Datasheet CC2650MODA Datasheet (Texas Instruments)

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CC2650MODA SimpleLink™ Bluetooth®low energy Wireless MCU Module

1 Device Overview

1.1 Features

• Microcontroller – Powerful ARM®Cortex®-M3 – EEMBC CoreMark®Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultra-Low-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air (OTA) Upgrade

• Ultra-Low-Power Sensor Controller – Can Run Autonomous From the Rest of the

System – 16-Bit Architecture – 2KB of Ultra-Low-Leakage SRAM for

Code and Data

• Efficient Code Size Architecture, Placing Drivers,

Bluetooth®low energy Controller, IEEE®802.15.4

Medium Access Control (MAC), and Bootloader in ROM

• Integrated Antenna

• Peripherals – All Digital Peripheral Pins Can Be Routed to

Any GPIO

– Four General-Purpose Timer Modules

(8 × 16-Bit or 4 × 32-Bit Timer, PWM Each)

– 12-Bit ADC, 200-ksamples/s, 8-Channel

Analog MUX – Continuous Time Comparator – Ultra-Low-Power Analog Comparator – Programmable Current Source – UART – 2 × SSI (SPI, MICROWIRE, TI) – I2C – I2S – Real-Time Clock (RTC) – AES-128 Security Module – True Random Number Generator (TRNG) – 15 GPIOs – Support for Eight Capacitive Sensing Buttons – Integrated Temperature Sensor

• External System – On-Chip Internal DC-DC Converter – No External Components Needed, Only Supply

Voltage

CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

• Low Power – Wide Supply Voltage Range

– Operation from 1.8 to 3.8 V – Active-Mode RX: 6.2 mA – Active-Mode TX at 0 dBm: 6.8 mA – Active-Mode TX at +5 dBm: 9.4 mA – Active-Mode MCU: 61 µA/MHz – Active-Mode MCU: 48.5 CoreMark/mA – Active-Mode Sensor Controller:

0.4 mA + 8.2 µA/MHz

– Standby: 1 µA (RTC Running and RAM/CPU

Retention) – Shutdown: 100 nA (Wake Up on External

Events)

• RF Section – 2.4-GHz RF Transceiver Compatible With

Bluetooth low energy (BLE) 5.1 Specification and IEEE 802.15.4 PHY and MAC

– CC2650MODA RF-PHY Qualified (QDID:

88415)

– Excellent Receiver Sensitivity (–97 dBm for

Bluetooth low energy and –100 dBm for

802.15.4), Selectivity, and Blocking

Performance – Programmable Output Power up to +5 dBm – Pre-certified for Compliance With Worldwide

Radio Frequency Regulations

– ETSI RED (Europe)

– IC (Canada)

– FCC (USA)

– ARIB STD-T66 (Japan)

– JATE (Japan)

• Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF

Configurations – Packet Sniffer PC Software – Sensor Controller Studio – SmartRF™ Studio – SmartRF Flash Programmer 2 – IAR Embedded Workbench®for ARM – Code Composer Studio™

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

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CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

1.2 Applications

• Building Automation

• Medical and Health

• Appliances

• Industrial

• Consumer Electronics

1.3 Description

The SimpleLink™ CC2650MODA device is a wireless microcontroller (MCU) module that targets

Bluetooth®low energy applications. The CC2650MODA device can also run ZigBee®and 6LoWPAN and

ZigBee RF4CE™ remote control applications. The module is based on the SimpleLink CC2650 wireless MCU, a member of the CC26xx family of cost-

effective, ultra-low-power, 2.4-GHz RF devices. Very-low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin-cell batteries and in energy-harvesting applications.

The CC2650MODA module contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. This sensor controller is good for interfacing with external sensors or for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2650MODA device is good for applications within a wide range of products including industrial, consumer electronics, and medical devices.

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• Proximity Tags

• Alarm and Security

• Remote Controls

• Wireless Sensor Networks

The CC2650MODA module is pre-certified for operation under the regulations of the FCC, IC, ETSI, and ARIB. These certifications save significant cost and effort for customers when integrating the module into their products.

The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly running on a separate ARM®Cortex®-M0 processor. This architecture improves overall system performance and power consumption and makes more flash memory available.

The Bluetooth low energy software stack (BLE-Stack) and the ZigBee software stack ( Z-Stack™) are available free of charge.

Device Information

PART NUMBER PACKAGE BODY SIZE

CC2650MODAMOH MOH (Module) 16.90 mm × 11.00 mm

(1) For more information, see Section 10.

(1)

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Main CPU

128-KB

Flash

Sensor Controller

cJTAG

20-KB SRAM

ROM

ARM

Cortex-M3

DC-DC Converter

RF core

ARM

Cortex-M0

DSP Modem

4-KB

SRAM

ROM

Sensor Controller Engine

2× Analog Comparators

12-bit ADC, 200 ks/s

Constant Current Source

SPI / I2C Digital Sensor IF

2-KB SRAM

Time-to-Digital Converter

General Peripherals / Modules

4× 32-bit Timers

2× SSI (SPI, µWire, TI)

Watchdog Timer

Temp. / Batt. Monitor

RTC

I2C

UART

I2S

15 GPIOs

AES

32 ch. µDMA

ADC ADC

Digital PLL

SimpleLink CC2650MODA Wireless MCU Module

TRNG

8-KB

Cache

24-MHz Crystal

Oscillator

32.768-kHz Crystal

Oscillator

RF Balun

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1.4 Functional Block Diagram

Figure 1-1 is a block diagram for the CC2650MODA device.

CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

Figure 1-1. CC2650MODA Block Diagram

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1 Device Overview ......................................... 1

1.1 Features .............................................. 1

1.2 Applications........................................... 2

1.3 Description............................................ 2

1.4 Functional Block Diagram ............................ 3

2 Revision History ......................................... 5

3 Device Comparison ..................................... 6

3.1 Related Products ..................................... 6

4 Terminal Configuration and Functions.............. 7

4.1 Module Pin Diagram.................................. 7

4.2 Pin Functions ......................................... 8

5 Specifications ............................................ 9

5.1 Absolute Maximum Ratings .......................... 9

5.2 ESD Ratings.......................................... 9

5.3 Recommended Operating Conditions ................ 9

5.4 Power Consumption Summary...................... 10

5.5 General Characteristics ............................. 10

5.6 Antenna ............................................. 11

5.7 1-Mbps GFSK (Bluetooth low energy) – RX ........ 11

5.8 1-Mbps GFSK (Bluetooth low energy) – TX ........ 12

5.9 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –

RX ................................................... 12

5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –

TX ................................................... 13

5.11 24-MHz Crystal Oscillator (XOSC_HF) ............. 13

5.12 32.768-kHz Crystal Oscillator (XOSC_LF).......... 13

5.13 48-MHz RC Oscillator (RCOSC_HF) ............... 13

5.14 32-kHz RC Oscillator (RCOSC_LF)................. 13

5.15 ADC Characteristics................................. 14

5.16 Temperature Sensor ................................ 15

5.17 Battery Monitor...................................... 15

5.18 Continuous Time Comparator....................... 15

5.19 Low-Power Clocked Comparator ................... 15

5.20 Programmable Current Source ..................... 16

5.21 DC Characteristics .................................. 16

5.22 Thermal Resistance Characteristics for MOH

Package ............................................. 17

5.23 Timing Requirements ............................... 17

5.24 Switching Characteristics ........................... 17

5.25 Typical Characteristics .............................. 20

6 Detailed Description ................................... 24

6.1 Overview ............................................ 24

6.2 Functional Block Diagram........................... 24

6.3 Main CPU ........................................... 25

6.4 RF Core ............................................. 25

6.5 Sensor Controller ................................... 26

6.6 Memory.............................................. 27

6.7 Debug ............................................... 27

6.8 Power Management................................. 28

6.9 Clock Systems ...................................... 29

6.10 General Peripherals and Modules .................. 29

6.11 System Architecture................................. 30

6.12 Certification.......................................... 30

6.13 End Product Labeling ............................... 32

6.14 Manual Information to the End User ................ 32

6.15 Module Marking ..................................... 33

7 Application, Implementation, and Layout ......... 34

7.1 Application Information.............................. 34

7.2 Layout ............................................... 35

8 Environmental Requirements and

Specifications........................................... 36

8.1 PCB Bending........................................ 36

8.2 Handling Environment .............................. 36

8.3 Storage Condition ................................... 36

8.4 Baking Conditions................................... 36

8.5 Soldering and Reflow Condition .................... 37

9 Device and Documentation Support ............... 38

9.1 Device Nomenclature ............................... 38

9.2 Tools and Software ................................. 39

9.3 Documentation Support ............................. 40

9.4 Texas Instruments Low-Power RF Website ........ 40

9.5 Low-Power RF eNewsletter ......................... 40

9.6 Community Resources .............................. 41

9.7 Additional Information ............................... 41

9.8 Trademarks.......................................... 41

9.9 Electrostatic Discharge Caution..................... 42

9.10 Export Control Notice ............................... 42

9.11 Glossary............................................. 42

10 Mechanical, Packaging, and Orderable

Information .............................................. 42

10.1 Packaging Information .............................. 42

10.2 PACKAGE OPTION ADDENDUM .................. 43

10.3 PACKAGE MATERIALS INFORMATION........... 44

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2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from July 1, 2017 to July 31, 2019 Page

• Added Module Marking section. .................................................................................................. 33

• Added Environmental Requirements and Specifications section. ............................................................ 36

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3 Device Comparison

Table 3-1. Device Family Overview

DEVICE PHY SUPPORT FLASH (KB) RAM (KB) GPIO PACKAGE

CC2650MODAMOH Multiprotocol

(1) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.

3.1 Related Products

TI's Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF

solutions suitable for a broad range of applications. The offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol).

TI's SimpleLink™ Sub-1 GHz Wireless MCUs Long-range, low-power wireless connectivity solutions

are offered in a wide range of Sub-1 GHz ISM bands.

Companion Products Review products that are frequently purchased or used in conjunction with this

product.

SimpleLink™ CC2650 Wireless MCU LaunchPad™ Development Kit The CC2650 LaunchPad™

development kit brings easy Bluetooth®low energy connectivity to the LaunchPad kit ecosystem with the SimpleLink ultra-low power CC26xx family of devices. This LaunchPad kit also supports development for multi-protocol support for the SimpleLink multi-standard CC2650 wireless MCU and the rest of CC26xx family of products: CC2630 wireless MCU for ZigBee®/6LoWPAN and CC2640 wireless MCU for Bluetooth low energy.

Reference Designs for CC2650MODA TI Designs Reference Design Library is a robust reference design

library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download designs at

ti.com/tidesigns.

(1)

128 20 15 MOH

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(Exposed GND Pads)

1 2

4 5 6 7 19

21 20

18 17

23 22

10 11 12 13 14 15 16

Antenna

GND DIO 0 DIO 1

DIO 2 DIO 3 DIO 4

JTAG_TMS

VDD VDD

DIO 14 DIO 13 DIO 12 DIO 11 DIO 10

JTAG_TCK

DIO 5/JTAG_TDO

DIO 6/JTAG_TDI

nRESET

DIO 7

DIO 8

DIO 9

8 9

25 24

GND GND

G1 G2

G3 G4

NC NC

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4 Terminal Configuration and Functions

Section 4.1 shows pin assignments for the CC2650MODA device.

4.1 Module Pin Diagram

CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

(1) The following I/O pins marked in bold in the pinout have high-drive capabilities:

• DIO 2

• DIO 3

• DIO 4

• JTAG_TMS

• DIO 5/JTAG_TDO

• DIO 6/JTAG_TDI

(2) The following I/O pins marked in italics in the pinout have analog capabilities:

• DIO 7

• DIO 8

• DIO 9

• DIO 10

• DIO 11

• DIO 12

• DIO 13

• DIO 14

Figure 4-1. CC2650MODA MOH Package

(16.9-mm × 11-mm) Module Pinout

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4.2 Pin Functions

Table 4-1 describes the CC2650MODA pins.

Table 4-1. Signal Descriptions – MOH Package

PIN NAME PIN NO. PIN TYPE DESCRIPTION

DIO_0 4 Digital I/O GPIO, Sensor Controller DIO_1 5 Digital I/O GPIO, Sensor Controller DIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDO DIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDI DIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analog EGP G1, G2, G3, G4 Power Ground – Exposed ground pad GND 1, 3, 25 — Ground JTAG_TCK 10 Digital I/O JTAG TCKC JTAG_TMS 9 Digital I/O JTAG TMSC, high-drive capability NC 2, 24 NC Not Connected—TI recommends leaving these pins floating nRESET 13 Digital input Reset, active low. No internal pullup VDD 22, 23 Power 1.8-V to 3.8-V main chip supply

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

VDD Supply voltage –0.3 4.1 V

Voltage on any digital pin

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

(2) All voltage values are with respect to ground, unless otherwise noted. (3) Including analog capable DIO.

Voltage on ADC input

Input RF level 5 dBm Storage temperature –40 85 °C

stg

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3)

Voltage scaling enabled –0.3 VDD

Voltage scaling disabled, VDD as reference –0.3 VDD / 2.9

5.2 ESD Ratings

Human body model (HBM), per ANSI/ESDA/JEDEC

(1)

ESD

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Electrostatic discharge

JS001

Charged device model (CDM), per JESD22-C101

(1)(2)

MIN MAX UNIT

–0.3 VDD + 0.3, max 4.1 V

VALUE UNIT

All pins ±1000

(2)

RF pins ±500 Non-RF pins ±500

VVoltage scaling disabled, internal reference –0.3 1.49

5.3 Recommended Operating Conditions

MIN MAX UNIT

Ambient temperature –40 85 °C

Operating supply voltage (VDD)

For operation in battery-powered and 3.3-V systems (internal DC-DC can be used to minimize power consumption)

1.8 3.8 V

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5.4 Power Consumption Summary

Tc= 25°C, VDD= 3.0 V with internal DC-DC converter, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Reset. RESET_N pin asserted or VDD below Power-onReset threshold

Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial) register

retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) register

retention. XOSC_LF

core

Core current consumption

Peripheral Current Consumption (Adds to core current I

Peripheral power domain

Serial power domain Delta current with domain enabled 13 RF core

peri

µDMA Delta current with clock enabled, module idle 130 Timers Delta current with clock enabled, module idle 113 I2C Delta current with clock enabled, module idle 12 I2S Delta current with clock enabled, module idle 36 SSI Delta current with clock enabled, module idle 93 UART Delta current with clock enabled, module idle 164

(1) I

is not supported in Standby or Shutdown.

peri

Standby. With Cache, RTC, CPU, RAM and (partial) register retention. RCOSC_LF

Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF

Idle. Supply systems and RAM powered. 550 Active. Core running CoreMark Radio RX 6.2

Radio TX, 5-dBm output power 9.4

for each peripheral unit activated)

core

Delta current with domain enabled 20

Delta current with power domain enabled, clock enabled, RF Core Idle

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100

1.2

2.5

µA

2.7

1.45 mA +

31 µA/MHz

mARadio TX, 0-dBm output power 6.8

(1)

237

µA

5.5 General Characteristics

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

FLASH MEMORY

Supported flash erase cycles before failure

Flash page/sector erase current Average delta current 12.6 mA Flash page/sector erase time

(1)

Flash page/sector size 4 KB Flash write current Average delta current, 4 bytes at a time 8.15 mA Flash write time

(1)

4 bytes at a time 8 µs

(1) This number is dependent on flash aging and will increase over time and erase cycles.

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100 k Cycles

8 ms

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5.6 Antenna

Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Polarization Linear Peak Gain 2450 MHz 1.26 dBi Efficiency 2450 MHz 57%

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity BER = 10 Receiver saturation BER = 10

Frequency error tolerance

Difference between center frequency of the received RF signal and local oscillator frequency.

Data rate error tolerance –750 750 ppm Co-channel rejection

Selectivity, ±1 MHz

Selectivity, ±2 MHz

Selectivity, ±3 MHz

Selectivity, ±4 MHz

(1)

Selectivity, ±5 MHz or more

Selectivity, Image frequency Selectivity,

Image frequency ±1 MHz Out-of-band blocking

(3)

Wanted signal at –67 dBm, modulated interferer in channel, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz,

(1)

BER = 10 Wanted signal at –67 dBm, modulated interferer at image

(1)

frequency, BER = 10 Wanted signal at –67 dBm, modulated interferer at ±1 MHz from

(1)

image frequency, BER = 10

30 MHz to 2000 MHz –20 dBm Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm

Intermodulation

Spurious emissions, 30 MHz to 1000 MHz

Spurious emissions, 1 GHz to 12.75 GHz

Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405

and 2408 MHz respectively, at the given power level

Conducted measurement in a 50-Ω single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440

class 2, FCC CFR47, Part 15 and ARIB STD-T-66

Conducted measurement in a 50-Ω single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440

class 2, FCC CFR47, Part 15 and ARIB STD-T-66 RSSI dynamic range 70 dB RSSI accuracy ±4 dB

(1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz (3) Excluding one exception at F

wanted

–3 –3

–3

/ 2, per Bluetooth Specification

–97 dBm

4 dBm

–350 350 kHz

–6 dB

(2)

7 / 3

(2)

29 / 23

(2)

38 / 26

(2)

42 / 29

32 dB

23 dB

(2)

3 / 26

–34 dBm

–71 dBm

–62 dBm

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5.8 1-Mbps GFSK (Bluetooth low energy) – TX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting 5 dBm Output power, lowest setting –21 dBm

f < 1 GHz, outside restricted bands –43

Spurious emission conducted measurement

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

(1)

f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45

dBm

5.9 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity PER = 1% –100 dBm Receiver saturation PER = 1% –7 dBm

Adjacent channel rejection

Alternate channel rejection

Channel rejection, ±15 MHz or more

Blocking and desensitization, 5 MHz from upper band edge

Blocking and desensitization, 10 MHz from upper band edge

Blocking and desensitization, 20 MHz from upper band edge

Blocking and desensitization, 50 MHz from upper band edge

Blocking and desensitization, –5 MHz from lower band edge

Blocking and desensitization, –10 MHz from lower band edge

Blocking and desensitization, –20 MHz from lower band edge

Blocking and desensitization, –50 MHz from lower band edge

Spurious emissions, 30 MHz to 1000 MHz

Spurious emissions, 1 GHz to 12.75 GHz

Frequency error tolerance RSSI dynamic range 100 dB

RSSI accuracy ±4 dB

Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1%

Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1%

Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1%

Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%

Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66

Difference between center frequency of the received RF signal and local oscillator frequency

35 dB

52 dB

57 dB

64 dB

65 dB

68 dB

63 dB

65 dB

67 dB

–71 dBm

–62 dBm

>200 ppm

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5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting 5 dBm Output power, lowest setting –21 dBm Error vector magnitude At maximum output power 2%

f < 1 GHz, outside restricted bands –43

Spurious emission conducted measurement

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

(1)

f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45

dBm

5.11 24-MHz Crystal Oscillator (XOSC_HF)

(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 24 MHz Crystal frequency tolerance Start-up time

(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. (2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per

Bluetooth and IEEE 802.15.4 specification

(3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection

(3)

(2)

–40 40 ppm

150 µs

5.12 32.768-kHz Crystal Oscillator (XOSC_LF)

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 32.768 kHz Initial crystal frequency tolerance, Bluetooth

low energy applications Crystal aging -3 3 ppm/year

Tc= 25°C

–20 20 ppm

5.13 48-MHz RC Oscillator (RCOSC_HF)

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Frequency 48 MHz Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy Start-up time 5 µs

(1) Accuracy relatively to the calibration source (XOSC_HF).

(1)

±0.25%

5.14 32-kHz RC Oscillator (RCOSC_LF)

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Calibrated frequency 32.8 kHz Temperature coefficient 50 ppm/°C

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SWRS187D –AUGUST 2016–REVISED JULY 2019

5.15 ADC Characteristics

Tc= 25°C, VDD= 3.0 V and voltage scaling enabled, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4.3-V equivalent reference Gain error Internal 4.3-V equivalent reference

(3)

DNL INL

(4)

Differential nonlinearity >–1 LSB Integral nonlinearity ±3 LSB

Internal 4.3-V equivalent reference

9.6-kHz input tone

ENOB Effective number of bits

Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference

9.6-kHz input tone

THD

Total harmonic distortion

Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference

9.6-kHz input tone SINAD and SNDR

Signal-to-noise and distortion ratio

Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference

9.6-kHz input tone SFDR

Spurious-free dynamic range

Internal 1.44-V reference, voltage scaling disabled, 32

samples average, 200 ksps, 300-Hz input tone Conversion time Serial conversion, time-to-output, 24-MHz clock 50 Current consumption Internal 4.3-V equivalent reference

Current consumption VDD as reference 0.75 mA

Equivalent fixed internal reference (input voltage

scaling enabled). For best accuracy, the ADC Reference voltage

conversion should be initiated through the TI-RTOS™

API to include the gain or offset compensation factors

stored in FCFG1.

Fixed internal reference (input voltage scaling

disabled). For best accuracy, the ADC conversion Reference voltage

should be initiated through the TI-RTOS API to include

the gain or offset compensation factors stored in

FCFG1. This value is derived from the scaled value

Reference voltage

(4.3 V) as follows: V

VDD as reference (Also known as RELATIVE) (input

voltage scaling enabled)

VDD as reference (Also known as RELATIVE) (input

voltage scaling disabled)

= 4.3 V × 1408 / 4095

ref

200 ksps, voltage scaling enabled. Capacitive input, Input Impedance

input impedance depends on sampling frequency and

sampling time

(1) Using IEEE Std 1241™-2010 for terminology and test methods. (2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24. (4) For a typical example, see Figure 5-25. (5) Applied voltage must be within absolute maximum ratings (see Section 5.1) at all times.

(2) (2)

(2)

, 200 ksps,

(2)

, 200 ksps,

(2)

, 200 ksps,

(2)

, 200 ksps,

(2)

(1)

4.3

VDD V

VDD / 2.82

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2 LSB

2.4 LSB

9.8 BitsVDD as reference, 200 ksps, 9.6-kHz input tone 10

11.1

–65

dBVDD as reference, 200 ksps, 9.6-kHz input tone –69

–71

dBVDD as reference, 200 ksps, 9.6-kHz input tone 63

dBVDD as reference, 200 ksps, 9.6-kHz input tone 72

clockcycles

0.66 mA

(2)(5)

1.48 V

(5)

>1 MΩ

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5.16 Temperature Sensor

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Resolution 4 °C Range –40 85 °C Accuracy ±5 °C Supply voltage coefficient

(1) Automatically compensated when using supplied driver libraries.

(1)

3.2 °C/V

5.17 Battery Monitor

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Resolution 50 mV Range 1.8 3.8 V Accuracy 13 mV

5.18 Continuous Time Comparator

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 V External reference voltage 0 V Internal reference voltage DCOUPL as reference 1.27 V Offset 3 mV Hysteresis <2 mV Decision time Step from –10 mV to +10 mV 0.72 µs Current consumption when enabled

(1) Additionally, the bias module must be enabled when running in standby mode.

(1)

8.6 µA

DD DD

V V

5.19 Low-Power Clocked Comparator

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 VDD V Clock frequency 32 kHz Internal reference voltage, VDD / 2 1.49–1.51 V Internal reference voltage, VDD / 3 1.01–1.03 V Internal reference voltage, VDD / 4 0.78–0.79 V Internal reference voltage, DCOUPL / 1 1.25–1.28 V Internal reference voltage, DCOUPL / 2 0.63–0.65 V Internal reference voltage, DCOUPL / 3 0.42–0.44 V Internal reference voltage, DCOUPL / 4 0.33–0.34 V Offset <2 mV Hysteresis <5 mV Decision time Step from –50 mV to +50 mV <1 clock-cycle Current consumption when enabled 362 nA

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5.20 Programmable Current Source

Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Current source programmable output range 0.25–20 µA Resolution 0.25 µA

Current consumption

(1) Additionally, the bias module must be enabled when running in standby mode.

(1)

Including current source at maximum programmable output

23 µA

5.21 DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

TA= 25°C, VDD= 1.8 V

GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 1.32 1.54 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.26 0.32 V GPIO VOH at 4-mA load IOCURR = 1 1.32 1.58 V GPIO VOL at 4-mA load IOCURR = 1 0.21 0.32 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 71.7 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDD 21.1 µA GPIO high/low input transition,

no hysteresis GPIO low-to-high input transition,

with hysteresis GPIO high-to-low input transition,

with hysteresis GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.33 V

TA= 25°C, VDD= 3.0 V

GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 V GPIO VOH at 4-mA load IOCURR = 1 2.72 V GPIO VOL at 4-mA load IOCURR = 1 0.28 V

TA= 25°C, VDD= 3.8 V

GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDD 113 µA GPIO high/low input transition,

no hysteresis GPIO low-to-high input transition,

with hysteresis GPIO high-to-low input transition,

with hysteresis GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.4 V

TA= 25°C

VIH

VIL

IH = 0, transition between reading 0 and reading 1 0.88 V

IH = 1, transition voltage for input read as 0 → 1 1.07 V

IH = 1, transition voltage for input read as 1 → 0 0.74 V

IH = 0, transition between reading 0 and reading 1 1.67 V

IH = 1, transition voltage for input read as 0 → 1 1.94 V

IH = 1, transition voltage for input read as 1 → 0 1.54 V

Lowest GPIO input voltage reliably interpreted as a «High»

Highest GPIO input voltage reliably interpreted as a «Low»

0.2 VDD

0.8 VDD

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5.22 Thermal Resistance Characteristics for MOH Package

NAME DESCRIPTION °C/W

RΘ RΘ RΘ RΘ Psi Psi

JC JB JA JMA JT JB

Junction-to-case 20.0 Junction-to-board 15.3 Junction-to-free air 29.6 0 Junction-to-moving air 25.0 1 Junction-to-package top 8.8 0 Junction-to-board 14.8 0

(1) °C/W = degrees Celsius per watt. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(3) m/s = meters per second.

(1) (2)

AIR FLOW (m/s)

5.23 Timing Requirements

MIN NOM MAX UNIT

Rising supply-voltage slew rate 0 100 mV/µs Falling supply-voltage slew rate 0 20 mV/µs Falling supply-voltage slew rate, with low-power flash settings

Positive temperature gradient in standby

CONTROL INPUT AC CHARACTERISTICS

(2)

(3)

RESET_N low duration 1 µs

SYNCHRONOUS SERIAL INTERFACE (SSI)

S1 (SLAVE)

(5)

clk_per

clk_high

clk_low

(4)

(1) For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDD input capacitor (see

Section 7.1.1) must be used to ensure compliance with this slew rate.

(2) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see

Section 5.14).

(3) TA= –40°C to +85°C, VDD= 1.7 V to 3.8 V, unless otherwise noted. (4) Tc= 25°C, VDD= 3.0 V, unless otherwise noted. Device operating as slave. For SSI master operation, see Section 5.24. (5) Refer to the SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.

(1)

No limitation for negative temperature gradient, or outside standby mode

SSIClk period 12 65024 SSIClk high time 0.5 t

SSIClk low time 0.5 t

3 mV/µs

5 °C/s

System

clocks

clk_per clk_per

(3)

5.24 Switching Characteristics

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

WAKEUP AND TIMING

Idle → Active 14 µs Standby → Active 151 µs Shutdown → Active 1015 µs

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SSIClk

SSIFss

SSITx

SSIRx

MSB LSB

8-bit control

4 to 16 bits output data

SSIClk

SSIFss

SSITx SSIRx

MSB LSB

4 to 16 bits

CC2650MODA

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Switching Characteristics (continued)

Measured on the TI CC2650EM-5XD reference design with Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SYNCHRONOUS SERIAL INTERFACE (SSI)

S1 (TX only)

S1 (TX and RX)

(2)

(1) Device operating as master. For SSI slave operation, see Section 5.23. (2) Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.

(2)

(SSIClk period) One-way communication to SLAVE 4 65024

clk_per

(2)

(SSIClk period) Normal duplex operation 8 65024

clk_per

(SSIClk high time) 0.5 t

clk_high

(SSIClk low time) 0.5 t

clk_low

(1)

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System

clocks

System

clocks

clk_per clk_per

Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement

Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer

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SSIClk

(SPO = 1)

SSITx

(Master)

SSIRx

(Slave)

LSB

SSIClk

(SPO = 0)

SSIFss

LSB

MSB

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Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1

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Frequency (MHz)

Sensitivity Level (dBm)

2400 2410 2420 2430 2440 2450 2460 2470 2480

-101

-100

-99

-98

-97

-96

-95

D008

Sensitivity

Frequency (MHz)

Sensitivity Level (dBm)

2400 2410 2420 2430 2440 2450 2460 2470 2480

-99

-98.5

-98

-97.5

-97

-96.5

-96

-95.5

-95

D009

Sensitivity

VDDS (V)

Sensitivity (dBm)

1.8 2.3 2.8 3.3 3.8

-101

-100

-99

-98

-97

-96

-95

D006

BLE Sensitivity

VDDS (V)

Sensitivity (dBm)

1.9 2.4 2.9 3.4 3.8

-101

-100

-99

-98

-97

-96

-95

D007

IEEE 802.15.4 Sensitivity

Temperature (qC)

Sensitivity (dBm)

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

-99

-98

-97

-96

-95

-94

-93

D004

Sensitivity

Temperature (qC)

Sensitivity (dBm)

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

-103

-102

-101

-100

-99

-98

-97

-96

-95

D005

Sensitivity

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5.25 Typical Characteristics

This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a single-ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C and VDD= 3.0 V, unless otherwise noted.

Figure 5-4. Bluetooth low energy Sensitivity vs Temperature

Figure 5-6. Bluetooth low energy Sensitivity

vs Supply Voltage (VDD)

Figure 5-5. IEEE 802.15.4 Sensitivity vs Temperature

Figure 5-7. IEEE 802.15.4 Sensitivity

vs Supply Voltage (VDD)

Figure 5-8. IEEE 802.15.4 Sensitivity

vs Channel Frequency

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Figure 5-9. Bluetooth low energy Sensitivity

vs Channel Frequency

Page 21

Voltage (V)

Current Consumption (mA)

1.75 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5

4.5

5.5

6.5

7.5

8.5

9.5

10.5

D014

Temperature (qC)

RX Current (mA)

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

5.5

5.6

5.7

5.8

5.9

6.1

6.2

6.3

6.4

6.5

6.6

6.7

6.8

6.9

D015

RX Current

Frequency (MHz)

Output Power (dBm)

2400 2410 2420 2430 2440 2450 2460 2470 2480

-1

D012

5-dBm setting

VDDS (V)

TX Current (mA)

1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8

D013

5-dBm Setting

Temperature (qC)

Output Power (dBm)

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

D010

5-dBm Setting

VDDS (V)

Output power (dBm)

1.8 2.3 2.8 3.3 3.8

D011

5-dBm Setting

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Typical Characteristics (continued)

Figure 5-10. TX Output Power vs Temperature Figure 5-11. TX Output Power vs Supply Voltage (VDD)

Figure 5-12. TX Output Power

vs Channel Frequency

Figure 5-14. RX Mode Current vs Supply Voltage (VDD) Figure 5-15. RX Mode Current Consumption vs Temperature

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Figure 5-13. TX Current Consumption

vs Supply Voltage (VDD)

Page 22

Input Frequency (Hz)

Effective Number of Bits

200300 500 1000 2000 5000 10000 20000 100000

9.4

9.6

9.8

10.2

10.4

10.6

10.8

11.2

11.4

D009

Fs= 200 kHz, No Averaging Fs= 200 kHz, 32 samples averaging

VDDS (V)

ADC Code

1.8 2.3 2.8 3.3 3.8

1004.8

1005

1005.2

1005.4

1005.6

1005.8

1006

1006.2

1006.4

D012

VDDS (V)

Current Consumption (mA)

1.8 2.3 2.8 3.3 3.8

2.5

3.5

4.5

D007

Active Mode Current

Temperature (qC)

Current (uA)

-20 -10 0 10 20 30 40 50 60 70 80

0.5

1.5

2.5

3.5

D008

Standby Mode Current

Temperature (qC)

Active Mode Current Consumpstion (mA)

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

2.85

2.9

2.95

3.05

3.1

D006

Active Mode Current

Temperature (qC)

TX Current (mA)

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

D016

5-dBm Setting

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Typical Characteristics (continued)

Figure 5-16. TX Mode Current Consumption vs Temperature

Figure 5-18. Active Mode (MCU Running, No Peripherals)

Current Consumption vs Supply Voltage (VDD)

Figure 5-17. Active Mode (MCU Running, No Peripherals)

Current Consumption vs Temperature

Figure 5-19. Standby Mode Current Consumption

With RCOSC RTC vs Temperature

Figure 5-20. SoC ADC Effective Number of Bits vs Input

Frequency (Internal Reference)

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Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input,

Internal Reference)

Page 23

ADC Code

INL

0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200

-4

-3

-2

-1

D011

ADC Code

DNL

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

2400

2600

2800

3000

3200

3400

3600

3800

4000

4200

-1.5

-1

-0.5

0.5

1.5

2.5

3.5

D010

Temperature (qC)

ADC Code

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80

1004.5

1005

1005.5

1006

1006.5

1007

1007.5

D013

Sampling Frequency (Hz)

ENOB

9.6

9.7

9.8

9.9

10.1

10.2

10.3

10.4

10.5

1k 10k 100k 200k

D009A

ENOB Internal Reference (No Averaging) ENOB Internal Reference (32 Samples Averaging)

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Typical Characteristics (continued)

Figure 5-22. SoC ADC Output vs Temperature (Fixed Input,

Internal Reference)

Figure 5-24. SoC ADC DNL vs ADC Code (Internal Reference)

Figure 5-23. SoC ADC ENOB vs Sampling Frequency

(Input Frequency = FS / 10)

Figure 5-25. SoC ADC INL vs ADC Code (Internal Reference)

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Main CPU

128-KB

Flash

Sensor Controller

cJTAG

20-KB SRAM

ROM

ARM

Cortex-M3

DC-DC Converter

RF core

ARM

Cortex-M0

DSP Modem

4-KB

SRAM

ROM

Sensor Controller Engine

2× Analog Comparators

12-bit ADC, 200 ks/s

Constant Current Source

SPI / I2C Digital Sensor IF

2-KB SRAM

Time-to-Digital Converter

General Peripherals / Modules

4× 32-bit Timers

2× SSI (SPI, µWire, TI)

Watchdog Timer

Temp. / Batt. Monitor

RTC

I2C

UART

I2S

15 GPIOs

AES

32 ch. µDMA

ADC ADC

Digital PLL

SimpleLink CC2650MODA Wireless MCU Module

TRNG

8-KB

Cache

24-MHz Crystal

Oscillator

32.768-kHz Crystal

Oscillator

RF Balun

CC2650MODA

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6 Detailed Description

6.1 Overview

Figure 6-1 shows the core modules of the CC2650MODA device.

6.2 Functional Block Diagram

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Figure 6-1. CC2650MODA Functional Block Diagram

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6.3 Main CPU

The SimpleLink CC2650MODA wireless MCU contains an ARM Cortex-M3 32-bit CPU, which runs the application and the higher layers of the protocol stack.

The Cortex-M3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts.

Cortex-M3 features include:

• 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications

• Outstanding processing performance combined with fast interrupt handling

• ARM Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications:

– Single-cycle multiply instruction and hardware divide – Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral

control

– Unaligned data access, enabling data to be efficiently packed into memory

• Fast code execution permits slower processor clock or increases sleep mode time

• Harvard architecture characterized by separate buses for instruction and data

• Efficient processor core, system, and memories

• Hardware division and fast digital-signal-processing oriented multiply accumulate

• Saturating arithmetic for signal processing

• Deterministic, high-performance interrupt handling for time-critical applications

• Enhanced system debug with extensive breakpoint and trace capabilities

• Serial wire trace reduces the number of pins required for debugging and tracing

• Migration from the ARM7™ processor family for better performance and power efficiency

• Optimized for single-cycle flash memory use

• Ultra-low-power consumption with integrated sleep modes

• 1.25 DMIPS per MHz

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6.4 RF Core

The RF core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core offers a high-level, command-based API to the main CPU.

The RF core can autonomously handle the time-critical aspects of the radio protocols (802.15.4 RF4CE and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources for the user application.

The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM Cortex-M0 processor is not programmable by customers.

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6.5 Sensor Controller

The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main Cortex-M3 CPU.

The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and typical use cases may be (but are not limited to):

• Analog sensors using integrated ADC

• Digital sensors using GPIOs and bit-banged I2C or SPI

• UART communication for sensor reading or debugging

• Capacitive sensing

• Waveform generation

• Pulse counting

• Keyboard scan

• Quadrature decoder for polling rotation sensors

• Oscillator calibration

The peripherals in the Sensor Controller include the following:

• The low-power clocked comparator can be used to wake the device from any state in which the comparator is active. A configurable internal reference can be used with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC.

• Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline tracking, hysteresis, filtering and other related functions.

• The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources, including timers, I/O pins, software, the analog comparator, and the RTC.

• The Sensor Controller also includes a SPI/I2C digital interface.

• The analog modules can be connected to up to eight different GPIOs.

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The peripherals in the Sensor Controller can also be controlled from the main application processor.

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Table 6-1 lists the GPIOs that are connected to the Sensor Controller.

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6.6 Memory

The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable.

The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8KB of cache can be used as a general-purpose RAM.

Table 6-1. GPIOs Connected to the Sensor Controller

ANALOG CAPABLE 16.9 × 11 MOH DIO NUMBER

Y 14 Y 13 Y 12 Y 11 Y 9 Y 10 Y 8

Y 7 N 4 N 3 N 2 N 1 N 0

(1) Up to 13 pins can be connected to the Sensor Controller. Up to eight

of these pins can be connected to analog modules

(1)

The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stack software (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader that can be used to reprogram the device using SPI or UART.

6.7 Debug

The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface.

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SWRS187D –AUGUST 2016–REVISED JULY 2019

6.8 Power Management

To minimize power consumption, the CC2650MODA device supports a number of power modes and power-management features (see Table 6-2).

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Table 6-2. Power Modes

MODE

CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On On Off Off Radio Available Available Off Off Off Supply System On On Duty Cycled Off Off

Current 1.45 mA + 31 µA/MHz 550 µA 1 µA 0.15 µA 0.1 µA Wake-up time to CPU active Register retention Full Full Partial No No SRAM retention Full Full Full No No

High-speed clock

Low-speed clock Peripherals Available Available Off Off Off

Sensor Controller Available Available Available Off Off Wake up on RTC Available Available Available Off Off Wake up on pin edge Available Available Available Available Off Wake up on reset pin Available Available Available Available Available Brown Out Detector (BOD) Active Active Duty Cycled Power On Reset (POR) Active Active Active Active N/A

(1) Not including RTOS overhead (2) The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold

between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releases it. To avoid this, TI recommends that STANDBY mode is avoided if there is a risk that the supply voltage (VDD) may drop below the specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a battery replacement, triggers a Power-on-reset by ensuring that the VDD decoupling network is fully depleted before applying supply voltage again (for example, inserting new batteries).

(1)

ACTIVE IDLE STANDBY SHUTDOWN

XOSC_HF or

RCOSC_HF

XOSC_LF or

RCOSC_LF

SOFTWARE-CONFIGURABLE POWER MODES

– 14 µs 151 µs 1015 µs 1015 µs

XOSC_HF or

RCOSC_HF

XOSC_LF or

RCOSC_LF

Off Off Off

XOSC_LF or

RCOSC_LF

(2)

Off Off

Off N/A

RESET PIN

HELD

In active mode, the application Cortex-M3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 6-2).

In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into active mode.

In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode.

In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller. The I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. The CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the flash memory contents.

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The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU, which means that the main CPU does not have to wake up, for example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the sensor controller and choose which peripherals are controlled and which conditions wake up the main CPU.

6.9 Clock Systems

The CC2650MODA device supports two external and two internal clock sources. A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to

create a 48-MHz clock. The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than

±500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal 32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal oscillator is designed for use with a 32-kHz watch-type crystal.

The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem. The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal

oscillator is not used.

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The 32-kHz clock source can be used as external clocking reference through GPIO.

6.10 General Peripherals and Modules

The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high-drive capabilities (marked in bold in Section 4).

The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.

The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps.

Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.

Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0. In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF

timer can be synchronized to the RTC. The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface

is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave. The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,

initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.

The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached.

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The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data transfer tasks from the Cortex-M3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list):

• Highly flexible and configurable channel operation of up to 32 channels

• Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-toperipheral

• Data sizes of 8, 16, and 32 bits

The AON domain contains circuitry that is always enabled, except in Shutdown mode (where the digital supply is off). This circuitry includes the following:

• The RTC can be used to wake the device from any state where it is active. The RTC contains three compare and one capture registers. With software support, the RTC can be used for clock and calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used instead of a crystal.

• The battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse temperature measure.

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6.11 System Architecture

Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-Chip (SoC), with the application and protocol stack running on the ARM Cortex-M3 core inside the device.

In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack.

6.12 Certification

The CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable).

Table 6-3. CC2650MODA List of Certifications

REGULATORY BODY SPECIFICATION ID (IF APPLICABLE)

FCC (USA)

IC (Canada)

ETSI/CE (Europe)

Japan MIC

Part 15C:2015 + MPE FCC 1.1307 RF Exposure (Bluetooth) Part 15C:2015 + MPE FCC 1.1307 RF Exposure (802.15.4) RSS-102 (MPE) and RSS-247 (Bluetooth) RSS-102 (MPE) and RSS-247 (IEEE 802.15.4) EN 300 328 V2.1.1 (Bluetooth) EN 300 328 V2.1.1 (802.15.4) EN 62479:2010 (MPE) Draft EN 301 489-1 V2.2.0 (2017-03) Draft EN 301 489-1 V3.2.0 (2017-03) EN 55024:2010 + A1:2015 EN 55032:2015 + AC:2016-07 EN 60950-1:2006/A11:2009/A1:2010/A12:2011/A2:2013 ARIB STD-T66 No: 201-160413/00 JATE D 16 0093 201/00

FCC ID: ZAT26M1

ID: 451H-26M1

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6.12.1 Regulatory Information Europe

Hereby, Texas Instruments Inc. declares that the radio equipment type CC2650MODA is in compliance with Directive 2014/53/EU.

The full text of the EU Declaration of Conformity (DoC) is available on the CC2650MODA technical

documents page. The compliance has been verified in the operating frequency band of 2400 MHz to

2483.5 MHz. Developers and integrators that incorporate the CC2650MODA RF Module in any end

products are responsible for obtaining applicable regulatory approvals for such end product.

NOTE

The CC2650MODA has been tested in the 2400-GHz to 2483.5-GHz ISM frequency band at

3.3 V with a maximum peak power of 5.056-dBm EIRP across the temperature range –40°C to +85°C and tolerance.

6.12.2 Federal Communications Commission Statement

You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference and

2. This device must accept any interference received, including interference that may cause undesired operation of the device.

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FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating with any other antenna or transmitter.

6.12.3 Canada, Industry Canada (IC)

This device complies with Industry Canada licence-exempt RSS standards.

Operation is subject to the following two conditions:

1. This device may not cause interference, and

2. This device must accept any interference, including interference that may cause undesired operation of the device

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence

L'exploitation est autorisée aux deux conditions suivantes:

1. l'appareil ne doit pas produire de brouillage, et

2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

IC RF Radiation Exposure Statement:

To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.

Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.

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6.12.4 Japan (JATE ID)

JATE ID is D 16 0093 201

For units already sold and marked with JATE ID: D 16 0086 201, please publicize to users that the JATE ID: D 16 0086 201 should be read as D 16 0093 201 (for example, clients web page, by software update, or similar).

6.13 End Product Labeling

This module is designed to comply with the FCC statement, FCC ID: ZAT26M1. The host system using this module must display a visible label indicating the following text:

"Contains FCC ID: ZAT26M1" This module is designed to comply with the IC statement, IC: 451H-26M1. The host system using this

module must display a visible label indicating the following text: "Contains IC: 451H-26M1"

6.14 Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module.

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NOTE

Operation outside of test conditions as documented in this datasheet is not supported and may void TI’s warranty. Should the user choose to configure the CC2650MODA to operate outside of the test conditions, the device must be operated inside a protected and controlled environment, such as an RF shielded chamber and user must ensure compliance with regulatory requirements.

The end user's manual must include all required regulatory information and warnings as shown in this document.

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T D160093201

R 201-160413

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6.15 Module Marking

Figure 6-2 shows the marking for the SimpleLink™ CC2650MODA module.

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Figure 6-2. SimpleLink CC2650MODA Module Marking

Table 6-4. Module Descriptions

MARKING DESCRIPTION

CC2650MODA Model

LTC (lot trace code):

YMWLLLC

ZAT26M1 FCC ID: single modular FCC grant ID 451H-26M1 IC: single modular IC grant ID

CE CE compliance mark

• Y = Year

• M = Month

• WLLLLC = Reserved for internal use

MIC compliance mark

JATE ID: Japan module grant ID

ARIB STD-T66 ID: Japan modular grant ID

Bluetooth compliance mark

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nReset JTAG-TCK JTAG-TMS

DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 DIO8 DIO9 DIO10 DIO11 DIO12 DIO13 DIO14

VDDS

CC2650MODAMOH

NC_2

DIO_0

DIO_1

DIO_2

DIO_3

DIO_4

DIO_5/JTAG_TDO

DIO_6/JTAG_TDI

DIO_7

DIO_8

DIO_9

DIO_10

DIO_11

DIO_12

DIO_13

DIO_14

VDDS

nRESET

JTAG_TMSC

JTAG_TCKC

VDDS

NC_24

GND

EGP

R28 100k

CC2650MODA

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7 Application, Implementation, and Layout

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

TI does not recommend the use of conformal coating or similar material on the module. This coating can lead to localized stress on the solder connections inside the module and impact the module reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module.

7.1 Application Information

7.1.1 Typical Application Circuit

No external components are required for the operation of the CC2650MODA device. Figure 7-1 shows the application circuit.

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NOTE

Figure 7-1. CC2650MODA Application Circuit

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7.2 Layout

7.2.1 Layout Guidelines

Use the following guidelines to lay out the CC2650MODA device:

• The module must be placed close to the edge of the PCB.

• TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in

Figure 7-2 and Figure 7-3.

• TI recommends using a generous amount of ground vias to stitch together the ground planes on different layers. Several ground vias should be placed close to the exposed ground pads of the module.

• No external decoupling is required.

• The reset line should have an external pullup resistor unless the line is actively driven. Placement of this component is not critical.

• TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.

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Figure 7-2. Top Layer Figure 7-3. Bottom Layer

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8 Environmental Requirements and Specifications

8.1 PCB Bending

The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch.

8.2 Handling Environment

8.2.1 Terminals

The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not make skin contact with the LGA portion.

8.2.2 Falling

The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product to malfunction.

8.3 Storage Condition

8.3.1 Moisture Barrier Bag Before Opened

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.

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8.3.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, < 30%.

8.4 Baking Conditions

Products require baking before mounting if:

• Humidity indicator cards read > 30%

• Temp < 30°C, humidity < 70% RH, over 96 hours

Baking condition: 90°C, 12 to 24 hours Baking times: 1 time

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8.5 Soldering and Reflow Condition

• Heating method: Conventional convection or IR convection

• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method

• Solder paste composition: Sn/3.0 Ag/0.5 Cu

• Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 8-1)

• Temperature profile: Reflow soldering will be done according to the temperature profile (see Figure 8-1)

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Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component

(at Solder Joint)

Table 8-1. Temperature Profile

Profile Elements Convection or IR

Peak temperature range 235 to 240°C typical (260°C maximum) Pre-heat / soaking (150 to 200°C) 60 to 120 seconds Time above melting point 60 to 90 seconds Time with 5°C to peak 30 seconds maximum Ramp up < 3°C / second Ramp down < -6°C / second

(1) For details, refer to the solder paste manufacturer's recommendation.

NOTE

TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module. This coating can lead to localized stress on the solder connections inside the module and impact the module reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module.

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SimpleLink™ Multistandard Wireless MCU

DEVICE FAMILY

PREFIX

CC2650 MOD

X = Experimental device Blank = Qualified device

MOH

ROM version 1

Flash = 128KB

DEVICE

PACKAGE DESIGNATOR

MOH = 29-pin Module

MOD = Module

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9 Device and Documentation Support

9.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2650MODA is in production; therefore, no prefix/identification is assigned).

Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical

specifications and may not use production assembly flow.

P Prototype device that is not necessarily the final silicon die and may not necessarily meet

final electrical specifications.

null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been

demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production

devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, MOH).

For orderable part numbers of CC2650MODA devices in the MOH package type, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

Figure 9-1. Device Nomenclature

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9.2 Tools and Software

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.

The following products support development of the CC2650MODA device applications:

Software Tools

SmartRF Studio 7:

SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an early stage in the design process.

• Test functions for sending and receiving radio packets, continuous wave transmit and receive

• Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger

• Can also be used without any hardware, but then only to generate, edit and export radio configuration settings

• Can be used in combination with several development kits for TI's CCxxxx RF-ICs

Sensor Controller Studio:

Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks autonomously and independent of the System CPU state.

• Allows for Sensor Controller task algorithms to be implemented using a C-like programming language

• Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine code and associated definitions

• Allows for rapid development by using the integrated Sensor Controller task testing and debugging functionality. This allows for live visualization of sensor data and algorithm verification.

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IDEs and Compilers

Code Composer Studio:

• Integrated development environment with project management tools and editor

• Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family

• Best support for XDS debuggers; XDS100v3, XDS110 and XDS200

• High integration with TI-RTOS with support for TI-RTOS Object View

IAR Embedded Workbench for ARM

• Integrated development environment with project management tools and editor

• IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family

• Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link

• Integrated development environment with project management tools and editor

• RTOS plugin is available for TI-RTOS

For a complete listing of development-support tools for the CC2650MODA platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

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9.3 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The following documents describe the CC2650MODA device. Copies of these documents are available on the Internet at www.ti.com.

Declaration of Conformity

CC2650MODA EU Declaration of Conformity (DoC)

Errata

CC2630 and CC2650 SimpleLink™ Wireless MCU Errata

Technical Reference Manual

CC13x0, CC26x0 SimpleLink™ Wireless MCU

Application Reports

Running Standalone Bluetooth® low energy Applications on CC2650 Module How to Qualify Your Bluetooth(R) Low Energy Product

www.ti.com

User's Guide

CC2650 Module BoosterPack™ Getting Started Guide

White Paper

Which TI Bluetooth® Solution Should I Choose?

More Literature

Streamline the Challenges of RF Design With Certified Wireless Modules

9.4 Texas Instruments Low-Power RF Website

TI's Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to Wireless Connectivity: TI’s SimpleLink™ Sub-1 GHz Wireless MCUs.

9.5 Low-Power RF eNewsletter

The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information.

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9.6 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster

collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.

Texas Instruments Embedded Processors WikiEstablished to help developers get started with

Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community

• Forums, videos, and blogs

• RF design help

• E2E interaction Join here.

Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power

RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:

• RF circuit, low-power RF, and ZigBee design services

• Low-power RF and ZigBee module solutions and development tools

• RF certification services and RF circuit manufacturing For help with modules, engineering services or development tools: Search the Low-Power RF Developer Network to find a suitable partner.

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SWRS187D –AUGUST 2016–REVISED JULY 2019

9.7 Additional Information

Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, modules, and Systems-on-Chips as well as various software solutions for the Sub-1 GHz and 2.4-GHz frequency bands.

In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs.

The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world.

With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio.

9.8 Trademarks

IAR Embedded Workbench is a registered trademark of IAR Systems AB. SmartRF, Code Composer Studio, SimpleLink, Z-Stack, LaunchPad, TI-RTOS, BoosterPack, E2E are trademarks of Texas Instruments. ARM7 is a trademark of ARM Limited (or its subsidiaries). ARM, Cortex, Thumb are registered trademarks of ARM Limited (or its subsidiaries). Bluetooth is a registered trademark of Bluetooth SIG, Inc. CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium. IEEE Std 1241 is a trademark of The Institute of Electrical and Electronics Engineers, Inc. IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. ZigBee is a registered trademark of ZigBee Alliance, Inc. ZigBee RF4CE is a trademark of Zigbee Alliance, Inc. All other trademarks are the property of their respective owners.

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9.9 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.10 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

9.11 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

10 Mechanical, Packaging, and Orderable Information

10.1 Packaging Information

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The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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Page 43

CC2650MODA

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SWRS187D –AUGUST 2016–REVISED JULY 2019

10.2 PACKAGE OPTION ADDENDUM

10.2.1 PACKAGING INFORMATION

Package

Orderable Device Status

(1)

Type

CC2650MODAMOHR ACTIVE QFM MOH 29 1200

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest

availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the

requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

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(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device

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(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Device Marking for that device.

Package

Drawing

Pins

Package

Qty

Eco Plan

(2)

Green (RoHS & no

Sb/Br)

Lead/Ball

Finish

MSL Peak

(3)

Temp

Op Temp (°C) Device Marking

ENIG 3, 250°C –40 to 85 CC2650MODA

(4) (5)

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief

on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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Reel Width (W1)

REEL DIMENSIONS

A0 B0 K0

Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q2 Q2

Q3 Q3Q4

Reel

Diameter

User Direction of Feed

CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

10.3 PACKAGE MATERIALS INFORMATION

10.3.1 TAPE AND REEL INFORMATION

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Device

CC2650MODAMOHR QFM MOH 29 1200 330 32.5 11.4 17.4 2.9 16 32 Q1

All dimensions are nominal.

Package

Type

Package Drawing

Pins SPQ

Reel

Diameter

(mm)

Reel Width

W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

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TAPE AND REEL BOX DIMENSIONS

Width (mm)

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CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

Device Package Type

CC2650MODAMOHR QFM MOH 29 1200 352 348 56

Package Drawing

Pins SPQ Length (mm) Width (mm) Height (mm)

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Page 46

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Mar-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

CC2650MODAMOHR QFM MOH 29 1200 330.0 32.4 11.4 17.4 2.9 16.0 32.0 Q1

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

Page 47

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Mar-2021

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CC2650MODAMOHR QFM MOH 29 1200 383.0 353.0 58.0

Pack Materials-Page 2

Page 48

PACKAGE OUTLINE

PIN 1 ID AREA

PICK & PLACE NOZZLE AREA

SCALE 1.000

QFM - 2.69 mm max heightMOH0029A

QUAD FLAT MODULE

11.1

10.9

17.0

16.8

( 10.77)

2.69 MAX

4.065±0.05

TYP0.45 0.05

22X 1.15

6.9

9.2

2X ( )0.7

1.27±0.05

PKG

SEATING PLANE

6.9

1.7±0.05

4.125±0.05

1.7±0.05

1.5 0.05

5.721

±0.05

(1)

25X

0.6

0.5

25X

0.95

0.85

0.1 C A B

0.05

PKG

4222814/A 04/2016

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

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Page 49

NO TRACES, VIAS, GND PLANE

OR SILK SCREEN SHOULD BE

LOCATED WITHIN THIS AREA

EXAMPLE BOARD LAYOUT

QFM - 2.69 mm max heightMOH0029A

QUAD FLAT MODULE

(11)

25X (0.55)

25X (0.9)

2X (6.9)

22X (1.15)

(8.45)

(R ) TYP0.05

( 1.5)

( ) VIA

0.2 TYP

PKG

(10.1)

(2.625)

(1.7)

(0.265)

(1.7)

PKG

(16.9)

(8)

LAND PATTERN EXAMPLE

SCALE:7X

0.05 MAX

ALL AROUND

METAL

SOLDER MASK OPENING

NON SOLDER MASK

DEFINED

PADS 1-25

0.05 MIN

ALL AROUND

METAL UNDER SOLDER MASK

SOLDER MASK OPENING

SOLDER MASK

DEFINED

PADS 26-29

SOLDER MASK DETAILS

4222814/A 04/2016

NOTES: (continued)

3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

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Page 50

25X (0.55)

PKG

EXAMPLE STENCIL DESIGN

QFM - 2.69 mm max heightMOH0029A

QUAD FLAT MODULE

(R ) TYP0.05

25X (0.9)

(2X 6.9)

22X (1.15)

4X METAL

ALL AROUND

1.383)

(

(1.7)

(2.625)

(1.7)

(0.265)

PKG

(8)

(10.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

PRINTED SOLDER COVERAGE BY AREA

PADS 26-29: 85%

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

SCALE:10X

4222814/A 04/2016

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Page 51

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Datasheet CC2650MODA Datasheet (Texas Instruments)

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Device Overview

1.1 Features

1.2 Applications

1.3 Description

1.4 Functional Block Diagram

Table of Contents

2 Revision History

3 Device Comparison

3.1 Related Products

4 Terminal Configuration and Functions

4.1 Module Pin Diagram

4.2 Pin Functions

5 Specifications

5.1 Absolute Maximum Ratings

5.2 ESD Ratings

5.3 Recommended Operating Conditions

5.4 Power Consumption Summary

5.5 General Characteristics

5.6 Antenna

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

5.8 1-Mbps GFSK (Bluetooth low energy) – TX

5.9 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX

5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX

5.11 24-MHz Crystal Oscillator (XOSC_HF)

5.12 32.768-kHz Crystal Oscillator (XOSC_LF)

5.13 48-MHz RC Oscillator (RCOSC_HF)

5.14 32-kHz RC Oscillator (RCOSC_LF)

5.15 ADC Characteristics

5.16 Temperature Sensor

5.17 Battery Monitor

5.18 Continuous Time Comparator

5.19 Low-Power Clocked Comparator

5.20 Programmable Current Source

5.21 DC Characteristics

5.22 Thermal Resistance Characteristics for MOH Package

5.23 Timing Requirements

5.24 Switching Characteristics

5.25 Typical Characteristics

6 Detailed Description

6.1 Overview

6.2 Functional Block Diagram

6.3 Main CPU

6.4 RF Core

6.5 Sensor Controller

6.6 Memory

6.7 Debug

6.8 Power Management

6.9 Clock Systems

6.10 General Peripherals and Modules

6.11 System Architecture

6.12 Certification

6.12.1 Regulatory Information Europe

6.12.2 Federal Communications Commission Statement

6.12.3 Canada, Industry Canada (IC)

6.12.4 Japan (JATE ID)

6.13 End Product Labeling

6.14 Manual Information to the End User

6.15 Module Marking

7 Application, Implementation, and Layout

7.1 Application Information

7.1.1 Typical Application Circuit

7.2 Layout

7.2.1 Layout Guidelines

8 Environmental Requirements and Specifications

8.1 PCB Bending

8.2 Handling Environment

8.2.1 Terminals

8.2.2 Falling

8.3 Storage Condition

8.3.1 Moisture Barrier Bag Before Opened

8.3.2 Moisture Barrier Bag Open

8.4 Baking Conditions

8.5 Soldering and Reflow Condition

9 Device and Documentation Support

9.1 Device Nomenclature

9.2 Tools and Software