Datasheet CXD2304R Datasheet (Sony) [en, no]

—1—

E94307B01

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

Absolute Maximum Ratings (Ta=25 °C)

• Supply voltage AVDD, DVDD 7V

•Input voltage (All pins)

VIN VDD+0.5 to VSS–0.5 V

• Output current (Every each channel)
IOUT 0 to 15 mA

• Storage temperature Tstg –55 to +150 °C

Recommended Operating Conditions

• Supply voltage AVDD, AVSS 3.0 to 3.6 V

DVDD, DVSS 3.0 to 3.6 V

• Reference input voltage

VREF 1.2 V

• Clock pulse width

TPW1, TPW0 22.5 ns (min.) to 1.1 µs (max.)

• Operating temperature

Topr –40 to +85 °C

Description

The CXD2304R is an 8-bit high-speed D/A
converter for video band use. It has an input/output
equivalent to 3 channels of R, G and B. It is suitable
for use of digital TV, graphic display, and others.

Features

• Resolution 8-bit

• Maximum conversion speed 20 MSPS

• RGB 3-channel input/output

• Differential linearity error ±0.5 LSB

• Low power consumption 50 mW

(330 Ω load at 1.2 Vp-p output)

• Single 3.3 V power supply

• Low glitch noise

• Stand-by function

Structure

Silicon gate CMOS IC

8-bit 20 MSPS RGB 3-Channel D/A Converter

48 pin LQFP (Plastic)

CXD2304R

—2—

CXD2304R

Block Diagram

DECODER

DECODER

DECODER

DECODER

DECODER

DECODER

LATCHES

LATCHES

LATCHES

32

35

34

42

29

41

40

31

30

33

28

39

38

46

45

44

43

27

37

36

48

47

2LSB’S

CURRENT

CELLS

6MSB’S

CURRENT

CELLS

CLOCK

GENERATOR

2LSB’S

CURRENT

CELLS

6MSB’S

CURRENT

CELLS

CLOCK

GENERATOR

2LSB’S

CURRENT

CELLS

6MSB’S

CURRENT

CELLS

CLOCK

GENERATOR

CURRENT CELLS

(FOR FULL SCALE)

BIAS VOLTAGE

GENERATOR

1
2
3
4
5
6
7

8
9

10
11
12
13
14
15
16

17
18
19
20

21
22

23
24

25

26

(LSB) R0

(MSB) R7

(LSB) G0

(MSB) G7

(LSB) B0

B1
B2
B3
B4
B5
B6

(MSB) B7

BLK

CE

R1
R2
R3
R4
R5
R6

G1
G2
G3
G4
G5
G6

DVDD
DVDD

RO
RO

RCK

AV

DD

AVDD
AVDD
AVDD

GO
GO

GCK

AV

SS

DVSS
DVSS

BO
BO

BCK

VG

VB

IREF

VREF

—3—

CXD2304R

Pin Configuration

R0

R1

R2

R3

R4

R5

R6

R7

G0

G1

G2

G3

B7
B6
B5
B4
B3
B2
B1
B0
G7
G6
G5
G4

BCK

RO

I

REF

V

REF

AV

SS

VB

DV

SS

DV

SS

GCK

RCK

CE

BLK

RO
GO
GO
BO
BO
VG

AV

DD

AVDD
AVDD
AVDD
DVDD
DVDD

1 2 3 4 5 6 7 8 9

10 11 12

13

14

15

16

17

18

19

20

21

22

23

24

252627282930313233343536

37
38
39
40
41
42
43
44
45
46
47
48

Pin Description and I/O Pins Equivalent Circuit

Pin No. Symbol I/O Equivalent circuit Description

1 to 8

9 to 16

17 to 24

25

32

R0 to R7

G0 to G7

B0 to B7

BLK

VB

I

I

O

1

24

DV

DD

DVSS

to

DVDD

DVSS

25

DVDD

DVSS

32

DVDD

Digital input
R0 (LSB) to R7 (MSB)
G0 (LSB) to G7 (MSB)
B0 (LSB) to B7 (MSB)

Blanking input.
This is synchronized with the clock
input signal for each channel.
No signal at “H” (Output 0 V).
Output condition at “L”.

Connect a capacitor of about 0.1 µF.

—4—

CXD2304R

Pin No. Symbol I/O Equivalent circuit Description

27

28

29

30, 31

33

26

35

34

42

43 to 46

RCK

GCK

BCK

DVSS
AVSS

CE

IREF

VREF

VG

AVDD

I

—
—

I

O

I

O

—

DVDD

DVSS

28

27

29

DVDD

DVSS

26

AVDD

AVSS

34

35

AVDD

AVSS

AVDD

AVDD

AVSS

42

Clock input.

Digital GND
Analog GND

Chip enable input.
This is not synchronized with the
clock input signal.
No signal (Output 0 V) at “H” and
minimizes power consumption.

Reference current output.
Connect a resistance 16 times “RIR”
that of output resistance value
“ROUT”.

Reference voltage output.
Set full scale output value.

Connect a capacitor of about 0.1 µF.

Analog VDD

—5—

CXD2304R

Pin No. Symbol I/O Equivalent circuit Description

37

39

41

36

38

40

47, 48

RO

GO

BO

RO

GO

BO

DVDD

O

—

AVDD

AVSS

41

39

37

AV

DD

AVSS

36
38
40

Current output.
Voltage output can be obtained by
connecting a resistance.

Inverted current output.
Normally dropped to analog GND.

Digital VDD

—6—

CXD2304R

Electrical Characteristics (FCLK=20 MHz, AVDD=DVDD=3.3 V, ROUT=330 Ω, VREF=1.2 V, RIR=5.1 kΩ, Ta=25 °C)

Item

Resolution
Conversion speed
Integral non-linearity error

Differential non-linearity error
Output full-scale voltage
Output full-scale ratio

∗1

Output full-scale current
Output offset voltage
Glitch energy
Crosstalk

Supply current
Analog input resistance

Input capacitance
Digital input voltage

Digital input current
Setup time

Hold time
Propagation delay time
CE enable time ∗

2

CE disable time ∗

2

Symbol

n
FCLK
EL

ED
VFS
FSR
IFS
VOS
GE
CT
IDD
ISTB
RIN
CI
VIH
VIL
IIH
IIL
ts
th
tPD
tE
tD

Measurement conditions

AVDD=DVDD=3.0 to 3.6 V
Ta=–40 to 85 °C

Endpoint

When “00000000” data input

When 1 kHz sine wave input
When 14.3 MHz color CE= “L”
bar data input CE= “H”
VREF

AVDD=DVDD=3.0 to 3.6 V
Ta=–20 to +75 °C
AVDD=DVDD=3.0 to 3.6 V
Ta=–20 to +75 °C

CE=H→L
CE=L→H

Min.

0.5

–2.5
–0.5

1.12
0

1

2.5

–5

7
3

Typ.

8

1.24

1.5

3.8

150

53
15

20

4
4

Max.

20

2.5

0.5

1.36

3.0

1

18

1.2

9

0.5
5

8
8

Unit

bit

MSPS

LSB
LSB

V

%
mA
mV

pV•s

dB
mA
MΩ

pF

V

µA

ns
ns

ns
ms
ms

Full-scale voltage of channel

∗1

Full-scale output ratio =

Average of the full-scale voltage of the channels

–1 × 100 (%)

∗2

When the external capacitors for the VG pins are 0.1 µF.

—7—

CXD2304R

Electrical Characteristics Measurement Circuit
Analog Input Resistance

Measurement Circuit

Digital Input Current

CXD2304R

+3.6V

AVDD, DVDD

AVSS, DVSS

V

A

Maximum Conversion Velocity Measurement Circuit

8bit

COUNTER

with

LATCH

0.1µ

DVSS

25
26
32

27
28
29

CLK
20MHz
SQUARE
WAVE

OSCILLOSCOPE

330

AV

SS

330

AV

SS

330

AV

SS

AVDD

0.1µ

5.1k
AV

SS

BLK
CE
VB

RCK
GCK
BCK

39

41

42
34
35

37

1k

RO

GO

BO

VG

VREF

IREF

R0 to R7
1 to 8

G0 to G7
17 to 24

B0 to B7

17 to 24

}

—8—

CXD2304R

Crosstalk Measurement Circuit

DIGITAL

WAVEFORM

GENERATOR

330

AV

SS

AVDD

0.1µ

5.1k
AV

SS

BLK
CE
VB

RCK
GCK
BCK

RO

GO

BO

VG

VREF

IREF

0.1µ

DVSS

25
26
32

27
28
29

CLK
20MHz
SQUARE
WAVE

1k

330

AV

SS

330

AV

SS

39

41

42
34
35

37

ALL “1”

SPECTRUM

ANALYZER

R0 to R7
1 to 8

G0 to G7
9 to 16

B0 to B7

17 to 24

Setup Time
Hold Time Measurement Circuit
Glitch Energy

8bit

COUNTER

with

LATCH

DELAY

CONTROLLER

AVDD

0.1µ

5.1k
AV

SS

330

AV

SS

330

AV

SS

330

AV

SS

0.1µ

DVSS

BLK
CE
VB

RCK
GCK
BCK

RO

GO

BO

VG

VREF

IREF

39

41

42
34
35

37

DELAY

CONTROLLER

25
26
32

27
28
29

1k

OSCILLOSCOPE

CLK
1MHz
SQUARE
WAVE

R0 to R7
1 to 8

G0 to G7
9 to 16

B0 to B7
17 to 24

}

—9—

CXD2304R

DC Characteristics Measurement Circuit

330

AV

SS

330

AV

SS

330

AV

SS

AVDD

0.1µ

5.1k
AV

SS

BLK
CE
VB

RCK
GCK
BCK

RO

GO

BO

VG

VREF

IREF

0.1µ

DVSS

CLK
20MHz
SQUARE
WAVE

CONTROLLER

DVM

1k

25
26
32

27
28
29

39

41

42
34
35

37

R0 to R7
1 to 8

G0 to G7
9 to 16

B0 to B7
17 to 24

Propagation Delay Time Measurement Circuit

330

AV

SS

330

AV

SS

330

AV

SS

CLK
1MHz
SQUARE
WAVE

BLK
CE
VB

RCK

GCK

BCK

RO

GO

BO

VG

VREF

IREF

0.1µ

DVSS

25
26
32

27
28
29

FREQUENCY

DEMULTIPLIER

AVDD

0.1µ

5.1k
AV

SS

1k

39

41

42
34
35

37

OSCILLOSCOPE

R0 to R7
1 to 8

G0 to G7
9 to 16

B0 to B7
17 to 24

SNR Measurement Circuit

DIGITAL

WAVEFORM

GENERATOR

330

AV

SS

AVDD

0.1µ

5.1k
AV

SS

BLK
CE

VB

RCK
GCK
BCK

RO

GO

BO

VG

VREF

IREF

0.1µ

DVSS

25
26
32

27
28
29

CLK
20MHz
SQUARE
WAVE

1k

330

AV

SS

330

AV

SS

39

41

42
34
35

37

ALL “1”

SPECTRUM

ANALYZER

ALL “1”

R0 to R7
1 to 8

G0 to G7
9 to 16

B0 to B7
17 to 24

SNR : Different between primary

component and secondary distortion

—10—

CXD2304R

Description of Operation
Timing Chart

I/O Chart (when full scale output voltage at 1.2 V)

Application Circuit

CLK

DATA

D/A OUT

tPW1 tPW0

1.5V

t

s th ts th ts th

tPD tPD

tPD

100%

50%

0%

DVDD

AVDD

0.1µ

(LSB)

(MSB)

(LSB)

1
2
3
4

5
6
7
8
9

10
11
12

R (Red) IN

G (Green) IN

B (Blue) IN

(MSB)

(LSB)

(MSB)

330

330

330

B (Blue) OUT

AV

SS

G (Green) OUT

AV

SS

R (Red) OUT

AV

SS

373839404142434445464748

5.1k

AV

SS

AVDD
1k

AV

SS

0.1µF

DV

SS

DVSS

CLOCK IN

36
35
34
33
32
31
30
29
28
27
26
25

13 14 15 16 17 18 19 20 21 22 23 24

•

•

•

•

•

•

•

• • • • • • • •

1.2V

(BCK)
(GCK)
(RCK)

Input code

MSB LSB

1 1 1 1 1 1 1 1

:

1 0 0 0 0 0 0 0

:

0 0 0 0 0 0 0 0

Output voltage

1.2 V

0.6 V

0 V

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

—11—

CXD2304R

Notes on Operation

• How to select the output resistance

The CXD2304R is a D/A converter of the current output type. To obtain the output voltage connect the
resistance to the current output pins R0, G0 and B0. For specifications we have;

Output full scale voltage VFS=1.12 to 1.36 [V]

Output full scale current IFS=3.8 [mA] (typ.)
Calculate the output resistance value from the relation of VFS=IFS × ROUT. Also, 16 times resistance of the
output resistance ROUT is connected to reference current pin IREF. In some cases, however, this turns out to
be a value that does not actually exist. In such a case a value close to it can be used as a substitute.
Here please note that VFS becomes

VFS=VREF × 16ROUT/RIR.
VREF is the voltage set at the reference voltage pin VREF and ROUT is the resistance connected to the current
output pins RO, GO and BO while RIR is connected to IREF pin.
Increasing the resistance value can curb power consumption. On the other hand glitch energy and data
settling time will inversely increase. Set the most suitable value according to the desired application.

• Phase relation between data and clock
To obtain the expected performance as a D/A converter, it is necessary to set properly the phase relation
between data and clock applied from the exterior. Be sure to satisfy the provisions of the setup time (tS) and
hold time (tH) as stipulated in the Electrical Characteristics.

• Power supply and ground
To reduce noise effects separate analog and digital systems in the device periphery. For power supply pins,
both digital and analog, bypass respective grounds by using a ceramic capacitor of about 0.1 µF, as close as
possible to the pin.

• Latch up
Digital power supply and analog power supply have to be common at the PCB power supply source. This is
to prevent latch up due to voltage difference between AVDD and DVDD pins when power supply is turned ON.

• RO, GO and BO pins
The RO, GO and BO pins are the inverted current output pins described in the Pin Description. The sums
shown below become the constant value for any input data.

a) The sum of the currents output form RO and RO
b) The sum of the currents output form GO and GO

c) The sum of the currents output form BO and BO
However, the performances such as the linearity error of the inverted current output pin output current is not
guaranteed.

• Output full-scale voltage
For the applications using the RGB signal, the color balance may be broken up when the no-adjusted output
full-scale voltage is used.

—12—

CXD2304R

Latch Up Prevention

The CXD2304R is a CMOS IC which required latch up precautions. Latch up is mainly generated by the lag in
the voltage rising time of AVDD (Pins 43 to 46) and DVDD (Pins 47 and 48), when power supply is ON.

1. Correct usage
a. When analog and digital supplies are from different sources

b. When analog and digital supplies are from a common source

(i)

(ii)

43

CXD2304R

AVSS

AVDD

44 45 46

33

AV

DD DVDD

DVSSAVSS

C C

31

DV

SS

+5V +5V

30

47 48

DIGITAL IC

DVDD

43

CXD2304R

AVSS

44 45 46

33

AV

DD DVDD

DVSSAVSS

C C

31

DV

SS

+5V

30

47 48

DIGITAL IC

DVDD

43

CXD2304R

AVSS

44 45 46

33

AV

DD DVDD

DVSSAVSS

C C

31

DV

SS

+5V

30

47 48

DIGITAL IC

DVDD

—13—

CXD2304R

2. Example when latch up easily occurs

a. When analog and digital supplies are from different sources

b. When analog and digital supplies are from common source

(i)

(ii)

43

CXD2304R

AVSS

AVDD

44 45 46

33

AV

DD DVDD

DVSSAVSS

C C

31

DV

SS

+5V +5V

30

47 48

DIGITAL IC

DVDD

43

CXD2304R

AVSS

44 45 46

33

AV

DD DVDD

DVSSAVSS

C C

31

DV

SS

+5V

30

47 48

DIGITAL IC

DVDD

AVDD

43

CXD2304R

AVSS

44 45 46

33

AV

DD DVDD

DVSSAVSS

C

31

DV

SS

+5V

30

47 48

DIGITAL IC

DVDD

AVDD

—14—

CXD2304R

Example of Representative Characteristics

80

60

40

20

0

0.1M 1M 10M
Output frequency F

O (Hz)

Crosstalk CT (dB)

Fig. 1. Crosstalk

80

60

40

20

0

0.1M 1M 10M
Output frequency F

O (Hz)

SNR (Difference between primary and secondary) (dB)

1.27

1.26

0

–25 25 75

Ambient temperature Ta (°C)

Output fullscale voltage V

FS

(V)

Fig. 3. Ambient temperature vs.

Output full scale voltage

500

20

10

0

10k 1M

Output frequency F

O (Hz)

Power supply current I

DD

(mA)

10M100k

400

200

0

200 400
Output resistance R

OUT (Ω)

Glitch energy GE (pV•s)

Fig. 5. Output resistance vs. Glitch energy

600

Fig. 4. Output frequency vs.

Power supply current

Fig. 2. SNR (Difference between primary

component and secondary distortion)

Reference measurement condition and
description

• AVDD=3.3 V

• DVDD=3.3 V

• VREF=1.2 V

• RIR=5.1 kΩ (≈16 ROUT in Fig. 5 only)

• Ta=25 °C (Except Fig. 3)

• Fig. 1, 2 Refer to the measurement circuit.

• Fig. 3 is input data=all 1

• Fig. 4 is input data=output of incremental

counter.

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

PLATING

42/COPPER ALLOY

PACKAGE STRUCTURE

48PIN LQFP (PLASTIC)

9.0 ± 0.2

∗ 7.0 ± 0.1

1

12

13

24

25

36

37

48

(0.22)

0.18 – 0.03

+ 0.08

0.2g

LQFP-48P-L01

LQFP048-P-0707

(8.0)

0.5 ± 0.2

0.127 – 0.02

+ 0.05

A

1.5 – 0.1

+ 0.2

0.1

SOLDER/PALLADIUM

NOTE: Dimension “∗” does not include mold protrusion.

0.1 ± 0.1

0.5 ± 0.2

0° to 10°

DETAIL A

0.13

M

0.5

S

S

B

DETAIL B:SOLDER

(0.18)

(0.127)

DETAIL B:PALLADIUM

0.127 ± 0.04

0.18 – 0.03

+ 0.08

0.127 – 0.02

+0.05

0.18 ± 0.03

Package Outline Unit : mm

CXD2304R

—15—