Page 1
P-Channel Enhancement Mode Field Effect Transistor
FEATURES
CEM2163
-20V, -8.9A, R
R
Super high dense cell design for extremely low R
High power and current handing capability.
Lead free product is acquired.
Surface mount Package.
ABSOLUTE MAXIMUM RATINGS T
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous
Drain Current-Pulsed
Maximum Power Dissipation
Operating and Store Temperature Range TJ,Tstg -55 to 150
= 20mΩ @VGS = -4.5V.
DS(ON)
= 30mΩ @VGS = -2.5V.
DS(ON)
Parameter
a
SO-8
.
DS(ON)
1
= 25 C unless otherwise noted
A
Symbol
V
DS
V
GS
I
D
I
DM
P
D
D D D D
8 7 6 5
1 2 3 4
S S S G
Limit
-20
±12
-8.9
-36
2.5
Units
V
V
A
A
W
C
Thermal Characteristics
Parameter Symbol Limit Units
Thermal Resistance, Junction-to-Ambient
Specification and data are subject to change without notice .
b
C/W50RθJA
Rev 1. 2010.Oct
http://www.cetsemi.com
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CEM2163
Electrical Characteristics T
= 25 C unless otherwise noted
A
Parameter Symbol Min Units
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Body Leakage Current, Forward
Gate Body Leakage Current, Reverse
On Characteristics
c
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Dynamic Characteristics
d
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
d
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
R
BV
C
C
C
t
d(on)
t
d(off)
Q
Q
DSS
I
DSS
I
GSSF
IGSSR
GS(th)
DS(on)
iss
oss
rss
t
r
t
f
Q
g
gs
gd
Drain-Source Diode Characteristics and Maximun Ratings
Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage
Notes :
a.Repetitive Rating : Pulse width limited by maximum junction temperature.
b.Surface Mounted on FR4 Board, t < 10 sec.
c.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
d.Guaranteed by design, not subject to production testing.
b
c
I
S
V
SD
Test Condition
VGS = 0V, ID = -250µA
VDS = -12V, VGS = 0V
VGS = 12V, VDS = 0V
VGS = -20V, VDS = 0V
VGS = VDS, ID = -250µA
VGS = -4.5V, ID = -7.6A
VGS = -2.5V, ID = -6A
VDS = -10V, VGS = 0V,
f = 1.0 MHz
VDD = -6V, ID = -1A,
VGS = -4.5V, R
GEN
= 6Ω
VDS = -6V, ID = -7A,
VGS = -4.5V
VGS = 0V, IS = -2A
Typ Max
-20
-1
100
-100
-0.4 -1.3
2015
3022 mΩ
2805
505
395
20
18
89
49
31.5
40
36
178
98
41
3.8
8.8
-2
-1.2
V
µA
nA
nA
V
mΩ
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
A
V
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CEM2163
5
4
3
2
-ID, Drain Current (A)
1
0
-VGS=4.5,4,3.5,1.5V
0.0 0.25 1 1.5
-VDS, Drain-to-Source Voltage (V)
Figure 1. Output Characteristics
3600
C
3000
2400
1800
1200
C, Capacitance (pF)
600
C
rss
0
0 5 10 15 20 25
iss
C
-VDS, Drain-to-Source Voltage (V)
oss
15
25 C
12
9
6
-ID, Drain Current (A)
-V
=1V
GS
1.250.750.5
3
TJ=125 C
0
0 1 30.5 21.5 2.5
-55 C
-VGS, Gate-to-Source Voltage (V)
Figure 2. Transfer Characteristics
2.2
ID=-7.6A
VGS=-4.5V
1.9
1.6
1.3
1.0
RDS(ON), Normalized
0.7
RDS(ON), On-Resistance(Ohms)
0.4
-100 -50 0 50 100 150 200
TJ, Junction Temperature( C)
Figure 3. Capacitance
1.3
VDS=V
GS
ID=-250µA
1.2
1.1
1.0
0.9
0.8
VTH, Normalized
0.7
Gate-Source Threshold Voltage
0.6
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature( C)
Figure 5. Gate Threshold Variation
with Temperature
5 - 18
Figure 4. On-Resistance Variation
with Temperature
V
=0
V
GS
1
10
0
10
-IS, Source-drain current (A)
-1
10
0.4 0.6 0.8 1.0
-VSD, Body Diode Forward Voltage (V)
Figure 6. Body Diode Forward Voltage
Variation with Source Current
1.41.2
Page 4
CEM2163
5
VDS=-6V
ID=-7.6A
4
3
2
1
-VGS, Gate to Source Voltage (V)
0
0 7 21 35 4214 28
Qg, Total Gate Charge (nC)
Figure 7. Gate Charge
V
V
GS
GEN
R
2
10
R
Limit
DS(ON)
1
10
0
10
-1
10
-ID, Drain Current (A)
-2
10
TA=25 C
TJ=150 C
Single Pulse
-2
10
-1
10
10ms
100ms
1s
DC
0
10
1
10
2
10
-VDS, Drain-Source Voltage (V)
Figure 8. Maximum Safe
Operating Area
DD
V
on
t
d(off)
t
r
t
90%
10% 10%
INVERTED
V
d(on)
t
OUT
R
IN
L
D
OUT
V
t
off
f
t
90%
G
S
IN
V
10%
50% 50%
90%
PULSE WIDTH
Figure 9. Switching Test Circuit
0
10
D=0.5
0.2
-1
0.1
10
0.05
0.02
0.01
-2
10
r(t),Normalized Effective
Single Pulse
Transient Thermal Impedance
-3
10
-4
10
-3
10
Figure 11. Normalized Thermal Transient Impedance Curve
Figure 10. Switching Waveforms
-2
10
-1
10
Square Wave Pulse Duration (sec)
5 - 19
PDM
t1
t2
1. RθJA (t)=r (t) * RθJA
2. RθJA=See Datasheet
3. TJM-TA = P* RθJA (t)
4. Duty Cycle, D=t1/t2
0
10
1
10
2
10
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