Datasheet CAT28F002T-90TT, CAT28F002T-90BT, CAT28F002T-15TT, CAT28F002T-15BT, CAT28F002T-12TT Datasheet (CTLST)

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CAT28F002
2 Megabit CMOS Boot Block Flash Memory
FEATURES
Fast Read Access Time: 90/120/150 ns
On-Chip Address and Data Latches
Blocked Architecture:
— One 16-KB Protected Boot Block
Hardware Data Protection
Automated Program and Erase Algorithms
Automatic Power Savings Feature
Low Power CMOS Operation
12.0V ± 5% Programming and Erase Voltage
Electronic Signature
100,000 Program/Erase Cycles and 10 Year
Data Retention
Standard Pinouts:
— 40-Lead TSOP — 40-Lead PDIP
High Speed Programming
Commercial, Industrial and Automotive Tem-
perature Ranges
Reset/Deep PowerDown Mode
— 0.2µA ICC Typical — Acts as Reset for Boot Operations
28F002 F01
I/O0–I/O
7
I/O BUFFERS
CE, OE LOGIC
SENSE
AMP
DATA
LATCH
ERASE VOLTAGE
SWITCH
COMMAND REGISTER
CE OE
WE
VOLTAGE VERIFY
SWITCH
ADDRESS LATCH
Y-DECODER
X-DECODER
Y-GATING
16K-BYTE BOOT BLOCK 8K-BYTE PARAMETER BLOCK 8K-BYTE PARAMETER BLOCK
96K-BYTE MAIN BLOCK
128K-BYTE MAIN BLOCK
A0–A
17
WRITE STATE
MACHINE
ADDRESS COUNTER
STATUS
REGISTER
COMPARATOR
PROGRAM VOLTAGE
SWITCH
RP
BLOCK DIAGRAM
DESCRIPTION
The CAT28F002 is a high speed 256K X 8-bit electrically erasable and reprogrammable Flash memory ideally suited for applications requiring in-system or after sale code updates.
The CAT28F002 has a blocked architecture with one 16 KB Boot Block, two 8 KB Parameter Blocks, one 96 KB Main Block and one 128 KB Main Block. The Boot Block section can be at the top or bottom of the memory map. The Boot Block section includes a reprogramming write lock out feature to guarantee data integrity. It is de­signed to contain secure code which will bring up the system minimally and download code to other locations of CAT28F002.
The CAT28F002 is designed with a signature mode which allows the user to identify the IC manufacturer and device type. The CAT28F002 is also designed with on­Chip Address Latches, Data Latches, Programming and Erase Algorithms. A deep power-down mode lowers the total Vcc power consumption 1µw typical.
The CAT28F002 is manufactured using Catalyst’s ad­vanced CMOS floating gate technology. It is designed to endure 100,000 program/erase cycles and has a data retention of 10 years. The device is available in JEDEC approved 40-pin TSOP and 40-pin PDIP packages.
© 1998 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
Licensed Intel
second source
Doc. No. 25072-00 2/98 F-1
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CAT28F002
2
Doc. No. 25072-00 2/98 F-1
PIN CONFIGURATION
TSOP Package (T)
28F002 F03
I/O
7
I/O
6
OE
A
8
A
0
20
29
9 10 11 12
40 39 38 37
A
12
A
11
A
10
A
9
5 6 7 8
1 2 3 4
V
PP
CE
NC
A
15
A
14
A
13
24 23 22 21
28 27 26 25
V
CC
WE
I/O
5
A
1
13
36
I/O
4
A
2
14
35
I/O
3
A
3
15
34
A
4
16
33
I/O
2
A
5
17
32
I/O
1
A
6
18
31
I/O
0
A
7
19
30
NC
V
CC
GND
A
17
NC
GND
NC
RP
A
16
NC
PDIP Package (P)
A
5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
17
NC NC A
10
I/O
7
V
CC
NC
OE GND CE A
0
A
6
A
7
NC
DU
V
PP
RP
WE
A
8
A
12
A
13
A
14
A
15
A
16
17 18 19 20
A
2
A
3
A
4
24 23 22 21
32 31 30 29 28 27 26 25
36 35 34 33
40 39 38 37
A
9
A
11
A
1
GND
I/O
6
I/O
5
I/O
4
V
CC
I/O
3
I/O
2
I/O
1
I/O
0
PIN FUNCTIONS
Pin Name Type Function
A0–A
17
Input Address Inputs for
memory addressing
I/O0–I/O
7
I/O Data Input/Output
CE Input Chip Enable OE Input Output Enable WE Input Write Enable
V
CC
Voltage Supply
V
SS
Ground
V
PP
Program/Erase
Voltage Supply RP Input Power Down DU Do Not Use
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CAT28F002
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Doc. No. 25072-00 2/98 F-1
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................... –55°C to +95°C
Storage Temperature....................... –65°C to +150°C
Voltage on Any Pin with
Respect to Ground
(1)
........... –2.0V to +VCC + 2.0V
Voltage on Pin A9 with
Respect to Ground
(1)
................... –2.0V to +13.5V
VPP with Respect to Ground
during Program/Erase
(1)
.............. –2.0V to +14.0V
VCC with Respect to Ground
(1)
............ –2.0V to +7.0V
Package Power Dissipation
Capability (TA = 25°C)..................................1.0 W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current
(2)
........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Test Method
N
END
(3)
Endurance 100K Cycles/Byte MIL-STD-883, Test Method 1033
T
DR
(3)
Data Retention 10 Years MIL-STD-883, Test Method 1008
V
ZAP
(3)
ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
I
LTH
(3)(4)
Latch-Up 100 mA JEDEC Standard 17
CAPACITANCE TA = 25°C, f = 1.0 MHz
Limits
Symbol Test Min Max. Units Conditions
C
IN
(3)
Input Pin Capacitance 8 pF V
IN
= 0V
C
OUT
(3)
Output Pin Capacitance 12 pF V
OUT
= 0V
C
VPP
(3)
VPP Supply Capacitance 25 pF VPP = 0V
Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
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Doc. No. 25072-00 2/98 F-1
D.C. OPERATING CHARACTERISTICS
VCC = +5V ±10%, unless otherwise specified
Limits
Symbol Parameter Min. Max. Unit Test Conditions
I
LI
Input Leakage Current ±1.0 µAVIN = VCC or V
SS
VCC = 5.5V
I
LO
Output Leakage Current ±10 µAV
OUT
= VCC or VSS,
VCC = 5.5V
I
SB1
VCC Standby Current CMOS 100 µA CE = VCC ±0.2V = RP
VCC = 5.5V
I
SB2
VCC Standby Current TTL 1.5 mA CE = RP = VIH, VCC = 5.5V
I
PPD
VPP Deep Powerdown Current 5.0 µA RP = GND±0.2V
I
CC1
VCC Active Read Current 55 mA VCC = 5.5V, CE = GND,
I
OUT
= 0mA, f = 10 MHz
I
CC2
(1)
VCC Programming Current 50 mA VCC = 5.5V,
Programming in Progress
I
CC3
(1)
VCC Erase Current 30 mA VCC = 5.5V,
Erase in Progress
I
PPS
VPP Standby Current ±10 µAVPP < V
CC
200 µAVPP > V
CC
I
PP1
VPP Read Current 200 µAVPP = V
PPH
I
PP2
(1)
VPP Programming Current 20 mA VPP = V
PPH
,
Programming in Progress
I
PP3
(1)
VPP Erase Current 15 mA VPP = V
PPH
,
Erase in Progress
V
IL
Input Low Level –0.5 0.8 V
V
OL
Output Low Level 0.45 V IOL = 5.8mA, VCC = 4.5V
V
IH
Input High Level 2.0 VCC+0.5 V
V
OH1
Output High Level TTL 2.4 V IOH = -2.5mA, VCC = 4.5V
V
ID
A9 Signature Voltage 10.8 13.2 V A9 = V
ID
I
ID
A9 Signature Current 500 µAA9 = V
ID
I
CCD
VCC Deep Powerdown Current 1.0 µA RP = GND±0.2V
I
CCES
VCC Erase Suspend Current 10 mA Erase Suspended CE = V
IH
I
PPES
VPP Erase Suspend Current 200 µA Erase Suspended
VPP=V
PPH
I
RP
RP Boot Block Unlock Current 500 µA RP = V
HH
V
OH2
Output High Level TTL 0.85 V
CC
VVCC = V
CCMIN
IOH = -1.5mA
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter.
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Doc. No. 25072-00 2/98 F-1
SUPPLY CHARACTERISTICS
Limits
Symbol Parameter Min Max. Unit
V
LKO
VCC Erase/Write Lock Voltage 2.0 V
V
CC
VCC Supply Voltage 4.5 5.5 V
V
PPL
VPP During Read Operations 0 6.5 V
V
PPH
VPP During Erase/Program 11.4 12.6 V
V
HH
RP, OE Unlock Voltage 10.8 13.2 V
V
PPLK
VPP Lock-Out Voltage 0 6.5 V
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) Output floating (High-Z) is defined as the state where the external data line is no longer driven by the output buffer. (3) Input Rise and Fall Times (10% to 90%) < 10 ns. (4) Input Pulse Levels = 0.45V and 2.4V. (5) Input and Output Timing Reference = 0.8V and 2.0V. (6) Low-Z is defined as the state where the external data may be driven by the output buffer but may not be valid.
5108 FHD F04
1.3V
DEVICE UNDER
TEST
1N914
3.3K
CL = 100 pF
OUT
CL INCLUDES JIG CAPACITANCE
Figure 2. A.C. Testing Load Circuit (example)
INPUT PULSE LEVELS REFERENCE POINTS
2.0 V
0.8 V
2.4 V
0.45 V
5108 FHD F03
Figure 1. A.C. Testing Input/Output Waveform
(3)(4)(5)
A.C. CHARACTERISTICS, Read Operation
VCC = +5V ±10%, unless otherwise specified
JEDEC Standard 28F002-90 28F002-12 28F002-15
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
t
AVAV
t
RC
Read Cycle Time 90 120 150 ns
t
ELQV
t
CE
CE Access Time 90 120 150 ns
t
AVQV
t
ACC
Address Access Time 90 120 150 ns
t
GLQV
t
OE
OE Access Time 40 40 40 ns
-tOHOutput Hold from Address OE/CE Change 0 0 0 ns t
GLQX
t
OLZ
(1)(6)
OE to Output in Low-Z 0 0 0 ns
t
ELQX
t
LZ
(1)(6)
CE to Output in Low-Z 0 0 0 ns
t
GHQZ
t
DF
(1)(2)
OE High to Output High-Z 30 30 30 ns
t
EHQZ
t
HZ
(1)(2)
CE High to Output High-Z 30 30 30 ns
t
PHQV
t
PWH
RP High to Output Delay 300 300 300 ns
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CAT28F002
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Doc. No. 25072-00 2/98 F-1
A.C. CHARACTERISTICS, Program/Erase Operation
VCC = +5V ±10%, unless otherwise specified.
JEDEC
Standard
28F002-90 28F002-12 28F002-15
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
t
AVAV
t
WC
Write Cycle Time 90 120 150 ns
t
AVWH
t
AS
Address Setup to WE Going High 50 50 50 ns
t
WHAX
t
AH
Address Hold Time from WE Going High 0 0 0 ns
t
DVWH
t
DS
Data Setup Time to WE Going High 40 40 40 ns
t
WHDX
t
DH
Data Hold Time from WE Going High 0 0 0 ns
t
ELWL
t
CS
CE Setup Time to WE Going Low 0 0 0 ns
t
WHEH
t
CH
CE Hold Time from WE Going High 0 0 0 ns
t
WLWH
t
WP
WE Pulse Width 50 50 50 ns
t
WHWL
t
WPH
WE High Pulse Width 20 20 20 ns
t
PHWL
t
PS
(1)
RP to WE Going Low 215 215 215 ns
t
PHHWH
t
PHS
(1)
RP VHH Setup to WE Going High 100 100 100 ns
t
VPWH
t
VPS
(1)
VPP Setup to WE Going High 100 100 100 ns
t
WHQV1
Duration of Programming Operations 6 6 6 µs
t
WHQV2
Duration of Erase Operations (Boot) 0.3 0.3 0.3 Sec
t
WHQV3
Duration of Erase Operations (Parameter) 0.3 0.3 0.3 Sec
t
WHQV4
Duration of Erase Operations (Main) 0.6 0.6 0.6 Sec
t
QVVL
t
VPH
(1)
VPP Hold from Valid Status Reg Data 0 0 0 ns
t
QVPH
t
PHH
(1)
RP VHH Hold from Status Reg Data 0 0 0 ns
t
PHBR
(1)
Boot Block Relock Delay 100 100 100 ns
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter.
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CAT28F002
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Doc. No. 25072-00 2/98 F-1
ERASE AND PROGRAMMING PERFORMANCE
28F002-90 28F002-12 28F002-15
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
Boot Block Erase Time 1.0 7 1.0 7 1.0 7 Sec Parameter Block Erase Time 1.0 7 1.0 7 1.0 7 Sec Main Block Erase Time 2.4 14 2.4 14 2.4 14 Sec Main Block Program Time 1.2 4.2 1.2 4.2 1.2 4.2 Sec
FUNCTION TABLE
(1)
Pins
Mode RP CE OE WE V
PP
I/O Notes
Read V
IH
V
IL
V
IL
V
IH
XD
OUT
Output Disable V
IH
V
IL
V
IH
V
IH
X High-Z
Standby V
IH
V
IH
X X X High-Z
Signature (MFG) V
IH
V
IL
V
IL
V
IH
X 31H A0 = VIL, A9 = 12V
Signature (Device) V
IH
V
IL
V
IL
V
IH
X 7CH-28F002T A0 = VIH, A9 = 12V
7DH-28F002B
Write Cycle V
IH
V
IL
V
IH
V
IL
XDINDuring Write Cycle
Deep Power Down V
IL
XXXXHIGH-Z
WRITE COMMAND TABLE
Commands are written into the command register in one or two write cycles. The command register can be altered only when VPP is high and the instruction byte is latched on the rising edge of WE. Write cycles also internally latch addresses and data required for programming and erase operations.
First Bus Cycle Second Bus Cycle
Mode Operation Address D
IN
Operation Address D
IN
D
OUT
Read Array/Reset Write X FFH Program Setup/ Write A
IN
40H Write A
IN
D
IN
Program 10H Read Status Reg. Write X 70H Read X St. Reg. Data Clear Status Reg. Write X 50H
Erase Setup/Erase Write Block ad 20H Write Block ad D0H Confirm
Erase Suspend/ Write X B0H Write X D0H Erase Resume
Read Sig (Mfg) Write X 90H Read 0000H 31H Read Sig (Dev) Write X 90H Read 0001H 7CH-28F002T
7DH-28F002B
Note: (1) Logic Levels: X = Logic ‘Do not care’ (VIH, VIL, V
PPL
, V
PPH
)
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Doc. No. 25072-00 2/98 F-1
READ OPERATIONS
Read Mode
The CAT28F002 memory can be read from any of its Blocks (Boot Block, Main Block or Parameter Block), Status Register and Signature Information by sending the Read Command Mode to the Command Register.
CAT28F002 automatically resets to Read Array mode upon initial device power up or after exit from deep power down. A Read operation is performed with both CE and OE low and with RP and WE high. Vpp can be either high or low. The data retrieved from the I/O pins reflects the contents of the memory location correspond­ing to the state of the 18 address pins. The respective timing waveforms for the read operation are shown in Figure 3. Refer to the AC Read characteristics for specific timing parameters.
Signature Mode
The signature mode allows the user to identify the IC manufacturer and the type of the device while the device resides in the target system. This mode can be activated in either of two ways; through the conventional method of applying a high voltage (12V) to address pin A9 or by sending an instruction to the command register (see Write Operations).
The conventional method is entered as a regular read mode by driving the CE and OE low (with WE high), and
applying the required high voltage on address pin A9 while the other address line are held at VIL.
A Read cycle from address 0000H retrieves the binary code for the IC manufacturer on outputs I/O7 to I/O0:
Catalyst Code = 0011 0001 (31H) A Read cycle from address 0001H retrieves the binary
code for the device on outputs I/O7 to I/O0: CAT28F002T = 0111 1100 (7CH) CAT28F002B = 0111 1101 (7DH)
Standby Mode
With CE at a logic-high level, the CAT28F002 is placed in a standby mode where most of the device circuitry is disabled, thereby substantially reducing power con­sumption. The outputs are placed in a high-impendance state independent of the OE status.
Deep Power-Down
When RP is at logic-low level, the CAT28F002 is placed in a Deep Power-Down mode where all the device circuitry are disabled, thereby reducing the power con­sumption to 0.25µW.
Figure 3. A.C. Timing for Read Operation
28F002 F05
ADDRESSES
CE (E)
OE (G)
WE (W)
DATA (I/O)
HIGH-Z
POWER UP
STANDBY DEVICE AND
ADDRESS SELECTION
OUPUTS
ENABLED
DATA VALID STANDBY
ADDRESS STABLE
OUTPUT VALID
t
AVQV
(t
ACC
)
t
ELQX
(tLZ)
t
GLQX
(t
OLZ
)
t
GLQV
(tOE)
t
ELQV
(tCE)
t
OH
t
GHQZ
(tDF)
t
EHQZ
t
AVAV
(tRC)
POWER DOWN
HIGH-Z
t
PHQV
(t
PWH
)
RP (P)
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CAT28F002
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Doc. No. 25072-00 2/98 F-1
WRITE OPERATIONS
The following operations are initiated by observing the sequence specified in the Write Command Table.
Read Array
The device can be put into a Read Array Mode by initiating a write cycle with FFH on the data bus. The device is also in a standard Read Array Mode after the initial device power up and when comes out of the Deep Power-Down mode.
Signature Mode
An alternative method for reading device signature (see Read Operations Signature Mode), is initiated by writing the code 90H into the command register. A read cycle from address 0000H with CE and OE low (and WE high) will output the device signature.
Catalyst Code = Catalyst Code = 0011 0001 (31H) A Read cycle from address 0001H retrieves the
binary code for the device on outputs I/O7 to I/O0: CAT28F002T = 0111 1100 (7CH)
CAT28F002B = 0111 1101 (7DH) To terminate the operations, it is necessary to write
another valid command into the register.
STATUS REGISTER
The 28F002 contains an 8-bit Status Register. The Status Register is polled to check for write or erase completion or any related errors. The Status Register may be read at any time by issuing a Read Status Register (70H) command. All subsequent read opera­tions output data from the Status Register, until another valid command is issued. The contents of the Status Register are latched on the falling edge of OE or CE, whichever occurs last in the read cycle. OE or CE must be toggled to VIH before further reads to update the status register latch.
The Erase Status (SR.5) and Program Status (SR.4) are set to 1 by the WSM and can only be reset issuing Clear Status Register (50H) These two bits can be polled for failures, thus allowing more flexibility to the designer when using the CAT28F002. Also, VPP Status (SR.3) when set to 1 must be reset by system software before any further byte programs or block erases are attempted.
ERASE SETUP/ERASE CONFIRM
Erase is executed one block at a time, initiated by a two cycle command sequence. The two cycle command sequence provides added security against accidental
block erasure. During the first write cycle, a Command 20H (Erase Setup) is first written to the Command Register, followed by the Command D0H (Erase Con­firm). These commands require both appropriate com­mand data and an address within Block to be erased. Also, Block erasure can only occur when VPP= VPPH.
Block preconditioning, erase and verify are all handled internally by the Write State Machine, invisible to the system. After receiving the two command erase se­quence the CAT28F002 automatically outputs Status Register data when read (Fig.5). The CPU can detect the completion of the erase event by checking if the SR.7 of the Status Register is set.
SR.5 will indicate whether the erase was successful. If an erase error is detected, the Status Register should be cleared. The device will be in the Status Register Read Mode until another command is issued.
ERASE SUSPEND/ERASE RESUME
The Erase Suspend Command allows erase sequence interruption in order to read data from another block of memory. Once the erase sequence is started, writing the Erase Suspend command (B0H) to the Command Register requests that the WSM suspend the erase sequence at a predetermined point in the erase algo­rithm. The CAT28F002 continues to output Status Reg­ister data when read, after the Erase Suspend command is written to it. Polling the WSM Status and Erase Suspend Status bits will determine when the erase operation has been suspended (both will be set to “1s”).
The device may now be given a Read ARRAY Com­mand, which allows any locations 'not within the block being erased' to be read. Also, you can either perform a Read Status Register or resume the Erase Operation by sending Erase Resume (D0H), at which time the WSM will continue with the erase sequence. The Erase Suspend Status and WSM Status bits of the Status Register will be cleared.
PROGRAM SETUP/PROGRAM COMMANDS
Programming is executed by a two-write sequence. The program Setup command (40H) is written to the Com­mand Register, followed by a second write specifying the address and data (latched on the rising edge of WE) to be programmed. The WSM then takes over, control­ling the program and verify algorithms internally. After the two-command program sequence is written to it, the CAT28F002 automatically outputs Status Register data when read (see figure 4; Byte Program Flowchart). The CPU can detect the completion of the program event by analyzing the WSM Status bit of the Status Register. Only the Read Status Register Command is valid while programming is active.
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CAT28F002
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When the Status Register indicates that programming is complete, the Program Status bit should be checked. If program error is detected, the Status Register should be cleared. The internal WSM verify only detects errors for “1s” that do not successfully program to “0s”. The Command Register remains in Read Status Register mode until further commands are issued to it.
If erase/byte program is attempted while VPP = V
PPL
, the Status bit (SR.5/SR.4) will be set to “1”. Erase/Program attempts while V
PPL
< VPP < V
PPH
produce spurious
results and should not be attempted.
EMBEDDED ALGORITHMS
The CAT28F002 integrates the Quick Pulse program­ming algorithm on-chip, using the Command Register, Status Register and Write State Machine (WSM). On­chip integration dramatically simplifies system software and provides processor-like interface timings to the Command and Status Registers. WSM operation, inter­nal program verify, and VPP high voltage presence are monitored and reported via appropriate Status Register bits. Figure 4 shows a system software flowchart for device programming.
As above, the Quick Erase algorithm is now imple­mented internally, including all preconditioning of block data. WSM operation, erase verify and VPP high voltage presence are monitored and reported through the Status Register. Additionally, if a command other than Erase Confirm is written to the device after Erase Setup has been written, both the Erase Status and Program Status bits will be set to “1”. When issuing the Erase Setup and
Erase Confirm commands, they should be written to an address within the address range of the block to be erased. Figure 5 shows a system software flowchart for block erase.
The entire sequence is performed with VPP at V
PPH
. Abort occurs when RP transitions to VIL, or VPP drops to V
PPL
. Although the WSM is halted, byte data is partially programmed or Block data is partially erased at the location where it was aborted. Block erasure or a repeat of byte programming will initialize this data to a known value.
BOOT BLOCK PROGRAM AND ERASE
The boot block is intended to contain secure code which will minimally bring up a system and control program­ming and erase of other blocks of the device, if needed. Therefore, additional “lockout” protection is provided to guarantee data integrity. Boot block program and erase operations are enabled through high voltage VHH on either RP or OE, and the normal program and erase command sequences are used. Reference the AC Waveforms for Program/Erase.
If boot block program or erase is attempted while RP is at VIH, either the Program Status or Erase Status bit will be set to “1”, reflective of the operation being attempted and indicating boot block lock. Program/erase attempts while VIH < RP < VHH produce spurious results and should not be attempted.
NOTES: The Write State Machine Status Bit must first be checked to
determine program or erase completion, before the Program or Erase Status bits are checked for success.
If the Program AND Erase Status bits are set to “1s” during an
erase attempt, an improper command sequence was entered. Attempt the operation again.
If VPP low status is detected, the Status Register must be
cleared before another program or erase operation is attempted.
The VPP Status bit, unlike an A/D converter, does not provide
continuous indication of VPP level. The WSM interrogates the VPP level only after the program or erase command sequences have been entered and informs the system if VPP has not been switched on. The VPP Status bit is not guaranteed to report accurate feedback between V
PPL
and
V
PPH
.
SR.7 = WRITE STATE MACHINE STATUS
1 = Ready 0 = Busy
SR.6 = ERASE SUSPEND STATUS
1 = Erase Suspended 0 = Erase in Progress/Completed
SR.5 = ERASE STATUS
1 = Error in Block Erasure 0 = Successful Block Erase
SR.4 = PROGRAM STATUS
1 = Error in Byte Program 0 = Successful Byte Program
SR.3 = VPP STATUS
1 = VPP Low Detect; Operation Abort
0 = VPP Okay SR.2 -SR.0 = RESERVED FOR FUTURE ENHANCEMENTS These bits are reserved for future use and should be masked
out when polling the Status Register.
WSMS ESS ES PS VPPS R R R
76543210
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11
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Bus Operation Command Comments
Write Program Data = 40H
Setup Address = Bytes to be Programmed
Write Program Data to be programmed
Address = Byte to be Programmed
Read Status Register Data.
Toggle OE or CE to update Status Register Check SR.7
Standby 1 = Ready, 0 = Busy
Repeat for subsequent bytes.
Full Status check can be done after each byte or after a sequence of bytes.
Write FFH after the last byte programming operation to reset the device to Read Array Mode.
Bus Operation Command Comments
Standby Check SR.3
1 = VPP Low Detect
Standby Check SR.3
1 = Byte Program Error
SR.3 MUST be cleared, if set during a program attempt, before further attempts are allowed by the Write State Machine.
SR.3 is only cleared by the Clear Status Register Command, in case where multiple bytes are programmed before full status is checked.
If error is detected, clear the Status Register before attempting retry or other error recovery.
START
WRITE 40H,
BYTE ADDRESS
READ STATUS
REGISTER
SR.7 = 1?
FULL STATUS
CHECK IF DESIRED
BYTE PROGRAM
COMPLETED
STATUS REGISTER DATA
READ (SEE ABOVE)
SR.3 = 0?
SR.4 = 0?
BYTE PROGRAM
SUCCESSFUL
NO
NO
WRITE BYTE
ADDRESS/DATA
FULL STATUS CHECK PROCEDURE
NO
V
PP
RANGE
ERROR
BYTE PROGRAM
ERROR
YES
YES
YES
Figure 4 Byte Programming Flowchart
IN-SYSTEM OPERATION
For on-board programming, the RP pin is the most convenient means of altering the boot block. Before issuing Program or Erase confirms commands, RP must transition to VHH. Hold RP at this high voltage throughout the program or erase interval (until after Status Register confirm of successful completion). At this time, it can return to VIH or VIL.
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Bus Operation Command Comments
Write Erase Data = 20H
Setup Address = Within Block to be erased
Write Erase Data - D0H
Address = Within Block to be erased
Read Status Register Data.
Toggle OE or CE to update Status Register
Standby Check SR.7
1 = Ready, 0 = Busy
Repeat for subsequent blocks. Full Status check can be done after each block or after a sequence
of blocks. Write FFH after the last block erase operation to reset the device to
Read Array Mode.
Bus Operation Command Comments
Standby Check SR.3
1 = VPP Low Detect
Standby Check SR.4
Both 1 = Command Sequence Error
Standby Check SR.5
1 = Block Erase Error
SR.3 MUST be cleared, if set during a erase attempt, before further attempts are allowed by the Write State Machine.
SR.3 is only cleared by the Clear Status Register Command, in cases where multiple blocks are erased before full status is checked.
If error is detected, clear the Status Register before attempting retry or other error recovery.
Figure 5 Block Erase Flowchart
START
WRITE 20H,
BLOCK ADDRESS
READ STATUS
REGISTER
SR.7 = 1?
FULL STATUS
CHECK IF DESIRED
BLOCK ERASE
COMPLETED
STATUS REGISTER DATA
READ (SEE ABOVE)
SR.3 = 0?
SR.5 = 0?
BLOCK ERASE SUCCESSFUL
NO
NO
WRITE D0H
BLOCK ADDRESS
FULL STATUS CHECK PROCEDURE
NO
V
PP
RANGE
ERROR
BLOCK ERASE
ERROR
SR.4,5 = 1?
YES
COMMAND SEQUENCE
ERROR
SUSPEND
ERASE?
NO
ERASE SUSPEND
LOOP
YES
YES
NO
YES
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Doc. No. 25072-00 2/98 F-1
Bus Operation Command Comments
Write Erase Data = B0H
Suspend
Write Erase Data = 70H
Status Register
Standby/ Read Status Register Ready Check SR.7
1 = Ready, 0 = Busy Toggle OE or CE to Update Status Register
Standby Check SR.6
1 = Suspended
Write Read Array Data = FFH
Read Read array data from block other
than that being erased.
Write Erase Resume Data = D0H
START
WRITE B0H
READ STATUS
REGISTER
SR.7 = 1?
SR.6 = 1?
CONTINUE
ERASE
NO
WRITE 70H
DONE
READING?
WRITE FFH
WRITE D0H
NO
ERASE HAS
COMPLETED
YES
YES
NO
YES
Figure 6 Block Erase Suspend/Resume Flowchart
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Doc. No. 25072-00 2/98 F-1
ADDRESSES (A)
CE (E)
OE (G)
WE (W)
DATA (I/O)
RP (P)
VPP (V)
V
IL
V
IH
V
PPL
V
PPH
V
IL
V
IH
6.5V
V
HH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
t
ELWL
t
WHEH
t
AVAV
A
IN
A
IN
t
AVWH
t
WHAX
t
WHGL
t
WHWL
t
PHWL
t
DVWH
t
WLWH
t
WHDX
t
PHHWH
t
QVPH
t
VPWH
t
QVVL
D
IN
D
IN
VALID
SRD
D
IN
HIGH Z
V
IH
V
IH
V
CC
POWER-UP
& STANDBY
WRITE PROGRAM OR
ERASE SETUP COMMAND
AUTOMATED PROGRAM
OR ERASE DELAY
READ STATUS
REGISTER DATA
WRITE READ ARRAY
COMMAND
WRITE
VALID ADDRESS & DATA (PROGRAM)
OR ERASE CONFIRM COMMAND
V
IL
V
IL
POWER UP/DOWN PROTECTION
The CAT28F002 offers protection against inadvertent programming during VPP and VCC power transitions. When powering up the device there is no power-on sequencing necessary. In other words, VPP and V
CC
may power up in any order. Additionally VPP may be hardwired to V
PPH
independent of the state of VCC and any power up/down cycling. The internal command register of the CAT28F002 is reset to the Read Mode on power up.
POWER SUPPLY DECOUPLING
To reduce the effect of transient power supply voltage spikes, it is good practice to use a 0.1µF ceramic capacitor between VCC and VSS and VPP and VSS. These high-frequency capacitors should be placed as close as possible to the device for optimum decoupling.
Figure 7. A.C. Timing for Program/Erase Operation
28F002 F09
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Doc. No. 25072-00 2/98 F-1
ALTERNATE CE-CONTROLLED WRITES
VCC = +5V ±10%, unless otherwise specified
JEDEC
Standard
28F002-90 28F002-12 28F002-15
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
t
AVAV
t
WC
Write Cycle Time 90 120 150 ns
t
AVEH
t
AS
Address Setup to CE Going High 50 50 50 ns
t
EHAX
t
AH
Address Hold Time from CE Going High 0 0 0 ns
t
DVEH
t
DS
Data Setup Time to CE Going High 40 40 40 ns
t
EHDX
t
DH
Data Hold Time from CE Going High 0 0 0 ns
t
WLEL
t
WS
WE Setup Time to CE Going Low 0 0 0 ns
t
EHWH
t
WH
WE Hold Time from CE Going High 0 0 0 ns
t
ELEH
t
CP
CE Pulse Width 50 50 50 ns
t
EHEL
t
EPH
CE Pulse Width High 30 30 30 ns
t
PHEL
t
PS
(1)
RP High Recovery to CE Going Low 215 215 215 ns
t
PHHEH
t
PHS
(1)
RP VHH Setup to CE Going High 100 100 100 ns
t
VPEH
t
VPS
(1)
VPP Setup to CE Going High 100 100 100 ns
t
EHQV1
Duration of Programming Operations 6 6 6 µs
t
EHQV2
Duration of Erase Operations (Boot) 0.3 0.3 0.3 Sec
t
EHQV3
Duration of Erase Operations (Parameter) 0.3 0.3 0.3 Sec
t
EHQV4
Duration of Erase Operations (Main) 0.6 0.6 0.6 Sec
t
QVVL
t
VPH
(1)
VPP Hold from Valid Status Reg Data 0 0 0 ns
t
QVPH
t
PHH
(1)
RP VHH Hold from Status Reg Data 0 0 0 ns
t
PHBR
(1)
Boot Block Relock Delay 100 100 100 ns
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter.
Page 16
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ORDERING INFORMATION
28F002 F13
Prefix Device # Suffix
28F002 T
IT
Product Number
Temperature Range
Blank = Commercial (0˚ to 70˚C) I = Industrial (-40˚ to 85˚C) A = Automotive (-40˚ to 105˚C)*
Tape & Reel
T: 500/Reel
Package
T: 40-pin TSOP P: 40-pin PDIP
Speed
90: 90 ns 12: 120 ns 15: 150 ns
-12CAT B
Boot Block
B: Bottom T: Top
* -40˚ to +125˚C is available upon request
Optional Company ID
Note: (1) The device used in the above example is a CAT28F002TI-12BT (TSOP, Industrial Temperature, 120ns access time, Bottom Boot
Block, Tape & Reel)
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