The FB2041 is a 7-bit bidirectional BTL transceiver and is intended
to provide the electrical interface to a high performance wired-OR
bus. The FB2041 is an inverting transceiver.
The B-port drivers are Low-capacitance open collectors with
controlled ramp and are designed to sink 100mA. Precision band
gap references on the B-port insure very good noise margins by
limiting the switching threshold to a narrow region centered at 1.55V .
FEA TURES
•7-bit BTL transceiver
•Separate I/O on TTL A-port
•Inverting
•Three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement
•Drives heavily loaded backplanes with equivalent load
impedances down to 10Ω.
•Allows incident wave switching in heavily loaded backplane buses
•Reduced BTL voltage swing produces less noise and reduces
power consumption
•Built-in precision band-gap reference provides accurate receiver
thresholds and improved noise immunity
•Compatible with IEEE Futurebus+ or proprietary BTL backplanes
•Controlled output ramp and multiple GND pins minimize ground
bounce
•Each BTL driver has a dedicated Bus GND for a signal return
•Glitch-free power up/power down operation
•Low I
current
CC
•Tight output skew
•Supports live insertion
•Pins for the optional JTAG boundary scan function are provided
•High density packaging in plastic Quad Flatpack
•High drive 100mA BTL open collector drivers on B-port
QUICK REFERENCE DATA
SYMBOLPARAMETERTYPICALUNIT
t
PLH
t
PHL
t
PLH
t
PHL
C
I
OB
OL
CC
Propagation delay3.7
AIn to Bn2.7
Propagation delay3.4
Bn to AOn3.2
Output capacitance (B0 - B6 only)6pF
Output current (B0 - B6 only)100mA
Standby19
pp
AIn to Bn (outputs Low or High)40
Bn to AOn (outputs Low)22
Bn to AOn (outputs High)19
The B-port interfaces to “Backplane Transceiver Logic” (See the
IEEE 1194.1 BTL standard). BTL features low power consumption
by reducing voltage swing (1Vp-p, between 1V and 2V) and reduced
capacitive loading by placing an internal series diode on the drivers.
BTL also provides incident wave switching, a necessity for high
performance backplanes.
There are three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement. The TTL/BTL output drivers for bit 0 are enabled with
OEA1/OEB1
OEA2/OEB2
OEA3/OEB3
, output drivers for bits 1–2–3 are enabled with
and output drivers for bits 4–5–6 are enabled with
.
The A-port operates at TTL levels with separate I/O. The 3-state
A-port drivers are enabled when OEAn goes High after an extra 6ns
delay which is built in to provide a break-before-make function.
When OEAn goes Low, A-port drivers become High impedance
without any extra delay. During power on/of f cycles, the A-port
drivers are held in a High impedance state when V
is below 2.5V.
CC
The B-port has an output enable, OEB0, which affects all seven
drivers. When OEB0 is High and OEBn
be enabled. When OEB0 is Low or if OEBn
is Low the output driver will
is High, the B-port
drivers will be inactive and at the level of the backplane signal.
CC
B0
TMS (option)
OEB0
OEB1
OEA2
TDO (option)
TCK (option)
BUS V
CC
OEA3
BUS V
TDI (option)
BUS GND
39
38
37
36
35
34
33
32
31
30
29
28
27
OEB2
OEB3
BUS GND
B1
BUS GND
B2
BUS GND
B3
BUS GND
B4
BUS GND
B5
BUS GND
B6
BUS GND
BIAS V
OEA1
FB2041
AI6
LOGIC GND
To support live insertion, OEB0 is held Low during power on/off
cycles to insure glitch free B port drivers. Proper bias for B port
drivers during live insertion is provided by the BIAS V pin when at a
5V level while V
BIAS V pin should be tied to a V
is Low. If live insertion is not a requirement, the
CC
CC
pin.
The LOGIC GND and BUS GND pins are isolated in the package to
minimize noise coupling between the BTL and TTL sides. These
pins should be tied to a common ground external to the package.
Each BTL driver has an associated BUS GND pin that acts as a
signal return path and these BUS GND pins are internally isolated
from each other. In the event of a ground return fault, a “hard” signal
failure occurs instead of a pattern dependent error that may be very
infrequent and impossible to trouble-shoot.
The LOGIC V
and BUS VCC pins are also isolated internally to
CC
minimize noise and may be externally decoupled separately or
simply tied together.
JTAG boundary scan functionality is provided as an option with
signals TMS, TCK, TDI and TDO. When this option is not present,
TMS and TCK are no-connects (no bond wires) and TDI and TDO
are shorted together internally.
B0 – B640, 38, 36, 34, 32, 30, 28I/OData inputs/Open Collector outputs, High current drive (BTL)
OEB046InputEnables the Bn outputs when High
OEB145InputEnables the B0 output when Low
OEB225InputEnables the B1 – B3 outputs when Low
OEB326InputEnables the B4 – B6 outputs when Low
OEA147InputEnables the A0 outputs when High
OEA220InputEnables the A1 – A3 outputs when High
OEA324InputEnables the A4 – A6 outputs when High
23, 43PowerPositive supply voltage
17, 49PowerPositive supply voltage
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.
SYMBOL
V
CC
IN
I
IN
V
OUT
OUT
T
STG
Supply voltage-0.5 to +7.0V
p
Input current-18 to +5.0mA
Voltage applied to output in High output state-0.5 to +V
Current applied to output inAO0 – AO648mA
Low output stateB0 – B6200
Storage temperature-65 to +150°C
H=High voltage level
L=Low voltage level
X=Don’t care
Z=High-impedance (OFF) state
— =Input not externally driven
H** =Goes to level of pull-up voltage
B* =Precaution should be taken to ensure B inputs do not float.
If they do, they are equal to Low state.
Z=High-impedance (OFF) state
— =Input not externally driven
H** =Goes to level of pull-up voltage
B* =Precaution should be taken to ensure B inputs do not float.
If they do, they are equal to Low state.
1995 May 25
5
Page 6
Philips SemiconductorsProduct specification
FB20417-bit Futurebus+ transceiver
LOGIC DIAGRAM
46
OEB0
45
OEB1
47
OEA1
AO0
OEB2
OEA2
AO1
AI0
AI1
51
50
25
20
2
52
40
B0
38
B1
TTL
Levels
AO2
AO3
OEB3
OEA3
AO4
AO5
AO6
AI2
AI3
AI4
AI5
AI6
36
3
4
8
6
26
24
9
10
14
12
18
16
B2
34
32
30
28
BTL
Levels
B3
B4
B5
B6
TMS
TCK
TDI
TDO
LOGIC V
LOGIC GND = 1, 5, 7, 11, 13, 15, 19
BUS V
BUS GND= 27, 29, 31, 33, 35, 37, 39, 41
BIAS V= 48
= 17, 49
CC
= 23, 43
CC
1995 May 25
42
44
(Future JTAG Boundary Scan option)
22
21
SG00071
6
Page 7
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
UNIT
I
Bias pin DC current
IOLOFF
Power up current
A
SYMBOL
PARAMETER
TEST CONDITIONS
1
UNIT
µ
IH
g
µ
µ
IL
µ
ICCSupply current (total)
mA
FB20417-bit Futurebus+ transceiver
LIVE INSERTION SPECIFICA TIONS
LIMITS
MINTYPMAX
V
BIASV
BIASV
V
I
I
IBnPEAK
t
Bias pin voltageVCC = 0 to 5.25V, Bn = 0 to 2.0V4.55.5V
VCC = 0 to 4.75V, Bn = 0 to 2.0V,
p
Bias V = 4.5 to 5.5V
VCC = 4.5 to 5.5V, Bn = 0 to 2.0V,
Bias V = 4.5 to 5.5V
Bus voltage during prebiasB0 – B8 = 0V, Bias V = 5.0V1.622.1V
Bn
Fall current during prebiasB0 – B8 = 2V, Bias V = 4.5 to 5.5V1µA
LM
Rise current during prebiasB0 – B8 = 1V, Bias V = 4.5 to 5.5V-1µA
HM
Peak bus current during
insertion
p
Input glitch rejectionVCC = 5.0V1.01.35ns
GR
VCC = 0 to 5.25V, B0 – B8 = 0 to 2.0V,
Bias V = 4.5 to 5.5V, OEB0 = 0.8V, tr = 2ns
V
= 0 to 5.25V, OEB0 = 0.8V100
CC
V
= 0 to 2.2V, OEB0 = 0 to 5V100
CC
1mA
10µA
10mA
µ
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
LIMITS
MINTYP2MAX
I
I
OFF
V
V
V
I
OZH
I
OZL
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operation conditions for the applicable type.
2. All typical values are at V
3. Due to test equipment limitations, actual test conditions are V
High level output current B0 – B6VCC = MAX, VIL = MAX, VIH = MIN, VOH = 2.1V100µA
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
PN
HL. Skew times are valid only under same test conditions (temperature, V
, loading, etc.).
CC
amb
VCC = 5V±10%,
CL = 50pF, RL = 500Ω
1.6
1.6
1.5
1.5
0.8
1.2
1.5
1.5
T
= -40 to +85°C,
amb
VCC = 5V±10%,
5.5
5.5
8.0
8.0
6.0
6.0
3.5
3.5
CD = 30pF, RU = 9Ω
1.9
1.5
1.9
1.8
1.9
1.5
1.0
0.5
2.0
1.6
2.0
1.9
2.0
1.6
1.0
0.5
5.9
5.0
6.4
5.9
6.8
6.8
3.0
3.0
6.0
5.1
6.5
6.0
6.9
6.9
3.0
3.0
UNIT
ns
ns
ns
ns
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
1995 May 25
9
Page 10
Philips SemiconductorsProduct specification
FB20417-bit Futurebus+ transceiver
AC WAVEFORMS
AIn, Bn or Bn
OEBn
AOn or Bn
V
M
t
PLH
V
M
t
PHL
V
M
V
M
Waveform 1. Propagation Delay for Data
or Output Enable to Output
AIn, Bn
AOn, Bn
OEA
AOn
V
M
t
PZH
V
M
t
PHZ
V
M
Waveform 3. Output Skews
VOH -0.3V
OV
Waveform 4. 3-State Output Enable Time to High Level
and Output Disable Time from High Level
NOTE: V
= 1.55V for Bn, V
M
V
M
tSK(o)
V
M
Waveform 5. 3-State Output Enable Time to Low Level
= 1.5V for all others.
M
AIn, Bn
OEB0
AOn, Bn
V
M
t
PHL
V
M
t
PLH
V
M
Waveform 2. Propagation Delay for Data
or Output Enable to Output
OEAn
AOn
V
M
t
PZL
V
M
t
PLZ
V
M
VOL +0.3V
and Output Disable Time from Low Level
V
M
SG00079
1995 May 25
10
Page 11
Philips SemiconductorsProduct specification
FB20417-bit Futurebus+ transceiver
TEST CIRCUIT AND WAVEFORMS
V
CC
BIAS
V
PULSE
GENERATOR
V
IN
R
T
D.U.T.
V
OUT
Test Circuit for 3-State Outputs on A Port
SWITCH POSITION
TESTSWITCH
t
All other
PULSE
GENERATOR
PLZ,
t
PZL
V
IN
BIAS
V
V
D.U.T.
closed
open
CC
V
OUT
R
L
R
C
L
L
2.0V (for RU = 9Ω)
2.1V (for RU = 16.5Ω)
R
U
7.0V
NEGATIVE
PULSE
POSITIVE
PULSE
Family
FB+
A Port
90%
10%
t
W
V
M
10%
(tf)
t
THL
t
(tr)
TLH
90%
V
M
t
W
VM = 1.55V for Bn, VM = 1.5V for all others.
V
10%
90%
V
Input Pulse Definitions
INPUT PULSE REQUIREMENTS
Low V
0.0V
1.0VB Port
Rep. RateAmplitudet
1MHz3.0V
1MHz2.0V
t
500ns
M
M
W
2.5ns
2.5ns500ns
V
t
TLH
t
THL
LOW V
(tr)
(tf)
V
LOW V
IN
IN
90%
10%
TLHtTHL
2.5ns
2.5ns
R
T
Test Circuit for Outputs on B Port
C
D
DEFINITIONS:
RL= Load Resistor; see AC CHARACTERISTICS for value.
CL= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
CD= Load capacitance includes jig and probe capacitance; see AC
of pulse generators.
OUT
CHARACTERISTICS for value.
RU= Pull up resistor; see AC CHARACTERISTICS for value.
SG00059
1995 May 25
11
Page 12
Philips SemiconductorsProduct specification
FB20417-bit Futurebus+ transceivers
QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mmSOT379-1
1995 May 25
12
Page 13
Philips SemiconductorsProduct specification
FB20417-bit Futurebus+ transceivers
NOTES
1995 May 25
13
Page 14
Philips SemiconductorsProduct specification
FB20417-bit Futurebus+ transceivers
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 08-98
Document order number:
1995 May 25
14
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