Page 1
Data sheet acquired from Harris Semiconductor
SCHS030D − Revised December 2003
The CD4020B and CD4040B types are supplied
in 16-lead hermetic dual-in-line ceramic
packages (F3A suffix), 16-lead dual-in-line
plastic packages (E suffix), 16-lead
small-outline packages (NSR suffix), and
16-lead thin shrink small-outline packages (PW
and PWR suffixes). The CD4040B type also is
supplied in 16-lead small-outline packages (M
and M96 suffixes).
The CD4024B types are supplied in 14-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic packages (E
suffix), 14-lead small-outline packages (M, MT,
M96, and NSR suffixes), and 14-lead thin shrink
small-outl ine packages (PW and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
Page 2
Page 3
Page 4
Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
CD4020BE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4020BE
CD4020BEE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4020BE
CD4020BF ACTIVE CDIP J 16 1 Non-RoHS
CD4020BF3A ACTIVE CDIP J 16 1 Non-RoHS
CD4020BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4020B
CD4020BNSRG4 ACTIVE SO NS 16 2000 TBD Call TI Call TI -55 to 125
CD4020BPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM020B
CD4020BPWE4 ACTIVE TSSOP PW 16 90 TBD Call TI Call TI -55 to 125
CD4020BPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM020B
CD4024BE ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4024BE
CD4024BEE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4024BE
CD4024BF ACTIVE CDIP J 14 1 Non-RoHS
CD4024BF3A ACTIVE CDIP J 14 1 Non-RoHS
CD4024BM ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4024BM
CD4024BM96 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4024BM
CD4024BME4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4024BM
CD4024BMG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4024BM
CD4024BMT ACTIVE SOIC D 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4024BM
CD4024BNSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4024B
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& Green
& Green
& Green
& Green
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
SNPB N / A for Pkg Type -55 to 125 CD4020BF
SNPB N / A for Pkg Type -55 to 125 CD4020BF3A
SNPB N / A for Pkg Type -55 to 125 CD4024BF
SNPB N / A for Pkg Type -55 to 125 CD4024BF3A
13-Jul-2022
Op Temp (°C) Device Marking
(4/5)
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 1
Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
CD4024BPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM024B
CD4024BPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM024B
CD4040BE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4040BE
CD4040BEE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4040BE
CD4040BF ACTIVE CDIP J 16 1 Non-RoHS
SNPB N / A for Pkg Type -55 to 125 CD4040BF
& Green
CD4040BF3A ACTIVE CDIP J 16 1 Non-RoHS
SNPB N / A for Pkg Type -55 to 125 CD4040BF3A
& Green
CD4040BM ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4040BM
CD4040BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4040BM
CD4040BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4040B
CD4040BPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM040B
CD4040BPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM040B
CD4040BPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM040B
JM38510/05653BEA ACTIVE CDIP J 16 1 Non-RoHS
SNPB N / A for Pkg Type -55 to 125 JM38510/
& Green
JM38510/05655BCA ACTIVE CDIP J 14 1 Non-RoHS
SNPB N / A for Pkg Type -55 to 125 JM38510/
& Green
M38510/05653BEA ACTIVE CDIP J 16 1 Non-RoHS
SNPB N / A for Pkg Type -55 to 125 JM38510/
& Green
M38510/05655BCA ACTIVE CDIP J 14 1 Non-RoHS
SNPB N / A for Pkg Type -55 to 125 JM38510/
& Green
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
05653BEA
05655BCA
05653BEA
05655BCA
13-Jul-2022
Samples
(4/5)
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 2
Page 7
PACKAGE OPTION ADDENDUM
www.ti.com
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4020B, CD4020B-MIL, CD4024B, CD4024B-MIL, CD4040B, CD4040B-MIL :
Catalog : CD4020B, CD4024B, CD4040B
•
13-Jul-2022
Military : CD4020B-MIL, CD4024B-MIL, CD4040B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
Page 8
PACKAGE MATERIALS INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0
W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1Q2 Q2
Q3 Q3Q4 Q4
User Direction of Feed
P1
Reel
Diameter
www.ti.com 9-Aug-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
CD4020BNSR SO NS 16 2000 330.0 16.4 8.45 10.55 2.5 12.0 16.2 Q1
CD4020BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4024BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4024BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4024BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4024BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4040BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4040BNSR SO NS 16 2000 330.0 16.4 8.1 10.4 2.5 12.0 16.0 Q1
CD4040BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
Page 9
PACKAGE MATERIALS INFORMATION
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
www.ti.com 9-Aug-2022
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4020BNSR SO NS 16 2000 356.0 356.0 35.0
CD4020BPWR TSSOP PW 16 2000 356.0 356.0 35.0
CD4024BM96 SOIC D 14 2500 356.0 356.0 35.0
CD4024BMT SOIC D 14 250 210.0 185.0 35.0
CD4024BNSR SO NS 14 2000 356.0 356.0 35.0
CD4024BPWR TSSOP PW 14 2000 356.0 356.0 35.0
CD4040BM96 SOIC D 16 2500 340.5 336.1 32.0
CD4040BNSR SO NS 16 2000 356.0 356.0 35.0
CD4040BPWR TSSOP PW 16 2000 356.0 356.0 35.0
Pack Materials-Page 2
Page 10
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TUBE
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4020BE N PDIP 16 25 506 13.97 11230 4.32
CD4020BE N PDIP 16 25 506 13.97 11230 4.32
CD4020BEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4020BEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4020BPW PW TSSOP 16 90 530 10.2 3600 3.5
CD4024BE N PDIP 14 25 506 13.97 11230 4.32
CD4024BE N PDIP 14 25 506 13.97 11230 4.32
CD4024BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4024BEE4 N PDIP 14 25 506 13.97 11230 4.32
CD4024BM D SOIC 14 50 506.6 8 3940 4.32
CD4024BME4 D SOIC 14 50 506.6 8 3940 4.32
CD4024BMG4 D SOIC 14 50 506.6 8 3940 4.32
CD4024BPW PW TSSOP 14 90 530 10.2 3600 3.5
CD4040BE N PDIP 16 25 506 13.97 11230 4.32
CD4040BE N PDIP 16 25 506 13.97 11230 4.32
CD4040BEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4040BEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4040BM D SOIC 16 40 507 8 3940 4.32
CD4040BPW PW TSSOP 16 90 530 10.2 3600 3.5
L - Tube length
Pack Materials-Page 3
Page 11
PACKAGE OUTLINE
A
10.4
10.0
NOTE 3
SCALE 1.500
8.2
TYP
7.4
PIN 1 ID
AREA
1
8
B
5.4
5.2
NOTE 4
9
16
14X 1.27
2X
8.89
0.51
16X
0.35
0.25 C A B
SOP - 2.00 mm max heightNS0016A
SOP
C
SEATING PLANE
0.1 C
2.00 MAX
0.15 TYP
SEE DETAIL A
GAGE PLANE
0 - 10
0.25
1.05
0.55
(1.25)
0.3
0.1
DETAIL A
TYPICAL
4220735/A 12/2021
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
www.ti.com
Page 12
EXAMPLE BOARD LAYOUT
SOP - 2.00 mm max heightNS0016A
SOP
16X (1.85)
16X (0.6)
14X (1.27)
(R0.05) TYP
SYMM
1
8
(7)
SEE
DETAILS
16
SYMM
9
LAND PATTERN EXAMPLE
SCALE:7X
METAL
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
OPENING
SOLDER MASK
OPENING
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
4220735/A 12/2021
www.ti.com
Page 13
EXAMPLE STENCIL DESIGN
SOP - 2.00 mm max heightNS0016A
SOP
16X (1.85)
16X (0.6)
14X (1.27)
(R0.05) TYP
SYMM
1
8
(7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:7X
16
SYMM
9
4220735/A 12/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
Page 14
Page 15
Page 16
PACKAGE OUTLINE
A
5.1
4.9
NOTE 3
SCALE 2.500
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
SEATING
6.6
TYP
6.2
PIN 1 INDEX AREA
1
8
B
4.5
4.3
NOTE 4
16
9
14X 0.65
2X
4.55
0.30
16X
0.19
0.1 C A B
C
1.2 MAX
PLANE
0.1 C
(0.15) TYP
SEE DETAIL A
GAGE PLANE
0.25
0.75
-80
0.50
A 20
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
0.15
0.05
www.ti.com
Page 17
EXAMPLE BOARD LAYOUT
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(R0.05) TYP
16
SYMM
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
METAL
15.000
SOLDER MASK DETAILS
METAL UNDER
SOLDER MASK
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SOLDER MASK
OPENING
EXPOSED METAL
4220204/A 02/2017
www.ti.com
Page 18
EXAMPLE STENCIL DESIGN
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
(R0.05) TYP
16
SYMM
9
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
Page 19
Page 20
Page 21
Page 22
PACKAGE OUTLINE
12X .100
[2.54]
PIN 1 ID
(OPTIONAL)
1
14
A
-.785.754
-19.9419.15[ ]
SCALE 0.900
4X .005 MIN
14X -.065.045
[0.13]
-1.651.15[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
TYP-.060.015
-1.520.38[ ]
14X -.026.014
-0.660.36[ ]
.010 [0.25] C A B
7
B -.283.245
AT GAGE PLANE
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
0
-7.196.22[ ]
-.314.308
-7.977.83[ ]
-15
TYP
8
.015 GAGE PLANE
[0.38]
14X .008-.014
[0.2-0.36]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
4214771/A 05/2017
www.ti.com
Page 23
SEE DETAIL A
(.300 ) TYP
[7.62]
EXAMPLE BOARD LAYOUT
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
SEE DETAIL B
12X (.100 )
[2.54]
14X ( .039)
[1]
1
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
14
SYMM
8
MAX.002
[0.05]
ALL AROUND
(R.002 ) TYP
[0.05]
(.063)
[1.6]
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
www.ti.com
METAL
SOLDER MASK
OPENING
( .063)
[1.6]
.002 MAX
[0.05]
ALL AROUND
DETAIL B
13X, SCALE: 15X
4214771/A 05/2017
Page 24
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