Datasheet cem4042 Datasheet

CEM4042

N-Channel Enhancement Mode Field Effect Transistor

FEATURES

40V, 18A, R

R

Super high dense cell design for extremely low R

High power and current handing capability.

Lead free product is acquired.

Surface mount Package.

ABSOLUTE MAXIMUM RATINGS T

Drain-Source Voltage

Gate-Source Voltage

Drain Current-Continuous

Drain Current-Pulsed

Maximum Power Dissipation

Operating and Store Temperature Range TJ,Tstg -55 to 150

= 5.1mΩ @VGS = 10V.

DS(ON)

= 7.5mΩ @VGS = 4.5V.

DS(ON)

Parameter

a

SO-8

.

DS(ON)

1

= 25 C unless otherwise noted

A

Symbol Limit

V

DS

V

GS

I

D

I

DM

P

D

D D D D

8 7 6 5

1 2 3 4

S S S G

40

±20

18

72

2.5

PRELIMINARY

Units

V

V

A

A

W

C

Thermal Characteristics

Parameter Symbol Limit Units

Thermal Resistance, Junction-to-Ambient

Details are subject to change without notice .

b

Rev 1. 2010.OctThis is preliminary information on a new product in development now .

http://www.cetsemi.com

1

C/W50RθJA

CEM4042

Electrical Characteristics T

= 25 C unless otherwise noted

c

Parameter Symbol Min Units

Off Characteristics

Drain-Source Breakdown Voltage

Zero Gate Voltage Drain Current

Gate Body Leakage Current, Forward

Gate Body Leakage Current, Reverse

BV

I

DSS

I

GSSF

IGSSR

DSS

On Characteristics

Gate Threshold Voltage

Static Drain-Source

On-Resistance

Dynamic Characteristics

c

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Switching Characteristics

c

Turn-On Delay Time

Turn-On Rise Time

Turn-Off Delay Time

Turn-Off Fall Time

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

V

GS(th)

R

DS(on)

C

C

C

t

d(on)

t

d(off)

Q

Q

iss

oss

rss

t

r

t

f

Q

g

gs

gd

Drain-Source Diode Characteristics and Maximun Ratings

Drain-Source Diode Forward Current

Drain-Source Diode Forward Voltage

Notes :

a.Repetitive Rating : Pulse width limited by maximum junction temperature.
b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
c.Guaranteed by design, not subject to production testing.

b

I

S

V

SD

Test Condition

VGS = 0V, ID = 250µA

Typ Max

40

VDS = 40V, VGS = 0V

VGS = 20V, VDS = 0V

VGS = -20V, VDS = 0V

VGS = VDS, ID = 250µA

VGS = 10V, ID = 10A

1 3

4.2

VGS = 4.5V, ID = 8A 5.7

VDS = 15V, VGS = 0V,
f = 1.0 MHz

4105

670

455

36
VDD = 15V, ID = 15A,
VGS = 4.5V,
R

= 1.8Ω

GEN

VDS = 15V, ID = 15A,
VGS = 4.5V

36

59

29

53

13

25

VGS = 0V, IS = 2.5A

1

100

-100

5.1

7.5

72

72

118

58

69

2.5

1

V

µA

nA

nA

V

mΩ

mΩ

pF

pF

pF

ns

ns

ns

ns

nC

nC

nC

A

V

2

CEM4042

10

VGS=10,8,6V

8

6

4

ID, Drain Current (A)

2

0

0 0.2

0.4

VDS, Drain-to-Source Voltage (V)

Figure 1. Output Characteristics

6000

5000

4000

3000

2000

C, Capacitance (pF)

1000

C

rss

0

0 5 10 15 20 25

C

iss

C

oss

VDS, Drain-to-Source Voltage (V)

0.6

40

32

V

=3V

GS

0.8

24

16

ID, Drain Current (A)

TJ=125 C

8

0

1.5 3 4.5 60 7.5

25 C

-55 C

VGS, Gate-to-Source Voltage (V)

Figure 2. Transfer Characteristics

2.2
ID=10A

VGS=10V

1.9

1.6

1.3

1.0

RDS(ON), Normalized

0.7

RDS(ON), On-Resistance(Ohms)

0.4

-100 -50 0 50 100 150 200

TJ, Junction Temperature( C)

Figure 3. Capacitance

1.3
VDS=V

GS

ID=250µA

1.2

1.1

1.0

0.9

0.8

VTH, Normalized

0.7

Gate-Source Threshold Voltage

0.6

-50 -25 0 25 50 75 100 125 150

TJ, Junction Temperature( C)

Figure 5. Gate Threshold Variation

with Temperature

Figure 4. On-Resistance Variation

with Temperature

V

=0

V

GS

1

10

0

10

IS, Source-drain current (A)

-1

10

0.4 0.6 0.8 1.0

1.41.2

VSD, Body Diode Forward Voltage (V)

Figure 6. Body Diode Forward Voltage

Variation with Source Current

3

CEM4042

5

VDS=15V
ID=15A

4

3

2

1

VGS, Gate to Source Voltage (V)

0

0 15 30 45 60

Qg, Total Gate Charge (nC)

Figure 7. Gate Charge

DD

V

IN

V

D

V

GS

GEN

R

G

S

2

10

R

Limit

DS(ON)

1

10

0

10

-1

10

ID, Drain Current (A)

-2

10

TA=25 C
TJ=150 C

Single Pulse

-2

10

-1

10

10ms

100ms

1s

DC

0

10

1

10

2

10

VDS, Drain-Source Voltage (V)

Figure 8. Maximum Safe

Operating Area

on

t

d(off)

t

r

t

90%

10% 10%

INVERTED

50% 50%

V

V

d(on)

t

OUT

IN

10%

R

L

OUT

V

90%

t

off

f

t

90%

PULSE WIDTH

Figure 9. Switching Test Circuit

0

10

D=0.5

0.2

-1

0.1

10

0.05

0.02

0.01

-2

10

r(t),Normalized Effective

Single Pulse

Transient Thermal Impedance

-3

10

-4

10

-3

10

Figure 11. Normalized Thermal Transient Impedance Curve

Figure 10. Switching Waveforms

-2

10

-1

10

Square Wave Pulse Duration (sec)

4

PDM

t1

t2

1. RθJA (t)=r (t) * RθJA

2. RθJA=See Datasheet

3. TJM-TA = P* RθJA (t)

4. Duty Cycle, D=t1/t2

0

10

1

10

2

10