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High-Frequency SPDT Antenna Switch
For the availability of this product, please contact the sales office.
Description
The CXG1012N is an antenna switch MMIC. This
IC is designed using the Sony’s GaAs J-FET process
and operates at a single positive power supply.
Features
• Single positive power supply operation
• Insertion loss 0.5 dB (Typ.) at 2.0 GHz
• Medium power switching
P1dB (Typ.) 29 dBm at 2.0 GHz
VCTL (H)=3.0V
33 dBm at 2.0 GHZ
VCTL (H)=4.0 V
Application
Antenna switch for digital cordless telephones
Structure
GaAs J-FET MMIC
Absolute Maximum Ratings (Ta=25 ˚C)
• Control voltage Vctl 6 V
• Operating temperature Topr –35 to +85 ˚C
• Storage temperature Tstg –65 to +150 ˚C
Operating Condition
Control voltage 0/3 V
CXG1012N
SSOP-8P-L01 (Plastic)
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E95444A57-TE
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CXG1012N
Electrical Characteristics
VCTL (L) =0V, VCTL (H) =3V, Pin=21.5dBm (Ta=25 ˚C)
Item Symbol Condition Min. Typ. Max. Unit
Insertion loss
Isolation
Insertion loss
Isolation
Input VSWR
Output VSWR
Switching time
Control pin current
IL1 f=1.0 GHz 0.3 0.6 dB
ISO1 30 35 dB
IL2 f=2.0 GHz 0.5 0.8 dB
ISO2 20 23 dB
VSWRIN 1.3 1.5
VSWROUT 1.3 1.5
TSW 100 ns
ICTL 70 150 µA
VCTL (L) =0V, f =2.0GHz
1 dB gain compression
point output
P1dB (3) VCTL (H) =3 V
26 29 dBm
1 dB gain compression
point output
P1dB (4) VCTL (H) =4 V
30 33 dBm
Block Diagram Package outline/Pin Configuration
1
8-pin SSOP (plastic)
Port1
Port3
Port2
CTLB
Port1
GND
CTLA
VCTLA VCTLB
High Low
Low High
Port1-Port2 ON
Port1-Port3 OFF
Port1-Port2 OFF
Port1-Port3 ON
(Ta=25 ˚C)
8
Port3
GND
GND
Port2
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Recommended Circuit
A
A
A
A
A
A
A
A
A
A
CXG1012N
CTLB
100pF
Port1
100pF
CTLA
100pF
Example of Representative Characteristics (Ta=25 ˚C)
1
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2
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3
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4 5
0
Insertion loss
–2
Insertion loss, isolation vs. Input power
CXG1012N
AAAAAAAAA
–4
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–6
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Insertion loss (dB)
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Isolation
VCTL (H) =5V
VCTL (H) =4V
VCTL (H) =3V
VCTL (H) =3
V
VCTL (H) =4V
VCTL (H) =5V
Port3
8
100pF
7
6
Port2
100pF
0
–10
–20
Isolation (dB)
AAAAAAAAA
20 24 28 3632 40
Input power (dBm)
0
–1
–2
–3
Insertion loss (dB)
–4
Insertion loss, isolation vs. Frequency
Insertion loss
Isolation
0
–10
–20
–30
–40
–5
Frequency (GHz)
–50
3210
–30
Isolation (dB)
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Package Outline Unit: mm
∗3.0 ± 0.1
8PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
CXG1012N
58
∗4.4 ± 0.1
1
+ 0.08
0.24 – 0.07
B
+ 0.08
0.24 – 0.07
(0.22)
NOTE: Dimension “∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
4
0.65
0.13
DETAIL B
SSOP-8P-L01
SSOP008-P-0044
M
+ 0.025
0.17 – 0.015
(0.15)
A
6.4 ± 0.2
0.25
0.1 ± 0.05
0° to 10°
DETAIL
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER / PALLADIUM
COPPER ALLOY
0.04g
0.1
A
(0.5)
0.6 ± 0.15
PLATING
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