Datasheet CD14538BM, CD14538BE Specification

Data sheet acquired from Harris Semiconductor
SCHS093C − Revised October 2003

The CD14538B is interchangeable with type MC14538 and is similar
to and pin-compatible with the CD4098B* and CD4538B. It can
replace the CD4538B which type is not recommended for new
designs.
The CD14538B types are s upplied in 16- lead hermetic dual-in-li ne
ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages
(E suffix) , 16-lead small-outlin e packages (M, M96, MT, and NSR
suffixes), and 16-lead thin shrink small-outline packages
(PW and PWR suffixes).

Copyright  2003, Texas Instruments Incorporated

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

5962-9055701EA ACTIVE CDIP J 16 1 Non-RoHS

CD14538BE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD14538BE
CD14538BF ACTIVE CDIP J 16 1 Non-RoHS

CD14538BF3A ACTIVE CDIP J 16 1 Non-RoHS

CD14538BM ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD14538BM

CD14538BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD14538BM

CD14538BMT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD14538BM

CD14538BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD14538B

CD14538BPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM538B

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& Green

& Green

& Green

Lead finish/
Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

SNPB N / A for Pkg Type -55 to 125 5962-9055701EA

CD14538BF3A

SNPB N / A for Pkg Type -55 to 125 CD14538BF

SNPB N / A for Pkg Type -55 to 125 5962-9055701EA

CD14538BF3A

13-Aug-2021

Samples

(4/5)

CD14538BPWG4 ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM538B

CD14538BPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM538B

CD14538BPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM538B

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

13-Aug-2021

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

Reel Width (W1)

REEL DIMENSIONS

A0
B0
K0

W

Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

K0 P1

B0

W

A0

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q1

Q1Q2 Q2

Q3 Q3Q4 Q4

User Direction of Feed

P1

Reel

Diameter

www.ti.com 3-Jun-2022

TAPE AND REEL INFORMATION

*All dimensions are nominal

CD14538BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD14538BNSR SO NS 16 2000 330.0 16.4 8.45 10.55 2.5 12.0 16.2 Q1

CD14538BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Device Package

Type

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

TAPE AND REEL BOX DIMENSIONS

Width (mm)

W

L

H

www.ti.com 3-Jun-2022

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD14538BM96 SOIC D 16 2500 340.5 336.1 32.0
CD14538BNSR SO NS 16 2000 356.0 356.0 35.0

CD14538BPWR TSSOP PW 16 2000 356.0 356.0 35.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TUBE

T - Tube

height

W - Tube

width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)

CD14538BE N PDIP 16 25 506 13.97 11230 4.32
CD14538BE N PDIP 16 25 506 13.97 11230 4.32
CD14538BM D SOIC 16 40 507 8 3940 4.32

CD14538BPW PW TSSOP 16 90 530 10.2 3600 3.5

CD14538BPWG4 PW TSSOP 16 90 530 10.2 3600 3.5

L - Tube length

Pack Materials-Page 3

PACKAGE OUTLINE

A

5.1

4.9

NOTE 3

SCALE 2.500

TSSOP - 1.2 mm max heightPW0016A

SMALL OUTLINE PACKAGE

SEATING

6.6

TYP

6.2
PIN 1 INDEX AREA

1

8

B

4.5

4.3

NOTE 4

16

9

14X 0.65

2X

4.55

0.30

16X

0.19

0.1 C A B

C

1.2 MAX

PLANE

0.1 C

(0.15) TYP

SEE DETAIL A

GAGE PLANE

0.25

0.75

-80

0.50

A 20

DETAIL A

TYPICAL

4220204/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-153.

0.15

0.05

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EXAMPLE BOARD LAYOUT

TSSOP - 1.2 mm max heightPW0016A

SMALL OUTLINE PACKAGE

16X (0.45)

14X (0.65)

1

8

16X (1.5)

SYMM

(R0.05) TYP

16

SYMM

9

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 10X

SOLDER MASK

OPENING

EXPOSED METAL

0.05 MAX
ALL AROUND

NON-SOLDER MASK

DEFINED

(PREFERRED)

METAL

15.000

SOLDER MASK DETAILS

METAL UNDER
SOLDER MASK

0.05 MIN
ALL AROUND

SOLDER MASK

DEFINED

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SOLDER MASK
OPENING

EXPOSED METAL

4220204/A 02/2017

www.ti.com

EXAMPLE STENCIL DESIGN

TSSOP - 1.2 mm max heightPW0016A

SMALL OUTLINE PACKAGE

16X (0.45)

14X (0.65)

1

8

16X (1.5)

SYMM

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

(R0.05) TYP

16

SYMM

9

4220204/A 02/2017

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

PACKAGE OUTLINE

A

10.4

10.0

NOTE 3

SCALE 1.500

8.2

TYP

7.4
PIN 1 ID

AREA

1

8

B

5.4

5.2

NOTE 4

9

16

14X 1.27

2X

8.89

0.51

16X

0.35

0.25 C A B

SOP - 2.00 mm max heightNS0016A

SOP

C

SEATING PLANE

0.1 C

2.00 MAX

0.15 TYP

SEE DETAIL A

GAGE PLANE

0 - 10

0.25

1.05

0.55
(1.25)

0.3

0.1

DETAIL A

TYPICAL

4220735/A 12/2021

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

www.ti.com

EXAMPLE BOARD LAYOUT

SOP - 2.00 mm max heightNS0016A

SOP

16X (1.85)

16X (0.6)

14X (1.27)

(R0.05) TYP

SYMM

1

8

(7)

SEE
DETAILS

16

SYMM

9

LAND PATTERN EXAMPLE

SCALE:7X

METAL

0.07 MAX
ALL AROUND

NON SOLDER MASK

DEFINED

SOLDER MASK
OPENING

SOLDER MASK

OPENING

0.07 MIN
ALL AROUND

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

4220735/A 12/2021

www.ti.com

EXAMPLE STENCIL DESIGN

SOP - 2.00 mm max heightNS0016A

SOP

16X (1.85)

16X (0.6)

14X (1.27)

(R0.05) TYP

SYMM

1

8

(7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:7X

16

SYMM

9

4220735/A 12/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

8. Board assembly site may have different recommendations for stencil design.

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