Page 1
Data sheet acquired from Harris Semiconductor
SCHS044C − Revised September 2003
The CD4047B-Series types are supplied in
14-lead hermetic dual-in-line ceramic
packages (F3A suffix), 14-lead dual-in-line
plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and
NSR suffixes), and 14-lead thin shrink
small-outline packages (PW and PWR
suffixes).
Copyright © 2003, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
8102001CA ACTIVE CDIP J 14 1 Non-RoHS
CD4047BD3 ACTIVE CDIP SB JD 14 1 Non-RoHS &
CD4047BE ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4047BE
CD4047BEE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4047BE
CD4047BF ACTIVE CDIP J 14 1 Non-RoHS
CD4047BF3A ACTIVE CDIP J 14 1 Non-RoHS
CD4047BM ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4047BM
CD4047BM96 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4047BM
CD4047BM96G4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4047BM
CD4047BMG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4047BM
CD4047BMT ACTIVE SOIC D 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4047BM
CD4047BNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4047B
CD4047BPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM047B
CD4047BPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM047B
CD4047BPWRE4 ACTIVE TSSOP PW 14 2000 TBD Call TI Call TI -55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& Green
Non-Green
& Green
& Green
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
SNPB N / A for Pkg Type -55 to 125 8102001CA
AU N / A for Pkg Type -55 to 125 CD4047BD/3
SNPB N / A for Pkg Type -55 to 125 CD4047BF
SNPB N / A for Pkg Type -55 to 125 8102001CA
13-Jul-2022
Op Temp (°C) Device Marking
(4/5)
CD4047BF3A
CD4047BF3A
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
www.ti.com
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4047B, CD4047B-MIL :
Catalog : CD4047B
•
13-Jul-2022
Military : CD4047B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
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PACKAGE MATERIALS INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0
W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1Q2 Q2
Q3 Q3Q4 Q4
User Direction of Feed
P1
Reel
Diameter
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
CD4047BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4047BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4047BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4047BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
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PACKAGE MATERIALS INFORMATION
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
www.ti.com 3-Jun-2022
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4047BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4047BMT SOIC D 14 250 210.0 185.0 35.0
CD4047BNSR SO NS 14 2000 356.0 356.0 35.0
CD4047BPWR TSSOP PW 14 2000 356.0 356.0 35.0
Pack Materials-Page 2
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PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TUBE
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4047BE N PDIP 14 25 506 13.97 11230 4.32
CD4047BE N PDIP 14 25 506 13.97 11230 4.32
CD4047BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4047BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4047BM D SOIC 14 50 506.6 8 3940 4.32
CD4047BMG4 D SOIC 14 50 506.6 8 3940 4.32
CD4047BPW PW TSSOP 14 90 530 10.2 3600 3.5
L - Tube length
Pack Materials-Page 3
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PACKAGE OUTLINE
12X .100
[2.54]
PIN 1 ID
(OPTIONAL)
1
14
A
-.785.754
-19.9419.15[ ]
SCALE 0.900
4X .005 MIN
14X -.065.045
[0.13]
-1.651.15[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
TYP-.060.015
-1.520.38[ ]
14X -.026.014
-0.660.36[ ]
.010 [0.25] C A B
7
B -.283.245
AT GAGE PLANE
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
0
-7.196.22[ ]
-.314.308
-7.977.83[ ]
-15
TYP
8
.015 GAGE PLANE
[0.38]
14X .008-.014
[0.2-0.36]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
4214771/A 05/2017
www.ti.com
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SEE DETAIL A
(.300 ) TYP
[7.62]
EXAMPLE BOARD LAYOUT
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
SEE DETAIL B
12X (.100 )
[2.54]
14X ( .039)
[1]
1
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
14
SYMM
8
MAX.002
[0.05]
ALL AROUND
(R.002 ) TYP
[0.05]
(.063)
[1.6]
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
www.ti.com
METAL
SOLDER MASK
OPENING
( .063)
[1.6]
.002 MAX
[0.05]
ALL AROUND
DETAIL B
13X, SCALE: 15X
4214771/A 05/2017
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