TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS11
CMS11
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
· Forward voltage: VFM = 0.55 V (max)
· Average forward current: I
· Repetitive peak reverse voltage: V
· Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Maximum Ratings
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
Average forward current
Peak one cycle surge forward current
(non-repetitive)
Junction temperature Tj -40~150 °C
Storage temperature T
Note: Device mounted on a ceramic board
(board size: 50 mm ´ 50 mm, soldering land: 2 mm ´ 2 mm)
(Ta ==== 25°C)
F (AV)
= 2.0 A
RRM
I
F (AV)
I
F (AV)
I
FSM
= 40 V
RRM
Note
30 (50 Hz) A
stg
40 V
2.0
(Ta = 34°C)
2.0
(Tℓ = 119°C)
-40~150 °C
A
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 3-4E1A
Weight: 0.023 g (typ.)
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CMS11
Electrical Characteristics
Characteristics Symbol Test Condition Min Typ. MaxUnit
Peak forward voltage
Repetitive peak reverse current I
Junction capacitance Cj VR = 10 V, f = 1.0 MHz ¾ 95 ¾ pF
Thermal resistance
(Ta ==== 25°C)
V
IFM = 0.5 A ¾ 0.38 ¾
FM (1)
V
IFM = 1.0 A ¾ 0.42 ¾
FM (2)
IFM = 2.0 A ¾ 0.49 0.55
V
FM (3)
V
= 5.0 V ¾ 2.0 ¾
RRM
RRM
R
th (j-a)
R
th (j-ℓ)
= 40 V ¾ 20.0 500
V
RRM
Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm ´ 6 mm)
¾ ¾ ¾ 16
¾ ¾ 60
¾ ¾ 135
V
mA
°C/W
Marking Following Indicates the Data
of Manufacture
Type code
Lot No.
012 3 4
SA
Cathode mark
Month of
manufacture
Year of
manufacture
January to December
are denoted by letter A
to L respectively.
Last decimal digit of
the year of
manufacture
567 8 9
Standard Soldering Pad
Unit: mm
2.1
1.4
3.0 1.4
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier
products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
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CMS11
100
(A)
F
10
Tj = 150°C
125°C
Instantaneous forward current i
75°C
1
25°C
0.1
0 0.2 1.2 0.8 0.4 0.6 1.0
Instantaneous forward voltage vF (V)
Tℓ max (°C)
Maximum allowable ambient temperature
Device mounted on a ceramic board
160
140
120
100
80
60
40
20
0
(board size: 50 mm ´ 50 mm)
a = 180°
a = 60°
0.4 0 0.8 1.2 2.0 2.4 1.6 2.8 3.2
Average forward current I
1000
(°C/W)
th (j-a)
100
10
Transient thermal impedance r
0.001 1000 0.01 0.1 100 10 1
– vF
i
F
Ta m a x – I
DC
a= 120°
1
F (AV)
Rectangular waveform
Conduction angle: a
VR = 20 V
F (AV)
Average forward power dissipation
1.4 1.6
I
F(AV)
360° 0° a
Maximum allowable lead temperature
(A)
– t
r
th (j-a)
Device mounted on a glass-epoxy board
Soldering land: 2.1 mm ´ 1.4 mm
Device mounted on a ceramic board
Soldering land: 2.0 mm ´ 2.0 mm
Time t (s)
P
1.6
1.4
1.2
1.0
(W)
0.8
F (AV)
0.6
P
0.4
0.2
0.0
0.4 0.0 0.8 1.2 2.0 2.4
Average forward current I
F (AV)
a = 120°
a = 60°
Tℓ max – I
160
140
120
100
80
60
Tℓ max (°C)
40
20
0
Device mounted on a glass-epoxy board
a = 120°
a = 60°
Rectangular
waveform
360°0° a
I
Conduction
angle: a
VR = 20 V
Soldering land: 6.0 mm ´ 6.0 mm
F(AV)
0.4 0 0.8 1.2 2.0 2.4 1.6 2.8 3.2
Average forward current I
– I
a= 180°
1.6 2.8 3.2
F (AV)
Rectangular
waveform
Conduction angle: a
F (AV)
DC
360° 0° a
(A)
F (AV)
DC
a= 180°
F (AV)
(A)
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CMS11
(A)
FSM
Surge forward current (non-repetitive)
50
40
30
20
10
Peak surge forward current I
0
1 10 100
100
Pulse test
(mA)
10
R
1
0.1
0.01
Repetitive peak reverse current I
0.001
0 20 40 60 80 100 120 160
Junction temperature Tj (°C)
Number of cycles
IR – Tj (typ.)
VR = 40 V
VR = 30 V
VR = 20 V
VR = 10 V
VR = 5 V
Ta = 25°C
f = 50 Hz
140
1000
(pF)
j
100
Junction capacitance C
10
1 10 100
Reverse voltage VR (V)
IR – Tj (typ.)
f = 1 MHz
Ta = 25°C
P
Average reverse power dissipation
1.6
Rectangular
1.4
waveform
1.2
1.0
(W)
0.8
R (AV)
0.6
P
0.4
0.2
0.0
0 10 20 40
360°0°
V
R
a
Conduction angle: a
Tj = 150°C
Reverse voltage VR (V)
– VR (typ.)
R (AV)
240°
180°
120°
300°
30
DC
a= 60°
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CMS11
A
RESTRICTIONS ON PRODUCT USE
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
000707EA
5
2003-02-17
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