Datasheet CXL1008P, CXL1008M Datasheet (Sony)

Page 1
CXL1008M/P
CMOS-CCD Signal Processor for Skew Compensation
Description
CXL1008M/P are CMOS-CCD signal processors developed for the variable-speed video signal processor for home-use 8mm VCRs.
Features
• Low power consumption 105mW (Typ.)
• Built-in peripheral circuit
Structure
CMOS-CCD
Functions
• 1/2H 359-bit, direct 20-bit CCD register
• Clock driver
• Timing oscillation circuit
• Automatic bias circuit
• Sync tip clamp circuit
• Dummy VD insert circuit
• Sample/hold circuit
CXL1008M
28 pin SOP (Plastic)
CXL1008P
28 pin DIP (Plastic)
Absolute Maximum Ratings (Ta = 25°C)
• Supply voltage VDD 11 V
VCL 6V
•Operating temperature Topr –10 to +60 °C
• Storage temperature Tstg –55 to +150 °C
• Allowable power dissipaiton
PD CXL1008M 500 mW
CXL1008P 1000 mW
Recommended Operating Conditions
Supply voltage VDD 9V ± 5 %
VCL 5V ± 5 %
Recommended Clock Conditions
• Clock input amplitude VCLK 0.15 to 1.0 (0.3 Typ.) Vp-p
• Clock frequency fCLK 10.738635 MHz
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
– 1 –
E60248-PS
Page 2
Block Diagram
13
AUTO
FEED OUT
24
FEED IN
25
CCD OUT
23
21
SIG DELAY
SIG IN2
12
CXL1008M/P
SIG OUT
19
AUTOBIAS
CIRCUIT
T10
T9
T1
T2
11
28 27
26
SKEW
2
3
SIG IN1
SKEW IN
4
T3
Pin Configuration (Top View)
1/2H
OUTPUT
D
CIRCUIT
50mV
50mV
REFERENCE
OUTPUT
φ1
CONTROL
φ2
DRIVER
DUTY
CONTROL
6
5
T4
T5
18
1
SS
V
SS
V
14
20
CL
V
TIMING
GENERATOR
DD
V
7
CLK IN
22
REC/PB
8
T6
10
17
16 15
9
MUTE IN
JOG IN EXT VD T8
T7
T8
EXT VD
JOG IN
V
SIG OUT
DD
V
SIG DELAY
REC/PB
CCD OUT
FEED OUT
FEED IN
SKEW IN
T9
T10
SS
15 16 17 18 19 20
23
21 22
24 25 26 27 28
14 13 12 11 10
9 8 7 6 5 4
3 2
1
VCL AUTO SIG IN2 SIG IN1 MUTE IN T7 T6 CLK IN T5 T4 T3 T2 T1
SS
V
– 2 –
Page 3
Pin Description
CXL1008M/P
Pin No.
1 7
10
11
12 13
14 16
17
18
Symbol I/O
VSS CLK IN
MUTE IN
SIG IN1
SIG IN2 AUTO
VCL EXT VD
JOG IN
VSS
I
0.3Vp-p 5V when
I
muting, normally 0V
1.1Vp-p or
I
less
2.2Vp-p or
I
less
O
+5V 5V when VD
I
is inserted JOG mode
I
PB/REC mode 0V
Supply voltage
Description
GND Input the sine wave of 3fsc (10.738635MHz) The video signal mute is generated at High level.
See the Logic Table of Signal Output Selection State (Table 1).
Signal input pin of CCD DL. Input composite video signal.
Signal input pin of the through side. Input composite video signal.
The DC level of automatic bias is output. Power supply 1 Use this pin when VD is inserted to the video signal
with the extrenal dummy VD signal input. JOG/NORMAL PB selection pin.
5V
See the Logic Table of Signal Output Selection State (Table 1).
GND
Impedance
(Ω)
> 50k
> 100k
> 100k
> 100k 10k
> 100k
> 100k
19 20
21
22 23
24 25
SIG OUT VDD
SIG DELAY
REC/PB CCD OUT
FEED OUT FEED IN
O
+9V
I
5V when PB
I
0V when REC O O
I
Final output Power supply 2 After the output from Pin 23 CCD OUT passes through
LPF, input it to the same pin and insert clamp and VD. Operate the clock at High when PB.
Stop the clock at Low when REC. Direct output from CCD DL Feedback DC output Smoothing capacitor connection pin of the bias
commutation loop on the output circuit
0.6 to 1.5k
> 100k
> 100k
0.6 to 1.5k 10k
> 100k
Select Direct DL and 1/2H DL signals when High
26
SKEW IN
I
and Low, respectively. See the Logic Table of CCD DL Mode Selection
> 100k
(Table 2).
Note) T1 through T10 test pins must be connected as shown in the application circuit because of the IC
internal circuit.
Notes on Handling
Countermeasures for electrostatics are necessary because some pins have low electrostatic strength (particularly Pin 26: SKEW IN).
– 3 –
Page 4
Unit Note
Max.
Min. Typ.
1
mA
12
7
1
mA
10
8
V
1.0
0.3
0.15
2
V
6.0
5.0
4.0
2
V
4.4
4.2
4.0
2
V
4.4
4.2
4.0
3
V
2.4
2.0
1.7
3
V
2.5
2.0
1.5
4
mV
55
0
–55
5
dB
3.0
0
–3.0
5
dB
0
–0.8
–1.2
5
dB
0
–0.8
–1.2
6
%
1.3
0
–1.3
7
dB
0
–2
–3
8
dB
—
0
–0.5
8
dB
—
0
–0.5
9
dB
0.2
0
–0.2
CXL1008M/P
10
10
%
%
4
10
3
2
0
0
10
%
4
2
0
H
H
∗1, ∗2
P2 P3 P4 P5
Control Pin Conditions
DD = 9.0V, VCL = 5.0V, fCLK = 10.7MHz, VCLK = 0.3Vp-p sine wave)
a
a
2 3 4 5 P1
a
a
Switch Conditions
c
1
c
H ←→ L
H
H
e
e
a
a
c
b
H
e
e
a
a c
a
H
H L L L
a a
e
e
a
a c
b
L L L
a
a
a
b f
a
b
b
c
b
H ←→ L H
H H L L a
a
b
a
f
a
b
b c
a
L L L
b
b
a
b
b ←→ c
b ←→ d
b
b
c
b
H ←→ L H
H H L L b
b
b
a
b ←→ c
b ←→ d b
b c
a
L
H
L
L
L
L
c
c
c
a
b
b
g
g
g
b
b
b
c
b
a
PB, JOG
Symbol Test Conditions
DD
I
ICL
Items
Electrical Characteristics
(See the Electrical Characteristics Test Circuit) (Ta = 25°C, V
Power current
CLK
Vdi1
Vdi2
Vdi3
Clock input level
Signal input pin voltage
Direct ←→ 1/2H
Vdo1
Vdo2
∆Dab
IGCCD
IGIn2
Signal output pin voltage
CCD signal output
voltage difference
Signal insert gain
– 4 –
Direct ←→ 1/2H
3.58MHz/100kHz
10MHz/100kHz
IGDL
∆Gab
fCCD
fIn2
CCD output signal gain
difference
Frequency characteristics
10MHz/100kHz
Direct ←→ 1/2H at 3.58MHz
1.1Vp-p input
2.2Vp-p input
2.2Vp-p input
fDL
∆fab
DGCCD
DGIn2
DGDL
Frequency characteristics
difference
Differential gain
Page 5
Unit Note
Max.
Min. Typ.
10
deg
5
3
0
10
deg
5
3
0
10
deg
5
3
0
Vp-p
1.1
—
—
Vp-p
2.2
—
—
11
dB
—
55
50
11
dB
—
65
50
11
dB
—
65
50
12
mV
100
50
0
V
—
4.0
CXL1008M/P
V
1.0
—
H
∗1, ∗2
P2 P3 P4 P5
Control Pin Conditions
2 3 4 5 P1
Switch Conditions
1
L
H
L
L
L
L
c
c
c
a
b
b
g
g
g
b
b
b
c
b
a
1.1Vp-p input
2.2Vp-p input
2.2Vp-p input
H
L
H
H
L
L
L
L
L
d
d
d
a
a
b
b
b
g
g
f ←→ e
a ←→ e b
b
c
a/b
c
b
g
f ←→ e b
a
a
a
2Vp-p video signal from
sync tip
Symbol Test Conditions
CCD
DP
DPIn2
Items
Differential phase
DPDL
VIN1–AC
VIN2–AC
S/NCCD
S/NIn2
Allowable input amplitude
S/N rate
S/NDL
VVD
VD insert depth
VIN H
VIN L
Control pins correspond to P1 through P5 of the Electrical Characteristics Test Circuit.
Logical input
1
∗
– 5 –
Symbols "H" and "L" in control pin conditions represent "VIN H" and "VIN L" of logical input.
∗2
Page 6
ANALYZER
SPECTRUM
OSCILLOSCOPE
VECTOR SCOPE
×1
NOISE METER
GROUND
100kHz 1.1Vp-p SINE WAVE
100kHz 300mVp-p SINE WAVE
b
a
10MHz 300mVp-p SINE WAVE
3.58MHz 300mVp-p SINE WAVE
c
d
e
CXL1008M/P
5-STAIR CASE WAVE
100kHz 2.2Vp-p SINE WAVE
f
g
14
13
12
11
10
9
8
7
6
5
4
3
2
1
10µ
100k
SW3
A1
5V
0.1µ
5V
P1
0.1µ
SW1
a
b
CLK
V1
b
a
SW2
c
Note 2) BPF Frequency Response
Note 1) LPF Frequency Response
BIAS
V
20k1M
Frequency [Hz]
200 50
0
–3
[dB]
0
–3
(Delay Time to 140ns)
[dB]
0 4.1M 10.7M
–50
Frequency [MHz]
0 5.8 10.7
–50
LPF
c
BPF
×1 ×1
0.1µ d
2SA1175
V2
220k
10µ
0.1µ
Note 2)
P2P3P5
9V
P4
5V
22µ
390k
A2
15
16
17
18
19
20
21
22
23
10k
24
25
2627
28
Note 1)
×1
a
b
SW5
SW4
a
2k
b
2k
2SA1175
V3
9V
5V
Electrical Characteristics Test Circuit
– 6 –
Page 7
CXL1008M/P
Notes)
1) Current value when the clock is in operation in the PB or JOG mode. In the REC mode, the clock is stopped (Pin 22 is at low) to save power.
2) With the signal input pin voltage value, the video signal sync tip is clamped.
3) Vdo1 is a CCD OUT output voltage when the SIG IN1 input voltage is Vdi1. Vdo2 is a SIG OUT output voltage when the SIG IN2 input voltage is Vdi2. Vdo1 and Vdo2 represent outputs for the sync tip clamp level when a white level signal is input as shown in the diagram.
Output signal
Vdo
100%40%
1.0Vp-p
Vdi Input signal
4) ∆Dab denotes an output voltage difference of CCD OUT when the direct DL and 1/2H DL are switched.
5) IGCCD is a CCD OUT gain when a 1.1Vp-p 100kHz sine wave is input to SIG IN1.
IGCCD = 20 log
Output amplitude (Vp-p)
1.1Vp-p
It is measured by giving a Vdi1 + 0.6 bias with VBias. IGin2 and IGDL are SIG OUT gains when 2.2Vp-p 100kHz sine wave is input to each of SIG IN2 and SIG DELAY pins.
IGin2 = 20 log
Output amplitude (Vp-p)
2.2Vp-p
It is measured by giving a Vdi2 + 1.1V bias with VBias.
– 7 –
Page 8
CXL1008M/P
6) ∆Gab is a gain difference between the direct DL and 1/2H DL.
7) It represents a loss at 3.58MHz compared with 100kHz. It is measured by raising the SIG IN1 input pin by 0.6V higher than the sync tip clamp level (Vdi1) with VBias.
3.85MHz 300mVp-p sine wave 100kHz 300mVp-p sine wave
SIG IN1 DC
F
CCD = 20 log
V3.58MHz output
VBias = Vdi1 + 0.6V
V100kHz output
8) It represents a loss at 10MHz compared with 100kHz. It is measured by raising the SIG IN2 or SIG DELAY input pin by 1.1V higher than the sync tip clamp level (Vdi2 or Vdi3) with VBias.
9) ∆Fab is a frequency response difference between the direct DL and 1/2H DL.
10)
Chroma 40 IRE
140 IRE
1H 63.5µs
1.1Vp-p at DGCCD
2.2Vp-p at DGin2 or DGDL
40 IRE
DG is measured with a vectorscope in each mode of the 5-stage waves.
11) Measure S/N of the BPF 100kHz to 4.2MHz in the subcarrier trap mode with a video noise meter.
12)
SIG DELAY Input waveform
EXT VD input
SIG OUT Output waveform
VD
V
2Vp-p
Set a voltage value at VVD when inserting EXT VD to the 2Vp-p signal output waveform sync tip of SIG OUT.
– 8 –
Page 9
CXL1008M/P
CLOCK
3fsc (10.738635MHz) Sine wave
0.15 to 1.0Vp-p
Function Outline
Output signal selection
SIG IN2 (PB)
SIG DELAY (JOG)
50mV REF
SIG OUT
The video output signal is selected by selecting the output switch for three signals: Pin 10 (MUTE IN), Pin 17 (JOG IN) and Pin 16 (EXT VD).
Table 1. Logic Table of Signal Output Selection State
Input control signal state Video signal output selection state
JOG IN
0 0 0 0 1 1 1 1
MUTE IN EXT VD PB JOG VD insert MUTE
0 0 1 1 0 0 1 1
0 1 0 1 0 1 0 1
O O
× × × × × ×
× × × ×
O
× × ×
× × × × ×
O
×
O
× ×
O O
× ×
O O
Note 1) Figures "0" and "1" of the input control signal state are equivalent to "Low" and "High" of logic. Note 2) Items marked with the symbol "O" in the video signal output selection state are selected. Note 3) PB = JOG IN · MUTE IN
JOG = JOG IN · MUTE IN · EXT VD VD insert = JOG IN · EXT VD MUTE = MUTE IN
– 9 –
Page 10
CXL1008M/P
CCD selection
SIG IN1
Application Circuit
SKEW IN
1/2H (359bit)
D (20bit)
10µ
220k
2728
10µ
26
4.7k2.2k
10k
SKEW IN
390
220
10k
25
10µ
2k
24
22µ
CCD OUT
8.2k390
18k
REC/PB
23
0.022µ
1M
22
1k
1.8k
120 10µH
220p 270p
47µ
21
20
Table 2. Logic Table of CCD DL Mode
Selection
1.5k
19
Control signal
SKEW IN
JOG
1000p
18
IN
17
0 1
560
EXT
VD
16
CCD DL mode
D
×
O
9V
SIGNAL OUTPUT
220k
15
1/2H
O
×
6
1
2
3
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
5
4
100k
7
0.01µF
3fsc
0.3Vp-p
SINE WAVE
Transistor to be used PNP: 2SA1175
9
8
10
MUTE
IN
2M
11
2M
0.047µ
12
10µ
0.047µ
13
510
14
5V
47µ 1000p
510
Frequency characteristics (Ta = 25°C)
0
–1
Gain [dB]
–2
SIGNAL INPUT
10k 100k 1M
f – Frequency [Hz]
– 10 –
Page 11
CXL1008M/P
Supply voltage (VCL) vs.
2
1
0
–1
– Insert gain [dB]
CCD
IG
–2
–3
Supply voltage (VCL) vs.
Differential gain (DG
5
4
Insert gain (IG
CCD)
5.004.75
V
CL – Supply voltage [V]
CCD)
5.25
Supply voltage (VCL) vs.
Frequency characteristics (f
1
0
–1
–2
–3
– Frequency characteristics [dB]
CCD
f
–4
5.004.75
V
CL – Supply voltage [V]
Supply voltage (VCL) vs.
Output pin voltage (V
2.5
CCD)
5.25
do1)
3
2
– Differential gain [%]
CCD
1
DG
0
V
CL – Supply voltage [V]
Supply voltage (VDD) vs.
Insert gain (IG
2
1
0
–1
– Insert gain [dB]
CCD
IG
–2
–3
V
DD – Supply voltage [V]
2.0
1 – Output pin voltage [V]
do
V
1.5
5.004.75
5.25
5.004.75
V
CL – Supply voltage [V]
5.25
Supply voltage (VDD) vs.
CCD)
– Frequency characteristics [dB]
CCD
f
9.08.5
9.5
Frequency characteristics (f
1
0
–1
–2
–3
–4
V
DD – Supply voltage [V]
CCD)
9.08.5
9.5
– 11 –
Page 12
CXL1008M/P
Supply voltage (VDD) vs. Differential gain (DG
5
4
3
2
– Differential gain [%]
CCD
DG
1
0
V
DD – Supply voltage [V]
Ambient temperature (Ta) vs.
Insert gain (IG
2
1
Supply voltage (VDD) vs.
CCD)
2.5
2.0
1 – Output pin voltage [V]
do
V
9.08.5
9.5
1.5
Output pin voltage (V
9.08.5
V
DD – Supply voltage [V]
do1)
9.5
Ambient temperature (Ta) vs.
CCD)
Frequency characteristics (f
1
0
CCD)
0
–1
– Insert gain [dB]
CCD
IG
–2
–3
Ta – Ambient temperature [°C]
Ambient temperature (Ta) vs.
Differential gain (DG
5
4
3
2
– Differential gain [%]
CCD
DG
1
–1
–2
– Frequency characteristics [dB]
–3
CCD
f
200
40
60
–4
200
6040
Ta – Ambient temperature [°C]
Ambient temperature (Ta) vs.
CCD)
2.5
2.0
1 – Output pin voltage [V]
do
V
Output pin voltage (V
do1)
0
200
40
60
Ta – Ambient temperature [°C]
1.5 200
6040
Ta – Ambient temperature [°C]
– 12 –
Page 13
Package Outline Unit: mm
CXL1008M/P
CXL1008M
28PIN SOP (PLASTIC)
+ 0.4
18.8 – 0.1
28 15
+ 0.3
114
0.45 ± 0.1
0.24
M
1.27
PACKAGE STRUCTURE
PACKAGE MATERIAL
SONY CODE EIAJ CODE
JEDEC CODE
SOP-28P-L02 SOP028-P-0375
LEAD TREATMENT LEAD MATERIAL
7.6 – 0.1
10.3 ± 0.4
PACKAGE MASS
9.3
+ 0.1
0.15 – 0.05
+ 0.4
2.3 – 0.15
0.15
+ 0.2
0.1 – 0.05
0.5 ± 0.2
EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY
0.6g
CXL1008P
28PIN DIP (PLASTIC)
+ 0.4
37.8 – 0.1
28 15
+ 0.3
15.24
13.0 – 0.1
114
Two kinds of package surface:
1.All mat surface type.
2.Center part is mirror surface.
SONY CODE EIAJ CODE JEDEC CODE
2.54
0.5 ± 0.1
1.2 ± 0.15
DIP-28P-03 DIP028-P-0600
+ 0.4
4.6 – 0.1
0.5 MIN
3.0 MIN
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS
EPOXY RESIN SOLDER PLATING COPPER ALLOY
4.2g
+ 0.1
0.25 – 0.05
0° to 15°
– 13 –
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