Datasheet CGA-6618 Datasheet (STANF)

Preliminary

Preliminary

Product Description

CGA-6618

Stanford Microdevices CGA-6618 is a high performance
GaAs HBT MMIC Amplifier. Designed with the InGaP
process technology for excellent reliability. A Darlington
configuration is utilized for broadband performance. The
heterojunction increases breakdown voltage and minimizes
leakage current between junctions. The amplifier contains
two amplifiers for use in wideband Push-Pull CATV amplifiers
requiring excellent second order performance. The second
and third order non-linearities are greatly improved in the
push pull configuration.

Amplifier Configuration

1
2
3
4

8
7
6
5

Key 75 Ohm Parameters at Room Temperature 50-860MHz CATV Band Data

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OSCVmBd43+,talF,.hC97dnaBrevOesaCtsroW cBd18

BTCVmBd43+,talF,.hC97dnaBrevOesaCtsroW cBd07

DOMXVmBd43+,talF,.hC97dnaBrevOesaCtsroW cBd56

dV V7.4

zHM1=gnicapsenoT

mBd6+=enoT/tuoP

zHM1=gnicapsenoT

mBd6+=enoT/tuoP

secived3foegarevA

Note: Measured in Push-Pull Application test board

The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or omissions.
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford
Microdevices product for use in life-support devices and/or systems.
Copyright 2001 Stanford Microdevices, Inc. All worldwide rights reserved.

726 Palomar Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC http://www.stanfordmicro.com

RV0.8=

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Dual CATV Broadband High
Linearity GaAs HBT Amplifier

Product Features



Excellent CSO/CTB/XMOD Performance at
+34 dBmV Output Power per Tone

 Dual Devices in each SOIC-8 Package simplify

Push-Pull configuration PC board layout

 Operates from a single supply
 Dropping Resistor provides

Temperature Compensation

Applications

 CATV Head End Driver and Predriver Amplifier
 CATV Line Driver Amplifier

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smhO57=

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zHM05

zHM005
zHM068

zHM05

zHM005
zHM068

zHM05

zHM005
zHM068

zHM05

zHM005
zHM068

zHM05

zHM005
zHM068

zHM05

zHM005
zHM068

zHM05

zHM005
zHM068

Bd

mBd

mBd

mBd

Bd

Bd

Bd

0.41

1.41

0.41

27
28
47

83
04
04

5.12

5.12

0.12

5.21

0.71

5.31

0.01

0.91

5.31

9.3

1.4

4.4

EDS-101994 Rev B

Preliminary

CGA-6618 Dual GaAs HBT Amplifier

Typical S-Parameters @ VS=8V, ID=160mA, R

Gain vs. Frequency

15

13

11

9

S21 (dB)

7

5

0 200 400 600 800 1000

Frequency (MHz)

-5

-10

-15

S22 (dB)

-20

-25
0 200 400 600 800 1000

Output Return Loss vs. Frequency

-40C
25C
85C

Frequency (MHz)

=39 Ohms, TL=+25°C

BIAS

-40C
25C
85C

Input Return Loss vs. Frequency

-5

-10

-15

S11 (dB)

-20

-25
0 200 400 600 800 1000

-40C
25C
85C

Frequency (MHz)

Absolute Maximum Ratings

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J

T(egnaR.pmeTgnitarepO

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Bias Conditions should also satisfy the following
expression: IDVD (max) < (TJ - TL)/Rth,j-l

726 Palomar Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC http://www.stanfordmicro.com

2

EDS-101994 Rev B

Preliminary

CGA-6618 Dual GaAs HBT Amplifier

Typical RF Performance @ VS=8V, ID=160mA, R

50
45
40
35
30

IP3 (dBm)

25
20

0 0.2 0.4 0.6 0.8 1

100

90
80
70
60
50

IM2 (dBc)

40
30
20

03691215

IP3 vs. Temperature

-40C
25C
85C

Frequency (MHz)

Second Harmonic vs. Pout and Freq.

Data shown is typical at 25C

66MHz
100MHz
250MHz
500MHz

Pout (dBm)

=39 Ohms, TL=+25°C

BIAS

90

IP2 vs. Temperature

85
80
75
70

IP2 (dBm)

65
60

0 0 .2 0.4 0.6 0.8 1

Frequency (MHz)

Third Harmonic vs. Pout and Freq.

Data shown is typical at 25C

100

90
80
70
60
50

IM3 (dBc)

40
30

66MHz
100MHz
250MHz
500MHz

20

0 3 6 9 12 15

Pout (dBm)

-40 C
25C
85C

Push-Pull CGA-6618 Noise Figure

6
5
4
3

NF (dB)

2
1
0

50MHz-900MHz, Typical

110
100

90
80
70

dBc

60
50
40

0 200 400 600 800 1000

Frequency (MHz)

726 Palomar Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC http://www.stanfordmicro.com

3

Push-Pull CGA-6618 CTB/CSO/XMOD

34 dBmV/Ch., 79 Ch.,Flat

CTB CSO­CSO+ Xmod

0 100 200 300 400 500 600

Frequency (MHz)

EDS-101994 Rev B

CGA-6618 Dual GaAs HBT Amplifier

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1

3,2

4

5

7,6

8

DAPE

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1

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2

3

4

Basic Application Schematic 50-860 MHz

Evalution Board Layout 50-860 MHz

Rbias

1uF Tant.

RF INPUT

Balun ETC1-1-13

1000pF

1000pF

1uF Tant .

Rbias

Recommended Land Pattern

.15 [3.81]

0.01µF 1000pF 68pF

1µF Tant.

Macom

1000 pF

ETC1-1-13

1000 pF

1µF Tant. 0.01µF 1000pF 68pF

1

4

Amp 1

Amp 2

CGA-6618

SOIC-08

Vs

RBIAS

220 nH

8

1000 pF

6,72,3

Macom

1000 pF

5

ETC1-1-13

220 nH

RBIAS

Vs

220nH

220nH

.01uF
1000pF
68pF

Balun ETC1-1-13

1000pF

1000pF

68pF
1000pF
.01uF

ECB-101611 Rev A
ESOP-8
Push-Pull
Eval Board

Preliminary

8

7

6

5

RF OUTPUT

IrofseulaVrotsiseRsaiBdednemmoceR

Am061=

D

V(egatloVylppuS

)V8V9V21V51

S

R

SAIB

R

SAIB

936519031

gnitaRrewoPW2/1W2/1W1W1

2(VS-VD)

R

=

BIAS

I

D

.24 [6.22]

.05 [1.27]

726 Palomar Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC http://www.stanfordmicro.com

4

.02 [.60]

.16 [4.02]

.33 [8.42]

.11 [2.71]

EDS-101994 Rev B

CGA-6618 Dual GaAs HBT Amplifier

Package Outline Drawing

Preliminary

.050

[1.27]

TOP VIEW

678

Date Code

CGA
6618

1

SIDE VIEW

32

.035 [.889]

.045 [1.143]

.194

[4.928]

5

.155 [3.937]

4

.016 [.406]

.

.003

[.076]

PARTING LINE

0

6

.061

[1.549]

1

1

[

.

.236 [5.994]

4

9

]

5

0

0

.

8

.

[

2

E

S

A

BOTTOM VIEW

.078 [1.969]

EXPOSED
PAD

.194 [4.93]

.013 [.33] x

]

4

7

3

[

1

.

.

0

5

8

0

3

]

T

I

N

G

L

P

A

N

E

E

S

E

D

T

E

A

45°

.

0

0

8

.155

[3.937]

I

L

A

E

N

D

I

V

W

E

DETAIL A

.025

5°

Part Number Ordering Information

Caution: ESD sensitive

Appropriate precautions in handling, packaging
and testing devices must be observed.

Note: Parts need to be baked prior to use as discussed in application note EAN-101472 (Special handling information
for Exposed Pad

TM

SOIC-8 products) to ensure no moisture is trapped in the encapsulated package. In production,

rebmuNtraP leeRrePseciveD eziSleeR

8166-AGC005"7

this baking procedure is not necessary if parts are used within 24 hours of opening the sealed shipping materials.

726 Palomar Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC http://www.stanfordmicro.com

5

EDS-101994 Rev B