• Support Component for LITELINK™Data Access Arrangement (DAA)
• Telecommunications
Description
The CPC5602 is an “N” channel depletion mode Field
Effect Transistor (FET) that utilizes Clare’s proprietary
third generation vertical DMOS process. The third
generation process realizes world class, high voltage
MOSFET performance in an economical silicon gate
process. The vertical DMOS process yields a highly
reliable device, particularly in difficult application
environments such as telecommunications.
One of the primary applications for the CPC5602 is
as a linear regulator/hook switch for the LITELINK
family of Data Access Arrangements (DAA) Devices
CPC5610A, CPC5611A, CPC5620A, CPC5621A,
and CPC5622A.
The CPC5602 has a typical on-resistance of 8Ω, a
drain-to-source voltage of 350V, and is available in
an SOT-223 package. As with all MOS devices, the
FET structure prevents thermal runaway and thermalinduced secondary breakdown.
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
VDS= VGS=0V--300pF
Ω
Thermal Characteristics
ParameterSymbolConditionsMinTypMaxUnits
Thermal ResistanceR
θJC
---14ºC/W
2
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R05
Page 3
MANUFACTURING INFORMATION
CPC5602
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
MECHANICAL DIMENSIONS
SOT-223 Package
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.20
(0.138 ± 0.008)
1.75 Nom
(0.069 Nom)
1.60 ± 0.10
(0.063 ± 0.004)
0.051 +0.076/-0.051
(0.002 +0.003/-0.002)
0.75 ± 0.04
(0.029 ± 0.002)
6.50 ± 0.20
(0.256 ± 0.008)
3.05 ± 0.10
(0.120 ± 0.004)
2.30 ± 0.10
(0.0905 ± 0.004)
7.00 ± 0.38
(0.276 ± 0.015)
1.85 MAX
(0.073 MAX)
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
Pb
2002/95/EC
e
3
Recommended PCB Land Pattern
0.31 ± 0.07
(0.012 ± 0.003)
0.80 ± 0.127
(0.031 ± 0.005)
6.20
(0.244)
2.30
(0.0905)
1.90
(0.075)
3.15
(0.124)
0.95
(0.0374)
Dimensions
(inches)
1.90
(0.075)
mm
7” Tape and Reel Packaging for the SOT-223 Package
177.8 Dia
(7.00 Dia)
=7.5 ± 0.1
W=16.0 ± 0.3
(0.630 ± 0.012)
Dimensions
mm
(inches)
Embossed
Carrier
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
Embossment
KO=1.956 MAX.
(0.077 MAX.)
B
O
(0.295 ± 0.004)
=7.0 ± 0.1
A
O
(0.276 ± 0.004)
P=8.0 ± 0.1
(0.315 ± 0.004)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Ter ms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare,
Inc. reserves the right to discontinue or make changes to its products at any time without notice.