Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors
FEATURES
• High volume product suitable for commercial
applications
• Excellent stability (R/R 1 % for 1000 h at
70 °C)
• Lead (Pb)-free solder contacts on Ni barrier layer
• Metal glaze on high quality ceramic
• Protective overglaze
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CRCW0201...BC0201 RR 0603M
CRCW0402...BC0402 RR 1005M
CRCW0603...BC0603 RR 1608M
CRCW0805...BC0805 RR 2012M
CRCW1206...BC1206 RR 3216M
CRCW1210...BC1210 RR 3225M
CRCW2010...BC2010 RR 5025M
CRCW2512...BC2512 RR 6332M
Notes
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
• Power rating depends on the maximum temperature at the solder point, the component placement density and the substrate material
Revision: 15-Apr-13
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
CASE
SIZE
INCH
CASE
SIZE
METRIC
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
POWER RATING
P
70 °C
W
0.0530
Zero-Ohm-Resistor: R
0.06350
Zero-Ohm-Resistor: R
0.1075
Zero-Ohm-Resistor: R
0.125150
Zero-Ohm-Resistor: R
0.25200
Zero-Ohm-Resistor: R
0.50200
Zero-Ohm-Resistor: R
0.75400
Zero-Ohm-Resistor: R
1.0500
Zero-Ohm-Resistor: R
For technical questions, contact: f3aresistors@vishay.com
LIMITING
ELEMENT
VOLTAGE
MAX. V
max.
max.
max.
max.
max.
max.
max.
max.
TEMPERATURE
COEFFICIENT
= 50 m, I
= 20 m, I
= 20 m, I
= 20 m, I
= 20 m, I
= 20 m, I
= 20 m, I
= 20 m, I
1
TOLERANCE
ppm/K
± 200
- 200/+ 4001R0 to 9R76
± 100
- 200/+ 4001R0 to 9R76
± 200
- 200/+ 4001R0 to 9R1
at 70 °C = 1.0 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 1.5 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 2.0 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 2.5 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 3.5 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 4.0 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 5.0 A
max.
± 100
± 2001R0 to 9R76
± 200± 51R0 to 10ME24
at 70 °C = 7.0 A
max.
%
± 0.5
± 1
± 5
± 1
± 1
± 1
± 1
± 1
± 1
± 1
RESISTANCE
RANGE
10R to 10M
47R to 1M
10R to 10M
1R0 to 10M
1R0 to 10M
1R0 to 10M
1R0 to 10M
1R0 to 10M
1R0 to 10M
1R0 to 10M
Document Number: 28743
E-SERIES
E96
E24; E96± 20010R to 10M
E24
E24; E96
E24; E96
E24; E96
E24; E96
E24; E96
E24; E96
E24; E96
Page 2
CRCW...BC e3
www.vishay.com
TECHNICAL SPECIFICATIONS
PARAMETER UNIT
Rated
Dissipation
at 70 °C
Limiting
Element
Voltage
U
Insulation
Voltage
U
Insulation
Resistance
Operating
Temperature
Range
Failure Rate°C0.3 x 10
Weight/
1000 Pieces
Note
(1)
(1)
AC/DC
max.
(1 min)
ins
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials maybe required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still the given solder pad dimensions will be found adequate for most general applications.
(2)
No marking for 0201 and 0402 sizes.
Revision: 15-Apr-13
3
Document Number: 28743
For technical questions, contact: f3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
(1)
Page 4
P70 x R
www.vishay.com
DERATING
120
100
80
Rated Power in %
60
40
20
0
- 55- 250255075100125155 175
70
Ambient Temperature in °C
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
4.5-Resistance-± 1 %± 5 %
4.8.4.2-
4.13-
4.17.558 (Td)Solderability
4.18.258 (Td)
4.1914 (Na)
4.2478 (Cab)
IEC
60068-2
TEST
METHOD
TESTPROCEDURE
Stability for product types:
Temperature
coefficient
Short time
overload
Resistance to
soldering heat
Rapid change
of temperature
Damp heat,
steady state
(20/- 55/20) °C and
(20/125/20) °C
U = 2.5 x 2 x U
duration: Acc. to the style
Pre-aging
4 h at 155 °C,
dryheat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
30 min. at - 55 °C;
30 min. at 125 °C;
1000 cycles± (1 % R + 0.05 ) ± (1 % R + 0.05 ) ± (1 % R + 0.05 )
(40 ± 2) °C;
(93 ± 3) % RH
CRCW....BC e31 to 10 M1 to 10 M1 to 10 M
max.;
Solder bath
method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Solder bath
method;
Sn96.5Ag3Cu0.5
non activated flux;
(245 ± 5) °C
(3 ± 0.3) s
5 cycles± (0.25 % R + 0.05 )± (0.5 % R + 0.05 )± (0.5 % R + 0.05 )
56 days;
REQUIREMENTS PERMISSIBLE CHANGE (R)
STABILITY
CLASS 1
OR BETTER
± 100 ppm/K,
± 200 ppm/K
± (0.25 % R + 0.05 )± (0.5 % R + 0.05 )± (1 % R + 0.05 )
± (0.25 % R + 0.05 )± (0.5 % R + 0.05 )± (1 % R + 0.05 )
± (1 % R + 0.05 )± (2 % R + 0.1
Vishay BCcomponents
STABILITY
CLASS 2
OR BETTER
± 200 ppm/K
Good tinning ( 95 % covered)
no visible damage
Good tinning ( 95 % covered)
no visible damage
CRCW...BC e3
SIZE 0201
± 0.5 %, ± 1 %, ± 5 %
± 100 ppm/K,
± 200 ppm/K,
- 200 ppm/K/
+ 400 ppm/K
)± (2 % R + 0.1 )
Revision: 15-Apr-13
For technical questions, contact: f3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4
Document Number: 28743
Page 5
www.vishay.com
P70 x R
P70 x R
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
4.23-
4.23.22 (Ba)Dry heat125 °C; 16 h
4.23.330 (Db)
4.23.41 (Aa)Cold- 55 °C; 2 h
4.23.513 (M)
4.23.630 (Db)
4.23.7-DC loadU = U
4.25.1-
4.25.3-
IEC
60068-2
TEST
METHOD
TESTPROCEDURE
Stability for product types:
Climatic
sequence:
Damp heat,
cyclic
Low air
pressure
Damp heat,
cyclic
Endurance
at 70 °C
Endurance
at 125 °C
55 °C; 90 % RH;
24 h; 1 cycle
1 kPa; (25 ± 10) °C; 1 h
55 °C; 90 % RH;
24 h; 5 cycles
U = U
1.5 h on; 0.5 h off;
70 °C; 1000 h± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
70 °C; 8000 h± (2 % R + 0.1 )± (4 % R + 0.1 )± (4 % R + 0.1 )
125 °C, 1000 h± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
CRCW....BC e31 to 10 M1 to 10 M1 to 10 M
-
max.
max.;
CRCW...BC e3
Vishay BCcomponents
REQUIREMENTS PERMISSIBLE CHANGE (R)
STABILITY
CLASS 1
OR BETTER
± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
STABILITY
CLASS 2
OR BETTER
SIZE 0201
APPLICABLE SPECIFICATIONS
• EN60115-1Generic specification
• EN140400Sectional specification
• EN140401-802Detail specification
Revision: 15-Apr-13
For technical questions, contact: f3aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
• IEC 60068-2-XVariety of environmental test procedures
• IEC 60286-3Packaging of SMD components
5
Document Number: 28743
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