D/CRCW e3 standard thick film chip resistors are the perfect
choice for most fields of modern electronics where high
reliability and stability are of major concern. Typical
applications include automotive, telecommunications, and
industrial.
D/CRCW e3
Vishay
FEATURES
• Stability at different environmental conditions
R/R 1 % (1000 h rated power at 70 °C)
• 2 mm pitch packaging option for 0603 size
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
For technical questions, contact: thickfilmchip@vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
2.2 M;
jumper
(0 )
1 to 10 M;
Document Number: 20035
e3
jumper (0 )
Page 2
D/CRCW e3
www.vishay.com
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZETCRTOLERANCERESISTANCEE-SERIES
± 200 ppm/K± 5 %1 to 10 ME24
D10/CRCW0402 e3
D11/CRCW0603 e3
D12/CRCW0805 e3
D25/CRCW1206 e3
CRCW1210 e3
CRCW1218 e3
CRCW2010 e3
CRCW2512 e3
Note
• The temperature coefficient of resistance (TCR) is not specified for 0 jumpers
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 10 ME24
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 10 ME24
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 10 ME24
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 10 ME24
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 2.2 ME24
± 100 ppm/K± 1 %1 to 2.2 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 10 ME24
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
± 200 ppm/K± 5 %1 to 10 ME24
± 100 ppm/K± 1 %1 to 10 ME24; E96
Jumper, I
= 1.5 A 20 m0 -
max.
= 2.0 A 20 m0 -
max.
= 2.5 A 20 m0 -
max.
= 3.5 A 20 m0 -
max.
= 5.0 A 20 m0 -
max.
= 7.0 A 20 m0 -
max.
= 6.0 A 20 m0 -
max.
= 7.0 A 20 m0 -
max.
Vishay
Revision: 23-Apr-2021
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
3
Document Number: 20035
Page 4
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D/CRCW e3
Vishay
DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A cermet film
layer and a glass-over are deposited on a high grade (Al
2O3
ceramic substrate with its prepared inner contacts. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating.
The result of the determined production is verified by an
extensive testing procedure on 100 % of the individual chip
resistors. Only accepted products are laid directly into
the tape in accordance with IEC 60286-3 Type 1a and
(1)
Type 2a
.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
(1)
. The encapsulation is resistant to all
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
)
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein
(2)
• The Global Automotive Declarable Substance List
(GADSL)
(3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC)
(4)
for its
supply chain
The products do not contain any of the banned
substances as per IEC 62474, GADSL, or the SVHC list,
see www.vishay.com/how/leadfree
.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037
.
APPROVALS
The resistors are qualified according to AEC-Q200.
Where applicable, the resistors are tested in accordance
with EN 140401-802 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068
(1)
series.
RELATED PRODUCTS
For more information about products with better TCR and
tighter tolerance please refer to the “Lead (Pb)-Free Thick
Film, Rectangular, Semi-Precision Chip Resistors”
datasheet (www.vishay.com/doc?20036
The D/CRCW with SnPb termination plating is designed for
applications where lead bearing terminations are
mandatory. For ordering D/CRCW with SnPb terminations
please refer to latest edition of datasheet D/CRCW
(www.vishay.com/doc?20008
Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
(2)
The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3)
The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4)
The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
Revision: 23-Apr-2021
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
6
Document Number: 20035
Page 7
D/CRCW e3
P70 x R
0.1 x P85 x R
P70 x R
P70 x R
P70 x R
www.vishay.com
TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-802, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days). The components are
mounted for testing on boards in accordance with EN
60115-8, 2.4.2 unless otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS PERMISSIBLE
EN
60115-1
CLAUSE
4.5-Resistance-± 1 %± 5 %
4.8-Temperature coefficient
4.25.1-Endurance at 70 °C
4.25.3-
4.2478 (Cab)Damp heat, steady state
4.3767 (Cy)
4.23-Climatic sequence:
4.23.22 (Bb)Dry heat125 °C; 16 h
4.23.330 (Db)Damp55 °C; 24 h; 90 % RH; 1 cycle
4.23.41 (Ab)Cold-55 °C; 2 h
4.23.513 (M)Low air pressure8.5 kPa; 2 h; (25 ± 10) °C
4.23.630 (Db)Damp heat, cyclic
4.23.7-DC loadU = U
-1 (Aa)Cold-55 °C; 2 h± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.1914 (Na)
4.13-Short time overload
4.27-
IEC
60068-2
(1)
TEST
METHOD
Damp heat, steady state,
Single pulse high voltage
TEST
Endurance at upper
category temperature
accelerated
Rapid change
of temperature
overload
Stability for product types:
30 min. at -55 °C and 30 min. at 125 °C
U = 2.5 x 2 x U
whichever is the less severe; 5 s
PROCEDURE
D/CRCW e3
At (20 / -55 / 20) °C and
(20 / 155 / 20) °C
U = or U = U
whichever is the less severe;
1.5 h on; 0.5 h off
70 °C; 1000 h± (1 % R + 0.05 )± (2 % R + 0.1 )
70 °C; 8000 h± (2 % R + 0.1 )± (4 % R + 0.1 )
155 °C; 1000 h± (1 % R + 0.05 )± (2 % R + 0.1 )
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
(85 ± 2) °C; (85 ± 5) % RH;
U = 100 V;
1000 h
55 °C; 5 days;
> 90 % RH; 5 cycles
1000 cycles
Severity no. 4:
U = 10 x
or U = 2 x U
whichever is the less severe;
10 pulses 10 μs / 700 μs
max.
max.;
max.
; 1 min
max.
STABILITY CLASS 1
± (1 % R + 0.05 )± (2 % R + 0.1 )
± (1 % R + 0.05 )± (2 % R + 0.1 )
;
OR BETTER
± 100 ppm/K± 200 ppm/K
CHANGE (R)
STABILITY CLASS 2
1 to 10 M
± (1 % R + 0.05 )
± (1 % R + 0.05 )
no visible damage
± (2 % R + 0.05 )
± (1 % R + 0.05 )
no visible damage
Vishay
OR BETTER
Revision: 23-Apr-2021
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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7
Document Number: 20035
Page 8
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15 x P70 x R
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS PERMISSIBLE
EN
60115-1
CLAUSE
IEC
60068-2
(1)
TEST
METHOD
TEST
Stability for product types:
4.39-Periodic electric overload
4.38-
Electrostatic discharge
(human body model)
3 positive + 3 negative discharges;
4.226 (Fc)Vibration
amplitude 1.5 mm or 200 m/s
4.1758 (Td)Solderability
4.1858 (Td)
4.2945 (XA)
4.3221 (Uu
4.3321 (Ue
)Shear (adhesion)
3
)Substrate bendingDepth 2 mm; 3 times
1
Resistance to
soldering heat
Component solvent
resistance
CRCW0402 and CRCW0603: 9 N
CRCW0805 to CRCW2512: 45 N
4.7-Voltage proofU = 1.4 x U
4.35-
Flammability,
needle flame test
Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
PROCEDURE
D/CRCW e3
U = or
U = 2 x U
whichever is the less severe;
max.;
0.1 s on; 2.5 s off; 1000 cycles
IEC 61340-3-1
(1)
;
ESD voltage acc. to size
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
7.5 h
Solder bath method,
SnPb40; non-activated flux
(235 ± 5) °C; (2 ± 0.2) s
Solder bath method,
Sn96.5Ag3Cu0.5;
non-activated flux
(245 ± 5) °C; (3 ± 0.3) s
Soldering bath method;
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol;
+50 °C; method 2
; 60 sNo flashover or breakdown
ins
IEC 60695-11-5
(1)
;
10 s
STABILITY CLASS 1
OR BETTER
± (0.25 % R + 0.05 )
no visible damage
2
;
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
D/CRCW e3
Vishay
CHANGE (R)
STABILITY CLASS 2
OR BETTER
1 to 10 M
± (1 % R + 0.05 )
no visible damage
± (1 % R + 0.05 )
± (0.5 % R + 0.05 )
no visible damage
Good tinning ( 95 % covered);
no visible damage
No visible damage
No visible damage
± (0.25 % R + 0.05 )
no visible damage,
no open circuit in bent position
No burning after 30 s
Revision: 23-Apr-2021
8
Document Number: 20035
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still, the given solder pad dimensions will be found adequate for most general applications
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
Revision: 23-Apr-2021
For technical questions, contact: thickfilmchip@vishay.com
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9
Document Number: 20035
Page 10
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.
Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website
or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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