Datasheet C7460 Datasheet (HAMAMATSU)

Multiband Plasma-Process Monitor

Model C7460

The Multiband Plasma-Process Monitor
(MPM) is a system specifically designed for
monitoring the optical plasma emissions that
are created during the various manufacturing
processes of semiconductors including
etching, sputtering, cleaning, and CVD.
The MPM can handle multi-channel recording
in real-time.

●

Simultaneous measurement
from 200 to 950 nm

●

Easy measurement using
optical fiber input

●

High levels of accuracy and
reliability

Software for measurement,

●

analysis and factory integration

Real-Time Plasma Monitoring

Real-Time Plasma Monitoring

BACKGROUND

Up to 60 percent of the time that a piece of semi­conductor manufacturing equipment spends in oper­ation is generally for non productive jobs like plas­ma cleanup, chamber stabilization (seasoning) and
system diagnosis. Typical approaches for reducing
down-time and repetitive processes like these are to

PLASMA ETCHING

utilize Advanced Process Control (APC) and Sensor

PLASMA ETCHING

Based Process Control (SBPC) technologies with
factory LAN services. The MPM allows you to gain
full control over processes using information provi-

SPUTTERING

SPUTTERING

ded by the MPM regarding plasma spectra, etching
end-point detection status, plasma fault status, etc.
The MPM opens the possibility of significantly in­creasing the efficiency of manufacturing equipment.

CONFIGURA TION OF APC WITH MPM (EXAMPLE)

FEATURES

Ethernet

● Highly Accurate and Reliable

The MPM employs a high-resolution compact spec­trograph and a highly sensitive detector which diag­nose plasma with elevated levels of precision.
Along with these superior photometric characteris­tics, the MPM is compact, sturdy and offers the high
standards of reliability that are required in a manu­facturing environment.

● Easy to Operate

The MPM is equipped with a sturdy fiber optic bun­dle, which can conveniently be combined with the
plasma chamber. Due to this, and due to its easy-to
use software, the MPM is easy to setup and operate.

● Intelligent Sensor System

The MPM is not just a spectrograph. It also contains in­ternal data processing capabilities which allow to ex­tract and compress the relevant infomation from the
data.

● Easy Fab Integration

The MPM is equipped with several interfaces in­cluding Ethernet and a TCP/IP protocol stack. To­gether with its very verstile software framework this
allows the easy integration into existing fab IT infra­structure.

Ethernet

HUB

Ethernet

MPM

C7460

12

34

5

POWER

POWER

POWER

POWER

RS-232C

1

2

C7460

12

34

5

RS-232C

1

2

C7460

12

34

5

RS-232C

1

2

C7460

12

34

5

RS-232C

1

2

Script output (end point, plasma fault status, etc)

Optical fiber

STANDARD CONFIGURATION

MPM Standard Configuration

12

POWER

Fiber input optics

34

1

2

Main unit

U9046 Plasma Process Data Aquisition Software

Windows 98, NT, 2000

2

C7460

5

RS-232C

Ethernet (TCP/IP)

Computer

Simultaneous Measurement

Simultaneous Measurement

from 200 nm to 950nm

from 200 nm to 950nm

BENEFITS (EXAMPLES)

● Easy Plasma Status Settings

Real-time monitoring of the plasma process supports easy to
make settings for the volume of introduced gas and plasma power.

PLASMA CVD

PLASMA CVD

CLEANING

CLEANING

APPLICATIONS OVERVIEW

Due to the high versatility of the hardware and the soft­ware framework, the MPM is suitable for various different
applications, without any compromise in performance or
convenience. These applications can be grouped into the
following categories:

● Engineering Tasks

Such as process optimization, comparison and matching;
trouble-shooting; etc.

● Endpoint Control

Advanced, highly specific and sensitive end point control.

● Fault Detection

Highly selective automatic fault detection.

● APC Sensor

Automatic extraction of highly specific APC key numbers.
(Under development)

Product yield is increased through improved processing stability,
and the early discovery of abnormalities.

● Advanced Endpoint Detection

Powerful scripts can be defined as recipes for each endpoint
detection. It is possible to use the information in the whole
spectrum by means of the unique spectral patterns method.
This allows for advanced endpoint control with unprecedented
specificity and precision.

● Higher Efficiency through Automatic Cleaning Control

Particularly with CVD, in which the chamber must be cleaned
each time a wafer is processed, cleaning time has a major effect
on actual operating efficiency. The automatic control features
greatly improved throughput, increased productivity, and reduced
costs.

● Monitoring of Impurities and Abnormal Discharges

Monitoring of the emission band, which does not occur in normal
processes, provides warning of impurities and abnormal dis­charges before they occur, and thus improves yield.

SYSTEM STRUCTURE

Driver Software

control
process data

U9046
Plasma Process
Data Acquisition Software

Database
spectrum data
with process data

Network

Plasma
Emission

control

spectrum
data

U8851
End-point Synthesis Tool

▲3-d display of plasma emission of CVD Cleaning (CF4, O2, Ar) of SiN

Plasma equipment

EPD signal

MPM(C7460)

(Hardware)

formula for
end-point detection

Standard

Optional

3

Easy Measurement using Optical Fiber

Easy Measurement using Optical Fiber

FUNCTIONS OF HARDWARE

● Measurement Parameter Setting

• Measurement interval

• Exposure time: 20 to 32767 ms

• Data accumulation: 1 to 32767 spectra

• Sensor sensitivity: 3 settings (1x, 2x, 5x)

• Wavelength smoothing: on/off

• Width for wavelength smoothing: any integer value within 1 to 50 nm

• Time smoothing (rolling average): on/off

• Filter for time smoothing: any value within 0 to 100 %

• Trigger : measurement start trigger

● Measurement Script

Scripts contain measurement conditions as well as formula and
judgments applied to the data. Results of script processing can be
output via the software and via the analog BNC terminal in real­time. Each etch process will be treated by a tailored script.
The maximum number of scripts the MPM can store internally is
100, and one of them is selected as the active one. Each script can
contain the definition of up to 32 formulas. All script processing is
perfomed inside the MPM and in real-time.

● Script Formula

Script fomula can be defined to perform math operations between
spectral intensities. Besides the four basic algebraic functions, it is
also possible to compute smoothing, differentials as well as the
special spectral patterns applied for endpoint and fault detection
(see section on U8851 in this brochure).

● Judgments

Judgments are used to detect endpoint or fault conditions. They
are defined by thresholds applied to formula, and they can be
chained and combined by logical operators.

SPECIFICATIONS

Fiber input optics

Wavelength range
Wavelength resolution

A/D resolution 16 bit
Analog signal output result

of formula calculation
Script output result of

judgment calculation
Busy output
Start input

Interfaces

Ethernet

Serial
Interface protocol
Line voltage
Power consumption

Bundle diameter inner: 1 mm; outer: 7 mm
Fiber aperture (N.A.) 0.2
Bundle length 3 m
200 to 950 nm (Measuring range)
235 to 950 nm (Sensitivity-corrected range)
< 2 nm

2 outputs
BNC; 0 to 10 V

5 outputs (3 outputs for External Trigger)
BNC; TTL; High impedance
BNC; TTL; High impedance

BNC; TTL; High impedance;
IEEE 802.3 (10BaseT); 10 Mbit/s
RJ45 modular connector
RS-232
TCP/IP (for Ethernet only)
AC 100 / 117 / 220 / 240 V ± 10%; 50 / 60 Hz
90 VA

pulse width: min. 40 ms

DIMENSIONAL OUTLINE (Unit: mm)

Main Unit (weight: approx.7kg)

●

C7460

12

34

POWER

1

200±1
262±1

5

RS-232C

2

4

Fiber Input Optics (weight: approx.100g)

●

40 50

98.5±1

3±0.5

6±1

25±1

325±
383±

1
1

0.95

7

Input side

3000

To main unit

Plasma Process Data Acquisition Software

Plasma Process Data Acquisition Software

Standard Software

U9046

U9046

Standard Software

SOFTWARE ARCHITECTURE

Drivers Watchdog Logging

Communication Layer

Control Station

Database

MPM C7460

U9046 consists of several software components to perform the
measurement in real time with great flexibility.

OUTLINE

The U9046 is a software which allows to control up to 4 units
of C7460 multiband plasma process monitor simultaneously
and observe the spectrum of plasma emission during plasma
processes. The observed spectrum data are stored in the
database automatically and can be analyzed. The highly
sensitive end-point detection software U8851 is an option. And
also the fault detection software for Advanced Process Control
will be available.

FEATURES

●

Up to 4 units of C7460 can be controlled simultaneously,
and all of the spectrum data during plasma process can be
observed.

●

Database oriented data storage is available and a fast SQL
based data access is allowed.

The various ways to trigger the measurement are prepared.

●

The drivers to communicate to the plasma chambers or

●

factory network can be optionally provided.

●

Control Station

Control Station allows to control C7460s and observe the
spectrum data. The measurement can be triggered by the trigger
signal from the plasma chamber and also by the optical trigger.
The measurement can be repeated automatically during the
several wafers' process.

●

Database

The spectrum data observed by the Control Station are stored into
the SQL compatible Database.

Watchdog

●

The Watchdog software component always monitors the condition
of the software, and an error will be reported by an e-mail.

●

Logging

The Logging component records the history of the software jobs in
a file.

Drivers for the Plasma Chambers

●

The Drivers software can be provided to make communication to
the plasma chambers or factory network. The Drivers can obtain
the information about the process like Process ID and Lot No. and
so on. Such information can be stored with the obser ved spectrum
data into the Database. Such a driver is needed typically for
endpoint and automatic fault detection installations.

●

Easy Graphical User Interfaces

The graphical user interfaces (GUIs) used by the process
engineer and by the operators are different and dedicated to their
respective tasks. Specifically, the operators' GUI is very easy to
use, minimizing the risk of human errors.

5

End-point Synthesis Tool U8851

End-point Synthesis Tool U8851

Optional Software

Optional Software

FEATURES

● End-point detection in small aperture process

●

Simultaneous analysis of se veral wafer s

●

Stability evaluation of a pr ocess

OPERATIONAL OUTLINE

Fig. 2 Analysis pattern

OUTLINE

The U8851 is an optional software application that is utilized
with the Multiband Plasma-Process Monitor C7460 for end­point detection in plasma etching.
With the U8851, highly sensitive end-point detection of the
conventionally difficult small aperture process has been
made possible.
In addition, since the process data of several wafers can be
analyzed simultaneously, the reliability of the operation
formula that performs an end-point detection is improved,
the verification of an end-point detection is performed easily,
and the stability evaluation of a process can be performed as
well.

COMPARISON

Conventional method

● Measurement data D (λ,t)

D (l, t) = Average spectrum + S1 (l) × T1 (t) + S2 (l)× T2 (t) + S3 (l) × T3 (t)

S1 (λ)

S2 (λ)

1

(t)

T

T2 (t)

U8851

End point

Fig. 1 Comparison of U8851 with conventional method

An example of an end-point detection of oxidization film
etching (1% or less of aperture ratio) is shown in Fig. 1.
Although it was difficult to detect the end-point of a process
from the time changes in spectrum intensity by using the
conventional method, detection with sufficient accuracy is
possible with the U8851.

6

S3 (λ)

T3 (t)

End-point Synthesis Tool U8851

End-point Synthesis Tool U8851

Optional Software

Optional Software

1The data recorded by the Multiband Plasma-Process Monitor
C7460 of the changes in the passage of time of the spectrum is
loaded onto the End-point Synthesis Tool U8851.

2With the analysis function of the U8851, the spectrum data,
which constantly changes, analyzes what kinds of spectrum
patterns are shown by addition, and how each spectrum pattern
is carrying out time changes.
In Fig. 1 the measured data D (l, t) shows that three spectrum
patterns (S
of data which carried out time changes like T
respectively focusing on the average spectrum.

3The U8851 can perform end-point detection of a process from
spectrum pattern changes obtained in the analysis of 2 with
changes in the passage of time.
It specifies which spectrum pattern can be utilized for end-point
detection with changes in the passage of time and smoothes and
differentiates waveforms according to changes in the passage of
time to detect an end-point.
Moreover, analysis of 2 and 3 can be simultaneously
performed on two or more wafers, and the detected end-point
time is displayed on a graph.
While verifying an end-point detection with these functions, the
stability of a process can also be evaluated. (Fig.3)

4The detection operation formula of the acquired end points as
mentioned above, can be saved in a file and downloaded into the
C7460 as well.
In the C7460, end-point detection like in 3 is performed in real
time.

1 [l] to S3 [l]) are mainly shown with the superposition

1 (t) to T3 (t),

Fig. 3 Example of an analysis display

(a)

(b)

(c)

(a) : An operation formula is set up.
(b) : An operation result is displayed.
(c) : Graph of wafer number pair terminal point time is displayed.

Optical Attenuator C8066

Optical Attenuator C8066

Optional Hardware

Optional Hardware

OUTLINE

The C8066 is an optical attenuator for the Multiband Plasma­Process Monitor C7460. It is possible to change the light
intensity in five steps (1, 1/10, 1/100, 1/1000, 1/10000) by the
button on the front panel or via RS-232C interface.
The optimum light intensity for monitoring the plasma
emission can thus be obtained.

7

Optical Attenuator C8066

Optical Attenuator C8066

Optional Hardware

Optional Hardware

FEATURES

● Light Intensity Change in Five Steps

With attenuated filter, the light intensity can be changed in
five steps (1 to 1/10000).

● High-speed and Highly Precise Changing

The stepping motor is adopted and a high-speed and
highly precise filter change of 0.2 s / step is possible.

● Easy Operation

The filter can be easily changed via a button on the front
panel, or via RS-232C interface.

●

Wide Wavelength Region

The wide wavelength region from ultra violet to near-infrared
(200 to 1000nm) is covered.

SYSTEM CONFIGURATION

C8066 Standard Configuration

Source light

Fiber input optics

Main unit

POWER

OPTICAL ATTENUATOR

ATTENUATOR CONTROL

SPECIFICATIONS

Functions/
Performance

Attenuated ratio
Wavelength region
Operation
Filter changing time

RS-232C

Baud rate
Data bit
Parity
Stop bit
Connector

Other

Line voltage
Power comsumption
Conformity specification

Ambient operation temperature
Ambient strage temperature

Fiber input optics

C8066

OD4OD3OD2OD1OD0

LOCAL

RS-232C

(Including C7460)

MPM C7460

12

POWER

34

1

2

1, 1/10, 1/100, 1/1000, 1/10000
200nm to 1000nm

Remote operation /Local operation

0.2sec/STEP
38400bps
8bit
None
1bit

D-sub 9pin

AC100 to 120V / 220 to 240V , 50/60Hz
50VA max
EMC EN55011:1991 Group1,ClassA
EN50082-2:1995
Safety EN61010-1:1993+A.2:1995
0 to + 40°C
+10 to + 50°C

Computer

C7460

5

RS-232C

RS-232C

DIMENSIONAL OUTLINE (Unit: mm)

Main Unit (weight: approx.3.0kg)

●

OPTICAL ATTENUATOR

ATTENUATOR CONTROL

POWER

170 ±1
232 ±1

★ Windows is a trademark of Microsoft Corporation in the U.S.A.

★ Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.

●

Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office..

●

Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice..

© 2002 Hamamatsu Photonics K.K.

C8066

OD4OD3OD2OD1OD0

LOCAL

±1

RS-232C

98.5

±1

3 ±0.5

6

25 ±1

175 ±1
233 ±1

Fiber Input Optics (weight: approx.100g)

●

40

7

Input

3000

to Main unit

φ 0.95

50

ISO 9001

Certificate: 09 105 79045

HAMAMATSU PHOTONICS K.K., Systems Division

Homepage Address http://www.hamamatsu.com

812 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: [phone], Fax: [phone], E-mail:[email protected]

U.S.A. and Canada:
Germany:
France:
United Kingdom:
North Europe:
Italy:

Hamamatsu Photonics Italia S.R.L.: Strada della Mois, 1/E 20020 Arese (Milano), Italy, Telephone: [phone], Fax: [phone], E-mail: [email protected]

Hamamatsu Photonic Systems: 360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: [phone], Fax: [phone], E-mail: [email protected]

Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: [phone], Fax: [phone], E-mail: [email protected],

Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: [phone], Fax: [phone], E-mail: [email protected]

Hamamatsu Photonics UK Limited: 2 How ard Court, 10 T ewin Road, Welwyn Garden City , Hertfordshire, AL7 1BW , U.K., Telephone: [phone], Fax: [phone], E-mail: [email protected]

Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171-41 Solna, Sweden, Telephone: [phone], Fax: [phone], E-mail: [email protected] -

Cat. No. SSIS1027E04
AUG/2002 HPK
Created in Japan (PDF)