Timing Generator for Progressive Scan CCD Image Sensor
Description
The CXD3607R is a timing generator IC which
generates the timing pulses required by Progressive
Scan CCD image sensors as well as signal processing
circuits.
Features
• Base oscillation frequency 57.3MHz
• High-speed/low-speed shutter function
• Supports FINE and DRAFT mode drive
(15 frames/s, 60 frames/s possible)
• Random trigger shutter function
(Supports TRIG and TRIGOUT mode drive)
• Horizontal driver for CCD image sensor
• Vertical driver for CCD image sensor
Applications
Progressive scan CCD cameras
Structure
Silicon gate CMOS IC
Absolute Maximum Ratings
• Supply voltageVDDa, bVss – 0.3 to +7.0V
• Input voltageVIVss – 0.3 to VDD + 0.3 V
• Output voltageVO1Vss – 0.3 to VDD + 0.3 V
• Operating temperature
• Storage temperature
48 pin LQFP (Plastic)
VL–10.0 to VssV
VHVL – 0.3 to +26.0V
VO2VL – 0.3 to Vss + 0.3V
VO3VL – 0.3 to VH + 0.3V
Topr–20 to +75°C
Tstg–55 to +150°C
Applicable CCD Image Sensors
ICX285 (Type 2/3, 1450K pixels)
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Recommended Operating Conditions
• Supply voltageVDDa4.75 to 5.25V
VDDb3.0 to 3.6V
VM0.0V
VH14.55 to 15.45V
VL–7.5 to –6.5V
• Operating temperature
Topr–20 to +75°C
– 1 –
E01318-PS
Page 2
Block Diagram
CXD3607R
OSCI
OSCO
CKI
CKO
MCKO
SSI
SCK
SEN
VD
HD
TRIG
27
26
25
23
22
29
30
31
32
33
34
XSHD
16
XSHP
17
Register
XCPDM
192021
18
1/2
XCPOB
PBLK
1
ADCLKRGV
10
SS
1112
Pulse Generator
H1
V Driver
13
H2
14
1
DD
V
15
28
24
36
38
39
40
42
47
48
37
41
45
VDD2
DD
3
V
V
DD
4
SS
2
V
SS
3
V
1
SS
4
V
V1
V4
V2A
V2B
V3
SUB
V
M
V
H
V
L
2
RST
378
SYNSL
9
TEST1
TEST2
– 2 –
35
WEN
Page 3
Pin Configuration (Top View)
CXD3607R
V
V1
V4
V2A
V
V2B
NC
NC
V
NC
V3
SUB
29
SSI
3
DD
V
OSCI
OSCO
262728
25
CKI
24
23
22
21
20
19
18
17
16
15
14
13
V
SS
2
CKO
MCKO
ADCLK
PBLK
XCPOB
XCPDM
XSHP
XSHD
V
DD
2
DD
1
V
H2
3
SS
V
36
M
37
35
WEN
TRIG
HD
VD
323334
31
SEN
SCK
30
38
39
40
H
41
42
43
44
L
45
46
47
48
123456789101112
4
SS
V
RST
SYNSL
NC
NC
NC
4
DD
V
TEST1
TEST2
RG
1
SS
V
H1
∗
Groups of pins enclosed in the figure indicate sections for which power supply separation is possible.
VL to VM
VM to VH
VL to VH
VM to VL
VH to VM
VH to VL
ConditionsMin.Typ.Max.Unit
200
200
30
200
200
30
350
350
60
350
350
60
500
500
90
500
500
90
1.0
1.0
1.0
1.0
ns
ns
ns
ns
ns
ns
V
V
V
V
1. The MOS structure of this IC has a low tolerance for static electricity, so full care should be given for
measures to prevent electrostatic discharge.
2. For noise and latch-up countermeasures, be sure to connect a by-pass capacitor (0.1µF or more)
between each power supply pin (VH, VL) and GND.
3. To protect the CCD image sensor, clamp the SUB pin output at VH before input to the CCD image sensor.
See the CCD image sensor data sheet for details.
– 7 –
Page 8
Switching Wa veforms
CXD3607R
V2A, V2B
V1, V3, V4
TTLM
10%
TTLM
10%
TTMHTTHM
90%
10%
90%
90%
90%
10%
90%
90%
TTLHTTHL
90%90%
TTML
10%
TTML
10%
H
V
V
M
V
L
V
M
V
L
V
H
Waveform Noise
SUB
VCLH
10%10%
VCMH
VCLL
VCML
V
L
V
M
VL
– 8 –
Page 9
AC Characteristics
AC characteristics between the serial interface clocks
CXD3607R
Symbol
ts1
th1
ts2
ts3
SSI
SSI
SCK
SEN
SEN
SSI setup time, activated by the rising edge of SCK
SSI hold time, activated by the rising edge of SCK
SCK setup time, activated by the rising edge of SEN
SEN setup time, activated by the rising edge of SCK
0.2V
DD
b
0.2V
0.8VDDb
0.8VDDb
b
th1ts1
ts2
DD
0.2V
DD
b
ts3
DefinitionMin.Typ.Max.Unit
Serial interface clock internal loading characteristics
DD
b
0.2V
DD
b
0.8V
DD
b
0.2V
(Within the recommended operating conditions)
20
20
20
20
Example: During FINE mode
ns
ns
ns
ns
HD
V2
SCK
SEN
∗
Be sure to maintain a constantly high SEN logic level from around the falling edge of the HD 8H after the
0.2V
DD
ts1
0.8V
b
DD
b
8H9H
0.2VDDb
th1
0.8V
DD
b
falling edge of VD to around the 9H falling edge and during that horizontal period.
(Within the recommended operating conditions)
Symbol
ts1
th1
Second SCK clock setup time after the rising edge of SEN,
activated by the falling edge of HD
SEN hold time, activated by the falling edge of 9H HD
DefinitionMin.Typ.Max.Unit
5
30
– 9 –
ns
µs
Page 10
CXD3607R
Serial interface clock output variation characteristics
The serial interface data “Standby setting” is loaded to the CXD3607R and controlled at the rising edge of the
second SCK clock after the rising edge of SEN.
SEN
0.8VDDb
SCK
Output signal
tpdPULSE
(Within the recommended operating conditions)
SymbolDefinitionMin.Typ.Max.Unit
tpdPULSE
Output signal delay, activated by the rising edge of the
second SCK clock after the rising edge of SEN
10ns
100
RST loading characteristics
RST
0.2VDDb
0.2VDDb
tw1
(Within the recommended operating conditions)
SymbolDefinitionMin.Typ.Max.Unit
tw1
RST pulse width
35
VD, HD and TRIG loading characteristics
DD
b
VD/HD/TRIG
0.2V
DD
b
ts1
th1
0.8V
ns
MCKO
0.2VDDb
0.8VDDb
MCKO load capacitance = 16pF
(Within the recommended operating conditions)
SymbolDefinitionMin.Typ.Max.Unit
ts1
th1
VD/HD/TRIG setup time, activated by the rising edge of MCKO
VD/HD/TRIG hold time, activated by the rising edge of MCKO
20
5
– 10 –
ns
ns
Page 11
Output variation characteristics
CXD3607R
MCKO
WEN
WEN load capacitance = 10pF
SymbolDefinition
tpd1
Time until WEN changes after the rise of MCKO
0.8VDDb
tpd1
(Within the recommended operating conditions)
Min.Typ.Max.Unit
ns–60
– 11 –
Page 12
CXD3607R
Description of Operation
Pulses output from the CXD3607R are controlled mainly by the RST and SYNSL pins and by the serial
interface data.
Control by the RST Pin
System reset is performed by setting the CXD3607R RST pin (Pin 2) low. After reset is canceled, the serial
data block is “XSHP, XSHD logic phase adjustment setting” D0 bit = 1 and all other bits = 0.
In addition, when RST = low, some circuit operations in the IC are stopped as shown in the Pin Status Table
below.
CKI
OSCO
OSCI
VDD3
SSI
SCK
SEN
VD
HD
TRIG
WEN
VSS3
VM
V1
V4
V2A
VH
V2B
NC
NC
VL
NC
V3
SUB
ACT
ACT
ACT
—
DIS
DIS
DIS
DIS
DIS
DIS
L
—
—
VL
VL
VM
—
VM
—
—
—
—
VM
VL
Note) ACT means that the circuit is operating, and DIS means that loading is stopped.
L indicates a low output level, and H a high output level in the controlled status.
VM and VL indicate the voltage levels applied to VM (Pin 37) and VL (Pin 45), respectively.
– 12 –
Page 13
CXD3607R
Control by the SYNSL Pin
The CXD3607R sync system can be switched by the CXD3607R SYNSL pin (Pin 3).
Low: MCKO sync (Normally use with this system configuration.)
Select this when sync signals VD and HD are generated by the MCKO output of the CXD3607R. The VD
and HD inputs are loaded to the CXD3607R at the rising edge of the MCKO pulse.
High: CKI sync
Select this when sync signals VD and HD are generated by the CKI input of the CXD3607R. The VD and
HD inputs are loaded to the CXD3607R at the rising edge of the CKI pulse, and the two MCKO logic
phases (a) and (b) existing after power-on can be aligned at the initial HD input by resetting the inter nal
clock.
Low: MCKO sync
High: CKI syncHigh: MCKO reset for CKI sync
CKI
Sync signal
generator block
VD/HD
HD
CKI
MCKO (a)
MCKO (b)
CXD3607R
CKI
MCKO
Sync signal
generator block
VD/HD
CXD3607R
Control by the Serial Interface Data
The CXD3607R loads the serial interface data in the following for mat at the rising edge of the second SCK
clock after the rising edge of SEN.
∗
Make sure that SCK does not stop even while SEN is high.
SD11SSI
SD10 SD9 SD8 SD7 SD6 SD5 SD4 SD3 SD2 SD1 SD0
SCK
SEN
In addition, the data are actually reflected at the following positions.
Data other than the following→ Reflected at the falling edge of the HD 8H after the falling
edge of VD.
2. Special drive data “SUB stop setting” → Reflected at the falling edge of the HD 9H after the falling
edge of VD.
4. Shutter data “Shutter SUB setting”→ Reflected at the falling edge of the HD 9H after the falling
edge of VD.
5. TRIG data→ Reflected at the falling edge of the HD 1H after the falling
edge of TRIG.
(Only when the TRIG function setting is 1: TRIG function
enabled)
6. Other data “Standby setting”→ Reflected at the rising edge of the second SCK clock after
the rising edge of SEN.
There are six categories of serial interface data: drive mode data, special drive data, logic phase adjustment
data, shutter data, TRIG data and other data. The details of the data for each category are described below.
∗
After reset is canceled, the serial data block is “XSHP, XSHD logic phase adjustment setting” D0 bit = 1 and
all other bits = 0.
– 13 –
Page 14
CXD3607R
1. Drive mode data
SD11Description of settings
SD101SD91SD81SD70SD61SD51SD40SD3XSD2D2SD1D1SD0
0
Drive mode setting, TRIG
D0
function setting
2. Special drive data
SD11Description of settings
SD100SD91SD80SD71SD60SD5XSD4XSD3XSD2XSD1D1SD0
0SG and SUB stop settings
D0
3. Logic phase adjustment data
SD11Description of settings
SD10 SD9 SD8
0
01
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
1
1
D1
D0
0
0
D1
D0
0
0
0
0
0
0
0
0
XSHP logic phase adjustment
0
setting
XSHD logic phase adjustment
0
setting
1
0
1
D1
D0
0
0
0
0
ADCLK logic phase adjustment
0
setting
4. Shutter data
SD11Description of settings
SD10 SD9 SD8 SD7 SD6
0
110
1
1
0
SD5
SD4
SD3
SD2
SD1
SD0
0
D5
D4
D3
D2
D1
D0
Shutter V setting
1
D11
D10
0
D5
D4
D9
D3
D8
D2
D7
D1
D6
D0
Shutter SUB setting
1
D11
D10
D9
D8
D7
D6
5. TRIG data
SD11Description of settings
SD10 SD9 SD8 SD7 SD61SD5
SD4
SD3
SD2
SD1
SD0
SG and SUB stop settings
0
0
D3
D2
D1
High-speed sweep setting
D0
Clamp pulse stop setting
0
0
1
D3
D2
D1
D0
11110
1
0
D7
D6
D5
1
1
X
D10
0
D3
D2
D9
D1
0
1
D7
D6
D5
SG generation position setting
D4
D8
D0
SUB setting
D4
6. Other data
SD11Description of settings
SD101SD91SD81SD71SD60SD50SD4XSD3XSD2XSD1XSD0
1Standby setting
D0
– 14 –
Page 15
Detailed Description of each Data
1. Drive mode data
(1) Drive mode setting
The CXD3607R drive mode can be switched as follows.
∗
TRIGOUT mode is the mode which stops the SG pulse (ternary value output of the V2A and V2B pulses)
and the corresponding V pulse of FINE mode. Note that this is different from the special drive data “SG
stop setting”.
D1D0Description of operation
CXD3607R
0
0
1
0
DRAFT mode
1
FINE mode
X
TRIGOUT mode
(2) TRIG function setting (valid in DRAFT, FINE and TRIGOUT modes)
The CXD3607R random trigger shutter function disabled/enabled setting can be switched as follows.
∗
For details, see “Special Dr ive Sequence (Random trigger shutter drive)”.
D2Description of operation
01TRIG function disabled
TRIG function enabled
2. Special drive data
(1) SG stop setting (valid in DRAFT and FINE modes)
SG pulse (ternar y value output of the V2A and V2B pulses) stopped/not stopped can be selected by the
D0 setting.
∗
When SG stopped is selected, the corresponding V pulse is not stopped.
∗
When SG stopped is selected, WEN becomes inactive during that VD period.
D0Description of operation
01SG not stopped
SG stopped
(2) SUB pulse stop setting (valid in DRAFT, FINE and TRIGOUT modes)
SUB pulse stopped/not stopped can be selected by the D1 setting.
D1Description of operation
01SUB not stopped
SUB stopped
– 15 –
Page 16
3. Logic phase adjustment data
(1) XSHP and XSHD logic phase adjustment setting
The XSHP and XSHD logic phase adjustment can be selected by the D1 and D0 setting.
∗
The default when reset is 90°.
∗
For details, see the high-speed phase timing chart.
D1D0Description of operation
0
0
0°
CXD3607R
0
1
1
1
0
1
90° (default)
180°
270°
(2) ADCLK logic phase adjustment setting
The ADCLK logic phase adjustment can be selected by the D1 and D0 setting.
∗
The default when reset is 0° (pulse delayed 90° relative to MCKO).
∗
For details, see the high-speed phase timing chart.
D1D0Description of operation
0
0
1
1
0
1
0
1
0° (default)
90°
180°
270°
– 16 –
Page 17
4. Shutter data
(1) Shutter V setting (valid in DRAFT and FINE modes)
The SG stopped VD period, that is to say the exposure time, can be adjusted from 0 to 4095V in 1V units
by the D11 to D0 setting. Setting all 0 results in the high-speed shutter corresponding to the shutter SUB
setting.
∗
During the SG stopped VD period, data other than 5. TRIG data and 6. Other data are not reflected.
∗
During the SG stopped VD period, only the SG pulse is stopped, and the corresponding V pulse is not
stopped.
∗
During the SG stopped VD period, PBLK, XCPOB and XCPDM are active, and WEN is inactive.
The SG stopped VD period (V) for each serial setting value and the shutter V setting outline diagrams (for
SG stopped VD periods 0V and 1V) are shown below.
D11SG stopped VD period (V)
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CXD3607R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Shutter V setting: 0V = high-speed shutter
VD
V2A
SUB
Exposure time
Serial data
reflected
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
1
2
:
1
1
1
1
0
1
1
1
1
1
4094
4095
Shutter V setting: 1V
VD
V2A
SUB
Exposure time
Serial data
reflected
– 17 –
Page 18
(2) Shutter SUB setting (valid in DRAFT, FINE and TRIGOUT modes)
The charge drain period by the SUB pulse can be adjusted from 1 to 4095H in 1H units by the D11 to D0
setting. The number of SUB pulses for each serial setting value is shown below.
∗
Setting values in excess of the maximum number of pulses per VD period (example: 1068 pulses for
VD = 1068H) are fixed to the maximum number of pulses.
∗
When performing long-time exposure with the shutter V setting, setting values in excess of the maximum
number of pulses per VD period are fixed to the maximum number of pulses.
∗
Setting all 1 results in all SUB output (ALL), for any VD period.
D11Number of SUB pulses
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CXD3607R
0
0
0
0
0
0
0
0
1
1
1
1
1
1
Shutter SUB setting
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
1
:
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1H2H3H4H4094H4095H 4096H to
HD
V2A
0
1
2
3
:
4093
4094
4095
(All)
1
1
2
3
:
4093
4094
All
– 18 –
Page 19
5. TRIG data
(1) SG stop setting (valid only during TRIG drive)
SG pulse (ternary value output of the V2A and V2B pulses) stopped/not stopped during TRIG drive can be
selected by the D0 setting.
∗
When SG stopped is selected, the corresponding V pulse is not stopped.
D0Description of operation
0
SG not stopped (TRIG drive)
1
SG stopped (TRIG drive)
(2) SUB stop setting (valid only during TRIG drive)
SUB pulse stopped/not stopped during TRIG drive can be selected by the D1 setting.
D1Description of operation
0
SUB not stopped (TRIG drive)
1
SUB stopped (TRIG drive)
CXD3607R
(3) High-speed sweep setting (valid only during TRIG drive)
High-speed sweep on/off during TRIG drive can be selected by the D2 setting.
(For details, see Chart-4 to Chart-7.)
D2Description of operation
0
High-speed sweep on (TRIG drive)
1
High-speed sweep off (TRIG drive)
∗
The number of V transfers (stages) for high-speed sweep differs according to the drive mode during
TRIG pulse input.
(For details, see Chart-12 and Chart-13.)
(4) Clamp pulse stop setting (valid only during TRIG drive)
XCPDM, XCPOB and PBLK stopped/not stopped from SG pulse generation until 7H after the falling edge
of the next valid VD during TRIG drive can be selected by the D3 setting.
(For details, see Chart-4 to Chart-7.)
D3Description of operation
0
Clamp pulses not stopped (TRIG drive)
1
Clamp pulses stopped (TRIG drive)
– 19 –
Page 20
(5) SG generation position setting (valid only during TRIG drive)
The SG pulse (ternar y value output of the V2A and V2B pulses) generation position dur ing TRIG drive can
be selected from 2 to 2048H counting from the next HD after the f alling edge of the TRIG pulse by the D10
to D0 setting. The SG generation position (H) for each serial setting value is shown below.
(For details, see Chart-4 to Chart-7.)
CXD3607R
D10
D9
D8
D7
D6
D5D4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
1
:
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
∗
When high-speed sweep is on, a SG generation prohibited area exists. When this area is designated, the SG
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
SG generation position (H)
0
1
0
1
1
0
1
2046
2047
2048
2
2
3
4
:
pulse is generated at the position indicated below. When the drive mode during TRIG pulse input is:
DRAFT mode: When the prohibited area 2 to 57H is designated, the SG pulse is generated at 58H.
FINE/TRIGOUT mode: When the prohibited area 2 to 214H is designated, the SG pulse is
generated at 215H.
∗
VD input is not accepted until 2H after the SG generation position (H), and is accepted from 3H onward.
(Example: When the SG generation position is 58H, VD input is not accepted from 1 to 59H, and is
accepted from 60H onward.)
(6) SUB setting (valid only during TRIG drive)
The number of SUB pulses during TRIG drive can be selected by the D7 to D0 setting. The number of
SUB pulses for each serial setting value is shown below.
D7
D6
D5
D4
D3
D2
D1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
:
1
1
0
1
0
1
0
1
1
0
1
0
1
1
1
1
0
1
0
1
1
∗
When high-speed sweep is off, the number of SUB pulses is two regardless of the drive mode during
D0
0
1
0
1
1
0
1
Number of SUB pulses
1
1
2
3
:
213
214
215
TRIG pulse input and the SUB setting value.
∗
When high-speed sweep is on, the maximum number of SUB pulses is as follows according to the drive
mode during TRIG pulse input. Setting values in excess of the maximum number of pulses are fixed to
the maximum number of pulses. (For details, see Chart-4 to Char t-7.)
CKI
OSCO
OSCI
VDD3
SSI
SCK
SEN
VD
HD
TRIG
WEN
VSS3
VM
V1
V4
V2A
ACT
ACT
ACT
—
ACT
ACT
ACT
DIS
DIS
DIS
L
—
—
VM
VM
VH
17
18
19
20
21
22
23
24
XSHP
XCPDM
XCPOB
PBLK
ADCLK
MCKO
CKO
VSS2
L
L
L
L
L
ACT
ACT
—
41
42
43
44
45
46
47
48
VH
V2B
NC
NC
VL
NC
V3
SUB
—
VH
—
—
—
—
VM
VH
Note) ACT means that the circuit is operating, and DIS means that loading is stopped.
L indicates a low output level, and H a high output level in the controlled state.
VM and VL indicate the voltage levels applied to VM (Pin 37) and VL (Pin 45), respectively.
– 21 –
Page 22
CXD3607R
Detailed Description of Output Pins
The CXD3607R generates special pulses that are used by signal processing circuits, etc. These details are
described below.
• WEN (Pin 30)
The CXD3607R outputs a WEN signal that indicates the effective line period output from the CCD image
sensor. The WEN signal is high during the vertical effective line period. For details, see the vertical timing
charts for each drive mode.
∗
When SG stopped is selected by the SG stop setting, WEN is inactive during the SG stopped VD per iod.
∗
When performing long-time exposure with the shutter V setting, WEN is inactive during the SG stopped VD
period.
Special Drive Sequence (Random trigger shutter drive)
Cameras using the CXD3607R can perform random trigger shutter drive which allows image capturing at an
optional timing. The TRIG pulse is loaded from the TRIG pin at the rising edge of MCKO, and reflected from the
falling edge of the next HD.
The random trigger shutter drive sequence in DRAFT mode is shown below.
(1)
TRIG
VD
HD
Mode
V2A
SUB
CCDOUT
XCPOB, XCPDM
DRAFTDRAFT (TRIG function enabled)
(4) SG generation position setting
(2) High-speed sweep setting
(3) SUB setting
Exposure AExposure C
Exposure A
(part-way)
Not accepted
Not accepted
TRIGOUTDRAFT
(6) SG and V pulse stopped
Main exposure
None
(5) Clamp pulse stop setting
ExposureExposure B
Exposure CMain exposure
– 22 –
Page 23
CXD3607R
(1) If the drive mode data “TRIG function setting” is 1: Enabled at the falling edge of the TRIG pulse, operation
switches to TRIG drive.
∗
Operation cannot be guaranteed for a TRIG pulse low-active period of 2H or less.
∗
The TRIG pulse is valid when input with the falling edge synchronized to the falling edge of VD.
∗
The TRIG pulse is not accepted after switching to TRIG drive.
∗
The VD pulse is not accepted for until 2H after SG generation after switching to TRIG drive. Serial data is
also not reflected by the falling edge of VD during this per iod. (Example: When SG is generated at 58H,
VD is not accepted from 1 to 59H)
(2) Operation switches to TRIG drive mode and high-speed sweep for ver tical register block charge drain
starts from the falling edge of the next HD after the falling edge of the input TRIG pulse. The number of
high-speed sweep stages differs according to the drive mode at the falling edge of the TRIG pulse as
follows. DRAFT: 20 (stages/H) × 53 (H) = 1060 (stages), FINE/TRIGOUT: 5 (stages/H) × 210 (H) = 1050
(stages). High-speed sweep off can also be selected by the TRIG data “High-speed sweep setting”.
(3) The charge drain period using the SUB pulse can be selected by the TRIG data “SUB setting”.
When high-speed sweep is on, the maximum number of SUB pulses is as follows according to the drive
mode at the falling edge of the TRIG pulse. DRAFT: max. 58 pulses, FINE/TRIGOUT: max. 215 pulses.
When high-speed sweep is off, the number of SUB pulses is two regardless of the drive mode at the falling
edge of the TRIG pulse and the SUB setting value.
(4) The SG pulse generation position can be selected by the TRIG data “SG generation position setting”. After
SG pulse output, V transfer is not performed and standby mode is established until the next VD input.
(5) The clamp pulses can also be stopped after SG pulse generation by the TRIG data “Clamp pulse stop
setting”.
(6) Be sure to drive in TRIGOUT mode during the next VD period after TRIG drive. (Operation in other modes
can be not guaranteed.)
∗
TRIG drive ends at the first VD input 3H onward after SG pulse generation. Even when operation shifted
to TRIG drive during long-time exposure using the “Shutter V setting”, note that serial data is always
reflected at the first VD input 3H onward after SG pulse generation.
Specifications for Each Drive Mode and A Table Corresponding Timing Char ts
The HD of this chart indicates the actual CXD3607R load timing.
∗
The numbers at the output pulse transition points indicate the count at the MCKO rise from the fall of HD.
CXD3607R
Page 37
Chart-14 High-Speed Phase Timing Char tMODE
DRAFT/FINE/TRIGOUT mode
HD
HD'
CKI
CKO
123456740414243444546
MCKO
– 37 –
H1
H2
377378379380381382
RG
XSHP
(Logical phase 90˚)
XSHD
(Logical phase 90˚)
ADCLK
(Logical phase 0˚)
∗
HD’ indicates the HD which is the actual CXD3607R load timing. (when MCKO sync is selected)
∗
The phase relationship of each pulse shows the logical position relationship. For the actual output waveform, a delay is added to each pulse.
∗
The logical phases of XSHP, XSHD and ADCLK can be specified by the serial interface data.
CXD3607R
Page 38
Application Circuit Block Diagram
CXD3607R
CCD
ICX285
CCD OUT
H1
H2
RG
V1
V2A
V2B
V3
V4
SUB
12
13
10
38
40
42
47
39
48
V-Dr
25 26
CKI
CDS/ADC Block
XSHP
XSHD
16
17 18 19
CXD3607R
27
OSCI
OSCO
XCPOB
XCPDM
TG
8 9
TEST2
TEST1
PBLK
20 21
29
ADCLK
30
SSI
SCK
Digital OUT
22
23
35
32
33
34
2
3
31
SEN
MCKO
CKO
WEN
VD
HD
TRIG
RST
SYNSL
Signal
Processor
Block
Controller
This block diagram shows the connection relationship with each block, and is not an actual circuit diagram.
See the CCD image sensor data sheet for a concrete example of circuit connection with a CCD image sensor.
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
Notes for Power-on
Of the four –7.0V, +15.0V, +3.3V, +5.0V power supplies, be sure to start up the –7.0V and +15.0V power
supplies in the following order to prevent the SUB pin of the CCD image sensor from going to negative
potential.
15V
t1
20%
20%
0V
t2
t2 ≥ t1
–7.0V
– 38 –
Page 39
Package Outline Unit: mm
9.0 ± 0.2
∗ 7.0 ± 0.1
CXD3607R
48PIN LQFP (PLASTIC)
37
48
0.5
36
1
0˚ to 10˚
+ 0.08
0.18 – 0.03
25
12
0.1 ± 0.1
0.5 ± 0.2
24
13
(0.22)
0.13
S
(8.0)
A
B
0.5 ± 0.2
+ 0.05
0.127 – 0.02
+ 0.2
M
1.5 – 0.1
0.1
S
0.18 ± 0.03
0.127 ± 0.04
DETAIL B: PALLADIUM
SONY CODE
EIAJ CODE
JEDEC CODE
DETAIL A
LQFP-48P-L01
P-LQFP48-7x7-0.5
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREA TMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
PALLADIUM PLATING
COPPER ALLOY
0.2g
– 39 –
Sony Corporation
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