Page 1
Data sheet acquired from Harris Semiconductor
SCHS020C − Revised October 2003
The CD4009UB and CD4010B types are
supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead
dual-in-line plastic packages (E suffix), 16-lead
small-outline packages (M, M96, MT, and NSR
suffixes), and 16-lead thin shink small-outline
packages (PW and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
Page 2
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PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
CD4009UBE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4009UBE
CD4009UBEE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4009UBE
CD4009UBF3A ACTIVE CDIP J 16 1 Non-RoHS
CD4009UBM ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4009UBM
CD4009UBMT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4009UBM
CD4009UBPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM009UB
CD4010BE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4010BE
CD4010BF ACTIVE CDIP J 16 1 Non-RoHS
CD4010BF3A ACTIVE CDIP J 16 1 Non-RoHS
CD4010BM ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010BM
CD4010BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010BM
CD4010BMG4 ACTIVE SOIC D 16 40 TBD Call TI Call TI -55 to 125
CD4010BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010B
CD4010BPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM010B
CD4010BPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM010B
CD4010BPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM010B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& Green
& Green
& Green
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
SNPB N / A for Pkg Type -55 to 125 CD4009UBF3A
SNPB N / A for Pkg Type -55 to 125 CD4010BF
SNPB N / A for Pkg Type -55 to 125 CD4010BF3A
13-Jul-2022
Samples
(4/5)
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
www.ti.com
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4009UB, CD4009UB-MIL, CD4010B, CD4010B-MIL :
Catalog : CD4009UB, CD4010B
•
13-Jul-2022
Automotive : CD4010B-Q1, CD4010B-Q1
•
Military : CD4009UB-MIL, CD4010B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
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PACKAGE OPTION ADDENDUM
www.ti.com
Military - QML certified for Military and Defense Applications
•
13-Jul-2022
Addendum-Page 3
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PACKAGE MATERIALS INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0
W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1Q2 Q2
Q3 Q3Q4 Q4
User Direction of Feed
P1
Reel
Diameter
www.ti.com 9-Aug-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
CD4009UBPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4010BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4010BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4010BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
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PACKAGE MATERIALS INFORMATION
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
www.ti.com 9-Aug-2022
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4009UBPWR TSSOP PW 16 2000 356.0 356.0 35.0
CD4010BM96 SOIC D 16 2500 340.5 336.1 32.0
CD4010BNSR SO NS 16 2000 356.0 356.0 35.0
CD4010BPWR TSSOP PW 16 2000 356.0 356.0 35.0
Pack Materials-Page 2
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PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TUBE
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4009UBE N PDIP 16 25 506 13.97 11230 4.32
CD4009UBE N PDIP 16 25 506 13.97 11230 4.32
CD4009UBEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4009UBEE4 N PDIP 16 25 506 13.97 11230 4.32
CD4009UBM D SOIC 16 40 507 8 3940 4.32
CD4010BE N PDIP 16 25 506 13.97 11230 4.32
CD4010BE N PDIP 16 25 506 13.97 11230 4.32
CD4010BM D SOIC 16 40 507 8 3940 4.32
CD4010BPW PW TSSOP 16 90 530 10.2 3600 3.5
L - Tube length
Pack Materials-Page 3
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PACKAGE OUTLINE
A
10.4
10.0
NOTE 3
SCALE 1.500
8.2
TYP
7.4
PIN 1 ID
AREA
1
8
B
5.4
5.2
NOTE 4
9
16
14X 1.27
2X
8.89
0.51
16X
0.35
0.25 C A B
SOP - 2.00 mm max heightNS0016A
SOP
C
SEATING PLANE
0.1 C
2.00 MAX
0.15 TYP
SEE DETAIL A
GAGE PLANE
0 - 10
0.25
1.05
0.55
(1.25)
0.3
0.1
DETAIL A
TYPICAL
4220735/A 12/2021
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
www.ti.com
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EXAMPLE BOARD LAYOUT
SOP - 2.00 mm max heightNS0016A
SOP
16X (1.85)
16X (0.6)
14X (1.27)
(R0.05) TYP
SYMM
1
8
(7)
SEE
DETAILS
16
SYMM
9
LAND PATTERN EXAMPLE
SCALE:7X
METAL
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
OPENING
SOLDER MASK
OPENING
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
4220735/A 12/2021
www.ti.com
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EXAMPLE STENCIL DESIGN
SOP - 2.00 mm max heightNS0016A
SOP
16X (1.85)
16X (0.6)
14X (1.27)
(R0.05) TYP
SYMM
1
8
(7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:7X
16
SYMM
9
4220735/A 12/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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PACKAGE OUTLINE
A
5.1
4.9
NOTE 3
SCALE 2.500
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
SEATING
6.6
TYP
6.2
PIN 1 INDEX AREA
1
8
B
4.5
4.3
NOTE 4
16
9
14X 0.65
2X
4.55
0.30
16X
0.19
0.1 C A B
C
1.2 MAX
PLANE
0.1 C
(0.15) TYP
SEE DETAIL A
GAGE PLANE
0.25
0.75
-80
0.50
A 20
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
0.15
0.05
www.ti.com
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EXAMPLE BOARD LAYOUT
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(R0.05) TYP
16
SYMM
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
METAL
15.000
SOLDER MASK DETAILS
METAL UNDER
SOLDER MASK
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SOLDER MASK
OPENING
EXPOSED METAL
4220204/A 02/2017
www.ti.com
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EXAMPLE STENCIL DESIGN
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
(R0.05) TYP
16
SYMM
9
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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