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查询CMS06供应商
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS06
CMS06
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
· Forward voltage: VFM = 0.37 V (max)
· Average forward current: I
· Repetitive peak reverse voltage: V
· Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Maximum Ratings
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
Average forward current I
Peak one cycle surge forward current
(non-repetitive)
Junction temperature Tj -40~125 °C
Storage temperature T
(Ta ==== 25°C)
F (AV)
= 2.0 A
RRM
F (AV)
I
FSM
= 30 V
RRM
40 (50 Hz) A
stg
30 V
2.0
(Note)
-40~150 °C
A
Unit: mm
JEDEC ―
JEITA ―
Note: Tℓ = 82.8°C: Rectangular waveform (a = 180°C), VR = 15 V
TOSHIBA 3-4E1A
Weight: 0.023 g (typ.)
Electrical Characteristics
Characteristics Symbol Test Condition Min Typ. Max Unit
Peak forward voltage
Repetitive peak reverse current
Junction capacitance Cj VR = 10 V, f = 1.0 MHz ¾ 130 ¾ pF
Thermal resistance R
Thermal resistance R
(Ta ==== 25°C)
V
IFM = 0.5 A ¾ 0.26 ¾
FM (1)
V
IFM = 1.0 A ¾ 0.28 ¾
FM (2)
V
IFM = 2.0 A ¾ 0.32 0.37
FM (3)
I
V
RRM
I
V
RRM
th (j-a)
th (j-ℓ)
= 5 V ¾ 0.09 ¾
RRM
= 30 V ¾ 1.4 3.0
RRM
Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm ´ 6 mm)
¾ ¾ ¾ 16 °C/W
¾ ¾ 60
¾ ¾ 135
°C/W
V
mA
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y
Marking Following Indicates the Data
of Manufacture
Type code
Lot No.
0 1 2 3 4
Month of
S6
Cathode mark
manufacture
Year of
manufacture
January to December
are denoted by letter A
to L respectivel
Last decimal digit of
the year of
manufacture
.
5 6 7 8 9
Standard Soldering Pad
Unit: mm
2.1
1.4
3.0 1.4
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier
products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
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100
(A)
F
10
Tj = 125°C
75°C
1
Instantaneous forward current i
0.1
0.0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Instantaneous forward voltage vF (V)
140
120
100
80
60
Tℓ max (°C)
40
20
Maximum allowable lead temperature
0
0.0
a = 120°
a = 60°
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
Average forward current I
500
(°C/W)
100
th (j-a)
10
Transient thermal impedance r
0.5
0.001
- vF
i
F
25°C
Tℓ max - I
a = 180°
Device mounted on a glass-epoxy board
1
F (AV)
DC
Rectangular
waveform
Conduction angle: a
V
= 15 V
(A)
F (AV)
Soldering land: 2.1 mm ´ 1.4 mm
0.01 10
P
1.0
0.9
0.8
0.7
0.6
(W)
360° 0° a
I
F (AV)
Average forward power dissipation
0.5
F (AV)
0.4
P
0.3
0.2
0.1
0.0
0.0
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
Average forward current I
C
1000
(pF)
j
100
Junction capacitance C
10
1
F (AV)
a = 120°
a = 60°
Reverse voltage VR (V)
- t
r
th (j-a)
Device mounted on a glass-epoxy board
Soldering land: 6.0 mm ´ 6.0 mm
Device mounted on a ceramic board
Soldering land: 2.0 mm ´ 2.0 mm
0.1 1 100 1000
Time t (s)
- I
F (AV)
a = 180°
DC
Rectangular
waveform
360° 0° a
Conduction angle: a
(A)
F (AV)
- VR (typ.)
j
f = 1 MHz
Ta = 25°C
10 100
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(A)
FSM
Surge forward current (non-repetitive)
50
40
30
20
I
1000
Ta = 25°C
f = 50 Hz
Pulse test
100
(mA)
R
10
1
Reverse current I
10
Peak surge forward current I
0
1 10
100
Number of cycles
0.1
0.01
040
20 80 60 100 120
Junction temperature Tj (°C)
P
10.0
(W)
R (AV)
P
Rectangular
waveform
0°
8.0
VR
Conduction angle: a
6.0
Tj = 125°C
4.0
360°
2.0
Average reverse power dissipation
0.0
0 10
Reverse voltage VR (V)
R (AV)
120°
60°
- V
180°
240°
R
300°
20
DC
(typ.)
30
- T
R
VR = 20 V
j
VR = 30 V
VR = 15 V
V
= 10 V
R
VR = 5 V VR = 3 V
(typ.)
140
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A
RESTRICTIONS ON PRODUCT USE
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
000707EA
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This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.
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