Datasheet CD4060BE, CD4060BM Specification

Data sheet acquired from Harris Semiconductor SCHS049C − Revised October 2003

HCD4060B consists of an oscillator

section and 14 ripple-carry binary counter stages. The oscillator configuration allows design of either RC or crystal oscillator circuits. A RESET input is provided which resets the counter to the all-O’s state and disables the oscillator. A high level on the RESET line accomplishes the reset function. All counter stages are master-slave flip-flops. The state of the counter is advanced one step in binary order on the negative transition of f (and fO). All inputs and outputs are fully buffered. Schmitt trigger action on the input-pulse line permits unlimited input-pulse rise and fall times.

The CD4060B-series types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffi xes).

I

Copyright  2003, Texas Instruments Incorporated

PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

PACKAGING INFORMATION

Orderable Device Status

CD4060BE ACTIVE PDIP N 16 25 Pb-Free

CD4060BEE4 ACTIVE PDIP N 16 25 Pb-Free

CD4060BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

CD4060BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

CD4060BF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI

CD4060BM ACTIVE SOIC D 16 40 Green (RoHS &

CD4060BM96 ACTIVE SOIC D 16 2500 Green (RoHS &

CD4060BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS &

CD4060BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS &

CD4060BME4 ACTIVE SOIC D 16 40 Green (RoHS &

CD4060BMG4 ACTIVE SOIC D 16 40 Green (RoHS &

CD4060BMT ACTIVE SOIC D 16 250 Green (RoHS &

CD4060BMTE4 ACTIVE SOIC D 16 250 Green(RoHS &

CD4060BMTG4 ACTIVE SOIC D 16 250 Green (RoHS &

CD4060BNSR ACTIVE SO NS 16 2000 Green (RoHS &

CD4060BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &

CD4060BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &

CD4060BPW ACTIVE TSSOP PW 16 90 Green (RoHS &

CD4060BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &

CD4060BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &

CD4060BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &

CD4060BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

CD4060BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, anda lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samplesmay or may not be available.

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use inspecified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight inhomogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

19-Mar-2008

*All dimensions are nominal

Device Package

CD4060BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4060BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4060BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

19-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD4060BM96 SOIC D 16 2500 333.2 345.9 28.6

CD4060BNSR SO NS 16 2000 346.0 346.0 33.0

CD4060BPWR TSSOP PW 16 2000 346.0 346.0 29.0

Pack Materials-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

14

0,30 0,19

8

4,50 4,30

PINS **

7

Seating Plane

0,15 0,05

8

1

A

DIM

14

0,10

6,60 6,20

M

0,10

0,15 NOM

0°–8°

2016

Gage Plane

24

0,25

0,75 0,50

28

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

CD4060BE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4060BE

CD4060BEE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4060BE

CD4060BF ACTIVE CDIP J 16 1 Non-RoHS

CD4060BF3A ACTIVE CDIP J 16 1 Non-RoHS

CD4060BM ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4060BM

CD4060BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4060BM

CD4060BMG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4060BM

CD4060BMT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4060BM

CD4060BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4060B

CD4060BPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM060B

CD4060BPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM060B

CD4060BPWRE4 ACTIVE TSSOP PW 16 2000 TBD Call TI Call TI -55 to 125

CD4060BPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM060B

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& Green

Lead finish/ Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

SNPB N / A for Pkg Type -55 to 125 CD4060BF

SNPB N / A for Pkg Type -55 to 125 CD4060BF3A

(4/5)

(2)

RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

13-Jul-2022

Samples

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD4060B, CD4060B-MIL :

Catalog : CD4060B

•

13-Jul-2022

Military : CD4060B-MIL

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Military - QML certified for Military and Defense Applications

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

Reel Width (W1)

REEL DIMENSIONS

A0 B0 K0

W

Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

K0 P1

B0

W

A0

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q1

Q1Q2 Q2

Q3 Q3Q4 Q4

User Direction of Feed

P1

Reel

Diameter

www.ti.com 3-Jun-2022

TAPE AND REEL INFORMATION

*All dimensions are nominal

CD4060BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4060BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4060BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Device Package

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

TAPE AND REEL BOX DIMENSIONS

Width (mm)

W

L

H

www.ti.com 3-Jun-2022

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD4060BM96 SOIC D 16 2500 340.5 336.1 32.0 CD4060BNSR SO NS 16 2000 356.0 356.0 35.0

CD4060BPWR TSSOP PW 16 2000 356.0 356.0 35.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TUBE

T - Tube

height

W - Tube

width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)

CD4060BE N PDIP 16 25 506 13.97 11230 4.32

CD4060BE N PDIP 16 25 506 13.97 11230 4.32 CD4060BEE4 N PDIP 16 25 506 13.97 11230 4.32 CD4060BEE4 N PDIP 16 25 506 13.97 11230 4.32

CD4060BM D SOIC 16 40 507 8 3940 4.32

CD4060BMG4 D SOIC 16 40 507 8 3940 4.32

CD4060BPW PW TSSOP 16 90 530 10.2 3600 3.5

L - Tube length

Pack Materials-Page 3

PACKAGE OUTLINE

A

10.4

10.0

NOTE 3

SCALE 1.500

8.2

TYP

7.4 PIN 1 ID

AREA

1

8

B

5.4

5.2

NOTE 4

9

16

14X 1.27

2X

8.89

0.51

16X

0.35

0.25 C A B

SOP - 2.00 mm max heightNS0016A

SOP

C

SEATING PLANE

0.1 C

2.00 MAX

0.15 TYP

SEE DETAIL A

GAGE PLANE

0 - 10

0.25

1.05

0.55 (1.25)

0.3

0.1

DETAIL A

TYPICAL

4220735/A 12/2021

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

www.ti.com

EXAMPLE BOARD LAYOUT

SOP - 2.00 mm max heightNS0016A

SOP

16X (1.85)

16X (0.6)

14X (1.27)

(R0.05) TYP

SYMM

1

8

(7)

SEE DETAILS

16

SYMM

9

LAND PATTERN EXAMPLE

SCALE:7X

METAL

0.07 MAX ALL AROUND

NON SOLDER MASK

DEFINED

SOLDER MASK OPENING

SOLDER MASK

OPENING

0.07 MIN ALL AROUND

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

4220735/A 12/2021

www.ti.com

EXAMPLE STENCIL DESIGN

SOP - 2.00 mm max heightNS0016A

SOP

16X (1.85)

16X (0.6)

14X (1.27)

(R0.05) TYP

SYMM

1

8

(7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:7X

16

SYMM

9

4220735/A 12/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

8. Board assembly site may have different recommendations for stencil design.

www.ti.com

PACKAGE OUTLINE

A

5.1

4.9

NOTE 3

SCALE 2.500

TSSOP - 1.2 mm max heightPW0016A

SMALL OUTLINE PACKAGE

SEATING

6.6

TYP

6.2 PIN 1 INDEX AREA

1

8

B

4.5

4.3

NOTE 4

16

9

14X 0.65

2X

4.55

0.30

16X

0.19

0.1 C A B

C

1.2 MAX

PLANE

0.1 C

(0.15) TYP

SEE DETAIL A

GAGE PLANE

0.25

0.75

-80

0.50

A 20

DETAIL A

TYPICAL

4220204/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-153.

0.15

0.05

www.ti.com

EXAMPLE BOARD LAYOUT

TSSOP - 1.2 mm max heightPW0016A

SMALL OUTLINE PACKAGE

16X (0.45)

14X (0.65)

1

8

16X (1.5)

SYMM

(R0.05) TYP

16

SYMM

9

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 10X

SOLDER MASK

OPENING

EXPOSED METAL

0.05 MAX ALL AROUND

NON-SOLDER MASK

DEFINED

(PREFERRED)

METAL

15.000

SOLDER MASK DETAILS

METAL UNDER SOLDER MASK

0.05 MIN ALL AROUND

SOLDER MASK

DEFINED

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SOLDER MASK OPENING

EXPOSED METAL

4220204/A 02/2017

www.ti.com

EXAMPLE STENCIL DESIGN

TSSOP - 1.2 mm max heightPW0016A

SMALL OUTLINE PACKAGE

16X (0.45)

14X (0.65)

1

8

16X (1.5)

SYMM

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

(R0.05) TYP

16

SYMM

9

4220204/A 02/2017

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

9. Board assembly site may have different recommendations for stencil design.

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Datasheet CD4060BE, CD4060BM Specification

Specifications and Main Features

Frequently Asked Questions

User Manual