Datasheet CMS07 Datasheet (TOSHIBA)

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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type

CMS07

CMS07

Switching Mode Power Supply Applications

Portable Equipment Battery Applications

· Forward voltage: V

· Average forward current: I

· Repetitive peak reverse voltage: V

· Suitable for compact assembly due to small surface-mount package

“M−FLAT

TM

” (Toshiba package name)

Maximum Ratings

Characteristics Symbol Rating Unit

Repetitive peak reverse voltage V

Average forward current

Peak one cycle surge forward current
(non-repetitive)

Junction temperature Tj -40~150 °C

Storage temperature T

= 0.45 V (max)

FM

F (AV)

(Ta ==== 25°C)

= 2.0 A

RRM

I

F (AV)

I

F (AV)

I

FSM

= 30 V

RRM

(Note)

40 (50 Hz) A

stg

30 V

2.0

(Ta = 60°C)

2.0

(Tℓ = 126°C)

-40~150 °C

A

Unit: mm

JEDEC ―

JEITA ―

TOSHIBA 3-4E1A

Note: Device mounted on a ceramic board (board size: 50 mm ´ 50 mm,

Weight: 0.023 g (typ.)

soldering land: 2 mm ´ 2 mm)

Electrical Characteristics

Characteristics Symbol Test Condition Min Typ. Max Unit

Peak forward voltage

Repetitive peak reverse current

Junction capacitance Cj VR = 10 V, f = 1.0 MHz ¾ 130 ¾ pF

Thermal resistance R

Thermal resistance R

(Ta ==== 25°C)

V

IFM = 0.5 A ¾ 0.35 ¾

FM (1)

V

IFM = 1.0 A 0.38 ¾

FM (2)

IFM = 2.0 A ¾ 0.41 0.45

V

FM (3)

I

V

RRM

I

V

RRM

th (j-a)

th (j-ℓ)

= 5 V ¾ 3.0 ¾

RRM

= 30 V ¾ 30.0 500

RRM

Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)

Device mounted on a glass-epoxy
board
(soldering land: 6 mm ´ 6 mm)

¾ ¾ ¾ 16 °C/W

¾ ¾ 60

¾ ¾ 135

°C/W

V

mA

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y

Marking Following Indicates the Data
of Manufacture

Type code

Lot No.

0 1 2 3 4

Month of

S7

Cathode mark

manufac­ture

Year of
manufac­ture

January to December
are denoted by letter A
to L respectivel

Last decimal digit of
the year of
manufacture

.

5 6 7 8 9

Standard Soldering Pad

Unit: mm

2.1

1.4

3.0 1.4

Handling Precaution

Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier

products. This current leakage and improper operating temperature or voltage may cause thermal runaway.

Please take forward and reverse loss into consideration when you design.

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T

–

I

(

100

(A)

F

10

75°C

125°C

1

Instantaneous forward current i

0.1
0 0.2 0.3 0.4 0.5 0.6 0.7 0.8

0.1

Instantaneous forward voltage vF (V)

160

140

120

100

80

60

Ta max (°C)

40

20

Maximum allowable ambient temperature

Device mounted on a ceramic board

board size: 50 mm ´ 50 mm)

a = 60°

0

0

0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2

Average forward current I

500

(°C/W)

100

th (j-a)

10

Transient thermal impedance r

0.5

0.001 0.01 0.1 1 10 100 1000

a max

1

– vF

i

F

Tj = 150°C

25°C

a = 180°

a = 120°

0.9

F (AV)

DC

Rectangular

waveform

360° 0° a

I

V

(A)

F (AV)

= 15 V

Conduction angle: a

F (AV)

Device mounted on a glass-epoxy board

Soldering land: 2.1 mm ´ 1.4 mm

Average forward power dissipation

Maximum allowable lead temperature

– t

r

th (j-a)

Device mounted on a ceramic board

Time t (s)

P

1.2

1.0

0.8

(W)

0.6

F (AV)

P

0.4

0.2

0

0

0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2

Average forward current I

F (AV)

a = 120°

a = 60°

Tℓ max – I

160

140

120

100

80

60

Tℓ max (°C)

40

20

Conduction angle: a

0

0

Device mounted on a glass-epoxy board

Soldering land: 6.0 mm ´ 6.0 mm

Soldering land: 2.0 mm ´ 2.0 mm

a = 60°

Rectangular

waveform

360°0° a

I

F (AV)

V

= 15 V

0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2

Average forward current I

– I

F (AV)

a = 180°

F (AV)

DC

Rectangular

waveform

360° 0° a

Conduction angle: a

(A)

F (AV)

DC

a = 180°

a = 120°

(A)

F (AV)

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(A)

FSM

Surge forward current (non-repetitive)

50

40

30

20

10

Peak surge forward current I

0

1 10

I

100

Pulse test

10

(mA)

R

1

0.1

Reverse current I

0.01

0.001
0

40 140

20 8060 120 100

Junction temperature Tj (°C)

Number of cycles

– T

R

j

VR = 30 V

VR = 10 V

VR = 5 V

VR = 3 V

Ta = 25°C

f = 50 Hz

VR = 20 V

VR = 15 V

(typ.)

100

160

C

1000

(pF)

j

100

Junction capacitance C

10

1

Reverse voltage VR (V)

– VR (typ.)

j

f = 1 MHz

Ta = 25°C

10 100

P

Average reverse power dissipation

1.6

1.4

1.2

1.0

(W)

0.8

R (AV)

0.6

P

0.4

0.2

Rectangular

wavefo rm

360°

0°

V

R

a

Conduction angle: a

Tj = 150°C

0

0

10 30

Reverse voltage VR (V)

– VR (typ.)

R (AV)

240°

180°

120°

60°

20

DC

300°

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A

RESTRICTIONS ON PRODUCT USE

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.

· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.

· The information contained herein is subject to change without notice.

000707EA

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