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CSPEMI202A
2 Channel Headset Microphone EMI Filter with ESD Protection
Features
• Two channels of EMI filtering
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Greater than 40dB attenuation at 1GHz
•
+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
•
+15kV ESD protection on each channel (HBM)
• Supports bipolar signals—ideal for
audio applications
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
• 5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset
microphone ports
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CSPEMI202A is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD protection. This part is custom-designed to interface with a
microphone port on a cellular telephone or similar
device. Each high quality filter provides more than
35dB attenuation in the 800-2700 MHz range. These
pi-style filters support bidirectional filtering, controlling
EMI both to and from a microphone element. They also
support bipolar signals, enabling audio signals to pass
through without distortion.
In addition, the CSPEMI202A provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD).
The input pins are designed and characterized to
safely dissipate ESD strikes of 8kV, the maximum
requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater
than 15kV.
The CSPEMI202A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format
and low weight. The CSPEMI202A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
68
Ω
47pF47pF
68
Ω
47pF47pF
GND
A1
A3
B2
MIC_IN1
MIC_IN2
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1
C1
C3
MIC_OUT1
MIC_OUT2
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PACKAGE / PINOUT DIAGRAMS
CSPEMI202A
BOTTOM VIEW
(Bumps Up View)
Orientation
Marking
(see note 2)
TOP VIEW
(Bumps Down View)
231
A
B
C
AD
Orientation
Marking
CSPEMI202A
Note:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CSP Package
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 MIC_IN1 Microphone Input 1 (from microphone)
A3 MIC_IN2 Microphone Input 2 (from microphone)
B2 GND Device Ground
C1 MIC_OUT1 Microphone Output 1 (to audio circuitry)
C3 MIC_OUT2 Microphone Output 2 (to audio circuitry)
MIC_OUT1 MIC_OUT2
C3C1
GND
B2
MIC_IN1 MIC_IN2
A1 A3
A1
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Lead-free Finish
Ordering Part
Bumps Package
5 CSP CSPEMI202A AD CSPEMI202AG AD
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
© 2003 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/09/03
Number
1
Part Marking
+" character for the top side orientation mark.
Ordering Part
Number
1
2
Part Marking
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CSPEMI202A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 200 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R
C
I
LEAK
V
SIG
V
ESD
Resistance 61 68 75 Ω
1
Capacitance 38 47 56 pF
1
Diode Leakage Current VIN=5.0V 1.0 µA
Signal Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
I
= 10mA
LOAD
Notes 2,4 and 5
5
-5
±15
7
-10
15
-15
V
V
kV
Method 3015
b) Contact Discharge per IEC 61000-4-2
±8
kV
Level 4
V
CL
Clamping Voltage during ESD Discharge
Notes 2,3,4 and 5
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
f
C
Cut-off frequency
Z
SOURCE
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
= 50Ω, Z
then clamping voltage is measured at Pin C1.
LOAD
= 50Ω
R = 68Ω, C = 47pF 60 MHz
+15
-19
V
V
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3
Page 4
CSPEMI202A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/09/03
Page 5
CSPEMI202A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +
Solder Ball Side Coplanarity +
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
50µm
20µm
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
250
200
150
100
Temperature (°C)
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5
Page 6
Mechanical Details
CSP Mechanical Specifications
CSPEMI202A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Information document.
CSPEMI202A
Mechanical Package Diagrams
BOTTOM VIEW
A1
B2
B1
B3
C1
B4
SIDE
VIEW
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 5
Dim
A1 0.905 0.950 0.995 0.0356 0.0374 0.0392
A2 1.365 1.410 1.455 0.0537 0.0555 0.0573
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.175 0.225 0.275 0.0069 0.0089 0.0108
C2 0.220 0.270 0.320 0.0087 0.0106 0.0126
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
CSP Tape and Reel Specifications
Millimeters Inches
Min Nom Max Min Nom Max
3500 pieces
Controlling dimension: millimeters
C
B
A
3
12
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
C2
D1
D2
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI202A Chip Scale Package
A2
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B
X A0 X K
0
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
P
0
1
CSPEMI202A 1.41 X 0.95 X 0.6 1.52 X 1.07 X 0.72 8mm 178mm (7") 3500 4mm 4mm
10 Pitc hes Cumulativ e
Tolerance On Tape
±
0.2 mm
Center Lines
of Cavity
W
Top
Cover
Tap e
K
o
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
A
o
B
o
P
1
User Direction of Feed
P
o
Figure 6. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/09/03
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