST
Fig. 8. RST input timing
Power supply rise time Power supply cut-off time
VDD
0.05 1
50
ms ms
Item Symbol Pin Conditions Min. Max. Unit
tR tOFF
Power-on reset Repetitive power-on reset
(6) Power-on reset
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, VSS = 0V reference)
VDD
tR tOFF
0.2V
0.2V
4.5V
Turn the power on smoothly.
Fig. 9. Power-on reset
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CXP845F60
Appendix
C1
A
EXTAL
XTAL
C2
Rd
A
EXTAL
XTAL
(i) Main clock
A
EXTAL
XTAL
C1 C2
Rd
(ii) Main clock
∗
1
Models with the built-in ground capacitance (C1, C2).
Manufacturer
MURATA MFG CO., LTD.
TDK CORPORATION.
KINSEKI LTD.
Model
CSA8.00MTZ CSA10.0MTZ CSA12.00MTZ CST8.00MTW
∗
1
CST10.0MT
∗
1
CST12.0MTW
∗
1
CSA16.00MXZ040 CST16.00MXZ0C1
∗
1
CSA20.00MXZ040 CSA24.00MXZ040 CSA28.00MXZ040 CCR20.0MC6
∗
1
CCR24.0MC6
∗
1
HC49/U-S CX-11F
fc (MHz)
8.00
10.00
12.00
8.00
10.00
12.00
16.00
16.00
20.00
24.00
28.00
20.00
24.00
28.00
28.00
30
5 5
OPEN
3
3 16 16
1
1
30
5 5
OPEN
3
3 16 16
1
1
0
0 0 0 0 0 0
0 220 220
C1 (pF) C2 (pF)
Rd (Ω)
Circuit example
(i)
(ii)
(i)
(ii)
(i)
(ii)
(i)
Selection Guide
CXP845F60Q-1-
Fig. 10. SPC700 Series recommended oscillation circuit
Mask Package ROM capacitance Reset pin pull-up resistor Power-on reset circuit
Existent/Non-existent
100-pin plastic QFP
40K bytes
48K bytes
Flash EEPROM 60K bytes
Existent/Non-existent
Existent Existent
Option item
100-pin plastic QFP
AA
AA
AA
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CXP845F60
Characteristics Curves
1
0.01
(10µA)
2 3 4 5 6 7 8 9
0.1
(100µA)
0.5
(500µA)
1
10
20
30
40
IDD vs. VDD
I
DD
– Supply current [mA]
(fc = 28MHz, Ta = 25˚C, Typical)
IDD vs. fc
(VDD = 5V, Ta = 25˚C, Typical)
40
0 10 20 30
50
20
30
10
0
fc – System clock [MHz]V
DD – Supply voltage [v]
I
DD
– Supply current [mA]
Stop mode
Sleep mode
1/2 dividing mode 1/4 dividing mode
1/16 dividing mode
1/2 dividing mode
1/4 dividing mode
1/16 dividing mode
Sleep mode
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CXP845F60
Writing to Flash EEPROM
The CXP845F60 contains the 60K bytes of flash EEPROM. There are two methods to write to the flash EEPROM; off-board write and on-board write. The on-board write supports boot mode and user programming mode. Rewriting at the room temperature is recommended.
1. Off-board write
In order to execute the off-board write, the microcomputer is attached on a conversion adaptor and the adaptor is inserted in the socket of the SFP-1 (flash memory programmer) or NICE-SPC700R. (See Fig. 11.) See the operation manuals for the operation methods of the SFP-1 and NICE-SPC700R. (Mitec SYSTEMS, Inc. manufactures and sells the SFP-1 and NICE-SPC700R.)
Conversion adaptor
Flash memory programmer SFP-1
Fig. 11. Off-board write (when writing by using SFP-1)
2. On-board write
This is performed with the microcomputer mounted on the board. The CXP845F60 supports boot mode and user programming mode. In boot mode, write is performed through the communication with the SFP-1 as shown in Fig. 12.
User board
CXP845F60
SIO communication cable (8 pins)
Flash memory programmer SFP-1
In user programming mode, write is performed in microcomputer mode (normal operation mode) by the communication method (SIO, I/O, etc.) according to the user's application. See the guide of the CXP845F60 write for actual use.
Fig. 12. On-board write boot mode
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CXP845F60
When the on-board write is performed, the pins and flash mode register (FMOD: 01F4h, 0FF0h) should be set as follows.
RST
Pins
Mode
Boot mode
TETA
Low fixed
TETB
High output
TETC
High fixed
PWE
Low fixed
SO1 SI1 SCK1
RST
V
SS
VDD
TETC TETB TETA
When normal operation
Switching circuit
In boot mode
Reset circuit
User circuit
When normal operation
Switching circuit
In boot mode
Switched to boot mode for low level
Switched to boot mode for low level
Cut off the connection to other circuits during the flash EEPROM rewrite.
∗1
AMP CT connector 175489-8
AMP CT receptacle 173977-8
VSS
SO1
SI1
SCK1
RST
V
DD
VSS SEL
GND
SI
SO SCK RES
VIN
GND
Vpp
Flash MCU
PWE
Fig. 13. Connection example for boot mode
1 2 3 4 5 6 7 8
4.7kΩ pull-up Open drain, 4.7kΩ pull-up Open drain, 4.7kΩ pull-up Open drain, 4.7kΩ pull-up
4.7kΩ pull-up
GND SI SO SCK RST VIN GND Vpp
Connector for SFP-1 (AMP CT receptacle 173977-8)
Symbol
Remarks
Connector for user board (AMP CT connector 175489-8)
← →
←→
→ ←
→
GND SO1 SI1 SCK1 RST VDD GND PWE
Remarks
Pull-up in the microcomputer (mask option)
Pull-up in the microcomputer
Pin No.
Signal direction
Symbol
∗1
The Vpp signal for the SFP-1 is pulled down with 4.7kΩ. Connecting cable permits writing when PWE pin is fixed at low level. Also, it can be used as select signal of the switching circuit.
∗1
FLMOD bit is set to "1" automatically in boot mode.
FMOD resister
FLMOD bit
1
∗1
1
User programming mode
On­board write
High level X X X
X: don't care
Page 23
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CXP845F60
Package Outline Unit: mm
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-80P-L01
∗QFP080-P-1420-A
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN SOLDER PLATING COPPER / 42 ALLOY
1.6g
23.9 ± 0.4
20.0 – 0.1
+ 0.4
1
80
65
64
41
40
25
24
0.8
0.35 – 0.1
+ 0.15
14.0 – 0.1
+ 0.4
17.9 ± 0.4
16.3
0.1 – 0.05
+ 0.2
2.75 – 0.15
+ 0.35
0.8 ± 0.2
0.15 – 0.05
+ 0.1
80PIN QFP (PLASTIC)
M
0.12
0.15
0° to 10°
DETAIL A
A
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