Page 1
General Multilayer Ceramic Capacitors
MLCC is an electronic part that temporarily stores an electrical charge and the
most prevalent type of capacitor today. New technologies have enabled the
MLCC manufacturers to follow the trend dictated by smaller and
smaller electronic devices such as Cellular telephones, Computers, DSC, DVC
General Features
- Miniature Size
- Wide Capacitance and Voltage Range
- Tape & Reel for Surface Mount Assembly
- Low ESR
Applications
- General Electronic Circuit
Part Numbering
CL 10 B 104 K B 8 N N N C
1
●
1
● Samsung Multilayer Ceramic Capacitor ● Thickness Option
2
● Size(mm) ● Product & Plating Method
3
● Capacitance Temperature Characteristic ● Samsung Control Code
4
● Nominal Capacitance ● Reserved For Future Use
5
● Capacitance Tolerance ● Packaging Type
6
● Rated Voltage
1
● Samsung Multilayer Ceramic Capacitor
2
● SIZE(mm)
●2●
Code EIA CODE Size(mm)
03
05
3
4
●
●5●6●7●8●9●10●
0201 0.6×0.3
0402 1.0×0.5
General Capacitors
11
7
8
9
108
118
10
21
31
32
43
55
0603 1.6×0.8
0805 2.0×1.25
1206 3.2×1.6
1210 3.2×2.5
1812 4.5×3.2
2220 5.7×5.0
Page 2
3
● CAPACITANCE TEMPERAT URE CHARACTERIS TIC
Code Temperature Characteristics
C
P
R
Ⅰ
S
T
U
L
A
B
X
F
Class
Class
Ⅱ
COG C
P2H P
R2H R
S2H S
T2H T
U2J U
S2L S
X5R X5R
X7R X7R
X6S X6S
Y5V Y5V +22 ~ -82% -30 ~ +85
△
△
△
△
△
△
△
※ Temperature Characteristic
Temperature
Characteristics
Δ
C
Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF
C0G C0G C0G C0G
0±30(ppm/℃)
-150±60
-220±60
-330±60
-470±60
-750±60
+350 ~ -1000
±
15%
±
15%
±
22%
Temperature
Range
-55 ~ +125
-55 ~ +85
-55 ~ +125
-55 ~ +105
℃
℃
℃
℃
℃
General Capacitors
Δ
P
Δ
R
Δ
S
Δ
T
Δ
U
- P2J P2H P2H
- R2J R2H R2H
- S2J S2H S2H
- T2J T2H T2H
- U2J U2J U2J
J : ±120PPM/℃, H : ±60PPM/℃, G : ±30PPM/℃
4
● NOMINAL CAPACITANCE
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
● Example
Code Nominal Capacitance
1R5 1.5pF
103 10,000pF, 10nF, 0.01μF
104 100,000pF, 100nF, 0.1μF
Page 3
5
● CAPACITANCE TO LERANCE
Code Tolerance Nominal Capacitance
±
A
B
C
D
F
F
G
J
K
M
0.05pF
±
±
0.25pF
±
±
±
±
±
±
±
0.1pF
Less than 10pF
(Including 10pF)
0.5pF
1pF
1%
2%
5%
More than 10pF
10%
20%
Z
6
● RATED VOLTAGE
Code Rated Voltage Code Rated Voltage
R
Q
P
O
A
L
B
C
+80, -20%
4.0V
6.3V
10V
16V
25V
35V
50V
100V
General Capacitors
D
E
G
H
I
J
K
200V
250V
500V
630V
1,000V
2,000V
3,000V
Page 4
7
● THICKNESS OPTION
Size Code Thickness (T) Size Code Thickness (T)
0201(0603)
0402(1005)
0603(1608)
0805(2012)
1206(3216)
1210(3225)
3
5
8
A
C
F
Q
C
F
H
F
H
I
J
0.30±0.03
0.50±0.05
0.80±0.10
0.65±0.10
0.85±0.10
1.25±0.10
1.25±0.15
0.85±0.15
1.25±0.15
1.6±0.20
1.25±0.20
1.6±0.20
2.0±0.20
2.5±0.20
1812(4532)
2220(5750)
F
H
I
J
L
F
H
I
J
L
1.25±0.20
1.6±0.20
2.0±0.20
2.5±0.20
3.2±0.30
1.25±0.20
1.6±0.20
2.0±0.20
2.5±0.20
3.2±0.30
General Capacitors
V
8
● PRODUCT & PLATING METHOD
Code Electrode Termination Plating Type
A
N
G
9
● SAMSUNG CONTROL CODE
Code Description of the code Code Description of the code
A
B
C
Pd Ag Sn_100%
Ni Cu Sn_100%
Cu Cu Sn_100%
Array (2-element)
Array (4-element)
2.5±0.30
High - Q
N
P
L
Normal
Automotive
LICC
Page 5
10
● RESERVED FOR FUTURE USE
6
Code Descri ption of the code
N Reserved for future use
11
● PACKAGING TYPE
Code Packaging Type Code Packaging Type
B
P
C
D
Paper 13" (10,000EA)
E
Bulk
Bulk Case
Paper 7"
Embo ssing 7"
APPEARANCE AND DIMENSION
T
F
L
O
S
Embossing 13" (10,000EA)
Paper 13" (15,000EA)
Paper 10"
Embossing 10"
General Capacitors
L
W
BW
CODE EIA CODE
03
05
10
21
31
32
43
55
0201 0.6±0.03 0.3±0.03 0.33 0.15±0.05
0402 1.0±0.05 0.5±0.05 0.55 0.2 +0.15/-0.1
0603 1.6±0.1 0.8±0.1 0.9 0.3±0.2
0805 2.0±0.1 1.25±0.1 1.35 0.5 +0.2/-0.3
1206
1210
1812 4.5±0.4 3.2±0.3 3.5 0.8±0.3
2220 5.7±0.4 5.0±0.4 3.5 1.0±0.3
DIMENSION ( mm )
L W T(MAX) BW
3.2±0.15 1.6±0.15 1.40 0.5 +0.2/-0.3
3.2±0.2 1.6±0.2 1.8 0.5 +0.3/-0.3
3.2±0.3 2.5±0.2 2.7
0.6±0.3
3.2±0.4 2.5±0.3 2.8
Page 6
RELIABILTY TEST CONDITION
NO
ITEM PE RFO RMA NCE TES T CONDITION
1 Appearance No Abnormal Exterior Appearance Through Microscope(×10)
10,000㏁or 500㏁·㎌whiche ver is smaller
2
Insulation
Resistan c e
Rate d Voltage is b e low 16V ;
Apply the Rated Voltage For 60 ~ 120 Sec.
10,000㏁or 100㏁·㎌whiche ver is smaller
Withstanding
3
4
Voltage
Capacita
nce
5Q
No Dielectric Breakdown or
Mechanical Breakdown
Class
Ⅰ
Class
Ⅱ
Class
Ⅰ
With in the specified to lerance
Within the specified tolerance
Capacitance≥30㎊:Q≥1,000
<30㎊:Q≥400 +20C
( C : Capacitance )
1. C ha racteristic : A(X5R), B(X7R), X(X6S)
Rat ed Volt age
≥
25V 0.025 max
Spec
ClassⅠ: 300% of the R at ed Volt age for 1~ 5 sec.
ClassⅡ:250% of the Ra ted Voltage for 1~5 s ec . is applied
with less than 50㎃current
Capacitance Frequency Voltage
≤
㎊
1,000
㎊
>1,000
Capacitance Frequency Voltage
≤10㎌
㎌
>10
Capacitance Frequency Voltage
≤
㎊
1,000
㎊
>1,000
Capacitance Frequency Voltage
≤10㎌
㎌
>10
16V 0.035 max
10V 0.05 max
*1. 0201 C≥0.022uF, 0402 C≥0.22uF, 0603 C≥2.2uF,
1
0805 C≥4.7uF, 1206 C≥10uF, 1210 C≥22uF,
1812 C≥47uF, 2220 C≥100uF,
All Low Profile Capacitors (P.16).
*2.. 0603 C≥0.47uF, 0805 C≥1uF
*3. 0402 C≥0.033uF, 0603 C>0.1uF
2
All 0805, 1206 size, 1210 C≤6.8uF
*4.. 1210 C>6.8uF
*5.. 0402 C≥0.22uF
4
*6.. All 1812 size
5
6
6Tan
δ
2. C haracteristic : F ( Y5V)
Class
Rat ed Vo ltage
Ⅱ
6.3V 0.05 m ax/ 0.10max*
Spec
50V 0.05 max, 0.07max*
35V 0.07 max
25V
0.05 m ax/
0.07 m ax*
3
/ 0.09m ax*
16V 0.09 m ax/ 0.125max*
10V 0.125 m ax/ 0.16max*
6.3V 0.16max
1㎒±10%
1㎑±10%
0.5 ~ 5 Vrms
1㎑±10% 1.0±0.2Vrms
120㎐±20% 0.5±0.1Vrms
1㎒±10%
1㎑±10%
0.5 ~ 5 Vrms
1㎑±10% 1.0±0.2Vrms
120㎐±20% 0.5±0.1Vrms
General Capacitors
Page 7
RELIABILTY TEST CONDITION
NO
7
Temperature
Characteristics
of Capacitance
ITEM PERFORMANCE TEST CONDITION
Capacitance shall be measured by the steps
shown in the following table.
Step Tem p.(℃)
125±2
2 Min. operating temp. ± 2
325±2
4 Max. operating temp ± 2
525±2
(1) Class
Temperature Coefficient shall be calculated from
the formula as below.
Temp, Coefficient =
C1; Capacitance at step 3
C2: Capacitance at 85
△
(2) CLASS
Capacitance Change shall be calculated from the
formula as below.
△
C1; Capacitance at step 3
C2: Capacitance at step 2 or 4
Apply 500g.f * Pressure for 10±1 sec.
* 200g.f for 0201 case size.
Ⅰ
T: 60℃(=85℃-25℃)
Ⅱ
C2 - C1
C=
C1
C2 - C1
C1×△T
℃
×100(%)
×10
Class
Ⅰ
Class
Ⅱ
Characteristics
C0G 0 ± 30
PH -150 ± 60
RH -220 ± 60
SH -330 ± 60
TH -470 ± 60
UL -750 ± 120
SL +350 ~ -1000
Characteristics
A(X5R)/
B(X7R)
X(X6S) ±22%
F(Y5V) +22% ~ -82%
Temp. Coefficient
Capacitance Change
with No Bias
(PPM/℃)
±15%
6
[ppm/℃]
General Capacitors
8
9
Adhesive Strength
of Termination
Bending
Strength
Apperance No mechanical damage shall occur.
Capacitance
No Indication Of Peeling Shall Occur On The
Terminal Electrode.
Characteristics Capacitance Change
Within ±5% or ± 0.5
Class I
A(X5R)/
B(X7R)/
X(X6S)
Class II
F(Y5V) Within ± 30%
pF whichever is
larger
Within ±12.5%
500g.f
Bending limit ; 1mm
Test speed ; 1.0mm/SEC.
Keep the test board at the limit point in 5 sec.,
Then measure capacitance.
20
R=340*
50
○○
45±1
R=230 For 0201 Case size
45±1
Bending limit
Page 8
RELIABILTY TEST CONDITION
NO
10
11
Solderability
Resistance to
Soldering heat
ITEM PERFORMANCE TEST CONDITION
More Than 95% of the terminal surface is to
be soldered newly, So metal part does not
com e out or dissolve
Apperance No mechanical damage shall occur. Solder Temperature : 270±5
Characteristics Capacitance Change
Within ± 2.5% o r
Capacitance
Q
(ClassⅠ)
δ
Tan
(ClassⅡ)
Insulation
Resistance
Withstanding
Voltage
Ⅰ
Class
A(X5R)/
B(X7R)
Ⅱ
Class
Capacitance≥30㎊:Q≥1000
Within the specified initial value
Within the specified initial value
Within the specified initial value
X(X6S) Within ±15%
±0.25㎊whichever is
larger
Within ± 7.5%
F Within ±20%
<30㎊:Q≥400+20×C
(C: Capacitance)
Solder Sn-3Ag-0.5Cu 63Sn-37Pb
Solder
Temp.
Flux RMA Type
Dip Time 3±0.3 sec. 5±0.5 sec.
Pre-heating at 80~120℃for 10 ~30 sec.
Dip Time : 10±1 sec.
Each termination shall be fully immersed and
preheated as below :
STEP TEMP.(℃) TIME(SEC.)
1 80~100 60
2 150~180 60
Leave the capacitor in ambient condition for
specified time* before measurement
*24±2hours(ClassⅠ)
48 ± 4 hours (ClassⅡ)
245±5
℃
℃
235±5
℃
General Capacitors
12
Vibration
Test
Appearance No mechanical damage shall occur.
Characteristics Capacitance Change
Within ± 2.5% o r
Ⅰ
Capacitance
Q
(ClassⅠ)
δ
Tan
(ClassⅡ)
Insulation
Resistance
Class
A(X5R)/
Class
Within the specified initial value
Within the specified initial value
Within the specified initial value
B(X7R)
Ⅱ
X(X6S) Within ±10%
F(Y5V) Within ± 20%
±0.25㎊whichever is
larger
Within ±5%
The capacitor shall be subjected to a
Harmonic Motion having a total amplitude of
1.5mm changing frequency from 10Hz to 55Hz
and back to 10Hz In 1 min.
Repeat this for 2hours e ach in 3 mutually
perpendicular directions
Page 9
RELIABILTY TEST CONDITION
NO
13
Humidity
(Steady
State)
ITEM PERFORMANCE TEST CONDITION
Appearance No mechanical damage shall occur. Temperature : 40±2
Relative humidity : 90~95 %RH
Duratio n time : 500 +12/-0 hr.
㎊
Leave the capacitor in am bient
condition for specified time* before
measurement.
CLASSⅠ:24±2Hr.
CLASSⅡ:48±4Hr.
Capacitance
Q
Ⅰ
CLASS
Characteristics Capacitance Change
Within ±5.0% or ±0.5
whichever is larger
Within ±12.5%
Within ±30%
Class
Ⅱ
Class
Ⅰ
A(X5R)/
B(X7R)/
X(X6S)
F(Y5V)
Capacitance≥30㎊:Q≥350
10≤Capacitance <30㎊:Q≥275 + 2.5×C
Capacitance < 10pF : Q≥200 + 10×C (C: Capacitance)
1. Characteristic : A(X5R),
2. Characteristic : F(Y5V)
℃
B(X7R)
0.075max (25V and over)
0.1max (16V, C<1.0㎌)
0.125max(16V, C≥1.0㎌)
0.15max (10V)
0.195max (6.3V)
Tan
CLASS
0.05max (16V and over)
0.075max (10V)
δ
0.075max
Ⅱ
(6.3V except Table 1)
0.125max*
(refer to Table 1)
Insulation
Resistance
Appearance No mechanical damage shall occur.
Capacitance
1,000㏁or 50㏁·㎌whichever is smaller.
Characteristics Capacitance Change
Within ±5.0% or ±0.5
whichever is larger
Within ±12.5%
Within ±12.5%
Within ±30%
Within ±30%
Within +30~－40%
Class
Class
Ⅱ
Ⅰ
A(X5R)/
B(X7R)/
X(X6S)
F(Y5V)
In case of Table 2 *
Applied V oltage : rated voltage
Temperature : 40±2
Humidity : :90~95%RH
㎊
Duration Time : 500 +12/-0 Hr.
Charge/Discharge Current : 50㎃max.
Perform the initial measurement according to
Note1 .
Perform the final measurement according to
Note2.
℃
General Capacitors
14
Moisture
Resistance
Q
(ClassⅠ)
δ
Tan
(ClassⅡ)
Insulation
Resistance
Capacitance≥30㎊:Q≥200
Capacitance <30㎊:Q≥100 + 10/3×C (C: Capacitance)
1. Characteristic : A(X5R),
2. Characteristic : F(Y5V)
B(X7R)
0.05max (16V and over)
0.075max (10V)
0.075max
(6.3V except Table 1)
0.125max*
0.075max (25V and over)
0.1max (16V, C<1.0㎌)
0.125max(16V, C≥1.0㎌)
0.15max (10V)
0.195max (6.3V)
(refer to Table 1)
X(X6S) 0.11max (6.3V and below)
500㏁or 25㏁·㎌whichever is smaller.
Page 10
RELIABILTY TEST CONDITION
NO ITEM PERFORMANCE TEST CONDITION
15
High
Temperature
Resistance
Appearance No mechanical damage shall occur.
Characteristics Capacitance Change
Within ±3% or ±0.3㎊,
Whichever is larger
Within ±12.5%
Within ±30%
Within +30~－40%
*IncaseofTable2
2. Characteristic : F(Y5V)
B(X7R )
0.075max
(25V and over)
0.1max(16V, C<1.0㎌)
0.125max(16V, C≥1.0㎌)
0.15max (10V)
0.195max (6.3V)
Capa citance
Q
(ClassⅠ)
δ
Tan
(ClassⅡ)
Ⅰ
Class
A(X5R )/
B(X7R)
X(X6S) Within ±25%
Ⅱ
Class
F(Y5V)
Capacitance≥30㎊:Q≥350
10≤Capacitance <30㎊:Q≥275 + 2.5×C
Capacitance < 10㎊:Q≥200 +10×C (C: Capacitance)
1. Characte ristic : A(X5R),
0.05max
(16V and over)
0.075max (10V)
0.075max
(6.3V except Table 1)
0.125max*
(refer to Table 1)
Applied Voltage : 200%* of the rated voltage
Temperature : max . operating temperature
Duration Time : 1000 +48/-0 Hr.
Charge/Discharge Current : 50㎃max.
* refer to table(3) : 150%/100% of the rated
voltage
Perform the initial m eas urement according to
Note1 for Class
Perform the final measurement according to
Note2.
Ⅱ
General Capacitors
16
Temperature
Cycle
X(X6S) 0.11max (6.3V and below)
Insulation
Resistance
Appearance No mechanical damage shall occur.
Capa citance
(ClassⅠ)
Tan
(ClassⅡ)
Insulation
Resistance
1,000㏁or 50㏁·㎌whichever is smaller.
Characteristics Capacitance Change
Ⅰ
Class
A(X5R )/
Class
Ⅱ
Q
Within the specified initial value
δ
Within the specified initial value
Within the specified initial value
B(X7R )/
X(X6S) Within ±15%
F(Y5V) Within ±20%
Within ±2.5% or ±0.25
Whichever is larger
Within ±7.5%
Capacitor shall be subjected to 5 cycles.
Condition for 1 cycle :
㎊
Step Temp.(℃) Time(min.)
Min. operating
1
225 2~3
3
425 2~3
Leave the capacitor in ambient condition
for specified time* before measurement
*24±2hours(ClassⅠ)
48 ± 4 hours (ClassⅡ)
temp.+0/-3
Max. operating
temp.+3/-0
30
30
Page 11
RELIABILTY TEST CONDITION
Recommended Soldering Method
Size
inch (mm)
Temperature
Characteristic
Capacitance
Condition
Flow Reflow
0201 (0603)
0402 (1005)
0603 (1608)
18
Note1. Initial Measurement For Class
Perform the heat treatment at 150℃+0/-10℃for 1 hour. Then
Then perform the measurement.
Recommended
Soldering Method
By Size & Capacitance
0805 (2012)
1206 (3216)
1210 (3225)
1808 (4520)
1812 (4532)
2220 (5750)
Ⅱ
---
Class I -
㎌ ○○
Class II
Class I -
Class II
Array - -
Class I -
Class II
Array - -
---
Leave the capacitor in ambient condition for 48±4 hours before measurement.
C＜1
㎌
C≥1
C＜4.7
C≥4.7
㎌ ○○
㎌
㎌ ○○
C＜10
㎌
C≥10
○○
-
○○
-
○○
-
○
○
○
○
○
○
○
○
○
○
General Capacitors
Note2. Latter Measurement
Ⅰ
1. CLASS
Leave the capacitor in ambient condition for 24±2 hours before measurement
Then perform the measurement.
δ
Tan
Class
A(X5R),
B(X7R)
Ⅱ
0201 C≥0.022
0402 C≥0.22
0603 C≥2.2
0805 C≥4.7
Ⅱ
1206 C≥10.0
1210 C≥22.0
1812 C≥47.0
2220 C≥100.0
All L ow Profile
Capacitors (P.16 ).
0.125max*
㎌
㎌
Leave the capacitor in ambient condition for 48±4 hours before measurement.
High Temperature Resistance test
Δ
㎌
㎌
㎌
㎌
㎌
㎌
C (Y5V) +30~－40%
0402 C≥0.47
0603 C≥2.2
0805 C≥4.7
Ⅱ
Class
F(Y5V)
1206 C≥10.0
1210 C≥22.0
1812 C≥47.0
2220 C≥100.0
Applied
㎌
㎌
㎌
㎌
㎌
㎌
㎌
Voltage
Class
A(X5R),
B(X7R),
X(X6S),
F(Y5V)
Ⅱ
2. Class
Perform the heat treatment at 150℃+0/-10℃for 1 hour. Then
Then perform the measurement.
*Table1. *Table2. *Table3.
Note3. All Size In Reliability Test Condition Section is "inch"
High Temperature Resistance test
100% of the rated
voltage
0201 C≥0.1
0402 C≥1.0
0603 C≥4.7
0805 C≥22.0
1206 C≥47.0
1210 C≥100.0
All Low Profile
Capacitors (P.16).
㎌
㎌
㎌
㎌
㎌
150% of the rated
0201 C≥0.022
0402 C≥0.47
0603 C≥2.2
0805 C≥4.7
1206 C≥10.0
㎌
1210 C≥22.0
1812 C≥47.0
2220 C≥100.0
voltage
㎌
㎌
㎌
㎌
㎌
㎌
㎌
㎌
Page 12
PACKAGING
● CARDBOARD PAPER TAPE (4mm)
Feeding Hole
A
B
t
Symbol
Type
D
i
(1608)
m
e
n
(2012)
s
i
o
(3216)
n
0603
0805
1206
A B W F E P1 P2 P0 D t
1.1
±0.2
1.6
±0.2
2.0
±0.2
1.9
±0.2
2.4
±0.2
3.6
±0.2
8.0
±0.3
P0 P1P2
3.5
±0.05
● CARDBOARD PAPER TAPE (2mm)
Chip Inserting Hole
1.75
±0.1
4.0
±0.1
D
±0.05
2.0
4.0
±0.1
Φ
1.5
+0.1/-0
E
F
W
unit : mm
1.1
Below
General Capacitors
t
Symbol
Type
D
i
m
e
n
s
i
o
n
0201
(0603)
0402
(1005)
Feeding Hole
Chip Inserting Hole
D
A
B
P0 P1P2
unit : mm
A B W F E P1 P2 P0 D t
0.38
±0.03
0.62
±0.04
0.68
±0.03
1.12
±0.04
8.0
±0.3
3.5
±0.05
1.75
±0.1
2.0
±0.05
2.0
±0.05
4.0
±0.1
Φ
1.5
+0.1/-0.03
E
F
W
0.37
±0.03
0.6
±0.05
Page 13
PACKAGING
● EMBOSSED PLASTIC TAPE
t1
t0
Sym bol
Type
0805
(2012)
1206
D
(3216)
i
m
1210
e
(3225)
n
1808
s
(4520)
i
o
1812
n
(4532)
2220
(5750)
A B W F E P1 P2 P0 D t1 t0
1.45
±0.2
1.9
±0.2
2.9
±0.2
2.3
±0.2
3.6
±0.2
5.5
±0.2
● TAPING SIZE
Feeding H ole Chip inserting Hole
A
B
P0 P1P2
2.3
±0.2
3.5
±0.2
3.7
±0.2
4.9
±0.2
4.9
±0.2
6.2
±0.2
8.0
±0 . 3
12.0
±0 . 3
3.5
±0.05
5.60
±0.05
1.75
±0.1
4.0
±0.1
8.0
±0.1
2.0
±0.05
D
E
F
W
unit : mm
2.5
max
Φ
4.0
±0.1
1.5
+0.1/-0
3.8
max
0.6
Below
General Capacitors
Empty Section
45 Pitch Packed Part
Type Symbol Size
0201(0603) 10,000
7" R eel C
10" Reel O - 10,000 - - -
D
13" Reel
L
0402(1005) 10,000 1210(3225)(t≥2.0mm) 1,000
OTH ERS 4,000 1808(4520)(t≥2.0mm) 1,000
0402(1005) 50,000
OTH ERS 10,000
0603(1608) 10,000 or 15,000
0805(2012)
(t≤0.85mm)
1206(3216)
(t≤0.85mm)
Cardboard
Paper Tape
15,000 or
10,000(Option)
10,000
Sym bol Size
Empty Section
50 Pitch
E
F
Loading Section
35 Pitch
STAR TEND
Em b osse d
All Size≤3216
1210(3225),1808(4520)
(t≤1.6mm )
All Size≤3216
1210(3225),1808(4520)
(t<1.6mm)
1210(3225)(1.6≤t<2.0mm )
1206(3216)(1.6≤t)
1210(3225),1808(4520)
(t≥2.0mm )
1812(4532)(t≤2.0mm) 4,000
1812(4532)(t>2.0mm )
5750(2220)
P lastic Tap e
2,000
10,000
8,000
4,000
2,000
Page 14
PACKAGING
●
REEL DIMENSION
E
C
W
B
t
unit : mm
1.2±0.2
R
A
Symbol A B C D E W t R
φ
7" Reel
13" Reel
180+0/ -3φ60+1/ -3
φ
330±2.0φ80+1/ -3 2.2±0.2
φ13±
D
0.3 25±0.5 2.0±0.5 9±1.5
General Capacitors
1.0
Page 15
●
BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
C
D
E
F
A
BT
W
General Capacitors
G
L
Symbol A B T C D E
Dimension
Symbol F W G H L I
Dimension
●
QU ANTITY OF BULK CASE PACKAGING
Size 0402(1005) 06 03(1608)
Quantity
6.8±0.1 8.8±0.1 12±0.1 1.5+0.1/-0 2+0/-0.1 3.0+0.2/-0
31.5+0.2/-0 36+0/-0.2 19±0.35 7±0.35 110±0.7 5±0.35
0 805(2 012)
T=0 .6 5mm T=0.85mm
50 ,000 10 ,000 or 15,000 10 ,0 00 5,000 or 10,000
I
H
unit : mm
unit :pcs
Page 16
APPLICATION MANUAL
●
ELECTRICAL CHARACTERISTICS
▶
CAPACITANCE - TEMPERATURE CHARACTERISTICS
% C
% C
8
8
6
6
4
4
2
-2
-2
-4
-4
-6
-6
-8
-8
-10
-10
2
Temp .(oC)
Temp .(oC)
-55 -40 -20 25 40 60 80 100 125
-55 -40 -20 25 40 60 80 100 125
S2L
S2L
COG
COG
o
o
U2J
U2J
% C
% C
40
40
20
20
X5R
X5R
25 40 60 80 100 120
-20-40-60
-20-40-60
-20
-20
-4 0
-4 0
-60
-60
-80
-80
25 40 60 80 100 120
Y5V
Y5V
X7R
X7R
▶
CA P ACI TANCE - DC VOLTAGE CHARAC TER ISTIC S
20
20
10
10
C %
C %
0
0
X7R 50V
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-100
10 20 30 40 50
10 20 30 40 50
▶
IMPEDANCE - FREQUENCY CHARACTERISTICS
Ohm
C0G
X7R 50V
X7R 16V
X7R 16V
Y5V
Y5V
COG
COG
X5R 50V
X5R 50V
Vdc
Vdc
100
10
1
10pF
100pF
0.1
1000pF
▶
CAPACITANCE CHANGE - AGING
5
5
10
10
C/C [%]
C/C [%]
Δ
Δ
15
15
1 10 100 1000 10000
1 10 100 1000 10000
Ohm
100
10
0.1
0.01
㎌
X7R/X5R/Y5V
㎌
0.001
㎌
1
0.1
X7R / X5 R
X7R / X5 R
Y5V
Y5V
Time(hr)
Time(hr)
C0G
C0G
General Capacitors
0.01
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
1MHz 10MHz 100MHz 1GHz 10GHz
0.01
1.E+06 1.E+07 1.E+08 1.E+09
1MHz 10MHz 100MHz 1GHz
Page 17
● STORAGE CONDITION
▶ Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature or
humidity. Therefore, the MLCCs shall be stored in the am bient temperature and the relative humidity
of less than 40℃ and 70%, respectively.
Guaranteed storage period is within 6 months from the outgoing date of delivery.
▶ Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶ Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are taken
out of storage, it is important to maintain the temperature-controlled environment
.
● DESIGN OF LAND PATTERN
When designing printed circuit boards, the shape and size of the lands must allow for the proper
amount of solder on the capacitor.
The amount of solder at the end terminations has a direct effect on the crack.
The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount
of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently.
Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size.
General Capacitors
Solder
Land
So lder R esist
W b
2/3 W < b < W
T
So lder R esist
a
2/3 T < a < T
Page 18
● ADHESIVES
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶ Requirement s for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the handling of the
circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly. They should not corrode the circuit board or chip material.
They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be
harmful when touched.
▶ Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor
adhesion and overflow into the land, respectively.
General Capacitors
Solder Resist
Land
PCB
aa
c
b
c
unit : mm
Type 21 31
a
b
c
0.2 min 0.2 min
70~100
㎛
>0 >0
70~100
㎛
▶ Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within 2 minutes
.
or less
● MOUNTING
▶ Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during
mounting.
Page 19
▶ Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the
board. When the MLCCs are mounted onto the other side,
it is important to support the board as shown in the illustration. If the circuit board is not supported,
the crack occur to the ready-installed MLCCs by the bending stress.
nozzle
force
support pin
General Capacitors
▶ Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors.
The hot soldering iron tip comes into direct contact with the end terminations, and operator's
carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic
body of the capacitor.
Therefore the soldering iron must be handled carefully, and close attention must be paid
to the selection of the soldering iron tip and to temperature control of the tip.
▶ Amount of Solder
Too much
Solder
N ot eno ug h
Solder
C racks tend to occ ur due
to large s tres s
Weak holding force may
cause bad connections or
detaching of the capac itor
Good
Page 20
▶ Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the
temperature difference(△T) must be less than 100℃
▶ Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in
the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This
means that the cleaning fluid must be carefully selected, and should always be new.
▶ Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been completed.
If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors.
Carefully choose a separation method that minimizes the bending often circuit board.
General Capacitors
▶ Recommended Soldering Profile
Pre-heati n g
Soldering
△
Temp. (℃)
i) 1206(3216) and below
:150℃max.
ii) 1210(3225) and over
:130℃max.
Pre-heati n g
Temp. (℃)
60 sec. min. 60 to 120 sec.
T
Reflow
250±5
6 sec. max.
℃
220
℃
30 to 50 sec.
Gradual Cooling
in the air
Time (sec.)
Page 21
Soldering
Temp. (℃)
Pre-heating
Temp. (℃)
Pre-heating
△
T
i) 1206(3216) and
below
: 150℃max.
Flow
260±3
5 sec. max.
℃
Gradual Cooling
in the air
120 sec. min.
Time (sec.)
Soldering Iron
Variation of Temp.
△T≤
130
Soldering
Temp (℃)
300±10℃max
Condition of Iron facilities
Wattage Tip Diameter Soldering Time
20W Max 3㎜Max 4SecMax
* Caution - Iron Tip Should Not Contact With Ceramic Body Directly.
Pre-heating
Time (Sec)
≥
60
Soldering
Time(Sec)
≤
4
Cooling
Time(Sec)
-
General Capacitors
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