The CXA2013M is a bipolar IC designed as EIAJ
TV sound multiplexing decoder, provides various
functions including sound multiplexing demodulation,
broadcast mode identification (stereo/bilingual
discrimination display), volume, tone control and
muting.
Features
• Adjustment free of filter
• Audio multiplexing decoder
• Sound processor
— One external input
— Bass control
— Treble control
— V olume control
— Balance control
are all included in a single chip. Almost any sort of
signal processing is possible through this IC.
• Separation adjustment, each mode control and sound
processor control are possible through I2C BUS.
CXA2013M
30 pin SOP (Plastic)
Absolute Maximum Ratings (Ta = 25°C)
• Supply voltageVCC12V
• Operating temperatureTopr –20 to +75 °C
• Storage temperatureTstg –65 to +150 °C
• Allowable power dissipation PD1000mW
Operating Supply Voltage Range8.5 to 9.5V
Applications
TVs
Structure
Bipolar silicon monolithic IC
Pin Configuration
SC OUT
NC
SC IN
MC OUT
MC IN
TV OUT-L
TV OUT-RNCAUX-L
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
REFL
Vcc
MPX IN
GND
SUBI
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
CUBI
NC
SDA
22
9
SCL
AUX-R
21
10
DGND
CL-R
20
11
BAL
CL-L
19
12
TRE
CH-R
18
13
BASS
CH-L
171516
14
VOL
LS OUT-L
LS OUT-R
– 1 –
E00Y28A1Y-PS
Page 2
Block Diagram
– 2 –
SUBI
1
BIAS
CURRENT
IBIAS
2
SC OUT
30
SUBDEEM
FM
DEMOD
BUFFER
VOLTAGE
REGULATOR
SC IN
28
BIAS
VOLTAGE
3
MC OUT
27
MAINDEEM
4
26
VCA
MC IN
SUB
DET
SUB
BPF
4.5fH
TRAP
SUB
ATT
MPX SIGNAL
5
TV OUT-L24TV OUT-R21AUX-R22AUX-L17CH-L19CL-L
25
MATRIXSW
MAIN
IIL LOGIC & CONT
3.5f
3.5fH
VCO
H
CLOCK
952Hz
BPF
CUE
BPF
CUE
CARRIOR
AM
DEMOD
952Hz
CLOCK
COMP
6
TONE
BASS
TRE
TONE
18
20
VCA
VOL
BAL
VCA
DACBUS DEC
11
12
13
14
LS OUT-L
16
LS OUT-R
15
8
9
10
GND
REFL
Vcc
MPX IN
CUBI
CH-R
CL-R
BAL
TRE
BASS
VOL
SDA
SCL
DGND
CXA2013M
Page 3
CXA2013M
Pin Description(Ta = 25°C, VCC = 9V)
Pin
No.
Symbol
Pin
voltage
1SUBI4.1V
2GND0
3REFL
1.2V
Equivalent circuitDescription
Vcc
20µ
64k
Bias capacitor connection of
Vcc
80µ
16k
sub FM detector
4.2V
147
3.3k
24k
1k
2
8k
147
1.7V
20k20k
8k
Analog block GND
The noise elimination filter
connection of internal
reference voltage
Note) When the IC is powered on, the registers "MUTE TV", "MUTE LS" and "VOL" are set to "0".
– 12 –
Page 13
Description of registers
Control registers
CXA2013M
Register
Number
of bits
TEST
ATT
EXT
FOMO
S1
S0
MUTE TV
MUTE LS
BASS
TREBLE
VOL
BAL
∗
Classification U: User control
Classi-
∗
fication
1
7
1
1
1
1
1
1
5
5
8
6
T
A
U
U
U
U
U
U
U
U
U
U
A: Adjustment
T: Test (when IC manufactured)
Standard
setting
0
34
0
0
0
0
1
1
10
10
FF
20
Contents
DAC test mode for VCA, checking Cue BPF mode.1: TEST
Adjustment of stereo separation
Selection of TV mode or external input mode for LSOUT output
Selection of forced MONO mode ON/OFF1:
1: External
Forced MONO
Selection of TV OUT, LS OUT output signal
Selection of TV OUT, LS OUT output signal
Selection of TV OUT mute ON/OFF0: Mute ON, 1: Mute OFF
Selection of LS OUT mute ON/OFF0: Mute ON, 1: Mute OFF
LS OUT output bass control
LS OUT output treble control
LS OUT output signal level control
LS OUT-L, R output signal level (balance) control
Status Registers
Register
Number of bitsContens
PON
ST
BIL
1
1
1
POWER ON RESET detection1: RESET
Stereo detection of the MPXIN input signal1: Stereo
Bilingual detection of the MPXIN input signal1: Bilingual
– 13 –
Page 14
CXA2013M
Description of Control Registers
TEST (1) :DAC test mode for VCA and checking Cue BPF mode.
Use only for the electrical characteristics inspection process of IC.
0 = Normal mode
1 = Test mode, the Cue signal component through Cue BPF to TV OUT-L.
Output DAC voltage for VCA to TV OUT -R.
ATT (7) :Perfor m the separation adjustment by varying the signal level input to MPX IN (Pin 5).
Va riable range of the input signal: Normal input level ±3.0dB
0 = Level Min.
34 = Center
7F = Level Max.
EXT (1) :Select TV mode or external input mode for LS OUT output
0 = TV mode
1 = External input mode
FOMO (1) :Select ON/OFF forced MONO mode
0 = Forced MONO OFF
1 = Forced MONO ON
S1 (1) :Select output signal for TV OUT, LS OUT
S0 (1) :Select output signal for TV OUT, LS OUT
MUTE TV (1) :Mute TV OUT output
0 = Mute ON
1 = Mute OFF
MUTE LS (1) :Mute LS OUT output
0 = Mute ON
1 = Mute OFF
BASS (5) :LS OUT output bass control
0 = Bass Min.
10 = Bass Center (0dB)
1F = Bass Max.
TREBLE (5) :LS OUT output treble contorl
0 = Treble Min.
10 = Treble Center (0dB)
1F = Treble Max.
BAL (6) :LS OUT-L, R output signal level (balance) control
0 = Lch Min., Rch Max.
20 = Center (Lch 0dB, Rch 0dB)
3F = Lch Max., Rch Min.
– 14 –
Page 15
Description of Mode Control
TV OUT output mode control table (TEST = 0 normal mode)
CXA2013M
Input signal
Mode detectionMode controlTV OUT output
MONO
Stereo
Bilingual
STBILFOMOS1S0
∗
∗
00
∗
∗
1
1
0
0
0
0
∗
∗
0
1
∗
∗
∗
∗
∗
0
0
1
∗
0
0
1
MUTE TV
∗
∗
∗
∗
0
1
0
∗
0
1
0
LS OUT output mode control table (TEST = 0 normal mode, EXT = 0 TV mode)
Mode detectionMode controlLS OUT output
Input signal
STBILFOMOS1S0
MUTE LS
LR
0
1
0
1
1
1
1
0
1
1
1
MUTE
MAIN
MUTE
L + R
L
L
L
MUTE
MAIN
SUB
MAIN
MUTE
MAIN
MUTE
L + R
R
R
R
MUTE
MAIN
SUB
SUB
∗: Don't care
LR
MONO
Stereo
Bilingual
∗
00
∗
∗
1
1
0
0
0
0
∗
∗
0
1
∗
∗
∗
∗
∗
∗
0
0
1
∗
0
0
1
TV OUT/LS OUT output mode control table (TEST = 0 normal mode)
TV OUT
EXT
TV mode
L
0
TV mode
Lch
RLR
TV mode
Rch
TV mode
Lch
∗
∗
∗
∗
0
1
0
∗
0
1
0
LS OUT
0
1
0
1
1
1
1
0
1
1
1
TV mode
Rch
MUTE
MAIN
MUTE
L + R
L
L
L
MUTE
MAIN
SUB
MAIN
MUTE
MAIN
MUTE
L + R
R
R
R
MUTE
MAIN
SUB
SUB
∗: Don't care
External mode
1
TV mode
Lch
TV mode
Rch
EXT
Lch
EXT
Rch
– 15 –
Page 16
CXA2013M
Description of Operation
The sound mutiplexing signal input from Pin 5 is passed through IN AMP and is applied to the Cue BPF, Sub
BPF, and Main de-emphasis circuit.
1. Discrimination circuits
Cue BPF passes only the Cue signal component from the multiplex signal. In the AM demodulator, the
signal (AM wave) is AM detected and one of two sine waves is generated, either a 922.5Hz signal for
bilingual broadcasts or a 982.5Hz signal for stereo broadcasts.
In the 952Hz BPF, the 3.5fH carrier component is eliminated from the Cue signal after AM wave detection.
The Cue signal, from which the carrier component has been eliminated, is waveform shaped by COMP, with
the resulting 922.5Hz or 982.5Hz pulse being applied to the Logic section.
In the 3.5fH VCO, a 3.5fH pulse locked onto the Cue signal carrier (3.5fH) is created and sent to the Logic
section.
In the Logic section, the broadcast mode is identified using the countdown method. Depending on this
result as well as the presence of a SUB signal from SUB detector and the MUTE ON/OFF, MODE
switching, and FOMO ON/OFF instructions from CONT, the output switching control signal is created. This
signal is used to control the output condition of OUTPUT SW and MAIN OUT.
2. Main circuits
In MAIN DEEM, de-emphasis is applied to the Main signal component and the Sub and Cue components
are removed.
After passing through the MAIN DEEM, the Main signal is applied to MATRIX, OUTPUT AMP, and
MAINOUT.
3. Sub circuits
In SUB BPF, only the SUB signal component out of multiplex signals is passed through. In the 4.5fH trap,
the digital facsimile signal component is removed.
In FM Demod, the SUB signal is FM demodulated.
In SUB DEEM, the FM demodulated Sub signal is de-emphasized and the carrier component is removed.
After passing through SUB DEEM, the Sub signal is applied to MATRIX and OUTPUT AMP.
4. MATRIX and output circuits
In MATRIX, the L and R signals are created by adding and subtracting the Main signal from MAIN DEEM
and the Sub signal from SUB DEEM in stereo broadcast.
In OUTPUT AMP and OUTPUT SW, the output signal is switched under the control of Logic.
In addition, MAIN OUT always outputs the MAIN signal component, regardless of the broadcast mode.
5. TONE circuit
Control BASS and TREBLE. Bass and TREBLE characteristics are decided by each CL and CH external
capacitance.
6. BALANCE, VOLUME curcuit
Control BALANCE and VOLUME. BALANCE has 64steps and VOLUME has 256 steps.
7. DAC
DAC is the circuit that control BASS, TREBLE, VOLUME and BALANCE.
Internal impedance is approximately 20kΩ (approximately 5kΩ for VOLUME).
Connect the external capacitance for LPF to each pins.
– 16 –
Page 17
Application Circuit
TVOUT output
Vcc
9V
C20
1µ
MC OUT
Vcc
C3
100µ
MC IN
MPX IN
C4
10µ
C19
C18
10µ
10µ
24252221
TV OUT-L
TV OUT-R
CUBI
NC
C5
10µ
C21
1µ
3029282726232019181716
NC
SC OUT
SC IN
– 17 –
SUBI
GND
REFL
123456781112131415
C1
10µ
C2
10µ
External input
NC
AUX-L
SDA
SCL
R1
220R2220
C17
10µ
AUX-R
DGND
109
C15
C14
0.1µ
C16
10µ
CL-R
BAL
0.1µ
CL-L
TRE
C6
4.7µC74.7µC84.7µC94.7µ
C13
4700p
CH-R
BASS
C12
4700p
CH-L
VOL
C11
10µ
LS OUT-L
LSOUT
output
LS OUT-R
C10
10µ
Composite
baseband
signal input
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
µ-com
DGND
CXA2013M
Page 18
I2C Bus Block Items (SDA, SCL)
CXA2013M
No.
1
High level input voltage
2
Low level input voltage
3
High level input current
4
Low level input current
5
Low level output voltage SDA (Pin 8) during 3mA inflow
6
Maximum inflow current
7
Input capacitance
8
Maximum clock frequency
9
Minimum waiting time for data change
10
Minimum waiting time for start of data transfer
11
Low level clock pulse width
12
High level clock pulse width
13
Minimum waiting time for start preparation
14
Minimum data hold time
15
Minimum data preparation time
16
Rise time
17
Fall time
18
Minimum waiting time for stop preparation
Item
Symbol
VIH
VIL
IIH
IIL
VOL
IOL
CI
fSCL
tBUF
tHD:STA
tLOW
tHIGH
tSU:STA
tHD:DAT
tSU:DAT
tR
tF
tSU:STO
Min.
3.0
0
—
—
0
3
—
0
4.7
4.0
4.7
4.0
4.7
0
250
—
—
4.7
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max.
5.0
1.5
10
10
0.4
—
10
100
—
—
—
—
—
—
—
1
300
—
Unit
V
µA
V
mA
pF
kHz
µs
ns
µs
ns
µs
I2C bus load conditions: Pull-up resistor 4kΩ (Connect to +5V)
Load capacitor 200pF (Connect to GND)
I2C Bus Control Signal
SDA
BUF
SCL
t
P
t
S
HD
:STA
t
R
LOW
t
tHD:DAT
t
t
HIGH
F
SU
:DAT
t
Sr
tHD:STA
t
SU
:STA
t
SU
:STO
P
– 18 –
Page 19
CXA2013M
I2C Bus Signal
There are I2C signals, SDA (Serial DATA) and SCL (Serial CLOCK) signals. SDA is a bidirectional signal.
• Accordingly there are 3 values outputs, H, L, and Hi-Z.
HLHi-ZL
• I2C transfer begins with Start Condition and ends with STOP condition.
Start Condition SStop Condition P
SDA
SCL
– 19 –
Page 20
• I2C data write (Write from I2C controller to the IC)
MSB
SDA
L during Write
CXA2013M
MSBLSB
Hi-ZHi-Z
SCL
S
189189
DATA (n)DATA (n + 1)ACK
123456789189
Address
LSBMSB
Hi-ZHi-Z
Hi-ZHi-Z
89189
ACKACKDATADATA
• I2C data read (Read from the IC to I2C controller)
H during Read
ACKDATA (n + 2)
∗
P
ACKSub AddressACK
Data can be transferred in 8-bit units to be
set as required.
Sub address is incremented automatically.
SDA
SCL
16789189
S
Address
• Read timing
MSBLSB
IC output SDA
SCL
Read timing
∗
Data Read is performed during SCL rise.
ACKACK
1234567899
Hi-Z
7
P
ACKDATAACK
DATA
– 20 –
Page 21
Example of Representative Characteristics
CXA2013M
0
Output level [dB]
–5
–10
–15
De-emphasis characteristics
Main
1001k10k
Frequency [Hz]
Cue BPF frequency characteristics
Sub
Output level [dB]
–20
–40
–60
SUB BPF frequency characteristics
0
10
20 30 40 50 60 70 8010090
Frequency [kHz]
MAIN distortion characteristics
3
0
–20
Attenuation level [dB]
–40
–60
0
–10
–20
–30
–40
–50
LS OUT-L, R [dB]
–60
–70
–80
3.5f
H
–40k
3.5f
–20k
H
H
3.5f
Frequency [Hz]
3.5f
+20k
VOL CONTROL characteristics
4080C0FF
BUS data [VOL]
2
Distortion [%]
1
100
H
3.5f
+40k
H
200300400500
MAIN modulation factor [%]
BALANCE CONTROL characteristics
0
–10
–20
–30
–40
LS OUT-L, R [dB]
–50
–60
–70
–80
OUT R
0
1020303F
BUS data [BALANCE]
OUT L
– 21 –
Page 22
20
10
0
LS OUT -L, R [dB]
–10
CXA2013M
TONE characteristics
BASS-TREBLE MAX.
BASS-TREBLE MIN.
–20
1001k10k
Frequency [Hz]
– 22 –
Page 23
Packag e Outline Unit: mm
30
1
0.45 ± 0.1
+ 0.4
18.8 – 0.1
30PIN SOP (PLASTIC)
16
+ 0.3
– 0.1
7.6
15
0.2
M
1.27
10.3 ± 0.4
A
(9.3)
+ 0.1
0.2 – 0.05
+ 0.4
2.3 – 0.15
+ 0.2
0.1 – 0.05
0.5 ± 0.2
CXA2013M
0.1
SONY CODE
EIAJ CODE
JEDEC CODE
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIALCOPPER ALLOY
SOLDER COMPOSITIONSn-Bi Bi:1-4wt%
PLA TING THICKNESS5-18µm
SOP-30P-L03
SOP030-P-0375
SPEC.
0˚ to 10˚
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREA TMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.7g
– 23 –
Sony Corporation
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