Datasheet CM1293-02SO, CM1293-02SR, CM1293-02ST, CM1293-04MR, CM1293-04MS Datasheet (CMD) [ru]

CM1293

2, 4, and 8-Channel Low Capacitance ESD Protection Arrays

Features

• 2, 4, and 8 channels of ESD protection

• Provides

ESD protection to IEC61000-4-2

- 8kV contact discharge

- 15kV air discharge

• Low loading capacitance of 2.0pF max.

• Low clamping voltage

• Channel I/O to I/O capacitance 1.5pF typical

• Zener diode protects supply rail and eliminates the
need for external by-pass capacitors

• Each I/O pin can withstand over 1000 ESD strikes

• Available in SOT, and MSOP packages

• Lead-free version available

Applications

• DVI ports, HDMI ports in notebooks, set top boxes,
digital TVs, LCD displays

• Serial ATA ports in desktop PCs and hard disk
drives

• PCI Express ports

• General purpose high-speed data line ESD
protection

Product Description

The CM1293 family of diode arrays has been designed
to provide ESD protection for electronic components or
sub-systems requiring minimal capacitive loading.
These devices are ideal for protecting systems with
high data and clock rates or for circuits requiring low
capacitive loading. Each ESD channel consists of a
pair of diodes in series which steer the positive or neg­ative ESD current pulse to either the positive (V

negative (V
between V
protects the V

) supply rail. A Zener diode is embedded

N

and VN, offering two advantages. First, it

P

rail against ESD strikes, and second,

CC

it eliminates the need for a bypass capacitor that would
otherwise be needed for absorbing positive ESD
strikes to ground. The CM1293 will protect against
ESD pulses up to (±15kV air, ±8kV contact discharge)
per the IEC 61000-4-2 Level 4 standard.

This device is particularly well-suited for protecting sys­tems using high-speed ports such as USB2.0,

IEEE1394 (Firewire

®, iLink™), Serial ATA, DVI, HDMI

and corresponding ports in removable storage, digital
camcorders, DVD-RW drives and other applications
where extremely low loading capacitance with ESD
protection are required in a small package footprint.

P

) or

The CM1293 family of devices is available with
optional lead-free finishing.

Electrical Schematics

CH6

V

P

CH1

V

N

CM1293-02ST/SO

CM1293--02SR

© 2006 California Micro Devices Corp. All rights reserved.

01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 1

CH2

CH4

CH1

CM1293-04ST/SO

CM1293-04MS/MR

CH3

V

P

CH2

V

N

CH8

CH1

CH7

CH2

CM1293-08MS/MR

V

P

CH3

V

N

CH5

CH4

PACKAGE / PINOUT DIAGRAMS

CM1293

Top View

4

V

CH1

1

N

D036

2

V

P

3

CH2

4-Lead SOT143-4

Top View

CH1

CH2

1

D035

V

2

N

3

6-Lead SOT23-6

6

D034 /

5

4

Note: These drawings are not to scale.

PIN DESCRIPTIONS

2-CHANNEL, 4-LEAD SOT143-4 PACKAGE

PIN NAME TYPE PIN

V

1

2 CH1 I/O 2

3 CH2 I/O 3

4

PIN NAME TYPE DESCRIPTION

1 NC No connect

2V

3 CH1 I/O ESD Channel

4 CH2 I/O ESD Channel

5V

PIN NAME TYPE DESCRIPTION

1 CH1 I/O ESD Channel

2V

3 CH2 I/O ESD Channel

4 CH3 I/O ESD Channel

5V

6 CH4 I/O ESD Channel

5V

6 CH4 I/O ESD Channel

N

V

P

N

P

N

P

P

GND 1

PWR

2-CHANNEL, 5-LEAD SOT23-5 PACKAGE

GND Negative voltage supply rail

PWR Positive voltage supply rail

4-CHANNEL, 6-LEAD SOT23-6 PACKAGE

GND Negative voltage supply rail

PWR Positive voltage supply rail

PWR Positive voltage supply rail

Top View

1

NC

2

V

N

CH1

3

5-Lead SOT23-5

D032 /

D033

5

V

P

4

CH2

CH1

CH2

CH3

CH4

V

Top View

1

2

3

4

N

56

10-Lead MSOP-10

D039

10

D038 /

CH8

9

CH7

V

8

7

P

CH6

CH5

Top View

1

CH4

V

P

CH3

CH1

NC

V

CH2

P

10

2

D040 /

D041

3

4

56NC CH3

10-Lead MSOP-10

4-CHANNEL, 10-LEAD MSOP-10 PACKAGE

PIN NAME TYPE DESCRIPTION

1 CH1 I/O ESD Channel

2 NC No connect

3V

4 CH2 I/O ESD Channel

4

5 NC No connect

6 CH3 I/O ESD Channel

7 NC No connect

8V

9 CH4 I/O ESD Channel

10 NC No connect

PIN NAME TYPE DESCRIPTION

1 CH1 I/O ESD Channel

2 CH2 I/O ESD Channel

3 CH3 I/O ESD Channel

4 CH4 I/O ESD Channel

5V

6 CH5 I/O ESD Channel

7 CH6 I/O ESD Channel

8V

9 CH7 I/O ESD Channel

10 CH8 I/O ESD Channel

P

N

N

N

PWR Positive voltage supply rail

GND Negative voltage supply rail

8-CHANNEL, 10-LEAD MSOP-10 PACKAGE

PWR Positive voltage supply rail

GND Negative voltage supply rail

NC

CH4

9

V

8

7

N

NC

© 2006 California Micro Devices Corp. All rights reserved.

2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 01/26/06

Ordering Information

PART NUMBERING INFORMATION

# of Channels Leads Package

2 4 SOT143-4 CM1293-02SR D036

2 5 SOT23-5 CM1293-02ST D032 CM1293-02SO D033

4 6 SOT23-6 CM1293-04ST D034 CM1293-04SO D035

4 10 MSOP-10 CM1293-04MS D040 CM1293-04MR D041

8 10 MSOP-10 CM1293-08MS D038 CM1293-08MR D039

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Specifications

Standard Finish Lead-free Finish

Ordering Part

Number

1

Part Marking

Ordering Part

Number

1

CM1293

Part Marking

ABSOLUTE MAXIMUM RATINGS

PARAMETER RATING UNITS

Operating Supply Voltage (V

Operating Temperature Range -40 to +85 °C

Storage Temperature Range -65 to +150 °C

DC Voltage at any channel input (V

- VN)6.0V

P

- 0.5) to (VP + 0.5) V

N

STANDARD OPERATING CONDITIONS

PARAMETER RATING UNITS

Operating Temperature Range -40 to +85 °C

Package Power Rating

SOT143-4 Package (CM1293-02SR)
SOT23-5 Package (CM1293-02ST/SO)
SOT23-6 Package (CM1293-04ST/SO)
MSOP-10 Package (CM1293-04MS/MR)
MSOP-10 Package (CM1293-08MS/MR)

225
225
225
400
400

mW
mW
mW
mW
mW

© 2006 California Micro Devices Corp. All rights reserved.

01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 3

Specifications (cont’d)

CM1293

ELECTRICAL OPERATING CHARACTERISTICS

1

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

V

I

V

I

LEAK

C

Operating Supply Voltage (VP-VN)3.35.5V

P

Operating Supply Current (VP-VN)=3.3V 8.0 μA

P

Diode Forward Voltage

F

Top Diode
Bottom Diode

IF = 8mA; TA=25°C

0.60

0.60

0.80

0.80

0.95

0.95

V
V

Channel Leakage Current TA=25°C; VP=5V, VN=0V ±0.1 ±1.0 μA

Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V;

IN

2.0 pF

Note 2

ΔC

V

ESD

Channel I/O to I/O capacitance 1.5 pF

IO

ESD Protection

Peak Discharge Voltage at any
channel input, in system

a) Contact discharge per

Notes 2, 4 & 5; T

=25°C

A

±8

kV
IEC 61000-4-2 standard
b) Human Body Model,
MIL-STD-883, Method

Notes 2, 3 & 5; T

=25°C

A

±15

kV

3015

R

V

DYN

Channel Clamp Voltage

CL

Positive Transients
Negative Transients

Dynamic Resistance

Positive Transients
Negative Transients

At 8kV ESD HBM; TA=25°C; Notes 2 & 3

TA=25°C; Notes 5 & 6

+9.0

-9.0

1.2

0.6

V
V

Ω
Ω

Note 1: All parameters specified at TA = -40°C to +85°C unless otherwise noted.
Note 2: These parameters guaranteed by design and characterization.

Note 3: Human Body Model per MIL-STD-883, Method 3015, C
Note 4: Standard IEC 61000-4-2 with C
Note 5: These measurements performed with no external capacitor on V
Note 6: Measured under pulsed conditions, pulse width = 0.7mS, maximum current = 1.5A.

© 2006 California Micro Devices Corp. All rights reserved.

Discharge

= 150pF, R

Discharge

= 100pF, R

Discharge

= 330Ω, VP = 3.3V, VN grounded.

.

P

Discharge

= 1.5KΩ, VP = 3.3V, VN grounded.

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CM1293

Performance Information (Cont’d)

Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)

Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, V

Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, V

=3.3V)

P

=3.3V)

P

© 2006 California Micro Devices Corp. All rights reserved.

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Application Information

Design Considerations

CM1293

In order to realize the maximum protection against
ESD pulses, care must be taken in the PCB layout to
minimize parasitic series inductances on the Supply/
Ground rails as well as the signal trace segment
between the signal input (typically a connector) and the
ESD protection device. Refer to Figure 3, which illus­trates an example of a positive ESD pulse striking an
input channel. The parasitic series inductance back to
the power supply is represented by L

age V

where I

on the line being protected is:

CL

VCL = Fwd voltage drop of D1 + V

+ L

x d(I

2

is the ESD current pulse, and V

ESD

ESD

) / dt

and L2. The volt-

1

+ L1 x d(I

SUPPLY

) / dt

ESD

SUPPLY

is

the positive supply voltage.

An ESD current pulse can rise from zero to its peak
value in a very short time. As an example, a level 4
contact discharge per the IEC61000-4-2 standard
results in a current pulse that rises from zero to 30
Amps in 1ns. Here d(I

ΔI

/Δt, or 30/(1x10-9). So just 10nH of series induc-

ESD

tance (L
ment in V

and L2 combined) will lead to a 300V incre-

1

!

CL

)/dt can be approximated by

ESD

Similarly for negative ESD pulses, parasitic series
inductance from the V

pin to the ground rail will lead

N

to drastically increased negative voltage on the line
being protected.

The CM1293 has an integrated Zener diode between
V

and VN. This greatly reduces the effect of supply rail

P

inductance L

on VCL by clamping VP at the break-

2

down voltage of the Zener diode. However, for the low­est possible V

, especially when VP is biased at a

CL

voltage significantly below the Zener breakdown volt­age, it is recommended that a 0.22μF ceramic chip
capacitor be connected between VP and the ground

plane.

As a general rule, the ESD Protection Array should be
located as close as possible to the point of entry of
expected electrostatic discharges. The power supply
bypass capacitor mentioned above should be as close
to the V

pin of the Protection Array as possible, with

P

minimum PCB trace lengths to the power supply,
ground planes and between the signal input and the
ESD device to minimize stray series inductance.

Additional Information

See also California Micro Devices Application Note
AP209, “Design Considerations for ESD Protection”, in
the Applications section at www.calmicro.com.

V

P

0.22μF

V

N

D

1

D

2

ONE
CHANNEL
OF

CM1213

2

PATH OF ESD CURRENT PULSE I

L

1

CHANNEL

INPUT

25A

0A

POSITIVE SUPPLY RAIL

LINE BEING
PROTECTED

V

CL

GROUND RAIL

ESD

CHASSIS GROUND

SYSTEM OR
CIRCUITRY
BEING
PROTECTED

V

CC

L

Figure 3. Application of Positive ESD Pulse between Input Channel and Ground

© 2006 California Micro Devices Corp. All rights reserved.

6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 01/26/06

Mechanical Details

SOT143 Mechanical Specifications

Dimensions for CM1293-02SR devices supplied in 4­pin SOT143 packages are presented below.

For complete information on the SOT143, see the Cali­fornia Micro Devices SOT143 Package Information
document.

PACKAGE DIMENSIONS

Package SOT143

Pins 4

Dimensions

A 0.80 1.22 0.031 0.048

A1 0.05 0.15 0.002 0.006

b 0.30 0.50 0.012 0.019

b2 0.76 0.89 0.030 0.035

c 0.08 0.20 0.003 0.008

D 2.80 3.04 0.110 0.119

E 2.10 2.64 0.082 0.103

E1 1.20 1.40 0.047 0.055

e 1.92 BSC 0.075 BSC

e1 0.20 BSC 0.008 BSC

L 0.4 0.6 0.016 0.024

L1 0.54 REF 0.021 REF

# per tape

and reel

Controlling dimension: millimeters

Millimeters Inches

Min Max Min Max

3000 pieces

CM1293

Mechanical Package Diagrams

TOP VIEW

e

43

E

E1

12

e1

SIDE VIEW

D

A

b2

END VIEW

c

b

A1

L

L1

Package Dimensions for SOT143.

© 2006 California Micro Devices Corp. All rights reserved.

01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 7

Mechanical Details (cont’d)

SOT23-5 Mechanical Specifications

Dimensions for CM1293-02ST/SO devices packaged
in 5-pin SOT23 packages are presented below.

CM1293

Mechanical Package Diagrams

For complete information on the SOT23-5 package,
see the California Micro Devices SOT23 Package
Information document.

PACKAGE DIMENSIONS

Package SOT23-5 (JEDEC name is MO-178)

Pins 5

Dimensions

A -- 1.45 -- 0.0571

A1 0.00 0.15 0.0000 0.0059

b 0.30 0.50 0.0118 0.0197

c 0.08 0.22 0.0031 0.0087

D 2.75 3.05 0.1083 0.1201

E 2.60 3.00 0.1024 0.1181

E1 1.45 1.75 0.0571 0.0689

e 0.95 BSC 0.0374 BSC

e1 1.90 BSC 0.0748 BSC

L 0.30 0.60 0.0118 0.0236

L1 0.60 REF 0.0236 REF

# per tape

and reel

Controlling dimension: millimeters

Millimeters Inches

Min Max Min Max

3000 pieces

TOP VIEW

e1

e

54

E1

12 3

b

SIDE VIEW

D

A1

END VIEW

c

L1
L

E

A

© 2006 California Micro Devices Corp. All rights reserved.

8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 01/26/06

Mechanical Details (cont’d)

SOT23-6 Mechanical Specifications

CM1293-04ST/SO devices are packaged in 6-pin
SOT23 packages. Dimensions are presented below.

For complete information on the SOT23-6 package,
see the California Micro Devices SOT23 Package
Information document.

CM1293

Mechanical Package Diagrams

TOP VIEW

e1

e

65 4

PACKAGE DIMENSIONS

Package SOT23-6 (JEDEC name is MO-178)

Pins 6

Dimensions

A -- 1.45 -- 0.0571

A1 0.00 0.15 0.0000 0.0059

b 0.30 0.50 0.0118 0.0197

c 0.08 0.22 0.0031 0.0087

D 2.75 3.05 0.1083 0.1201

E 2.60 3.00 0.1024 0.1181

E1 1.45 1.75 0.0571 0.0689

e 0.95 BSC 0.0374 BSC

e1 1.90 BSC 0.0748 BSC

L 0.30 0.60 0.0118 0.0236

L1 0.60 REF 0.0236 REF

# per tape

and reel

Controlling dimension: millimeters

Millimeters Inches

Min Max Min Max

3000 pieces

Pin 1

Marking

12 3

b

SIDE VIEW

D

END VIEW

c

E1

A1

E

A

L1
L

Package Dimensions for SOT23-6.

© 2006 California Micro Devices Corp. All rights reserved.

01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 9

Mechanical Details (cont’d)

MSOP-10 Mechanical Specifications

CM1293-04MS/MR and CM1293-08MS/MR devices
are packaged in 10-pin MSOP packages. Dimensions
are presented below.

For complete information on the MSOP-10 package,
see the California Micro Devices MSOP Package Infor­mation document.

PACKAGE DIMENSIONS

CM1293

Mechanical Package Diagrams

TOP VIEW

D

10 9 8 7

6

Package MSOP

Pins 10

Dimensions

A 0.75 0.95 0.028 0.038

A1 0.05 0.15 0.002 0.006

B 0.18 0.40 0.006 0.016

C 0.18 0.007

D 2.90 3.10 0.114 0.122

E 2.90 3.10 0.114 0.122

e 0.50 BSC 0.0196 BSC

H 4.76 5.00 0.187 0.197

L 0.40 0.70 0.0137 0.029

# per tape

and reel

Millimeters Inches

Min Max Min Max

4000

Controlling dimension: inches

SEATING

PLANE

C

H

A

L

Pin 1
Marking

1234

SIDE VIEW

B

END VIEW

E

5

A1

e

Package Dimensions for MSOP-10

© 2006 California Micro Devices Corp. All rights reserved.

10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 01/26/06