Powerex IGBTMOD™ Modules
are designed for use in switching
applications. Each module consists
of two IGBT Transistors in a halfbridge configuration with each transistor having a reverse-connected
super-fast recover y free-wheel
diode. All components and interconnects are isolated from the
heat sinking baseplate, offering
simplified system assembly and
thermal management.
Features:
□ Low Drive Power
□ Low V
□ Discrete Super-Fast Recovery
□ Isolated Baseplate for Easy
Applications:
□ AC Motor Control
□ UPS
□ Battery Powered Supplies
Ordering Information:
Example: Select the complete
module number you desire from
the table - i.e. CM200DU-12F is a
600V (V
IGBTMOD™ Power Module.
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
RatingsSymbolCM200DU-12FUnits
Junction TemperatureT
Storage TemperatureT
Collector-Emitter Voltage (G-E SHORT)V
Gate-Emitter Voltage (C-E SHORT)V
Collector Current (Tc = 25°C)I
Peak Collector CurrentI
Emitter Current** (Tc = 25°C)I
Peak Emitter Current**I
Maximum Collector Dissipation (Tc = 25°C, Tj ≤ 150°C)P
j
stg
CES
GES
C
CM
E
EM
c
Mounting Torque, M5 Main Terminal – 31 in-lb
Mounting Torque, M6 Mounting–40in-lb
Weight–310Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.)V
iso
-40 to 150°C
-40 to 125°C
600Volts
±20Volts
200Amperes
400*Amperes
200Amperes
400*Amperes
590Watts
2500Volts
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff CurrentI
Gate Leakage Current I
Gate-Emitter Threshold V oltageV
Collector-Emitter Saturation VoltageV
Total Gate ChargeQ
Emitter-Collector Voltage**V
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed T
** Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).