Datasheet CAT28C17AK-20T, CAT28C17AJI-20T, CAT28C17AJA-20T, CAT28C17AJ-20T, CAT28C17API-20T Datasheet (CTLST)

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CAT28C17A
16K-Bit CMOS PARALLEL E2PROM
FEATURES
Fast Read Access Times: 200 ns
Low Power CMOS Dissipation:
Simple Write Operation:
–On-Chip Address and Data Latches –Self-Timed Write Cycle with Auto-Clear
Fast Write Cycle Time: 10ms Max
DESCRIPTION
The CAT28C17A is a fast, low power, 5V-only CMOS parallel E2PROM organized as 2K x 8-bits. It requires a simple interface for in-system programming. On-chip address and data latches, self-timed write cycle with auto-clear and VCC power up/down write protection eliminate additional timing and protection hardware. DATA Polling and a RDY/BSY pin signal the start and end of the self-timed write cycle. Additionally, the CAT28C17A features hardware write protection.
End of Write Detection:
DATADATA
DATA Polling
DATADATA
BSYBSY
–RDY/
BSY Pin
BSYBSY
Hardware Write Protection
CMOS and TTL Compatible I/O
10,000 Program/Erase Cycles
10 Year Data Retention
Commercial,Industrial and Automotive
Temperature Ranges
The CAT28C17A is manufactured using Catalyst’s ad­vanced CMOS floating gate technology. It is designed to endure 10,000 program/erase cycles and has a data retention of 10 years. The device is available in JEDEC approved 28-pin DIP and SOIC or 32-pin PLCC pack­ages.
BLOCK DIAGRAM
A4–A
10
V
CC
CE OE
WE
A0–A
3
RDY/BUSY
© 1998 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
ADDR. BUFFER
& LATCHES
INADVERTENT
WRITE
PROTECTION
CONTROL
LOGIC
TIMER
ADDR. BUFFER
& LATCHES
1
ROW
DECODER
HIGH VOLTAGE
GENERATOR
DATA POLLING
& RDY/BUSY
COLUMN
DECODER
2,048 x 8
2
E
PROM
ARRAY
I/O BUFFERS
I/O0–I/O
7
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5091 FHD F02
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CAT28C17A
PIN CONFIGURATION
DIP Package (P) PLCC Package (N)SOIC Package (J,K)
1
28 27 26 25 24 23 22 21 20 19 18 17 16 15
V WE NC A A NC OE A CE I/O I/O I/O I/O I/O
CC
8 9
10
7 6 5 4 3
RDY/BUSY
NC
A A A A A A A A
I/O I/O
V
SS
2 3
7
4
6
5
5
6
4
7
3
8
2
9
1
10
0
11I/O
0
12
1
13
2
14
PIN FUNCTIONS
Pin Name Function
A0–A
10
Address Inputs
RDY/BUSY
NC
A A A A A A A A
I/O I/O
V
SS
1
28
V
CC
2
27
WE
3
26 25 24 23 22 21 20 19 1811I/O 17 16 15
NC A A NC OE A CE I/O I/O I/O I/O I/O
8 9
10
RDY/BUSY
A7NC
4321323130
5
A
6
6
A
5
7
A
4
8
A
I/O
A A A
NC
3
9
2
10
1
11
0
12 13
0
14 15 16 17 18 19 20
I/O1I/O
7 6 5 4 3
NC
TOP VIEW
2
SS
NC
V
VCCWE
NC
29 28 27 26 25 24 23 22 21
5
I/O3I/O4I/O
5091 FHD F01
A A NC NC OE A CE I/O I/O
8 9
10
7 6
7
4
6
5
5
6
4
7
3
8
2
9
1
10
0 0
12
1
13
2
14
I/O0–I/O
7
Data Inputs/Outputs RDY/BUSY Ready/BUSY Status CE Chip Enable OE Output Enable WE Write Enable V
CC
V
SS
5V Supply
Ground NC No Connect
MODE SELECTION
Mode CE WE OE I/O Power
Read L H L D Byte Write (WE Controlled) L H D Byte Write (CE Controlled) L H D
OUT IN IN
ACTIVE ACTIVE
ACTIVE Standby, and Write Inhibit H X X High-Z STANDBY Read and Write Inhibit X H H High-Z ACTIVE
CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V
Symbol Test Max. Units Conditions
(1)
C
I/O
(1)
C
IN
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter.
Doc. No. 25034-00 2/98
Input/Output Capacitance 10 pF V Input Capacitance 6 pF VIN = 0V
2
I/O
= 0V
Page 3
CAT28C17A
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature....................... –65°C to +150°C
Voltage on Any Pin with
Respect to Ground
VCC with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C)................................... 1.0W
(2)
........... –2.0V to +VCC + 2.0V
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specifica­tion is not implied. Exposure to any absolute maximum rating for extended periods may affect device perfor­mance and reliability.
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current
(3)
........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Test Method
(1)
N T V I
LTH
END
DR
ZAP
(1)
(1)
(1)(4)
Endurance 10,000 Cycles/Byte MIL-STD-883, Test Method 1033 Data Retention 10 Years MIL-STD-883, Test Method 1008 ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015 Latch-Up 100 mA JEDEC Standard 17
D.C. OPERATING CHARACTERISTICS
VCC = 5V ±10%, unless otherwise specified.
Limits
Symbol Parameter Min. Typ. Max. Units Test Conditions
I
CC
VCC Current (Operating, TTL) 35 mA CE = OE = VIL,
f = 1/tRC min, All I/O’s Open
(5)
I
CCC
VCC Current (Operating, CMOS) 25 mA CE = OE = V
ILC
,
f = 1/tRC min, All I/O’s Open
I
SB
I
SBC
(6)
VCC Current (Standby, TTL) 1 mA CE = VIH, All I/O’s Open VCC Current (Standby, CMOS) 100 µA CE = V
IHC
,
All I/O’s Open
I
LI
I
LO
(6)
V
IH
(5)
V
IL
V
OH
V
OL
V
WI
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns. (3) Output shorted for no more than one second. No more than one output shorted at a time. (4) Latch-up protection is provided for stresses up to 100mA on address and data pins from –1V to VCC +1V. (5) V (6) V
= –0.3V to +0.3V.
ILC
= VCC –0.3V to VCC +0.3V.
IHC
Input Leakage Current –10 10 µAVIN = GND to V Output Leakage Current –10 10 µAV
= GND to VCC,
OUT
CE = V
IH
High Level Input Voltage 2 VCC +0.3 V Low Level Input Voltage –0.3 0.8 V High Level Output Voltage 2.4 V IOH = –400µA Low Level Output Voltage 0.4 V IOL = 2.1mA Write Inhibit Voltage 3.0 V
CC
3
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CAT28C17A
A.C. CHARACTERISTICS, Read Cycle
VCC = 5V ±10%, unless otherwise specified.
28C17A-20
Symbol Parameter Min. Max. Units
t
RC
t
CE
t
AA
t
OE
t
LZ
t
OLZ
t
HZ
t
OHZ
t
OH
(1)
(1)
(1)(2)
(1)(2)
(1)
Read Cycle Time 200 ns CE Access Time 200 ns Address Access Time 200 ns OE Access Time 80 ns CE Low to Active Output 0 ns OE Low to Active Output 0 ns CE High to High-Z Output 55 ns OE High to High-Z Output 55 ns Output Hold from Address Change 0 ns
Figure 1. A.C. Testing Input/Output Waveform(3)
2.4 V INPUT PULSE LEVELS REFERENCE POINTS
0.45 V
Figure 2. A.C. Testing Load Circuit (example)
2.0 V
0.8 V
5089 FHD F03
1.3V
1N914
3.3K
DEVICE
UNDER
TEST
CL INCLUDES JIG CAPACITANCE
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) Output floating (High-Z) is defined as the state when the external data line is no longer driven by the output buffer. (3) Input rise and fall times (10% and 90%) < 10 ns.
Doc. No. 25034-00 2/98
CL = 100 pF
4
OUT
5089 FHD F04
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CAT28C17A
A.C. CHARACTERISTICS, Write Cycle
VCC = 5V ±10%, unless otherwise specified.
28C17A-20
Symbol Parameter Min. Max. Units
t
WC
t
AS
t
AH
t
CS
t
CH
(2)
t
CW
t
OES
t
OEH
(2)
t
WP
t
DS
t
DH
t
DL
(1)
t
INIT
t
DB
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) A write pulse of less than 20ns duration will not initiate a write cycle.
Write Cycle Time 10 ms Address Setup Time 10 ns Address Hold Time 100 ns CE Setup Time 0 ns CE Hold Time 0 ns CE Pulse Time 150 ns OE Setup Time 15 ns OE Hold Time 15 ns WE Pulse Width 150 ns Data Setup Time 50 ns Data Hold Time 10 ns Data Latch Time 50 ns Write Inhibit Period After Power-up 5 20 ms Time to Device Busy 80 ns
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CAT28C17A
DEVICE OPERATION
Read
Data stored in the CAT28C17A is transferred to the data bus when WE is held high, and both OE and CE are held low. The data bus is set to a high impedance state when either CE or OE goes high. This 2-line control architec­ture can be used to eliminate bus contention in a system environment.
Figure 3. Read Cycle
t
RC
ADDRESS
t
CE
CE
t
OE
OE
V
IH
t
WE
DATA OUT DA TA V ALIDDA TA V ALID
HIGH-Z
LZ
t
OLZ
Ready/BUSY (RDY/BUSY)
The RDY/BUSY pin is an open drain output which indicates device status during programming. It is pulled low during the write cycle and released at the end of programming. Several devices may be OR-tied to the same RDY/BUSY line.
t
OHZ
t
OH
t
AA
t
HZ
28C17A F05
Figure 4. Byte Write Cycle [WE Controlled]
ADDRESS
CE
OE
WE
RDY/BUSY
DATA OUT
DATA IN
t
AS
t
OES
t
CS
HIGH-Z
t
AH
t
WP
DATA VALID
t
DB
t
CH
t
OEH
t
DL
t
WC
Doc. No. 25034-00 2/98
t
DS
t
DH
5091 FHD F06
6
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CAT28C17A
Byte Write
A write cycle is executed when both CE and WE are low, and OE is high. Write cycles can be initiated using either WE or CE, with the address input being latched on the falling edge of WE or CE, whichever occurs last. Data, conversely, is latched on the rising edge of WE or CE, whichever occurs first. Once initiated, a byte write cycle automatically erases the addressed byte and the new data is written within 10 ms.
Figure 5. Byte Write Cycle [CE Controlled]
ADDRESS
CE
OE
WE
t
t
CS
AS
t
OES
t
AH
t
CW
DATA Polling
DATA polling is provided to indicate the completion of a byte write cycle. Once a byte write cycle is initiated, attempting to read the last byte written will output the complement of that data on I/O7 (I/O0–I/O6 are indeter­minate) until the programming cycle is complete. Upon completion of the self-timed byte write cycle, all I/O’s will output true data during a read cycle.
t
WC
t
DL
t
OEH
t
CH
RDY/BUSY
DATA OUT
DATA IN
Figure 6. DATA Polling
ADDRESS
CE
WE
OE
HIGH-Z
t
OEH
DATA VALID
t
DS
t
OE
t
DB
t
DH
t
OES
5091 FHD F07
I/O
t
WC
D
7
= X D
IN
= X D
OUT
7
OUT
= X
28C17A F08
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Page 8
CAT28C17A
HARDWARE DATA PROTECTION
The following is a list of hardware data protection fea­tures that are incorporated into the CAT28C17A.
(1) VCC sense provides for write protection when V
CC
falls below 3.0V min.
(2) A power on delay mechanism, t
(see AC charac-
INIT
ORDERING INFORMATION
Prefix Device # Suffix
28C17A N I
Optional Company ID
Product Number
Temperature Range
Blank = Commercial (0˚C to +70˚C) I = Industrial (-40˚C to +85˚C) A = Automotive (-40˚ to +105˚C)*
teristics), provides a 5 to 20 ms delay before a write sequence, after VCC has reached 3.0V min.
(3) Write inhibit is activated by holding any one of OE
low, CE high or WE high.
(4) Noise pulses of less than 20 ns on the WE or CE
inputs will not result in a write cycle.
-20CAT
T
Tape & Reel
T: 500/Reel
Package
P: PDIP
Speed
20: 200ns N: PLCC J: SOIC (JEDEC) K: SOIC (EIAJ)
* -40˚C to +125˚C is available upon request
Notes: (1) The device used in the above example is a CAT28C17ANI-20T (PLCC, Industrial temperature, 200 ns Access Time, Tape & Reel).
28C17A F09
Doc. No. 25034-00 2/98
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