Datasheet cem8809 Datasheet

N-Channel Enhancement Mode Field Effect Transistor

FEATURES

CEM8809

30V, 16A, R

R

Super high dense cell design for extremely low R

High power and current handing capability.

Lead free product is acquired.

Surface mount Package.

ABSOLUTE MAXIMUM RATINGS T

Drain-Source Voltage

Gate-Source Voltage

Drain Current-Continuous

Drain Current-Pulsed

Maximum Power Dissipation

Operating and Store Temperature Range TJ,Tstg -55 to 150

= 6 mΩ @VGS = 10V.

DS(ON)

= 7.5 mΩ @VGS = 4.5V.

DS(ON)

Parameter

a

SO-8

.

DS(ON)

1

= 25 C unless otherwise noted

A

Symbol

V

DS

V

GS

I

D

I

DM

P

D

D D D D

8 7 6 5

1 2 3 4

S S S G

Limit

30

±20

16

60

2.5

Units

V

V

A

A

W

C

Thermal Characteristics

Parameter Symbol Limit Units

Thermal Resistance, Junction-to-Ambient

Details are subject to change without notice .

b

1

50RθJA

Rev 5. 2012.Feb

http://www.cetsemi.com

C/W

CEM8809

Electrical Characteristics T

= 25 C unless otherwise noted

A

Parameter Symbol Min Units

Off Characteristics

Drain-Source Breakdown Voltage

Zero Gate Voltage Drain Current

Gate Body Leakage Current, Forward

Gate Body Leakage Current, Reverse

On Characteristics

c

Gate Threshold Voltage

Static Drain-Source

On-Resistance

Dynamic Characteristics

d

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Switching Characteristics

d

Turn-On Delay Time

Turn-On Rise Time

Turn-Off Delay Time

Turn-On Fall Time

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

V

R

BV

C

C

C

t

d(on)

t

d(off)

Q

Q

DSS

I

DSS

I

GSSF

IGSSR

GS(th)

DS(on)

iss

oss

rss

t

r

t

f

Q

g

gs

gd

Drain-Source Diode Characteristics and Maximun Ratings

Drain-Source Diode Forward Current

Drain-Source Diode Forward Voltage

Notes :

a.Repetitive Rating : Pulse width limited by maximum junction temperature.
b.Surface Mounted on FR4 Board, t < 10 sec.
c.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
d.Guaranteed by design, not subject to production testing.

b

c

I

S

V

SD

Test Condition

VGS = 0V, ID = 250µA

VDS = 30V, VGS = 0V

VGS = 20V, VDS = 0V

VGS = -20V, VDS = 0V

VGS = VDS, ID = 250µA

VGS = 10V, ID = 8A

VGS = 4.5V, ID = 8A

VDS = 10V, VGS = 0V,
f = 1.0 MHz

VDD = 15V, ID = 6.5A,
VGS = 10V, R

GEN

= 4.7Ω

VDS = 24V, ID = 13A,
VGS = 10V

VGS = 0V, IS = 2.1A

30

1

Typ Max

100

-100

7.55.7 mΩ

2970

600

450

20

13

74

24

72

40

26

148

48

94

8

20

2.1

1.3

V

1

µA

nA

nA

V

3

64.8

mΩ

pF

pF

pF

ns

ns

ns

ns

nC

nC

nC

A

V

2

CEM8809

10

VGS=10,8,6,5V

8

V

=3V

6

4

ID, Drain Current (A)

2

0

0 0.2 0.4 10.80.6

GS

VDS, Drain-to-Source Voltage (V)

Figure 1. Output Characteristics

3600

3000

2400

1800

1200

C, Capacitance (pF)

600

0

0 2 4 6 8 10

C

iss

C

oss

C

rss

VDS, Drain-to-Source Voltage (V)

20

16

12

8

ID, Drain Current (A)

TJ=125 C

4

0

0 2 4 63 51

25 C

-55 C

VGS, Gate-to-Source Voltage (V)

Figure 2. Transfer Characteristics

2.2
ID= 8A

VGS=10V

1.9

1.6

1.3

1.0

RDS(ON), Normalized

0.7

RDS(ON), On-Resistance(Ohms)

0.4

-100 -50 0 50 100 150 200

TJ, Junction Temperature( C)

Figure 3. Capacitance

1.3
VDS=V

GS

ID=250µA

1.2

1.1

1.0

0.9

0.8

VTH, Normalized

0.7

Gate-Source Threshold Voltage

0.6

-50 -25 0 25 50 75 100 125 150

TJ, Junction Temperature( C)

Figure 5. Gate Threshold Variation

with Temperature

Figure 4. On-Resistance Variation

with Temperature

V

=0

V

GS

1

10

0

10

IS, Source-drain current (A)

-1

10

0.4 0.6 0.8 1.0

1.41.2

VSD, Body Diode Forward Voltage (V)

Figure 6. Body Diode Forward Voltage

Variation with Source Current

3

CEM8809

10

VDS=24V

ID=13A

8

6

4

2

VGS, Gate to Source Voltage (V)

0

0 20 40 60 80 100

Qg, Total Gate Charge (nC)

Figure 7. Gate Charge

DD

V

IN

V

D

V

GS

GEN

R

G

S

2

10

R

Limit

DS(ON)

1

10

DC

0

10

-1

10

ID, Drain Current (A)

-2

10

TA=25 C
TJ=150 C

Single Pulse

-2

10

-1

10

10

100ms

1s

0

10ms

1ms

10

1

2

10

VDS, Drain-Source Voltage (V)

Figure 8. Maximum Safe

Operating Area

on

t

d(off)

t

r

t

90%

10% 10%

INVERTED

50% 50%

V

V

d(on)

t

OUT

IN

10%

R

L

OUT

V

90%

t

off

f

t

90%

PULSE WIDTH

Figure 9. Switching Test Circuit

0

10

D=0.5

0.2

-1

0.1

10

0.05

0.02

0.01

-2

10

r(t),Normalized Effective

Single Pulse

Transient Thermal Impedance

-3

10

-4

10

-3

10

Figure 11. Normalized Thermal Transient Impedance Curve

Figure 10. Switching Waveforms

-2

10

-1

10

Square Wave Pulse Duration (sec)

4

PDM

t1

t2

1. RθJA (t)=r (t) * RθJA

2. RθJA=See Datasheet

3. TJM-TA = P* RθJA (t)

4. Duty Cycle, D=t1/t2

0

10

1

10

2

10